CN105485969A - Heat exchange device and semiconductor refrigeration refrigerator with same - Google Patents
Heat exchange device and semiconductor refrigeration refrigerator with same Download PDFInfo
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- CN105485969A CN105485969A CN201510996970.6A CN201510996970A CN105485969A CN 105485969 A CN105485969 A CN 105485969A CN 201510996970 A CN201510996970 A CN 201510996970A CN 105485969 A CN105485969 A CN 105485969A
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- heat
- fins set
- exchanging part
- exchanger rig
- heat exchanging
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/09—Improving heat transfers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/12—Sound
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a heat exchange device and a semiconductor refrigeration refrigerator with the same. The heat exchange device comprises a first heat exchange part; the first heat exchange part is provided with two fin sets and a fan, each fin set is provided with a plurality of fins arranged in parallel and at intervals, the two fin sets are arranged at intervals in the length direction of the fins, and the fan is arranged between the two fin sets and is used for enabling air flow to flow from the gap between every two adjacent fins of one fin set to the gap between every two adjacent fins of the other fin set. In addition, the invention provides the semiconductor refrigeration refrigerator with the heat exchange device. The fan of the heat exchange device is arranged between the two fin sets and is located on the outer side of one end of each fin, and therefore the thickness of the heat exchange device can be reduced, and the fan is especially suitable for cooling the semiconductor refrigeration refrigerator.
Description
Technical field
The present invention relates to refrigerating equipment, particularly relate to a kind of heat-exchanger rig and there is the semiconductor freezer of this heat-exchanger rig.
Background technology
Semiconductor freezer, is also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to realize refrigeration by heat pipe heat radiation and conduction technique and automatic pressure-transforming Variable flow control technology, without the need to refrigeration working medium and mechanical moving element, solves the application problem of traditional mechanical refrigerator such as medium pollution and mechanical oscillation.But, the cold junction of semiconductor chilling plate is while refrigeration, a large amount of heats can be produced in its hot junction, for ensureing that semiconductor chilling plate reliably carries out work constantly, need to dispel the heat to hot junction in time, but the scheme of by arranging blower fan fin being carried out to forced convertion heat radiation in prior art, is generally used for the hot-side heat dissipation of semiconductor chilling plate, to improve heat exchange efficiency, but the volume of radiating fin own is larger; In addition, axial flow blower is set in the side of radiating fin group, with to the gap blow flow between every two adjacent fins, or sucks air-flow from the gap between every two adjacent fins.The volume ratio of this heat exchanger is comparatively large, needs the problems such as installing space is large, is not suitable for installing in less space.In addition, hot-side heat dissipation normally reaches the object of heat radiation by the rotating speed and power increasing blower fan, radiating efficiency is poor and the large energy consumption of noise is high.
Summary of the invention
One object of the present invention is intended at least one defect overcoming existing heat-exchanger rig, provides a kind of heat-exchanger rig of novel structure, and it has less thickness, is specially adapted to the heat radiation of semiconductor freezer.
As far as possible a further object of first aspect present invention to reduce the noise of heat-exchanger rig.
An object of second aspect present invention to provide a kind of semiconductor freezer with above-mentioned heat-exchanger rig.
According to an aspect of the present invention, the invention provides a kind of heat-exchanger rig for semiconductor freezer.This heat-exchanger rig comprises the first heat exchanging part, and described first heat exchanging part has:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and described two fins set are arranged along the length direction interval of described fin; With
Blower fan, is arranged between two described fins set, is configured to impel the Clearance Flow of the gap of air-flow from a described fins set between every two adjacent fins in fins set described in another between every two adjacent fins.
Alternatively, described blower fan is axial flow blower, and its rotation extends along the length direction of described fin.
Alternatively, described first heat exchanging part also comprises two ducting assemblies, is arranged at the both sides of described blower fan, and each described ducting assembly limits gas channel, to be communicated with gap in a described fins set between every two adjacent fins and described blower fan.
Alternatively, described heat-exchanger rig also comprises the second heat exchanging part, is arranged symmetrically with about a geometrical plane with described first heat exchanging part.
Alternatively, described heat-exchanger rig also comprises:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
A fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at the two ends of a described heat-transfer device;
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at the two ends of heat-transfer device described in another.
Alternatively, each described heat-transfer device comprises:
Heat-conducting substrate, has and described thermal source or the hot linked heat-transfer surface of low-temperature receiver; With
Many heat carriers, length direction along described fin is spaced, heat carrier described in every root comprise the middle part heat carrier section that is fixed on described heat-conducting substrate and be positioned at heat carrier section both sides, described middle part, perpendicular to the straight heat carrier section in two ends of described geometrical plane, two end straight heat carrier sections of heat carrier described in every root extend respectively through the poling hole of each fin be mounted thereon.
Alternatively, the middle part heat carrier section of heat carrier described in every root comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from described middle part respectively; And
In each described heat-transfer device, the straight heat carrier section in multiple described middle part is in same plane, the straight heat carrier section in multiple described end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between described middle part straight heat carrier section and described heat-transfer surface is less than the distance between described end straight heat carrier section and described heat-transfer surface.
Alternatively, the width of each described fin is 1/7 to 3/7 of its length;
The width of each described fins set is 1/3 to 2/3 of the length of each described fin.
According to a second aspect of the invention, the invention provides a kind of semiconductor freezer, the heat-insulation layer comprising inner bag, semiconductor chilling plate and be arranged on rear side of described inner bag, especially, also comprise:
Back cover, the rear surface of itself and described heat-insulation layer is limited with installing space, and it offers the first air inlet and the first air outlet; With
Any one heat-exchanger rig above-mentioned, two fins set of its first heat exchanging part and blower fan to be all installed in described installing space and to be between described first air inlet and described first air outlet; And
Two fins set of described first heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The blower fan of described first heat exchanging part is configured to impel air-flow to enter described installing space from described first air inlet, flows out described installing space via after two fins set of described first heat exchanging part from described first air outlet.
Alternatively, described first air outlet is arranged at the top of described first air inlet;
Described back cover also offers the second air inlet and be in the second air outlet above described second air inlet; And
Two fins set of the second heat exchanging part of described heat-exchanger rig and blower fan to be all installed in described installing space and to be between described second air inlet and described second air outlet; And
Two fins set of described second heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The blower fan of described second heat exchanging part is configured to impel air-flow to enter described installing space from described second air inlet, flows out described installing space via after two fins set of described second heat exchanging part from described second air outlet.
Heat-exchanger rig of the present invention and semiconductor freezer because blower fan is arranged between two fins set, and are positioned at the outside, one end of each fin, can reduce the thickness of heat-exchanger rig, be specially adapted to the heat radiation of semiconductor freezer.In addition, there are two heat exchanging part and each heat exchanging part has the area of dissipation that two fins set also can improve heat-exchanger rig.Adopt a blower fan to make air-flow flow through from two fins set simultaneously, blower fan utilization rate can be improved, and the noise of heat-exchanger rig can be reduced.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic elevational view of heat-exchanger rig according to an embodiment of the invention;
Fig. 2 is the schematic side elevation of heat-exchanger rig according to an embodiment of the invention;
Fig. 3 is the schematic side elevation of semiconductor freezer according to an embodiment of the invention;
Fig. 4 is the schematic rear view of semiconductor freezer according to an embodiment of the invention.
Detailed description of the invention
Fig. 1 and Fig. 2 is schematic elevational view and the side view of heat-exchanger rig 600 according to an embodiment of the invention respectively.As depicted in figs. 1 and 2, embodiments provide a kind of heat-exchanger rig 600 for semiconductor freezer, it can comprise the first heat exchanging part 610.First heat exchanging part 610 can have two fins set 611 and blower fan 612.Each fins set 611 has the fin that multiple parallel interval is arranged, and thermally coupled directly or indirectly with the cold junction/hot junction of the semiconductor chilling plate in semiconductor freezer, and two fins set 611 can be arranged along the length direction interval of fin.Blower fan 612 can be arranged between two fins set 611, is configured to impel the Clearance Flow of the gap of air-flow from a fins set 611 between every two adjacent fins in another fins set 611 between every two adjacent fins, to take away the cold/heat on fin.Blower fan 612 is arranged between two fins set 611, and is positioned at the outside, one end of each fin, can reduce the thickness of heat-exchanger rig 600, be specially adapted to the heat radiation of semiconductor freezer.Preferably, blower fan 612 is axial flow blower, and its rotation extends along the length direction of fin.The width of each fin is 1/7 to 3/7 of its length.The width of each fins set 611 is 1/3 to 2/3 of the length of each fin.
In some further embodiments of the present invention, first heat exchanging part 610 also can comprise two ducting assemblies 613, be arranged at the both sides of blower fan 612, and each ducting assembly 613 limits gas channel, each gas channel is communicated with gap in a fins set 611 between every two adjacent fins and blower fan 612.Particularly, gas channel is communicated with the air inlet of gap in a fins set 611 between every two adjacent fins and blower fan 612.Another gas channel is communicated with the gap in the air outlet of blower fan 612 and another fins set 611 between every two adjacent fins.
Each ducting assembly 613 can comprise two side plates.Each side plate extends from one end of the outermost fin of a corresponding fins set 611, with one-body molded with this fin; Or each side plate also can be fixed on one end of the outermost fin of a corresponding fins set 611.Further, back cover 510 grade of semiconductor freezer and two side plates can be utilized jointly to limit gas channel; Each ducting assembly 613 also can comprise base plate and cover plate further, to surround gas channel.
In some embodiments of the invention, as depicted in figs. 1 and 2, heat-exchanger rig 600 also can comprise the second heat exchanging part 610'.Second heat exchanging part 610' also can have two fins set 611, blower fan 612 and two ducting assemblies 613, and is arranged symmetrically with about a geometrical plane with the first heat exchanging part 610, to improve heat exchange efficiency further.
In some embodiments of this embodiment, heat-exchanger rig 600 also comprises two heat-transfer devices 630, and each heat-transfer device 630 is symmetrical about above-mentioned geometrical plane, and the middle part of each heat-transfer device 630 is configured to absorb heat or cold from thermal source or low-temperature receiver.A fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' are arranged at the two ends of a heat-transfer device 630; Another fins set 611 of first heat exchanging part 610 and another fins set 611 of the second heat exchanging part 610' are arranged at the two ends of another heat-transfer device 630.That is, this heat-exchanger rig 600 simultaneously can absorb heats or cold from two thermals source, and the heat of a corresponding thermal source or low-temperature receiver or cold can be passed to a fins set 611 of the first heat exchanging part 610 and a fins set 611 of the second heat exchanging part 610' by each heat-exchanger rig 600.
Particularly, each heat-transfer device 630 comprises heat-conducting substrate 631 and Duo Gen heat carrier 632.Heat-conducting substrate 631 has and thermal source or the hot linked heat-transfer surface of low-temperature receiver.Many heat carriers 632 can be spaced along the length direction of fin.And every root heat carrier 632 can be heat pipe, comprise the middle part heat carrier section that is fixed on heat-conducting substrate 631 and be positioned at heat carrier section both sides, middle part, perpendicular to the straight heat carrier section in two ends of geometrical plane.The middle part heat carrier section of every root heat carrier 632 comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from middle part respectively.Two end straight heat carrier sections of every root heat carrier 632 extend respectively through the poling hole of each fin be mounted thereon.
Preferably, in each heat-transfer device 630, the straight heat carrier section in multiple middle part is in same plane, the straight heat carrier section in multiple end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between multiple middle part straight heat carrier section and heat-transfer surface is less than the distance between the straight heat carrier section in multiple end and heat-transfer surface.Such setting, can make heat-exchanger rig 600 have special structure, is convenient to heat-exchanger rig 600 to be installed on semiconductor freezer.
The straight heat carrier section in middle part is fixedly connected with mode and can is with heat-conducting substrate 631: heat-conducting substrate 631 only has a base plate, and it is opposing offers multiple holding tank in heat-transfer surface side; The straight heat carrier section in middle part of many heat carriers 632 is by the embedding holding tank that presses, and this mode connects reliably, thermal resistivity is low.The straight heat carrier section in middle part is fixedly connected with mode and also can is with heat-conducting substrate 631: heat-conducting substrate 631 can have base plate and cover plate, and the opposing of base plate offers multiple holding tank in heat-transfer surface side; The straight heat carrier section in middle part of many heat carriers 632 is by the embedding holding tank that presses; It is opposing in heat-transfer surface side that cover plate is installed on heat-conducting substrate 631, straight for the middle part of many heat carriers 632 heat carrier section to be folded in therebetween with base plate.
In some substituting embodiments, each heat-transfer device 630 can be the heat-conducting plate of strip, and the middle part of one side is heat-transfer surface.Four fins set 611 are arranged at the two ends of two heat-conducting plates respectively, and the fin of each fins set 611 extends from the another side of heat-conducting plate.Heat-conducting plate can be plate-type heat-pipe.In other substituting embodiments, two fins set 611 of the first heat exchanging part 610 can be installed on a heat-transfer device 630, and two fins set 611 of the second heat exchanging part 610' can be installed on another heat-transfer device 630.Particularly, each heat-transfer device 630 can comprise heat-conducting substrate 631 and many single u-shaped heat-conductive thermo tube.The middle part of each U-shaped heat-conductive thermo tube is thermally coupled with the hot junction of semiconductor chilling plate by heat-conducting substrate 631.The two ends of each U-shaped heat-conductive thermo tube are provided with a fins set 611.
Further, the embodiment of the present invention additionally provides a kind of semiconductor freezer using above-mentioned heat-exchanger rig 600, Fig. 3 and Fig. 4 is schematic side elevation and the rearview of semiconductor freezer according to an embodiment of the invention respectively.As shown in Figure 3 to Figure 4, the semiconductor freezer of the present embodiment can comprise semiconductor module 100, inner bag 200, shell, chamber door 300 and heat-insulation layer 400.Storage space is limited with in inner bag 200.Generally there are two kinds of structures in the shell of semiconductor freezer, a kind of be pin-connected panel, be namely assembled into a complete casing by top cover, left side plate, back cover 510, lower shoe etc.Another kind is monoblock type, by top cover and left side plate on request rolling become one to fall " U " font, be called U shell, then be welded into casing with back cover 510, lower shoe point.The semiconductor freezer of the embodiment of the present invention preferably uses monoblock type shell, and namely shell includes U shell and back cover 510.Back cover 510 can be limited with installing space with the rear surface of the heat-insulation layer 400 be positioned on rear side of inner bag 200, and back cover 510 offers the first air inlet and the first air outlet.
In this embodiment, the semiconductor module 100 of semiconductor freezer can comprise semiconductor chilling plate, cold junction heat-exchanger rig and hot junction heat-exchanger rig.Heat-insulation layer 400 on rear side of the rear wall of inner bag 200 and inner bag 200 offers installing hole.Cold junction heat-exchanger rig can comprise cool guiding block, cold scattering substrate, the multiple cold scattering fins be formed on cold scattering substrate, and for the cold scattering fan of forced convertion cold scattering.Cool guiding block and semiconductor chilling plate are installed in installing hole, and the cold end surface thermo-contact of the rear surface of cool guiding block and semiconductor chilling plate.
Hot junction heat-exchanger rig can be the heat-exchanger rig 600 in above-mentioned any embodiment, and two fins set 611 of its first heat exchanging part 610 and blower fan 612 to be all installed in installing space and to be between the first air inlet and the first air outlet.And two fins set 611 of the first heat exchanging part 610 are thermally coupled directly or indirectly with the hot junction of semiconductor chilling plate.The blower fan 612 of the first heat exchanging part 610 is configured to impel air-flow to enter installing space from the first air inlet, flows out installing space via after two fins set 611 of the first heat exchanging part 610 from the first air outlet.
In order to improve heat exchange efficiency, heat-exchanger rig 600 comprises the second heat exchanging part 610' further.First air outlet is arranged at the top of the first air inlet; Back cover 510 also offers the second air inlet and be in the second air outlet above the second air inlet.First air inlet and the second air inlet are in sustained height place, and the first air outlet and the second air outlet are in sustained height place.Two fins set 611 of the second heat exchanging part 610' of heat-exchanger rig 600 and blower fan 612 to be all installed in installing space and to be between the second air inlet and the second air outlet.And two fins set 611 of the second heat exchanging part 610' are thermally coupled directly or indirectly with the hot junction of semiconductor chilling plate; The blower fan 612 of the second heat exchanging part 610' is configured to impel air-flow to enter installing space from the second air inlet, flows out installing space via after two fins set 611 of the second heat exchanging part 610' from the second air outlet.
In this embodiment, semiconductor module 100 can be two, and vertically interval is arranged, to improve refrigerating efficiency.Heat-exchanger rig 600 also can comprise two heat-transfer devices 630.The heat-transfer surface of the heat-conducting substrate 631 of each heat-transfer device 630 and the hot junction of a semiconductor chilling plate contact against, the heat of each semiconductor chilling plate to be passed to the first heat exchanging part 610 and the second heat exchanging part 610'.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. for a heat-exchanger rig for semiconductor freezer, it is characterized in that comprising the first heat exchanging part, described first heat exchanging part has:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and described two fins set are arranged along the length direction interval of described fin; With
Blower fan, is arranged between two described fins set, is configured to impel the Clearance Flow of the gap of air-flow from a described fins set between every two adjacent fins in fins set described in another between every two adjacent fins.
2. heat-exchanger rig according to claim 1, is characterized in that,
Described blower fan is axial flow blower, and its rotation extends along the length direction of described fin.
3. heat-exchanger rig according to claim 1, is characterized in that, described first heat exchanging part also comprises:
Two ducting assemblies, are arranged at the both sides of described blower fan, and each described ducting assembly limits gas channel, to be communicated with gap in a described fins set between every two adjacent fins and described blower fan.
4. heat-exchanger rig according to claim 1, is characterized in that, also comprises:
Second heat exchanging part, is arranged symmetrically with about a geometrical plane with described first heat exchanging part.
5. heat-exchanger rig according to claim 4, is characterized in that, also comprises:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
A fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at the two ends of a described heat-transfer device;
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at the two ends of heat-transfer device described in another.
6. heat-exchanger rig according to claim 5, is characterized in that, each described heat-transfer device comprises:
Heat-conducting substrate, has and described thermal source or the hot linked heat-transfer surface of low-temperature receiver; With
Many heat carriers, length direction along described fin is spaced, heat carrier described in every root comprise the middle part heat carrier section that is fixed on described heat-conducting substrate and be positioned at heat carrier section both sides, described middle part, perpendicular to the straight heat carrier section in two ends of described geometrical plane, two end straight heat carrier sections of heat carrier described in every root extend respectively through the poling hole of each fin be mounted thereon.
7. heat-exchanger rig according to claim 6, is characterized in that,
The middle part heat carrier section of heat carrier described in every root comprises: the straight heat carrier section in middle part, and two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides from described middle part respectively; And
In each described heat-transfer device, the straight heat carrier section in multiple described middle part is in same plane, the straight heat carrier section in multiple described end is in same plane, and the distance between every two adjacent middle part straight heat carrier sections is less than the distance between every two adjacent straight heat carrier sections in end, the distance between described middle part straight heat carrier section and described heat-transfer surface is less than the distance between described end straight heat carrier section and described heat-transfer surface.
8. heat-exchanger rig according to claim 1, is characterized in that,
The width of each described fin is 1/7 to 3/7 of its length;
The width of each described fins set is 1/3 to 2/3 of the length of each described fin.
9. a semiconductor freezer, the heat-insulation layer comprising inner bag, semiconductor chilling plate and be arranged on rear side of described inner bag, is characterized in that, also comprises:
Back cover, the rear surface of itself and described heat-insulation layer is limited with installing space, and it offers the first air inlet and the first air outlet; With
Heat-exchanger rig according to any one of claim 1 to 8, two fins set of its first heat exchanging part and blower fan to be all installed in described installing space and to be between described first air inlet and described first air outlet; And
Two fins set of described first heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The blower fan of described first heat exchanging part is configured to impel air-flow to enter described installing space from described first air inlet, flows out described installing space via after two fins set of described first heat exchanging part from described first air outlet.
10. semiconductor freezer according to claim 9, is characterized in that,
Described first air outlet is arranged at the top of described first air inlet;
Described back cover also offers the second air inlet and be in the second air outlet above described second air inlet; And
Two fins set of the second heat exchanging part of described heat-exchanger rig and blower fan to be all installed in described installing space and to be between described second air inlet and described second air outlet; And
Two fins set of described second heat exchanging part and the hot junction of described semiconductor chilling plate thermally coupled directly or indirectly;
The blower fan of described second heat exchanging part is configured to impel air-flow to enter described installing space from described second air inlet, flows out described installing space via after two fins set of described second heat exchanging part from described second air outlet.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510996970.6A CN105485969B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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| CN201510996970.6A CN105485969B (en) | 2015-12-24 | 2015-12-24 | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig |
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| CN105485969A true CN105485969A (en) | 2016-04-13 |
| CN105485969B CN105485969B (en) | 2018-10-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108562090A (en) * | 2018-05-24 | 2018-09-21 | 澳柯玛股份有限公司 | A kind of semiconductor refrigerating air-cooled freezer |
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| CN205537253U (en) * | 2015-12-24 | 2016-08-31 | 青岛海尔电冰箱有限公司 | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator |
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| CN108562090A (en) * | 2018-05-24 | 2018-09-21 | 澳柯玛股份有限公司 | A kind of semiconductor refrigerating air-cooled freezer |
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| CN105485969B (en) | 2018-10-12 |
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