CN202085437U - Variable-frequency air conditioner heat radiator - Google Patents

Variable-frequency air conditioner heat radiator Download PDF

Info

Publication number
CN202085437U
CN202085437U CN2011202208504U CN201120220850U CN202085437U CN 202085437 U CN202085437 U CN 202085437U CN 2011202208504 U CN2011202208504 U CN 2011202208504U CN 201120220850 U CN201120220850 U CN 201120220850U CN 202085437 U CN202085437 U CN 202085437U
Authority
CN
China
Prior art keywords
heat
radiator
air conditioning
semiconductor chilling
dissipation base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011202208504U
Other languages
Chinese (zh)
Inventor
张先雄
洪伟东
陈秋红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL Air Conditioner Zhongshan Co Ltd
Original Assignee
TCL Air Conditioner Zhongshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TCL Air Conditioner Zhongshan Co Ltd filed Critical TCL Air Conditioner Zhongshan Co Ltd
Priority to CN2011202208504U priority Critical patent/CN202085437U/en
Application granted granted Critical
Publication of CN202085437U publication Critical patent/CN202085437U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

The utility model discloses a variable-frequency air conditioner heat radiator, which comprises a heat radiator and an electric control panel connected with the heat radiator, wherein the heat radiator comprises a heat radiation base, heat radiation fins and a semiconductor refrigeration sheet, a square groove is arranged in the center of the heat radiation base, and the hot end of the semiconductor refrigeration sheet is arranged in the groove of the heat radiation base. In the work process, on one hand, the cold end of the semiconductor refrigeration sheet absorbs partial heat of a high-power device, starts to refrigerate and transfers the cold back to the high-power device, so the temperature of the high-power device is reduced, the heat of the hot end is transferred to the heat radiator, and on the other hand, and the heat of the high-power device higher than that of the hot end is transmitted to the heat radiator through the semiconductor refrigeration sheet. The heat is taken away through the heat radiation fins of the heat radiator by the cooling air flow of an outdoor fan. Therefore, compared with the prior art, the variable-frequency air conditioner heat radiator also has the effects of heat absorption and cooling.

Description

A kind of transducer air conditioning heat abstractor
Technical field
The utility model relates to the air conditioner field, particularly a kind of transducer air conditioning heat abstractor.
Background technology
Along with the appearance of the new efficiency standard of country, convertible frequency air-conditioner is more and more welcome with advantages such as its superior performance, low energy consumption, and also along with the continuous of high-power frequency conversion air conditioner popularized, the caloric value of the components and parts on the automatically controlled plate of its off-premises station is also in continuous increase.Can raise because of heating causes temperature during electronic device work, if can not in time dispel the heat, may cause the performance of chip to reduce even burn out, especially for high power devices such as frequency-change air conditioner outdoor machine electronic control module and IGBT, except the temperature that guarantees operational environment in the reasonable scope, also must carry out effective radiating treatment to it.Therefore, the quality of heat abstractor determines the stability and the useful life of electronic device to a certain extent.
Existing air-cooled heat abstractor, be that the automatically controlled plate of off-premises station was taken with the end that screw is fastened on radiator, make heat pass to radiator, by radiating fin characteristic and mounting means by heat conduction, the wind eddies stream that utilizes the outdoor fan running to form comes cold sink, reaches the purpose of heat radiation.But the effect of this heat abstractor depends on the height of ambient temperature, if when ambient temperature is too high, its radiating effect descends at once, the heat of high power device is loose do not go out and causes that performance reduces, job insecurity.
The utility model content
The technical problems to be solved in the utility model is that the deficiency at prior art exists on the basis of wind-cooling heat dissipating, adds semiconductor refrigerating technology, and a kind of transducer air conditioning heat abstractor is provided.
For solving the problems of the technologies described above, construct a kind of transducer air conditioning heat abstractor, comprise radiator and the automatically controlled plate that is connected with radiator, described radiator comprises heat dissipation base and radiating fin, also comprise semiconductor chilling plate, described heat dissipation base central authorities are provided with a square groove, and the hot junction of described semiconductor chilling plate is installed in the groove of described heat dissipation base.
In the above-mentioned transducer air conditioning heat abstractor, the hot junction of described semiconductor chilling plate and the contact-making surface of radiator have one deck heat-conducting silicone grease.
In the above-mentioned transducer air conditioning heat abstractor, the cold junction of described semiconductor chilling plate and the contact-making surface of described automatically controlled plate have one deck heat-conducting silicone grease.
In the above-mentioned transducer air conditioning heat abstractor, the degree of depth of the drop-center of described heat dissipation base is 2mm, and its size is mated with the size of semiconductor chilling plate.
In the above-mentioned transducer air conditioning heat abstractor, described heat dissipation base is provided with several screw holes that is used to install described automatically controlled plate.
In the above-mentioned transducer air conditioning heat abstractor, described heat dissipation base is provided with several and is used for heat abstractor is fixed on screw hole on the automatically controlled box of air-conditioner outdoor unit
The utility model compared with prior art has the following advantages and good effect is: during work, the cold junction of semiconductor chilling plate absorbs the part heat of high power device on the one hand, begin refrigeration and cold is passed to high power device conversely, the temperature of high power device is reduced, and with the heat transferred radiator in hot junction; Semiconductor chilling plate is higher than high power device in the heat transferred radiator in hot junction on the other hand.Cooling airflow by outdoor fan is taken away heat through the radiating fin of radiator.Therefore, compared with prior art, it also has the effect of heat absorption, cooling.
Description of drawings
Fig. 1 is the heat spreader structures schematic diagram of the utility model transducer air conditioning heat abstractor;
Fig. 2 is the refrigeration principle schematic diagram of semiconductor chilling plate;
Fig. 3 is the utility model transducer air conditioning heat abstractor assembling schematic diagram;
Fig. 4 is the assembling schematic diagram of the utility model transducer air conditioning heat abstractor at air-conditioner outdoor unit.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing.
As shown in Figure 1, the transducer air conditioning heat abstractor that the utility model provides comprises radiator 1 and semiconductor chilling plate 2, and the automatically controlled plate 3 of the off-premises station that is connected with radiator 1.The hot junction of semiconductor chilling plate 2 closely is fitted in by heat-conducting silicone grease in the groove of radiator 1 base and (indicates among the heat conductive silica gel figure between described semiconductor chilling plate and the radiator), heat-conducting silicone grease is used for the space of filling semiconductor cooling piece 2 and radiator 1 contact-making surface making the contact heat resistance minimum.The cold junction of the automatically controlled plate of off-premises station 3 and semiconductor chilling plate 2 closely fits together by heat-conducting silicone grease (among the figure sign), and heat-conducting silicone grease is used for the space of filling semiconductor cooling piece and automatically controlled plate 3 contact-making surfaces of off-premises station making the contact heat resistance minimum.With screw with on automatically controlled plate 3 of off-premises station and semiconductor chilling plate 2 fixed heat sink 1 base.The degree of depth of the groove of radiator 1 base is 2mm, can make semiconductor chilling plate 2 not be shifted, fix easily, and can guarantee again has more space between automatically controlled plate 3 of off-premises station and the radiator 1.
Fig. 2 is the semiconductor refrigerating principle schematic.P type semiconductor and N type semiconductor material clip form path (claim thermoelectric to) between metal plate, outside under the effect of electric field, P type semiconductor at a point place the hole, need absorb certain heat from sheet metal, in order to improve the potential energy of self, just can enter in the P type semiconductor, so this some place temperature can reduce the formation cold junction; And in the hole at b point place, on the contrary, need discharge unnecessary energy just can enter in the sheet metal, at this moment this temperature raises, and forms hot junction.And be that free electron flows in N type semiconductor, the direction of it and hole flow is opposite, absorbs heat at c point place just can enter in the N type semiconductor, emits heat at d point place and just can enter into sheet metal.Therefore can absorb extraneous heat refrigeration here at a, c, become cold junction; And b, d have the unnecessary heat of release here, become the hot junction.
Fig. 3 is the heat spreader structures schematic diagram of the utility model transducer air conditioning heat abstractor.Radiator is made up of heat dissipation base 14 and some radiating fins 15.Heat dissipation base 14 central authorities are provided with a rectangular groove 13, and the length of groove 13 and wide size according to semiconductor chilling plate are decided, and the degree of depth is 2mm; Heat dissipation base 14 is provided with six automatically controlled plate mounting screw holes 12, and decide according to the screw hole location on the automatically controlled plate its position, hole; Heat dissipation base 14 also is provided with six electric-controlled box mounting screw holes 11, and decide together according to the screw hole location of electric-controlled box its position, hole, and above-mentioned screw hole can increase or reduce according to actual needs.
As shown in Figure 4, transducer air conditioning heat abstractor that the utility model provides and the automatically controlled plate 3 of off-premises station fixed thereon are fixed on the position of electric-controlled box 6 sides over against outdoor fan 8 together, make the space direction of 15 of fin fins consistent with airflow direction.The bottom shelf of electric-controlled box 6 is on off-premises station median septum 5, on the outer dynamo-electric machine support 7 of one end fixed chamber.When work, add the direct voltage of 12V at the two ends of semiconductor chilling plate, the cold junction of semiconductor chilling plate absorbs the part heat from the high power device on the automatically controlled plate 3 of off-premises station on the one hand, begin refrigeration, cold is passed to high power device conversely, the temperature of high power device is reduced, and with the heat transferred radiator in hot junction; Semiconductor chilling plate is higher than the transmission of the heat in hot junction by lattice energy with high power device on the other hand, moves to hot junction and conduction to radiator.During outdoor fan 8 runnings, cooling airflow is taken away heat through the radiating fin of radiator.Because the fin fin is consistent with airflow direction, the heat of radiator in time and is rapidly taken away in the wind-force blind area that effectively solves the traditional heat-dissipating device, and the hot junction of assurance semiconductor chilling plate works in relative low temperature.
Below only be concrete exemplary applications of the present utility model, protection range of the present utility model is not constituted any limitation.Utility model can also have other execution mode in addition to the implementation.All employings are equal to the technical scheme of replacement or equivalent transformation formation, all drop in the utility model scope required for protection.

Claims (6)

1. transducer air conditioning heat abstractor, comprise radiator and the automatically controlled plate that is connected with radiator, described radiator comprises heat dissipation base and radiating fin, it is characterized in that: also comprise semiconductor chilling plate, described heat dissipation base central authorities are provided with a square groove, and the hot junction of described semiconductor chilling plate is installed in the groove of described heat dissipation base.
2. transducer air conditioning heat abstractor according to claim 1 is characterized in that: the hot junction of described semiconductor chilling plate and the contact-making surface of radiator have one deck heat-conducting silicone grease.
3. transducer air conditioning heat abstractor according to claim 1 is characterized in that: the cold junction of described semiconductor chilling plate and the contact-making surface of described automatically controlled plate have one deck heat-conducting silicone grease.
4. transducer air conditioning heat abstractor according to claim 1 is characterized in that: the degree of depth of the drop-center of described heat dissipation base is 2mm, and its size is mated with the size of semiconductor chilling plate.
5. transducer air conditioning heat abstractor according to claim 1 is characterized in that: described heat dissipation base is provided with several screw holes that is used to install described automatically controlled plate.
6. transducer air conditioning heat abstractor according to claim 1 is characterized in that: described heat dissipation base is provided with several and is used for heat abstractor is fixed on screw hole on the automatically controlled box of air-conditioner outdoor unit.
CN2011202208504U 2011-06-27 2011-06-27 Variable-frequency air conditioner heat radiator Expired - Fee Related CN202085437U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011202208504U CN202085437U (en) 2011-06-27 2011-06-27 Variable-frequency air conditioner heat radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011202208504U CN202085437U (en) 2011-06-27 2011-06-27 Variable-frequency air conditioner heat radiator

Publications (1)

Publication Number Publication Date
CN202085437U true CN202085437U (en) 2011-12-21

Family

ID=45346048

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011202208504U Expired - Fee Related CN202085437U (en) 2011-06-27 2011-06-27 Variable-frequency air conditioner heat radiator

Country Status (1)

Country Link
CN (1) CN202085437U (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102931818A (en) * 2012-10-24 2013-02-13 广东美的暖通设备有限公司 Frequency conversion module heat abstractor and air conditioner
CN105042722A (en) * 2015-06-11 2015-11-11 珠海格力电器股份有限公司 Radiator, control method and device of same and air conditioner
CN105423512A (en) * 2015-12-21 2016-03-23 美的集团武汉制冷设备有限公司 Heat dissipation control device of electronic control module, and air conditioner and control method thereof
CN105674433A (en) * 2016-03-04 2016-06-15 青岛海尔空调器有限总公司 Frequency converter air-conditioning system for high-temperature environment
CN105890066A (en) * 2016-06-03 2016-08-24 海信(山东)空调有限公司 Cooling device for circuit board of outdoor unit of variable frequency air conditioner and electric control box of outdoor unit of variable frequency air conditioner
CN106016504A (en) * 2016-05-31 2016-10-12 海信(山东)空调有限公司 Frequency conversion air conditioner and radiator thereof
CN108103597A (en) * 2018-01-10 2018-06-01 中山大学 Electrospinning wire material reception device and Electrospun manufacturing equipment
CN110779105A (en) * 2019-10-22 2020-02-11 四川长虹空调有限公司 Waterproof assembly process for electric control box
WO2020211489A1 (en) * 2019-04-19 2020-10-22 青岛海尔空调器有限总公司 Outdoor air-conditioning unit and air conditioner

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102931818A (en) * 2012-10-24 2013-02-13 广东美的暖通设备有限公司 Frequency conversion module heat abstractor and air conditioner
CN105042722A (en) * 2015-06-11 2015-11-11 珠海格力电器股份有限公司 Radiator, control method and device of same and air conditioner
CN105423512A (en) * 2015-12-21 2016-03-23 美的集团武汉制冷设备有限公司 Heat dissipation control device of electronic control module, and air conditioner and control method thereof
CN105674433A (en) * 2016-03-04 2016-06-15 青岛海尔空调器有限总公司 Frequency converter air-conditioning system for high-temperature environment
CN106016504A (en) * 2016-05-31 2016-10-12 海信(山东)空调有限公司 Frequency conversion air conditioner and radiator thereof
CN106016504B (en) * 2016-05-31 2019-05-14 海信(山东)空调有限公司 A kind of convertible frequency air-conditioner radiator and transducer air conditioning
CN105890066A (en) * 2016-06-03 2016-08-24 海信(山东)空调有限公司 Cooling device for circuit board of outdoor unit of variable frequency air conditioner and electric control box of outdoor unit of variable frequency air conditioner
CN105890066B (en) * 2016-06-03 2019-07-16 海信(山东)空调有限公司 A kind of frequency-variable air conditioner outdoor machine circuit board radiating device and electric-controlled box
CN108103597A (en) * 2018-01-10 2018-06-01 中山大学 Electrospinning wire material reception device and Electrospun manufacturing equipment
CN108103597B (en) * 2018-01-10 2020-01-31 中山大学 Electrospinning material receiving device and electrospinning manufacturing equipment
WO2020211489A1 (en) * 2019-04-19 2020-10-22 青岛海尔空调器有限总公司 Outdoor air-conditioning unit and air conditioner
CN110779105A (en) * 2019-10-22 2020-02-11 四川长虹空调有限公司 Waterproof assembly process for electric control box

Similar Documents

Publication Publication Date Title
CN202085437U (en) Variable-frequency air conditioner heat radiator
CN202231001U (en) Chip cooling device for control module of variable frequency air conditioner
CN104035459B (en) The control method of the temperature of frequency converter and described frequency converter
CN105890066A (en) Cooling device for circuit board of outdoor unit of variable frequency air conditioner and electric control box of outdoor unit of variable frequency air conditioner
CN203279443U (en) Electric cabinet and air conditioner possessing same
CN105299950A (en) Solar semiconductor refrigerating system
CN104251522B (en) Air conditioning appliance case assembly and its air-conditioner outdoor unit
CN202948389U (en) Semiconductor central processing unit (CPU) radiator
CN205784105U (en) Semiconductor refrigerating module and the cold closet including this module with solid-state fan
CN203810590U (en) Air conditioning electric control box cooling device and air conditioning comprising same
CN203322882U (en) Active cooling type high-power light-emitting diode (LED) street lamp
CN201475747U (en) High-power LED lighting lamp with radiating structure
CN202353034U (en) Semiconductor refrigerating and cooling device of sealing type power distribution cabinet
CN202949128U (en) Radiator and laser with the radiator
CN208477255U (en) A kind of radiator for display
CN202813870U (en) Heat dissipation device of semiconductor cooler
CN206973503U (en) A kind of three-dimensional convection heat radiation light source module group radiator
CN202551578U (en) Air-conditioning controller heat radiation device and mobile air conditioner using the same
CN202888236U (en) High-efficiency radiating high-power light-emitting diode (LED)
CN206099401U (en) Electric vehicle charging ware with refrigeration function
CN201748700U (en) Flue gas condenser
CN203136189U (en) PTC heat pipe heater
CN202476019U (en) Heat dissipation device used for high-power digital television repeater
CN202734090U (en) Air conditioner cooling device
CN202121918U (en) Radiating device of frequency converting air conditioner

Legal Events

Date Code Title Description
GR01 Patent grant
C14 Grant of patent or utility model
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111221

Termination date: 20140627

EXPY Termination of patent right or utility model