CN114979809A - Industry internet gateway heat radiation structure - Google Patents
Industry internet gateway heat radiation structure Download PDFInfo
- Publication number
- CN114979809A CN114979809A CN202210752818.3A CN202210752818A CN114979809A CN 114979809 A CN114979809 A CN 114979809A CN 202210752818 A CN202210752818 A CN 202210752818A CN 114979809 A CN114979809 A CN 114979809A
- Authority
- CN
- China
- Prior art keywords
- cooling
- internet gateway
- heat dissipation
- casing
- still
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title claims description 6
- 238000001816 cooling Methods 0.000 claims abstract description 63
- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims description 25
- 238000005057 refrigeration Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 8
- 239000011550 stock solution Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 description 7
- 239000002826 coolant Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04Q—SELECTING
- H04Q1/00—Details of selecting apparatus or arrangements
- H04Q1/02—Constructional details
- H04Q1/035—Cooling of active equipments, e.g. air ducts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Networks & Wireless Communication (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an industrial internet gateway heat dissipation structure which comprises a shell, wherein a mounting plate in the horizontal direction is installed in the shell, an internet gateway main body is fixed at the upper end of the mounting plate through a fixing seat, a cooling mechanism installed in the shell is further arranged at the lower end of the mounting plate, and a heat dissipation mechanism is further installed at the upper half part of the shell.
Description
Technical Field
The invention relates to the technical field of internet gateways, in particular to an industrial internet gateway heat dissipation structure.
Background
An internet gateway is a bridge connecting an intranet and the internet, and the gateway can collect information and upload the collected information to a system, and a gateway address can be understood as a communication address for information transmission between the intranet and the internet. The internet gateway is also widely used in industry, the working time of the internet gateway usually needs continuous work, and long-time work can generate a large amount of heat in the gateway, so that the heat needs to be timely dissipated in order to not influence the normal use of the gateway. In the prior art, the internet gateway is provided with the vent holes to dissipate heat in the gateway, but the vent holes are small, so that the heat dissipation speed is very slow, the heat is easy to accumulate in the gateway, and internal parts are easy to damage.
Disclosure of Invention
The invention aims to provide an industrial internet gateway heat dissipation structure to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides an industry internet gateway heat radiation structure, includes the casing, its characterized in that: install the mounting panel of horizontal direction in the casing, the mounting panel upper end is fixed with internet gateway main part through the fixing base, the mounting panel lower extreme still installs the cooling mechanism in the casing, first half still installs heat dissipation mechanism in the casing.
The cooling mechanism is including installing the cooling case in the inside bottom surface of casing, the division board of horizontal direction is installed to cooling case intermediate position, the division board divide into the cooling chamber on upper portion and the stock solution chamber of lower part with the cooling case, the solenoid valve is still installed to the division board lower extreme, the cooling tube is still installed to the mounting panel upper end, the feed liquor end and the stock solution chamber intercommunication of cooling tube, the play liquid end and the cooling chamber intercommunication of cooling tube, still install the transfer pump on the cooling tube. Through setting up cooling mechanism, be convenient for cool down the internet gateway main part.
Preferably, the cooling pipes are distributed in an S shape at the upper end of the mounting plate.
Preferably, a plurality of radiating fins are further distributed and mounted at the lower end of the fixed seat.
Preferably, the heat sink is made of copper material.
Preferably, the heat dissipation mechanism is including fixing the heat insulating board in the first half in the casing, the heat insulating board lower extreme is fixed with leads cold fin, the heat insulating board upper end is inlayed and is equipped with the semiconductor refrigeration piece, the refrigeration end and the lead cold fin fixed connection of semiconductor refrigeration piece, the thermovent has still been seted up to the first half left and right sides of casing, each all install the dust screen in the thermovent, radiator fan is still installed to the correspondence thermovent position in the heat insulating board upper end left and right sides. Through setting up heat dissipation mechanism, can dispel the heat to the internet gateway main part.
Preferably, the insulation panels are made of fiberglass material.
Preferably, still include level sensor and controller, the inside roof of cooling chamber is fixed with level sensor, still install the controller in the casing, level sensor, solenoid valve all are connected with the controller electricity. Through setting up controller cooperation level sensor and solenoid valve, be convenient for in time with the coolant liquid discharge stock solution intracavity in the cooling chamber.
Compared with the prior art, the invention has the beneficial effects that: the cooling mechanism is arranged, so that the temperature of the internet gateway can be conveniently reduced; through setting up heat dissipation mechanism, be convenient for accelerate internet gateway's heat dissipation. The invention has simple structure, can effectively improve the heat dissipation effect of the Internet gateway and can bring convenience to the technical field of the Internet gateway.
Drawings
Fig. 1 is a schematic front sectional structural view of an industrial internet gateway heat dissipation structure;
fig. 2 is a schematic view of a cooling pipe of an industrial internet gateway heat dissipation structure in a top view.
In the figure: the system comprises a shell, a mounting plate, a fixing seat, a heat radiating plate, an internet gateway main body, a cooling mechanism, a cooling box, a solenoid valve, a partition plate, a cooling pipe, a liquid conveying pump, a liquid level sensor, a heat radiating mechanism, a heat radiating opening, a dustproof net, a heat radiating fan, a heat insulating plate, a cold guiding plate and a semiconductor refrigerating plate, wherein the shell is 1, the mounting plate is 11, the fixing seat is 13, the heat radiating plate is 14, the internet gateway main body is 15, the cooling mechanism is 2, the cooling box is 21, the solenoid valve is 22, the partition plate is 23, the cooling pipe is 24, the liquid conveying pump is 25, the liquid level sensor is 26, the heat radiating mechanism is 3, the heat radiating opening is 31, the dustproof net is 32, the heat radiating fan is 33, the heat insulating plate is 34, the cold guiding plate is 35, and the semiconductor refrigerating plate is 36.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: referring to fig. 1-2, an industrial internet gateway heat radiation structure includes a housing 1, a mounting plate 11 in a horizontal direction is installed in the housing 1, an internet gateway main body 15 is fixed at the upper end of the mounting plate 11 through a fixing seat 13, a cooling mechanism 2 is also installed in the housing 1 at the lower end of the mounting plate 11, and a heat radiation mechanism 3 is also installed at the upper half part of the housing 1. The mounting plate 11 is made of a material with good thermal conductivity, so that heat conduction is facilitated.
In this embodiment, cooling mechanism 2 is including installing cooling box 21 in the inside bottom surface of casing 1, the division board 23 of horizontal direction is installed to cooling box 21 intermediate position, division board 23 divide into the cooling chamber on upper portion and the stock solution chamber of lower part with cooling box 21, solenoid valve 22 is still installed to division board 23 lower extreme, cooling tube 24 is still installed to mounting panel 11 upper end, cooling tube 24's feed liquor end and stock solution chamber intercommunication, cooling tube 24's play liquid end and cooling chamber intercommunication, still install transfer pump 25 on the cooling tube 24.
During the use, open transfer pump 25, with the coolant liquid input cooling tube 24 in the stock solution chamber, the heat that radiating fin 14 gave out is absorbed to the coolant liquid in cooling tube 24 afterwards, discharges the coolant liquid into the cooling chamber at last and cools off, the subsequent use of being convenient for.
In this embodiment, the cooling tubes 24 are distributed in an S-shape at the upper end of the mounting plate 11. The cooling tubes 24 are distributed on the mounting plate 11 in an S-shape, so that the length of the cooling tubes 24 can be increased, and the heat emitted from the radiating fins 14 can be better absorbed.
In this embodiment, a plurality of fins 14 are further distributed and installed at the lower end of the fixing seat 13, the fins 14 are made of copper material, and the copper material has good heat-conducting property and is convenient for heat dissipation.
In this embodiment, the heat dissipation mechanism 3 includes the heat insulating board 34 fixed at the first half in the casing 1, the heat insulating board 34 lower extreme is fixed with leads cold plate 35, semiconductor refrigeration piece 36 is inlayed to heat insulating board 34 upper end, the refrigeration end and the lead cold plate 35 fixed connection of semiconductor refrigeration piece 36, thermovent 31 has still been seted up to the first half left and right sides of casing 1, each all install dust screen 32 in the thermovent 31, radiator fan 33 is still installed to the correspondence thermovent 31 position of the heat insulating board 34 upper end left and right sides, heat insulating board 34 is made by glass fiber material.
During the use, refrigerate through semiconductor refrigeration piece 36, semiconductor refrigeration piece 36 lower extreme is the refrigeration end, and the heat exchange of better realization internet gateway main part 15 and semiconductor refrigeration piece 36 of being convenient for is led cold piece 35, and internet gateway main part 15 of being convenient for dispels the heat, opens radiator fan 33 simultaneously, discharges casing 1 with the heat that semiconductor refrigeration piece 36 hot junction distributed.
Example 2: referring to fig. 1-2, the difference between the industrial internet gateway heat dissipation structure and embodiment 1 is that the industrial internet gateway heat dissipation structure further includes a liquid level sensor 26 and a controller, the liquid level sensor 26 is fixed on the top wall inside the cooling cavity, the controller is further installed inside the housing 1, and both the liquid level sensor 26 and the electromagnetic valve 22 are electrically connected to the controller.
When the liquid level sensor 26 is used, the liquid level of the liquid level sensor is set through the controller, when the liquid level in the cooling cavity reaches a set threshold value, the electromagnetic valve 22 is opened through the controller, the cooling liquid in the cooling cavity is discharged into the liquid storage cavity, and therefore the cooling liquid can be reused.
The working principle of the invention is as follows: firstly, the liquid level of a liquid level sensor 26 is set through a controller, when the liquid level sensor is used, an infusion pump 25 is started, cooling liquid in a liquid storage cavity is input into a cooling pipe 24, then the cooling liquid in the cooling pipe 24 absorbs heat emitted by a radiating fin 14, and finally the cooling liquid is discharged into the cooling cavity for cooling, when the liquid level in the cooling cavity reaches a set threshold value, the controller opens an electromagnetic valve 22, and the cooling liquid in the cooling cavity is discharged into the liquid storage cavity, so that the repeated use of the cooling liquid is realized; simultaneously through the refrigeration of semiconductor refrigeration piece 36, 36 lower extremes of semiconductor refrigeration piece are the refrigeration end, and the heat exchange of better realization internet gateway main part 15 and semiconductor refrigeration piece 36 of being convenient for is led cold piece 35, and the internet gateway main part 15 of being convenient for dispels the heat, opens radiator fan 33 simultaneously, discharges casing 1 with the heat that 36 hot ends of semiconductor refrigeration piece distributed, further improves the radiating effect of internet gateway main part 15.
In the present invention, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only terms of relationships determined for convenience of describing structural relationships of the parts or elements of the present invention, and are not intended to refer to any parts or elements of the present invention, and are not to be construed as limiting the present invention.
Claims (8)
1. The utility model provides an industry internet gateway heat radiation structure, includes casing (1), its characterized in that: install mounting panel (11) of horizontal direction in casing (1), mounting panel (11) upper end is fixed with internet gateway main part (15) through fixing base (13), mounting panel (11) lower extreme is installed cooling mechanism (2) in casing (1) in addition, first one still installs heat dissipation mechanism (3) in casing (1).
2. The industrial internet gateway heat dissipation structure of claim 1, wherein: cooling mechanism (2) are including installing cooling box (21) in the inside bottom surface of casing (1), cooling box (21) intermediate position installs division board (23) of horizontal direction, division board (23) divide into cooling chamber on upper portion and stock solution chamber of lower part with cooling box (21), solenoid valve (22) are still installed to division board (23) lower extreme, cooling tube (24) are still installed to mounting panel (11) upper end, the feed liquor end and the stock solution chamber intercommunication of cooling tube (24), the play liquid end and the cooling chamber intercommunication of cooling tube (24), still install transfer pump (25) on cooling tube (24).
3. The industrial internet gateway heat dissipation structure of claim 2, wherein: the cooling pipes (24) are distributed on the upper end of the mounting plate (11) in an S shape.
4. The industrial internet gateway heat dissipation structure of claim 3, wherein: and a plurality of radiating fins (14) are distributed at the lower end of the fixed seat (13).
5. The industrial internet gateway heat dissipation structure of claim 4, wherein: the heat sink (14) is made of copper material.
6. The industrial internet gateway heat dissipation structure of claim 5, wherein: heat dissipation mechanism (3) are including fixing heat insulating board (34) first in casing (1), heat insulating board (34) lower extreme is fixed with leads cold plate (35), heat insulating board (34) upper end is inlayed and is equipped with semiconductor refrigeration piece (36), the refrigeration end and lead cold plate (35) fixed connection of semiconductor refrigeration piece (36), thermovent (31), each have still been seted up to casing (1) first left and right sides all install dust screen (32) in thermovent (31), radiator fan (33) are still installed to heat insulating board (34) upper end left and right sides correspondence thermovent (31) position.
7. The industrial internet gateway heat dissipation structure of claim 6, wherein: the insulating panels (34) are made of a fiberglass material.
8. The industrial internet gateway heat dissipation structure of claim 7, wherein: still include level sensor (26) and controller, the inside roof of cooling chamber is fixed with level sensor (26), still install the controller in casing (1), level sensor (26), solenoid valve (22) all are connected with the controller electricity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210752818.3A CN114979809A (en) | 2022-06-28 | 2022-06-28 | Industry internet gateway heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210752818.3A CN114979809A (en) | 2022-06-28 | 2022-06-28 | Industry internet gateway heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114979809A true CN114979809A (en) | 2022-08-30 |
Family
ID=82966719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210752818.3A Pending CN114979809A (en) | 2022-06-28 | 2022-06-28 | Industry internet gateway heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114979809A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210629735U (en) * | 2019-12-03 | 2020-05-26 | 武汉众联恒兴科技有限公司 | Efficient heat dissipation core network switch |
| CN112543139A (en) * | 2020-12-02 | 2021-03-23 | 广东轻工职业技术学院 | Industrial internet gateway |
| CN213876585U (en) * | 2021-01-05 | 2021-08-03 | 南京贝翼信息技术有限公司 | Micro-isolation network structure carding device |
| CN214014864U (en) * | 2020-12-25 | 2021-08-20 | 北京知形科技有限公司 | Industrial Internet robot scheduling mechanism based on cloud computing |
| WO2021191781A1 (en) * | 2020-03-24 | 2021-09-30 | Tdk Corporation | Heat dissipation mechanism, gateway, and lite-gateway |
| CN214376852U (en) * | 2021-03-24 | 2021-10-08 | 中慧城通科技发展有限公司 | A marginal gateway equipment for conversion of wisdom smoke sensation data |
| WO2022032846A1 (en) * | 2020-08-12 | 2022-02-17 | 苏州祺烁信息科技有限公司 | High heat dissipation mounting box for network information device |
| CN216057054U (en) * | 2021-11-01 | 2022-03-15 | 厦门微芯云智能科技研究院有限公司 | High-efficient radiating internet gateway |
-
2022
- 2022-06-28 CN CN202210752818.3A patent/CN114979809A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210629735U (en) * | 2019-12-03 | 2020-05-26 | 武汉众联恒兴科技有限公司 | Efficient heat dissipation core network switch |
| WO2021191781A1 (en) * | 2020-03-24 | 2021-09-30 | Tdk Corporation | Heat dissipation mechanism, gateway, and lite-gateway |
| WO2022032846A1 (en) * | 2020-08-12 | 2022-02-17 | 苏州祺烁信息科技有限公司 | High heat dissipation mounting box for network information device |
| CN112543139A (en) * | 2020-12-02 | 2021-03-23 | 广东轻工职业技术学院 | Industrial internet gateway |
| CN214014864U (en) * | 2020-12-25 | 2021-08-20 | 北京知形科技有限公司 | Industrial Internet robot scheduling mechanism based on cloud computing |
| CN213876585U (en) * | 2021-01-05 | 2021-08-03 | 南京贝翼信息技术有限公司 | Micro-isolation network structure carding device |
| CN214376852U (en) * | 2021-03-24 | 2021-10-08 | 中慧城通科技发展有限公司 | A marginal gateway equipment for conversion of wisdom smoke sensation data |
| CN216057054U (en) * | 2021-11-01 | 2022-03-15 | 厦门微芯云智能科技研究院有限公司 | High-efficient radiating internet gateway |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101600325A (en) | A kind of combination heat abstractor of closed shell electronic equipment | |
| CN211297490U (en) | Novel high-efficient radiating data center rack | |
| CN220156945U (en) | Radiating assembly, electric control box and air conditioner | |
| CN209946807U (en) | Auxiliary heat dissipation device for computer case | |
| CN114979809A (en) | Industry internet gateway heat radiation structure | |
| CN214901176U (en) | Embedded network switch | |
| CN212970620U (en) | Switch | |
| CN212341816U (en) | Computer modularization radiator unit | |
| CN211297520U (en) | Integrated data processing cabinet | |
| CN210399246U (en) | Air condensing units and air conditioner | |
| CN112123723A (en) | Cooling system of injection mold | |
| CN221652613U (en) | Network switch convenient for heat dissipation for computer | |
| CN219628218U (en) | Communication cabinet heat abstractor for communication engineering | |
| CN218996003U (en) | Server cooling system | |
| CN113453473B (en) | Communication cabinet supporting 700MHz and DRAN | |
| CN213300521U (en) | Efficient radiator coated with heat dissipation coating | |
| CN219893720U (en) | SVG water-cooling heat abstractor | |
| CN221710124U (en) | Master set that radiating effect is good | |
| CN218676386U (en) | LED double-sided display screen | |
| CN220208210U (en) | Novel computer radiator | |
| CN218603848U (en) | Computer lab air conditioner radiator | |
| CN216286545U (en) | Water cooling circulation system for computer server room | |
| CN218163115U (en) | Electromechanical integrated equipment | |
| CN219225908U (en) | Heat radiation equipment for storage | |
| CN220292453U (en) | G-type heat pipe arrangement heat dissipation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |