CN218163115U

CN218163115U - Electromechanical integrated equipment

Info

Publication number: CN218163115U
Application number: CN202222401746.6U
Authority: CN
Inventors: 连友; 牟欢
Original assignee: Shenyang Yuhua Electric Technology Co ltd
Current assignee: Shenyang Yuhua Electric Technology Co ltd
Priority date: 2022-09-09
Filing date: 2022-09-09
Publication date: 2022-12-27
Anticipated expiration: 2032-09-09

Abstract

The utility model discloses an mechatronic equipment, including installing the installing frame on mechatronic equipment, the lateral wall symmetry of installing frame is provided with two restriction framves, two be provided with the casing between the restriction frame, the lateral wall symmetry of casing is provided with two handles, the thermovent has been seted up to the lateral wall of casing, the inside of thermovent is inlayed and is equipped with the dust screen, two radiator fan are installed to the inboard of thermovent, the inboard fixedly connected with cooling tube of casing, the one end fixedly connected with heat-conducting plate of casing is kept away from to the cooling tube. The utility model discloses utilize the water in the quick cooling water tank of mode of semiconductor refrigeration piece, need not to add the ice-cube, and can guarantee the long-time supply of cooling water, the cooling effect can not descend along with the extension of time.

Description

Electromechanical integrated equipment

Technical Field

The utility model relates to an electromechanical integration equipment technical field especially relates to an electromechanical integration equipment.

Background

The mechatronics technology is a comprehensive technology which organically combines a plurality of technologies such as a mechanical technology, an electrical and electronic technology, a microelectronic technology, an information technology, a sensor technology, an interface technology, a signal conversion technology and the like and comprehensively applies the technologies to practice, and modern automatic production equipment is almost all mechatronics equipment. The air cooling and heat dissipation effects of the electromechanical integrated equipment in the prior art are poor, and the heat dissipation device and the electromechanical integrated equipment are fixed by bolts, so that the heat dissipation device is inconvenient to mount;

for this reason, application number is CN202121839048.3 high-efficient heat abstractor of mechatronic equipment, which comprises a housin, the welding of one side outer wall of casing has first connecting pipe, the welding of one side outer wall of casing has the second connecting pipe, the welding has evenly distributed's heat exchange tube between first connecting pipe and the second connecting pipe, evenly distributed's fin has been cup jointed to the outside of heat exchange tube, there is the fan one side outer wall of casing through bolted connection, the welding of one side outer wall of first connecting pipe has the inlet tube, the welding of one side outer wall of second connecting pipe has the outlet pipe, one side of casing is provided with the insulation can, there is the water pump one side outer wall of insulation can through bolted connection, the delivery port and the inlet tube of water pump pass through pipe connection, the water inlet and the insulation can of water pump pass through pipe connection. The utility model utilizes the cooling water introduced into the heat exchange tube to cool the air in the shell, and then blows the cold air into the mechatronic equipment through the fan, thereby ensuring the heat dissipation effect of the mechatronic equipment to be more efficient;

however, in the actual operation process, the insulation can needs to be opened every time the mechatronic device is in operation to dissipate heat, and then cooling water and ice cubes are added into the insulation can, so that the heat dissipation of the integrated device is not facilitated, and the cooling effect of the ice cubes can be gradually reduced along with time, and the use requirement cannot be met.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the mechatronic equipment that proposes, its water that utilizes the quick cooling water tank of mode of semiconductor refrigeration piece need not to add the ice-cube, and can guarantee the long-time supply of cooling water, and the cooling effect can not descend along with the extension of time.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides an mechatronic equipment, is including installing the installing frame on mechatronic equipment, the lateral wall symmetry of installing frame is provided with two restriction framves, two be provided with the casing between the restriction frame, the lateral wall symmetry of casing is provided with two handles, the thermovent has been seted up to the lateral wall of casing, the inside of thermovent is inlayed and is equipped with the dust screen, two radiator fan are installed to the inboard of thermovent, the inboard fixedly connected with cooling tube of casing, the one end fixedly connected with heat-conducting plate of casing is kept away from to the cooling tube, the lateral wall of casing is provided with and is used for the refrigerated water-cooling mechanism of heat-conducting plate.

Preferably, two the mounting groove has all been seted up to the relative one side of restriction frame, both ends are located two mounting grooves respectively about the casing.

Preferably, the cross section of the shell is of a T-shaped structure.

Preferably, water-cooling mechanism includes the water tank of fixed connection on the casing lateral wall, the inboard of water tank inlays and is equipped with the semiconductor refrigeration piece, the upper end fixedly connected with water pump of water tank, the water pump passes through the inlet tube and is connected with the heat-conducting plate, the heat-conducting plate is provided with the cooling water course that communicates with the inlet tube with the cooling tube in jointly, the other end of cooling water course passes through outlet pipe and water tank intercommunication.

Preferably, the part of the cooling water channel in the heat conducting plate is of a serpentine structure, and the part in the cooling pipe is arranged in a spiral manner.

Preferably, the cooling pipe is of a square structure, and a plurality of radiating fins are arranged on the inner side of the cooling pipe at equal intervals.

Preferably, the cold end of the semiconductor refrigeration piece is positioned in the water tank, and the hot end of the semiconductor refrigeration piece is positioned outside the water tank.

The utility model discloses possess following beneficial effect:

1. through the arrangement of the limiting plates, the shell and the handle, the shell can be directly inserted into the limiting plates and fixed between the limiting plates under the action of the weight of the shell and the weight of the water tank, and the handle is convenient for lifting the shell;

2. through the arrangement of the semiconductor refrigerating sheet, the water in the water tank can be cooled, the mode of adding ice blocks is not needed, the purpose of cooling the water is achieved, and the cooling device is simple and quick;

3. through radiator fan, heat-conducting plate, cooling tube, water-cooling mechanism's setting, utilize the cooling water to reduce the temperature of heat-conducting plate, cooling tube to make the air of process cool down inside, so that the air of blowing to mechatronic equipment is cold air, reaches better radiating effect.

Drawings

Fig. 1 is a schematic structural view of an mechatronic device provided by the present invention;

fig. 2 is a back sectional view of a housing of an mechatronic device provided by the present invention;

fig. 3 is a perspective view of a heat-conducting plate of an mechatronic device provided by the present invention;

fig. 4 is a perspective view of the mounting plate of the mechatronic device provided by the utility model.

In the figure: the cooling device comprises a mounting frame 1, a limiting frame 2, a shell 3, a water outlet pipe 4, a handle 5, a heat dissipation opening 6, a heat dissipation fan 7, a dust screen 8, a water pump 9, a water inlet pipe 10, a semiconductor refrigeration piece 11, a heat conduction plate 12, a cooling water channel 13, a heat dissipation fin 14 and a cooling pipe 15.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-4, an mechatronic device comprises an installation frame 1 installed on the mechatronic device, wherein two limiting frames 2 are symmetrically arranged on the side wall of the installation frame 1, a shell 3 is arranged between the two limiting frames 2, two handles 5 are symmetrically arranged on the side wall of the shell 3, the cross section of the shell 3 is of a T-shaped structure, mounting grooves are formed in the opposite sides of the two limiting frames 2, the left end and the right end of the shell 3 are respectively positioned in the two mounting grooves, a heat dissipation port 6 is formed in the side wall of the shell 3, a dust screen 8 is embedded in the heat dissipation port 6, and two cooling fans 7 are installed on the inner side of the heat dissipation port 6;

the inner side of the shell 3 is fixedly connected with a cooling pipe 15, one end of the cooling pipe 15, which is far away from the shell 3, is fixedly connected with a heat-conducting plate 12, the side wall of the shell 3 is provided with a water cooling mechanism for cooling the heat-conducting plate 12, the water cooling mechanism comprises a water tank fixedly connected to the side wall of the shell 3, a semiconductor refrigerating sheet 11 is embedded in the inner side of the water tank, the cold end of the semiconductor refrigerating sheet 11 is positioned in the water tank, the hot end of the semiconductor refrigerating sheet 11 is positioned outside the water tank, the upper end of the water tank is fixedly connected with a water pump 9, the water pump 9 is connected with the heat-conducting plate 12 through a water inlet pipe 10, the heat-conducting plate 12 and the cooling pipe 15 are both internally provided with a cooling water channel 13 communicated with the water inlet pipe 10, and the other end of the cooling water channel 13 is communicated with the water tank through a water outlet pipe 4;

the part that cooling water course 13 is located heat-conducting plate 12 is serpentine, and the part that is located cooling tube 15 is the heliciform setting, and heat-conducting plate 12 all adopts aluminium system with cooling tube 15, possesses better heat conductivility, makes things convenient for heat-conduction, reduces the temperature of air, and cooling tube 15 is a mouthful style of calligraphy structure, and the inboard equidistant a plurality of radiating fin 14 that are provided with of cooling tube 15.

The working principle is as follows:

during the heat dissipation, open radiator fan 7, water pump 9, semiconductor refrigeration piece 11 can carry out cooling treatment with the water in the water tank, water pump 9 is with cooling water through inlet tube 10 pump income cooling water course 13 in, make heat-conducting plate 12 and cooling tube 15 can cool off, this moment, under radiator fan 7's effect, radiator fan 7 takes away the air in the external world in casing 3 through thermovent 6, through the in-process of cooling tube 15, because cooling tube 15, radiating fin 14, the heat conductivility of heat-conducting plate 12, can reduce the temperature of air, reach the effect of cooling, thereby can blow the air after the cooling to electromechanical integration equipment, reach good radiating effect.

Above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be included in the protection scope of the present invention.

Claims

1. The utility model provides an mechatronic equipment, is including installing frame (1) on mechatronic equipment, its characterized in that, the lateral wall symmetry of installing frame (1) is provided with two restriction framves (2), two be provided with casing (3) between restriction frame (2), the lateral wall symmetry of casing (3) is provided with two handle (5), thermovent (6) have been seted up to the lateral wall of casing (3), the inside of thermovent (6) is inlayed and is equipped with dust screen (8), two radiator fan (7) are installed to the inboard of thermovent (6), inboard fixedly connected with cooling tube (15) of casing (3), the one end fixedly connected with heat-conducting plate (12) of casing (3) are kept away from in cooling tube (15), the lateral wall of casing (3) is provided with and is used for heat-conducting plate (12) refrigerated water-cooling mechanism.

2. The mechatronic device according to claim 1, wherein each of the two opposite sides of the limiting frame (2) is provided with a mounting groove, and the left end and the right end of the housing (3) are respectively positioned in the two mounting grooves.

3. The mechatronic device according to claim 1, characterized in that the cross-section of the housing (3) is of a T-shaped configuration.

4. The mechatronic device according to claim 1, wherein the water cooling mechanism comprises a water tank fixedly connected to a side wall of the housing (3), a semiconductor refrigerating plate (11) is embedded inside the water tank, a water pump (9) is fixedly connected to an upper end of the water tank, the water pump (9) is connected with a heat conducting plate (12) through an inlet pipe (10), a cooling water channel (13) communicated with the inlet pipe (10) is jointly arranged in the heat conducting plate (12) and the cooling pipe (15), and the other end of the cooling water channel (13) is communicated with the water tank through an outlet pipe (4).

5. The mechatronic device according to claim 4, characterized in that the cooling water channels (13) are arranged in a serpentine configuration in the heat-conducting plate (12) and in a spiral configuration in the cooling pipe (15).

6. An mechatronic device according to claim 1, characterized in that the cooling tube (15) is of a square structure, and a plurality of heat dissipating fins (14) are arranged on the inside of the cooling tube (15) at equal intervals.

7. An mechatronic device according to claim 4, characterized in that the cold end of the semiconductor refrigeration plate (11) is located inside the water tank and the hot end is located outside the water tank.