CN216057054U - High-efficient radiating internet gateway - Google Patents
High-efficient radiating internet gateway Download PDFInfo
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- CN216057054U CN216057054U CN202122650400.5U CN202122650400U CN216057054U CN 216057054 U CN216057054 U CN 216057054U CN 202122650400 U CN202122650400 U CN 202122650400U CN 216057054 U CN216057054 U CN 216057054U
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- heat dissipation
- semiconductor refrigeration
- internet gateway
- refrigeration piece
- cold
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Abstract
The utility model provides an internet gateway with high-efficiency heat dissipation, which comprises a shell, a circuit board and a heat dissipation assembly, wherein the heat dissipation assembly comprises a partition plate, a semiconductor refrigeration piece and a heat dissipation fin, the partition plate is transversely arranged in the shell, the circuit board is positioned above the partition plate, the middle part of the partition plate is provided with a mounting hole, the semiconductor refrigeration piece is arranged in the mounting hole, the cold end of the semiconductor refrigeration piece faces towards the upper part of the partition plate, the hot end of the semiconductor refrigeration piece is positioned below the partition plate, the heat dissipation fin is attached to the hot end of the semiconductor refrigeration piece, the position of the shell below the partition plate is provided with a heat dissipation through hole, the semiconductor refrigeration piece is arranged below the circuit board, the cold end of the semiconductor refrigeration piece faces towards the circuit board, the electric heating plate is cooled through the semiconductor refrigeration piece, the circuit board in the shell is cooled through heat dissipation, the partition plate partitions the heat exchange of the air at the cold end and the hot end, and the heat in the internet gateway is guided out from the heat dissipation through hole through the heat dissipation fin, high-efficiency heat dissipation of the internet gateway is achieved.
Description
Technical Field
The utility model relates to the technical field of gateways, in particular to an internet gateway capable of efficiently dissipating heat.
Background
An internet gateway is a bridge connecting an intranet and the internet, and the gateway can collect information and upload the collected information to a system, and a gateway address can be understood as a communication address for information transmission between the intranet and the internet. The internet gateway is also widely used in industry, the working time of the internet gateway usually needs continuous work, and long-time work can generate a large amount of heat in the gateway, so that the heat needs to be timely dissipated in order to not influence the normal use of the gateway. In the prior art, the internet gateway is provided with the vent holes to dissipate heat in the gateway, but the vent holes are small, so that the heat dissipation speed is very slow, the heat is easy to accumulate in the gateway, and internal parts are easy to damage.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the utility model provides a high-efficient radiating internet gateway, the radiating efficiency is high, can improve internet gateway internals's life.
In order to solve the technical problems, the utility model adopts the technical scheme that:
the utility model provides a high-efficient radiating internet gateway, includes casing and circuit board, the circuit board sets up in the casing, still be provided with radiator unit in the casing, radiator unit includes semiconductor refrigeration piece, baffle and radiating fin, the baffle transversely sets up in the casing and with two upper and lower cavitys are split into to the casing, the circuit board is located in the cavity of baffle top, the baffle middle part is provided with the mounting hole, semiconductor refrigeration piece sets up in the mounting hole, the cold junction orientation of semiconductor refrigeration piece the cavity of baffle top, the hot junction orientation of semiconductor refrigeration piece the cavity of baffle below, radiating fin laminating the hot junction of semiconductor refrigeration piece, the casing is located the position of baffle below is provided with radiating through-hole.
Furthermore, the partition plate is a heat insulation partition plate, and the side face of the semiconductor refrigeration piece is connected with the mounting hole in a sealing mode.
Further, the cold junction laminating of semiconductor refrigeration piece has the cold piece of leading, lead cold piece area and be greater than the cold junction area of semiconductor refrigeration piece and with have the clearance between the circuit board.
Further, the cold guide sheet is a steel sheet or an aluminum sheet.
Further, the cold guide sheet is a corrugated sheet.
Furthermore, a fan is arranged on one side, away from the semiconductor refrigeration sheet, of the heat dissipation fin, the air outlet end of the fan faces towards the heat dissipation fin, an air inlet is formed in the bottom of the shell, and the air inlet end of the fan is connected with the air inlet in a sealing mode.
Furthermore, an air guide piece is arranged on one side, facing the radiating fins, of the partition board, a tubular air channel is enclosed by the air guide piece and the partition board, the radiating fins and the air outlet end of the fan are located in the air channel, and an outlet of the air channel is connected with the radiating through hole.
Further, the fan is an axial fan.
The utility model has the beneficial effects that: through set up baffle installation semiconductor refrigeration piece below the circuit board to with the refrigerated cold junction of semiconductor refrigeration piece towards the circuit board, cool down the electric plate through the semiconductor refrigeration piece, cool down the circuit board of internet gateway dispels the heat, and the baffle cuts off the direct heat exchange in cold junction and hot junction, and the heat guide in with the internet gateway through radiating fin is derived from the heat dissipation through-hole, realizes the high-efficient heat dissipation of internet gateway.
Drawings
Fig. 1 is a perspective structural view of an internet gateway with efficient heat dissipation according to a first embodiment of the present invention;
fig. 2 is a cross-sectional structural diagram of an internet gateway with efficient heat dissipation according to an embodiment of the present invention.
Description of reference numerals:
1. a housing; 11. an upper housing; 12. a lower housing; 13. an air inlet; 14. a heat dissipating through hole;
2. a circuit board;
3. a heat dissipating component; 31. a cold conducting sheet; 32. a semiconductor refrigeration sheet; 33. a thermally insulating barrier; 331. mounting holes; 34. an air guide member; 341. an air duct; 342. a fixing hole; 35. a heat dissipating fin; 36. an axial flow fan.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 and 2, an internet gateway with efficient heat dissipation includes a housing and a circuit board, the circuit board is disposed in the housing, a heat dissipation assembly is further disposed in the housing, the heat dissipation assembly includes semiconductor refrigeration pieces, a partition board and heat dissipation fins, the partition board is transversely disposed in the housing and divides the housing into an upper cavity and a lower cavity, the circuit board is disposed in the cavity above the partition board, a mounting hole is disposed in the middle of the partition board, the semiconductor refrigeration pieces are disposed in the mounting hole, cold ends of the semiconductor refrigeration pieces face the cavity above the partition board, hot ends of the semiconductor refrigeration pieces face the cavity below the partition board, the heat dissipation fins are attached to the hot ends of the semiconductor refrigeration pieces, and heat dissipation through holes are disposed in the position of the housing below the partition board.
From the above description, the beneficial effects of the present invention are: through set up baffle installation semiconductor refrigeration piece below the circuit board to with the refrigerated cold junction of semiconductor refrigeration piece towards the circuit board, cool down the electric plate through the semiconductor refrigeration piece, cool down the circuit board of internet gateway dispels the heat, and the baffle cuts off the direct heat exchange in cold junction and hot junction, and the heat guide in with the internet gateway through radiating fin is derived from the heat dissipation through-hole, realizes the high-efficient heat dissipation of internet gateway.
Furthermore, the partition plate is a heat insulation partition plate, and the side face of the semiconductor refrigeration piece is connected with the mounting hole in a sealing mode.
As can be seen from the above description, the thermal insulation partition board made of thermal insulation material is used as the partition board, so that the heat transfer on the two sides of the partition board can be better blocked.
Further, the cold junction laminating of semiconductor refrigeration piece has the cold piece of leading, lead cold piece area and be greater than the cold junction area of semiconductor refrigeration piece and with have the clearance between the circuit board.
According to the above description, the cold-end of the cold-conducting sheet and the cold-end of the semiconductor refrigerating sheet are used for heat exchange, so that the heat exchange efficiency of high and low temperature is increased, and the heat dissipation efficiency is improved.
Further, the cold guide sheet is a steel sheet or an aluminum sheet.
Further, the cold guide sheet is a corrugated sheet.
As can be seen from the above description, the cold guide fins are configured as the corrugated fins, so that the area of the cold guide fins is increased in a limited space, and the heat exchange efficiency is improved, thereby improving the heat dissipation efficiency.
Furthermore, a fan is arranged on one side, away from the semiconductor refrigeration sheet, of the heat dissipation fin, the air outlet end of the fan faces towards the heat dissipation fin, an air inlet is formed in the bottom of the shell, and the air inlet end of the fan is connected with the air inlet in a sealing mode.
According to the above description, the fan is arranged on one side of the radiating fin, the air flow speed near the radiating fin is increased through the fan, the heat dissipation of the radiating fin is increased, and the heat dissipation effect inside the internet gateway is improved.
Furthermore, an air guide piece is arranged on one side, facing the radiating fins, of the partition board, a tubular air channel is enclosed by the air guide piece and the partition board, the radiating fins and the air outlet end of the fan are located in the air channel, and an outlet of the air channel is connected with the radiating through hole.
According to the above description, the air guide member is arranged to guide the air flow exchanged by the heat of the radiating fins, so that the hot air flow can be quickly emitted to the environment outside the shell along the tubular air duct formed by the air guide member and the partition plate, and the radiating efficiency is improved.
Further, the fan is an axial fan.
According to the description, the axial flow fan is adopted as the fan, so that the whole volume of the gateway is prevented from being increased while the air volume is ensured.
Referring to fig. 1 and fig. 2, a first embodiment of the present invention is:
the utility model provides a high-efficient radiating internet gateway, includes casing 1, circuit board 2 and radiator unit 3, and casing 1 includes casing 11 and lower casing 12 down, and radiator unit 3 includes cold piece 31, semiconductor refrigeration piece 32, thermal insulation baffle 33, air ducting 34, radiating fin 35 and axial fan 36. The upper casing 11 and the lower casing 12 form a square cavity, the heat insulation partition plate 33 is arranged between the upper casing 11 and the lower casing 12 and divides the cavity in the casing 1 into an upper cavity and a lower cavity, and the circuit board 2 is arranged in the cavity above the heat insulation partition plate 33.
Wherein, the middle part of thermal insulation partition plate 33 is provided with mounting hole 331, semiconductor refrigeration piece 32 sets up in mounting hole 331, the side and the mounting hole 331 sealing connection of semiconductor refrigeration piece 32, the cold end of semiconductor refrigeration piece 32 is towards the cavity above thermal insulation partition plate 33, set up cold conduction piece 31 between the cold end of semiconductor refrigeration piece 32 and circuit board 2, cold conduction piece 31 is the aluminium wave form piece the same with thermal insulation partition plate 33 size, need to have certain clearance between cold conduction piece 31 and the circuit board 2.
The hot end of the semiconductor refrigeration sheet 32 is located in the cavity below the heat insulation partition plate 33, the air guide 34 with a U-shaped cross section is arranged below the heat insulation partition plate 33, and two ends of the U-shaped cross section are connected with the partition plate to form a tubular air duct 341. The hot end of semiconductor refrigeration piece 32 is located in wind channel 341, and the hot end position of semiconductor refrigeration piece 32 in wind channel 341 sets up radiating fin 35, and the base plate position of radiating fin 35 and the hot end laminating of semiconductor refrigeration piece 32, the U-shaped bottom of air guide 34 and the position that radiating fin 35 corresponds set up fixed orifices 342, and axial fan 36 is fixed on this fixed orifices 342 and air-out one end is towards radiating fin 35, and is more excellent, and axial fan 36 and radiating fin 35 laminate.
The air duct 341 formed by the air guide member 34 and the thermal insulation partition 33 extends to the lower casing 12 at both sides, the grid-shaped heat dissipation through holes 14 are arranged at the position of the lower casing 12 corresponding to the outlet of the air duct 341, the air inlet 13 is arranged at the position of the bottom of the lower casing 12 corresponding to the axial flow fan 36, and the air inlet end of the axial flow fan 36 is hermetically connected with the air inlet 13. As shown in fig. 2, when the axial flow fan 36 works, the airflow outside the gateway enters from the air inlet 13 through the air inlet end of the axial flow fan 36, and is blown to the heat dissipation fins 35 from the air outlet end of the axial flow fan 36, and then exchanges heat with the heat dissipation fins 35, and the carried heat is guided through the air duct 341 and blown to the heat dissipation through holes 14 on both sides, and is dissipated outside the gateway from the heat dissipation through holes 14, so as to take away the heat of the heat end of the semiconductor chilling plate 32 and the heat dissipation fins 35 inside the gateway.
In other equivalent embodiments, the cold conducting element can also be made of other materials with better heat conducting performance. The heat insulating partition 33 is a partition made of a heat insulating material, such as a foam plastic plate or a glass fiber plate. The connection of the upper housing 11 and the lower housing 12 and the fixation of other components may be by screw fixation, snap fixation or other position-setting-achievable structural fixation.
In summary, according to the internet gateway with high heat dissipation efficiency provided by the utility model, the semiconductor refrigeration sheet is used for cooling and dissipating heat of the circuit board in the internet gateway, the heat dissipation is accelerated by the heat dissipation fins and the fan, and the air guide member is arranged to surround the air duct to guide heat dissipation, so that the heat dissipation effect is improved, the internet gateway can dissipate heat efficiently, and the service life of circuit board parts in the internet gateway is prolonged.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (8)
1. The utility model provides a high-efficient radiating internet gateway, includes casing and circuit board, the circuit board sets up in the casing, its characterized in that, still be provided with radiator unit in the casing, radiator unit includes semiconductor refrigeration piece, baffle and radiating fin, the baffle transversely sets up in the casing and with two upper and lower cavitys are cut apart into to the casing, the circuit board is located in the cavity of baffle top, the baffle middle part is provided with the mounting hole, the semiconductor refrigeration piece sets up in the mounting hole, the cold junction orientation of semiconductor refrigeration piece the cavity of baffle top, the hot junction orientation of semiconductor refrigeration piece the cavity of baffle below, the radiating fin laminating the hot junction of semiconductor refrigeration piece, the casing is located the position of baffle below is provided with the radiating through-hole.
2. The internet gateway with efficient heat dissipation according to claim 1, wherein the partition is a heat insulation partition, and the side surface of the semiconductor refrigeration piece is hermetically connected with the mounting hole.
3. The internet gateway with efficient heat dissipation of claim 1, wherein a cold guide plate is attached to the cold end of the semiconductor refrigeration plate, the area of the cold guide plate is larger than that of the cold end of the semiconductor refrigeration plate, and a gap is formed between the cold guide plate and the circuit board.
4. An internet gateway with efficient heat dissipation as claimed in claim 3, wherein the cold-conducting sheet is a steel sheet or an aluminum sheet.
5. An internet gateway with efficient heat dissipation as recited in claim 3, wherein the cold-conducting fins are corrugated fins.
6. The internet gateway with efficient heat dissipation according to claim 1, wherein a fan is arranged on one side, away from the semiconductor refrigeration sheet, of the heat dissipation fin, an air outlet end of the fan faces the heat dissipation fin, an air inlet is formed in the bottom of the casing, and an air inlet end of the fan is connected with the air inlet in a sealing mode.
7. The internet gateway with efficient heat dissipation as recited in claim 6, wherein a wind guide is disposed on a side of the partition board facing the heat dissipation fins, the wind guide and the partition board form a tubular wind channel, the heat dissipation fins and an outlet end of the fan are located in the wind channel, and an outlet of the wind channel is connected to the heat dissipation through hole.
8. An internet gateway with efficient heat dissipation as recited in claim 6, wherein the fan is an axial fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122650400.5U CN216057054U (en) | 2021-11-01 | 2021-11-01 | High-efficient radiating internet gateway |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122650400.5U CN216057054U (en) | 2021-11-01 | 2021-11-01 | High-efficient radiating internet gateway |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216057054U true CN216057054U (en) | 2022-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122650400.5U Active CN216057054U (en) | 2021-11-01 | 2021-11-01 | High-efficient radiating internet gateway |
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| Country | Link |
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| CN (1) | CN216057054U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117320422A (en) * | 2023-11-28 | 2023-12-29 | 合众新能源汽车股份有限公司 | Intelligent cabin domain controller and vehicle |
-
2021
- 2021-11-01 CN CN202122650400.5U patent/CN216057054U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117320422A (en) * | 2023-11-28 | 2023-12-29 | 合众新能源汽车股份有限公司 | Intelligent cabin domain controller and vehicle |
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