Disclosure of Invention
The invention aims to solve the problems that the refrigerator is influenced by the installation environment, the air inflow is small and the heat exchange efficiency is low.
According to one aspect of the present invention, there is provided a refrigerator, comprising a cabinet, a heat sink disposed on a top of the cabinet, air inlets protruding from the top of the cabinet on two sides of the cabinet, and a refrigerator further comprising: the air duct cover is covered on the top of the box body, and two sides of the air duct cover are provided with air inlet parts and air inducing inclined planes which are used for guiding airflow to flow along the upper surface of the air duct cover; the air inducing port is formed in the middle of the air duct housing; the air outlet is formed by enclosing the air duct housing and the box body and faces to the back side of the box body; the induced draft fan is arranged at the induced draft opening.
Furthermore, the box has storage chamber and semiconductor refrigeration spare, and the semiconductor refrigeration spare includes the cold junction that is used for carrying out the refrigeration to storage chamber and contacts radiating hot junction with the radiator.
Further, the radiator comprises a radiating fin group and a radiating liquid pipe, wherein the radiating fin group is provided with a plurality of radiating fins which are arranged side by side and are parallel to each other, and the radiating liquid pipe penetrates through the radiating fins in sequence; the semiconductor refrigerating element is provided with one or more flow passage channels penetrating through the hot end, and the flow passage channels are communicated with the heat radiating liquid pipe.
Further, air inlet portion includes: the air inlet housing is integrally formed with the side wall of the box body; the air inlet is formed on the side plate of the air inlet housing; the transition inclined plane is arranged in the air inlet housing, the lower end of the transition inclined plane is abutted against the lower part of the air inlet, and the upper end of the transition inclined plane is connected with the air inducing inclined plane.
Further, the air inlet portion further comprises a filter screen, and the filter screen is arranged on the inner side of the air inlet.
Furthermore, the two sides of the air duct housing are bent to form an induced draft inclined plane, and the induced draft inclined plane is smoothly connected with the transition inclined plane.
Furthermore, the induced draft fan comprises a centrifugal fan, the centrifugal fan is arranged between the air duct housing and the box body, and the setting position of the centrifugal fan is matched with the setting position of the radiator.
Furthermore, the shape of the air induction port is matched with that of the centrifugal fan, and the center of the air induction port is coincided with the axis of the rotating shaft of the centrifugal fan.
Furthermore, the front side of the box body is provided with a convex wind shield part arranged at the top of the box body and used for shielding the front side opening formed by the surrounding of the air channel cover shell and the box body.
Furthermore, the height of the protrusion of the wind shield part is matched with that of the wind inlet part.
The refrigerator can form airflow flow paths with air inlets at two sides and air inlets at the top through the structures such as the air inlet arranged at the upper part of the refrigerator body, the air duct housing and the like, thereby improving the air flow of the refrigerator, reducing the limit influence of the external installation position of the refrigerator on the induced air heat dissipation of the refrigerator, and improving the heat dissipation efficiency of the refrigerator.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. Embodiments may be referred to herein, individually or collectively, by the term "invention" merely for convenience and without intending to voluntarily limit the scope of this application to any single invention or inventive concept if more than one is in fact disclosed. Herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. As for the methods, products and the like disclosed by the embodiments, the description is simple because the methods correspond to the method parts disclosed by the embodiments, and the related parts can be referred to the method parts for description.
As shown in fig. 1 to 3, the present invention provides a refrigerator, and a heat dissipation air duct structure of a refrigerator body 1 mainly includes:
the air inlet parts 3 are positioned at two sides of the refrigerator body 1 of the refrigerator and are convexly arranged at the top of the refrigerator body 1 so as to form an air inlet path for air at two sides of the refrigerator to flow to the top of the refrigerator;
the air duct housing 4 is covered on the top of the box body 1, the front view section of the air duct housing 4 is in an isosceles trapezoid shape, two sides of the air duct housing 4 are air inducing inclined planes used for guiding airflow to flow along the upper surface of the air duct housing 4, and the air inducing inclined planes correspond to the air inlet part 3 so that air entering from the air inlet part 3 continuously flows along the upper surface of the air duct housing 4;
the air inducing port 5 is formed in the middle of the air duct housing 4, so that air flowing along the upper surface of the air duct housing 4 is introduced into a space formed by the air duct housing 4;
the air outlet is a back side outlet of a space formed by the air duct housing 4 and the box body 1 in an enclosing manner, faces to the back side of the box body 1 and is used for dissipating the air after heat exchange to the external environment of the refrigerator again; in the embodiment, considering that the centrifugal fan blows air along the circumferential direction when rotating, in order to enable most of the air flow to the radiators on the two sides, the air baffle is further arranged in the middle of the air outlet, so that the air flow flows towards the two sides, and the air is blown out from the two sides of the air outlet after the heat exchange of the radiators.
The induced draft fan 6 is arranged at the induced draft opening 5, and in the rotating process of the induced draft fan 6, air on the upper portion of the air duct housing 4 can be extracted into the space on the inner side of the air duct housing 4, so that the air can exchange heat with the radiator 12 which is also arranged in the space and be cooled.
In one embodiment of the present invention, the main structure of the air inlet portion 3 of the refrigerator includes:
the air inlet housing 7, the air inlet housing 7 is integrally formed with the sidewall of the box body 1, in the embodiment, the air inlet housing 7 is a hollow rectangular housing, and one side of the air inlet housing 7 is an opening structure, and the opening side of the air inlet housing 7 is the side adjacent to the air duct housing 4;
the air inlet 8 is formed in the side plate of the air inlet housing 7, and in the embodiment, the air inlet 8 is positioned on one side opposite to the opening of the air inlet housing 7;
the transition inclined plane is arranged in the hollow structure of the air inlet housing 7, the lower end of the transition inclined plane is abutted against the lower part of the air inlet 8, and the upper end of the transition inclined plane is connected with the induced draft inclined plane, so that air entering from the air inlet 8 can flow to the position of the middle induced draft opening 5 of the air duct housing 4 along the transition inclined plane and the induced draft inclined plane in sequence.
In some embodiments, considering that the refrigerator of the present invention is mostly installed in a kitchen environment with heavy oil smoke, the air inlet portion 3 of the present invention is further provided with a filter screen 9, and the filter screen 9 is disposed at the hollow structure inside the air inlet 8, so as to filter oil smoke impurities carried by the air flow and reduce the amount of oil smoke entering the air duct housing 4, thereby ensuring the cleanliness of the components such as the heat sink 12 and the semiconductor refrigerating element 11.
The filter screen 9 is connected with the air inlet part 3 in a detachable mode, so that a user can clean the oil smoke impurities accumulated on the filter screen 9 regularly, the service life of the filter screen is prolonged, and the problems that the air inlet 8 is blocked by the oil smoke impurities and the air inlet amount is reduced can be avoided.
In some embodiments, the air duct housing 4 is an integrated plate structure, two sides of the air duct housing 4 are symmetrically bent to form an induced draft inclined plane, and the height of a space formed by bending the air duct housing 4 needs to be determined according to the heights of the installation positions of the radiator 12 and the semiconductor cooler 11, so that the space is enough to accommodate the radiator 12, the semiconductor cooler 11 and other components; the induced draft inclined plane is smoothly connected with the transition inclined plane.
In some embodiments, the induced draft fan 6 includes a centrifugal fan, and the centrifugal fan is disposed at an inner side position between the air duct housing 4 and the refrigerator body 1 to reduce the overall height size of the refrigerator and reduce the space occupation; the installation position of the centrifugal fan is matched with the installation position of the radiator 12, for example, in the illustrated embodiment, the radiator 12 is respectively arranged at the left side and the right side of the top of the box body 1, and the centrifugal fan is arranged between the two radiators 12, so that the air flow can respectively flow to the two sides of the fan; meanwhile, the height of the centrifugal fan is communicated with or close to that of the radiator 12, so that the airflow rotated by the centrifugal fan can just flow into the space between the radiating fins 14 of the radiator 12, and the heat exchange efficiency between the radiator 12 and the airflow is improved.
The centrifugal fan adopted by the invention is integrally circular, and the shape of the air induction port 5 is also a circular shape matched with the shape of the centrifugal fan so as to ensure the maximum air inflow area; the center of the air inducing opening 5 coincides with the axis of the rotating shaft of the centrifugal fan.
In some optional embodiments, the front side of the box 1 has a protruding wind-blocking portion 10 arranged at the top of the box 1, and is used for blocking the front side opening formed by the surrounding of the air duct housing 4 and the box 1, so that hot air after heat exchange is prevented from flowing to the front side, and the discomfort of a user caused by the direct blowing of the hot air is avoided, thereby improving the use experience of the user.
In addition, the protruding height of the wind blocking part 10 is matched with that of the air inlet part 3, the wind blocking part 10 and the air inlet parts 3 on two sides are arranged in an enclosing mode to form a C-shaped structure, the air duct housing 4 is located in the C-shaped structure, and the air outlet is located at the opening position of the C-shaped structure.
In some embodiments as shown in fig. 4 and 5, the refrigeration device of the present invention includes a semiconductor refrigeration member 11 for refrigerating and cooling the storage chamber 2 inside the refrigerator, the operation principle of the semiconductor refrigeration member 11 is based on the peltier principle, the semiconductor refrigeration member 11 is made of two different conductors, when current is applied, one of the two conductors releases heat at the joining position, which can be regarded as a hot end, and the other joining position opposite to the joining position absorbs heat, which can be regarded as a cold end, and the present invention refrigerates the storage chamber 2 through the cold end and radiates the heat to the external environment of the refrigerator through the hot end; in some embodiments, the semiconductor refrigeration member 11 is disposed at the top of the box body 1, and most of the semiconductor refrigeration members 11 are sheet-shaped structures and are not easy to be directly installed and fixed in the storage chamber 2, so that the cold end of the refrigerator is connected with the heat conduction member 17 extending to the storage chamber 2, and in the working process of the refrigerator, the cold end of the semiconductor refrigeration member 11 exchanges heat with air in the storage chamber 2 through the heat conduction member 17 and absorbs the exchanged heat, so that the internal environment of the storage chamber 2 can be controlled at a lower temperature condition by continuously supplying current to the semiconductor refrigeration member 11, thereby realizing long-time storage of meat, vegetables, fruits and other articles.
In some embodiments, the heat absorbed by the cold end of the semiconductor refrigerating element 11 is dissipated to the external environment through the hot end, and the shape and size of the hot end are small, so that the heat dissipation area is limited, and therefore in order to improve the heat dissipation efficiency of the hot end of the semiconductor refrigerating element 11 and reduce the heat accumulation of the hot end, the refrigerator provided by the invention is further provided with the radiator 12, the radiator 12 is positioned at the top of the refrigerator body 1 and is arranged adjacent to the semiconductor refrigerating element 11, and the radiator 12 is in contact with the hot end of the semiconductor refrigerating element 11 for heat exchange, so that the heat dissipation area of the hot end and the external environment is enlarged, and the heat dissipation efficiency of the refrigerator is improved.
Optionally, the main structure of the heat sink 12 includes: the heat radiating fin group is provided with a plurality of heat radiating fins 14 which are arranged side by side and are parallel to each other, and the heat radiating fins 14 are of plate-shaped structures made of heat conducting materials, so that heat conducted by a hot end can be uniformly distributed on the heat radiating fins 14, and the heat exchange area with air is further increased; meanwhile, airflow channels are formed among the radiating fins 14 which are arranged in parallel, so that air can flow on two sides of the radiating fins 14, and the external heat dissipation is accelerated.
In the embodiment, the number of the heat dissipation liquid pipes 13 is one or more, each heat dissipation liquid pipe 13 sequentially penetrates through the plurality of heat dissipation fins 14 arranged in parallel, the heat dissipation liquid pipe 13 is filled with liquid metal with high thermal conductivity, and heat can be sequentially transmitted to each heat dissipation fin 14 through the flow of the liquid metal in the heat dissipation liquid pipe 13, so that the heat distribution of the heat radiator 12 is uniform, and the problem of local overheating is avoided.
In one embodiment of the present invention, the heat sink 12 is configured with three liquid tubes, which are perpendicular to the plate surface of the heat dissipation fins 14 and parallel to each other; optionally, the three liquid tubes are arranged in a triangular shape to accelerate heat conduction of the three liquid tubes on the same heat dissipation fin 14. The specific number of the heat dissipation liquid pipes 13 can be determined according to the actual heat dissipation requirement, which is not limited in the present invention.
In some embodiments of the present invention, in order to continuously transfer the heat of the semiconductor refrigeration element 11 to the heat sink 12, the semiconductor refrigeration element 11 of the present invention is formed with one or more flow channels penetrating through the hot end, and the flow channels are communicated with the heat dissipation liquid pipe 13, so that the heat dissipation liquid pipe 13 and the flow channels jointly form a loop for the liquid metal to flow circularly, in a specific heat dissipation process, after the low-temperature liquid metal absorbs the heat generated by the hot end in the flow channel of the semiconductor refrigeration element 11, the high-temperature liquid metal flows to the heat dissipation plate group along the heat dissipation liquid pipe 13, and uniformly transfers the heat to the plurality of heat dissipation fins 14, and the heat dissipation fins 14 exchange heat with the air to dissipate the heat in the external environment; meanwhile, the high-temperature liquid metal after heat exchange is converted into low-temperature liquid metal again, and continuously flows back to the flow channel of the semiconductor refrigerating element 11 along the heat radiating liquid pipe 13, so that a heat radiating cycle is completed.
In one embodiment of the present invention, in order to accelerate the heat exchange between the air in the storage chamber 2 and the heat conducting member 17, the heat exchanging fan 15 for driving the air in the storage chamber 2 to flow is disposed in the storage chamber 2, and the flow of the air in the storage chamber 2 can be accelerated under the driving action of the rotation of the heat exchanging fan 15, so as to increase the air flow passing through the heat conducting member 17 and improve the cooling efficiency of the heat conducting member 17 on the air in the storage chamber 2; meanwhile, with the continuous rotation of the heat exchange fan 15, the low-temperature air absorbed by the heat conducting member 17 can be conveyed to other parts of the storage chamber 2, and then the cooling and refrigeration of the whole internal space of the storage chamber 2 can be realized.
In one embodiment of the present invention, since the semiconductor refrigerating element 11 and the heat sink 12 are both disposed on the top of the refrigerator body 1, the heat conducting element 17, which is in contact with the cold end of the semiconductor refrigerating element 11 to conduct heat, is also disposed on the top of the refrigerator body 1 and extends from the top of the refrigerator body 1 to the top of the storage chamber 2; accordingly, the heat exchanging fan 15 of the present invention is also disposed at the upper portion of the storage chamber 2 and corresponds to the position of the heat conducting member 17, so as to increase the air flow rate near the heat conducting member 17 and accelerate the heat exchange between the heat conducting member 17 and the air.
Optionally, the heat conducting member 17 adopted in the present invention is a copper heat conducting block, the top of the box body 1 is provided with an accommodating hole for installing the heat conducting member 17, and the shape of the accommodating hole is adapted to the shape of the copper heat conducting block.
In order to increase the heat exchange area between the heat conducting member 17 and the cold end of the semiconductor cooling member 11, the shape of the copper heat conducting block may be adapted to the shape of the semiconductor cooling member 11, for example, in another embodiment, the semiconductor cooling member 11 is a rectangular sheet structure, so the copper heat conducting block may also be designed to be rectangular.
In one embodiment of the present invention, a fan housing 16 is covered on the outer side of the heat exchange fan 15 to prevent the fan blades of the heat exchange fan 15 rotating at a high speed from damaging the user of the refrigerator; the shape of the fan casing 16 is adapted to the shape of the heat exchanging fan 15 to reduce the space occupation of the fan casing 16 in the storage compartment 2.
The fan housing 16 is provided with a ventilation opening, so that air in the storage chamber 2 flows into a space formed by the fan housing 16 along the ventilation opening for heat exchange, and meanwhile, the air after heat exchange can flow back into the storage chamber 2 along the ventilation opening again. In the embodiment, the heat exchange fan 15 installed in the storage chamber 2 is a centrifugal heat exchange fan 15, the axis of the rotating shaft of the heat exchange fan 15 is perpendicular to the top plate surface of the storage chamber 2, and the ventilation opening is formed along the horizontal peripheral side of the fan housing 16.
In some embodiments of the invention, the storage chamber 2 is composed of one or more sub-chambers, which can be used to store different types of food products, respectively; the adjacent sub-chambers are separated by the heat insulation plate so as to block the air flow between different sub-chambers and reduce the occurrence of the problems of food taint and the like.
Because the temperature environments required by different food storage are different, each sub-chamber is provided with the independent semiconductor refrigerating piece 11 and the independent radiator 12, correspondingly, each sub-chamber is also provided with the independent heat exchange fan 15, the fan housing 16 and other structures, and a user can meet the temperature conditions required by different food storage by respectively adjusting the refrigerating temperature of the semiconductor refrigerating pieces 11 of different sub-chambers.
In an embodiment of the present invention, the storage chamber 2 is provided with a claw 18 with adjustable height for mounting the shelf 19, the claw 18 is arranged on the inner wall of the storage chamber 2 and at the included angle position of the inner wall, the included angle position of the inner wall and the inner wall of the storage chamber 2 is longitudinally provided with a plurality of fastening components which are fastened and fixed with the fastening blocks, and by fastening and fixing the claw 18 and the fastening components at different height positions, the adjustment of the spacing distance between adjacent shelves 19 can be realized to adapt to the volume shape of the food stored in the refrigerator, thereby improving the air conditioning utilization rate of the storage chamber 2.
It is to be understood that the present invention is not limited to the procedures and structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.