CN216796551U - Semiconductor constant temperature air conditioning suit - Google Patents

Abstract

The utility model relates to the technical field of air-conditioning clothes, in particular to a semiconductor constant-temperature air-conditioning clothes. A semiconductor constant-temperature air-conditioning suit comprises a suit body, a semiconductor refrigerating system, a water tank and a water pump; the clothes main body is provided with a waterway circulating pad in an attaching way; semiconductor refrigerating system is including leading cold spare, semiconductor refrigeration device and radiator unit, the one end laminating of leading cold spare set up in a side of water tank, the other end of leading cold spare with it holds to press from both sides between the radiator unit semiconductor refrigeration device, so that semiconductor refrigeration device's cold junction face laminating in lead cold spare. The semiconductor constant-temperature air conditioning suit can realize constant temperature of the air conditioning suit, is high in refrigerating efficiency, can enable the whole surface of the air conditioning suit to be uniformly cooled, effectively reduces the weight of the air conditioning suit, improves the wearing comfort level, and solves the problem that the existing air conditioning suit is poor in wearing comfort level due to large weight, uneven temperature and low refrigerating efficiency.

Description

Semiconductor constant temperature air conditioner clothes

Technical Field

The utility model relates to the technical field of air-conditioning clothes, in particular to a semiconductor constant-temperature air-conditioning clothes.

Background

Outdoor workers such as duty personnel, medical care personnel and the like often need to work outdoors for a long time in a relatively hot environment, and the environment for long-term outdoor work is severe, particularly in hot summer, high-temperature heatstroke easily occurs. The air-conditioning suit on the market usually adopts an air-cooling structure, a plurality of refrigerating system modules need to be arranged, the weight of the suit can be increased, and after the air-conditioning suit is worn, a cooling area can be concentrated in a cooling capacity transmission area of a refrigerating module, so that the problem of uneven temperature of the whole air-conditioning suit can not be solved, the constant temperature of the air-conditioning suit can not be realized, and in addition, the problem of low refrigerating efficiency is also solved, and the wearing comfort degree is directly influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor constant-temperature air-conditioning suit, which can realize constant temperature of the air-conditioning suit, has high refrigeration efficiency, can uniformly cool the whole surface of the air-conditioning suit, effectively reduces the weight of the air-conditioning suit, improves the wearing comfort level, and solves the problems of poor wearing comfort level caused by large weight, nonuniform temperature and low refrigeration efficiency of the conventional air-conditioning suit.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a semiconductor constant-temperature air-conditioning suit comprises a suit body, a semiconductor refrigerating system, a water tank and a water pump;

the clothes main body is provided with a waterway circulation pad in an attaching manner;

the semiconductor refrigeration system comprises a cold conducting piece, a semiconductor refrigeration device and a heat dissipation assembly, wherein one end of the cold conducting piece is attached to one side face of the water tank, the semiconductor refrigeration device is clamped between the other end of the cold conducting piece and the heat dissipation assembly, so that the cold end face of the semiconductor refrigeration device is attached to the cold conducting piece, and the hot end face of the semiconductor refrigeration device is attached to the heat dissipation assembly;

the water inlet end of the water pump is communicated with the water outlet end of the waterway circulation cushion, the water outlet end of the water pump is communicated with the water inlet end of the water tank, and the water outlet end of the water tank is communicated with the water inlet end of the waterway circulation cushion.

In a further aspect, the cold guide member is integrally formed on a side of the water tank.

Further, an installation groove is formed in one side face of the water tank, and the cold guide piece is detachably embedded in the installation groove;

and one side of the cold guide piece, which is close to the water tank, is provided with cold guide fins, and the cold guide fins are positioned in the mounting grooves.

Further, the heat dissipation assembly comprises a heat dissipation block and at least one heat dissipation fan, wherein the heat dissipation block comprises a heat dissipation plate and heat dissipation fins;

the hot end surface of the semiconductor refrigerating device is attached to the heat dissipation plate, and the heat dissipation fins are arranged on one side, far away from the semiconductor refrigerating device, of the heat dissipation plate;

the heat radiation fan is arranged on the side face of the ventilation channel of the heat radiation fin.

Further, the number of the heat dissipation fans is two, and the two heat dissipation fans are symmetrically arranged on two sides of the ventilation channel of the heat dissipation fin.

Further, the heat dissipation assembly further includes a heat dissipation fan cover, and the heat dissipation fan cover is covered outside the heat dissipation fan.

Further, the semiconductor refrigeration system further comprises a sponge frame, an installation opening is arranged in the middle of the sponge frame in a penetrating mode, and the semiconductor refrigeration device is clamped in the installation opening of the sponge frame.

Further, the refrigerator also comprises a shell, wherein the shell comprises a shell cover and a shell body, the shell cover is arranged on the shell body, and the semiconductor refrigeration system, the water tank and the water pump are arranged in the shell body;

the shell body is provided with at least one ventilation opening, and the ventilation opening is arranged at the corresponding heat dissipation fan of the shell body;

the water pump is characterized in that the shell body is provided with a first water inlet pipe and a first water outlet pipe, the water inlet end of the first water inlet pipe is communicated with the water outlet end of the water path circulation pad, the water outlet end of the first water inlet pipe is communicated with the water inlet end of the water pump, the water inlet end of the first water outlet pipe is communicated with the water outlet end of the water tank, and the water outlet end of the first water outlet pipe is communicated with the water inlet end of the water path circulation pad.

The semiconductor refrigeration system further comprises a battery, the shell body is provided with a partition board, an accommodating cavity is formed between the partition board and the side wall of the shell body, the battery is detachably mounted in the accommodating cavity, and the battery is used for supplying power to the semiconductor refrigeration system.

Further, the waterway circulation pad comprises a plurality of waterway pipelines which are communicated with each other, and a second water inlet pipe and a second water outlet pipe are arranged below the waterway circulation pad;

one end of the second water inlet pipe is communicated with the waterway pipeline, and the other end of the second water inlet pipe is communicated with the water outlet end of the first water outlet pipe;

one end of the second water outlet pipe is communicated with the water channel pipeline, and the other end of the second water outlet pipe is communicated with the water inlet end of the first water inlet pipe.

Compared with the prior art, the embodiment of the utility model has the following beneficial effects:

1. by adopting a water-cooled structure, the clothes main body is set into a circulating water path structure with a water path circulating cushion, when refrigeration is needed, after the water is powered on, the water pump supplies water to the water tank, the cold end surface of the semiconductor refrigeration device is refrigerated, the cold quantity is emitted and transmitted to the water tank through the cold guide piece, the water in the water tank enters the water path circulating cushion on the clothes main body after refrigeration and temperature reduction, the constant temperature of the air-conditioning suit is realized through the water path circulating structure, the whole surface of the air-conditioning suit can be uniformly cooled, compared with an air-cooled structure, the weight of the air-conditioning suit can be effectively reduced, the wearing comfort level is improved, the cold quantity is more quickly transmitted through the arrangement that the cold guide piece is attached to the water tank, the refrigeration efficiency of the water in the water tank is higher, the heat emitted from the hot end surface of the semiconductor refrigeration device can be rapidly emitted and discharged in time through the heat radiation component, and the refrigeration effect of the cold guide piece is ensured, the air-conditioning suit has good refrigerating and cooling effects, and solves the problems of poor wearing comfort caused by heavy weight, uneven temperature and low refrigerating efficiency of the existing air-conditioning suit;

2. the cold guide piece is embedded into one side face of the water tank, the cold end face of the semiconductor refrigerating device is close to the cold guide piece, at the moment, cold energy transmitted by the semiconductor refrigerating device during refrigeration cools water in the water tank through the cold guide piece, the cold guide effect of the cold guide piece on the water in the water tank is enhanced, and the cold guide fin is arranged on one side, close to the water tank, of the cold guide piece and located in the mounting groove, so that the cold energy transmission area can be increased, the refrigeration effect is further enhanced, and the refrigeration efficiency is improved;

3. through setting up radiating block and radiator fan, the heat that semiconductor refrigeration device's hot junction face distributed out distributes away through the radiating block, and radiator fan forms the ventilation passageway with radiating fin, and radiator fan blows off the heat along radiating fin's ventilation passageway direction, effectively reduces the windage, strengthens the radiating effect.

Drawings

FIG. 1 is a schematic perspective view of a garment body of a semiconductor constant temperature air-conditioning suit according to an embodiment of the present invention;

FIG. 2 is a schematic perspective view of a semiconductor constant temperature air conditioning suit according to an embodiment of the present invention;

FIG. 3 is an exploded view of a semiconductor constant temperature air conditioning suit according to one embodiment of the present invention;

FIG. 4 is an exploded view (with the shell removed) of a semiconductor constant temperature air conditioning suit of one embodiment of the present invention;

FIG. 5 is an exploded view (with the shell removed) of a semiconductor constant temperature air conditioning suit of one embodiment of the present invention;

fig. 6 is an exploded view (with the shell removed) of a semiconductor constant temperature air conditioning suit of one embodiment of the present invention;

fig. 7 is an exploded view of a structure for mounting a cold conductor and a water tank of the semiconductor constant temperature air-conditioning suit according to an embodiment of the present invention;

FIG. 8 is an exploded view of a semiconductor constant temperature air conditioning suit of one embodiment of the present invention;

fig. 9 is an exploded view of a structure for mounting a cold conductor and a water tank of the semiconductor constant temperature air-conditioning suit according to an embodiment of the present invention;

FIG. 10 is an exploded view of a semiconductor constant temperature air conditioning suit of one embodiment of the present invention;

FIG. 11 is a schematic perspective view of a semiconductor constant temperature air conditioning suit according to an embodiment of the present invention;

FIG. 12 is an exploded view of a semiconductor constant temperature air conditioning suit according to one embodiment of the present invention;

fig. 13 is an exploded view of an installation structure of a water-cooling head pipe of the semiconductor constant temperature air-conditioning suit according to an embodiment of the present invention;

FIG. 14 is an exploded view of a semiconductor constant temperature air conditioning suit of one embodiment of the present invention;

in the drawings: 1-clothes body, 11-waterway circulation pad, 111-waterway pipeline, 112-second water inlet pipe, 113-second water outlet pipe, 2-semiconductor refrigeration system, 21-cold guide piece, 211-cold guide fin, 212-second mounting hole, 213-third mounting hole, 214-mounting groove, 22-semiconductor refrigeration device, 23-heat dissipation component, 231-heat dissipation block, 2311-heat dissipation plate, 2313-fifth mounting hole, 2312-heat dissipation fin, 232-heat dissipation fan cover, 24-sponge frame, 241-mounting port, 242-fourth mounting hole, 3-water tank, 31-mounting groove, 311-first mounting part, 3111-first mounting hole, 312-second mounting part, 4-water pump, 5-shell, 51-shell cover, 52-shell body, 521-ventilation opening, 522-first water inlet pipe, 523-first water outlet pipe, 524-partition plate, 525-accommodating cavity, 6-battery, 7-water cooling head pipeline and 8-heat preservation cover.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial.

In the description of the present invention, "a plurality" means two or more unless otherwise specified.

As shown in fig. 1 to 8, a semiconductor constant temperature air-conditioning suit comprises a suit body 1, a semiconductor refrigerating system 2, a water tank 3 and a water pump 4;

the clothes body 1 is provided with a waterway circulation pad 11 in an attaching way;

the semiconductor refrigeration system 2 comprises a cold conduction piece 21, a semiconductor refrigeration device 22 and a heat dissipation assembly 23, wherein one end of the cold conduction piece 21 is attached to one side face of the water tank 3, the semiconductor refrigeration device 22 is clamped between the other end of the cold conduction piece 21 and the heat dissipation assembly 23, so that the cold end face of the semiconductor refrigeration device 22 is attached to the cold conduction piece 21, and the hot end face of the semiconductor refrigeration device 22 is attached to the heat dissipation assembly 23;

the water inlet end of the water pump 4 is communicated with the water outlet end of the waterway circulation cushion 11, the water outlet end of the water pump 4 is communicated with the water inlet end of the water tank 3, and the water outlet end of the water tank 3 is communicated with the water inlet end of the waterway circulation cushion 11.

Through adopting water-cooled structure, will clothes main part 1 sets to have the circulation waterway structure of water route circulation pad 11, when needs refrigerate, the circular telegram back, water pump 4 to water tank 3 supplies water, semiconductor refrigeration device 22's cold junction face refrigeration, through cold conduction piece 21 gives off cold volume and conducts to water tank 3, water in the water tank 3 gets into after refrigeration cooling in clothes main part 1 in the water route circulation pad 11, through the structure of water route circulation, realize the constant temperature of air conditioning suit, not only can make the whole face of air conditioning suit cool down evenly, compare with the forced air cooling structure, can effectively alleviate the weight of air conditioning suit, promote the comfort level and wear, and through cold conduction piece 21 with water tank 3 laminating sets up for the transmission of cold volume is faster, and is right the refrigeration efficiency of water in water tank 3 is higher, through radiator unit 23 can in time fast with the heat of the hot junction face of semiconductor refrigeration device 22 is sent out and is arranged And the refrigerating effect on the cold guide piece 21 is ensured, so that the air-conditioning clothes have better refrigerating and cooling effects, and the problem that the wearing comfort level is poor due to large weight, uneven temperature and low refrigerating efficiency of the conventional air-conditioning clothes is solved.

In one embodiment of the present invention, the cold guiding member 21 is integrally formed on one side of the water tank 3.

Through with lead cold spare 21 set up integratively in a side of water tank 3, the cold junction face of semiconductor refrigeration device 22 pastes tightly lead cold spare 21, the cold volume that semiconductor refrigeration device 22 derived when refrigerating at this moment passes through lead cold spare 21 to carry out cooling to the water in the water tank 3, reinforcing lead cold spare 21 to the cold effect of leading of the water in the water tank 3.

As shown in fig. 9 and 10, in another embodiment, a mounting groove 31 is formed on one side surface of the water tank 3, and the cold guiding member 21 is detachably inserted into the mounting groove 31;

the cold guide piece 21 is close to one side of the water tank 3 and is provided with a cold guide fin 211, and the cold guide fin 211 is positioned in the mounting groove 31.

When the semiconductor refrigerating device 22 transmits cold energy to the water in the water tank 3 through the cold conduction member 21 for cooling, only the cold conduction member 21 conducts the cold energy at this time, and the area for conducting the cold energy is limited; the cold guide fins 211 are arranged on one side of the cold guide piece 21 close to the water tank 3, and the cold guide fins 211 are positioned in the mounting groove 31, so that the cold conduction area can be increased, the refrigeration effect is further enhanced, and the refrigeration efficiency is improved; preferably, the cold conducting part 21 is a metal flat plate, and the heat conducting efficiency can be effectively improved by adopting a metal material.

Specifically, mounting groove 31 includes first installation department 311 and second installation department 312, the notch of the one end of first installation department 311 is seted up in a side of water tank 3, the other end of first installation department 311 with the one end of second installation department 312 is connected, the other end orientation of second installation department 312 the inside of water tank 3 is extended and is set up, the cross-sectional size of the longitudinal section of first installation department 311 is less than the cross-sectional size of the longitudinal section of second installation department 312, cold guide 21 detachably inlays and locates in the first installation department 311, cold guide 211 is located in the second installation department 312.

Specifically, first mounting hole 3111 has been seted up to first installation department 311, the face of leading cold spare 21 runs through and is provided with the corresponding second mounting hole 212 of first mounting hole 3111, passes in proper order through retaining member such as screw, bolt the second mounting hole 212 with first mounting hole 3111 will lead cold spare 21 detachably install in mounting groove 31.

More specifically, the heat dissipation assembly 23 includes a heat dissipation block 231 and at least one heat dissipation fan, the heat dissipation block 231 includes a heat dissipation plate 2311 and heat dissipation fins 2312;

the hot end face of the semiconductor refrigeration device 22 is attached to the heat dissipation plate 2311, and the heat dissipation fins 2312 are arranged on one side of the heat dissipation plate 2311, which is far away from the semiconductor refrigeration device 22;

the heat dissipation fan is disposed at a side of the ventilation passage of the heat dissipation fin 2312.

By arranging the heat dissipation block 231 and the heat dissipation fan, heat dissipated from the hot end face of the semiconductor refrigeration device 22 is dissipated through the heat dissipation block 231, the heat dissipation fan and the heat dissipation fins 2312 form a ventilation channel, and the heat dissipation fan blows out the heat along the direction of the ventilation channel of the heat dissipation fins 2312, so that the wind resistance is effectively reduced, and the heat dissipation effect is enhanced.

Specifically, the number of the heat dissipation fans is two, and the two heat dissipation fans are symmetrically arranged on two sides of the ventilation channel of the heat dissipation fin 2312.

By arranging two heat dissipation fans which are symmetrically arranged on two sides of the ventilation channel of the heat dissipation fins 2312, a convection effect is achieved, heat is blown out from the two heat dissipation fans, and heat dissipation efficiency is effectively improved.

Preferably, the heat dissipation assembly 23 further includes a heat dissipation fan cover 232, and the heat dissipation fan is covered with the heat dissipation fan cover 232.

The heat dissipation fan cover 232 covers the outside of the heat dissipation fan, so that the heat dissipation fan cover 232 can protect the heat dissipation fan, the heat dissipation fan is prevented from being influenced by the external environment when rotating, the heat dissipation fan cover 232 also has the flow guiding function, heat can be blown out along the opening direction of the heat dissipation fan cover 232, and the heat dissipation efficiency is improved.

To explain further, the semiconductor refrigeration system 2 further includes a sponge frame 24, an installation port 241 is provided through the middle of the sponge frame 24, and the semiconductor refrigeration device 22 is clamped in the installation port 241 of the sponge frame 24.

It should be noted that at least one semiconductor refrigeration device 22 is provided, and a plurality of semiconductor refrigeration devices 22 may also be provided according to the temperature regulation requirement, so as to realize quick and efficient constant temperature of the air-conditioning suit.

Through setting up sponge frame 24 will semiconductor refrigeration device 22 card is located in sponge frame 24's installation opening 241, can realize semiconductor refrigeration device 22's installation is fixed, and can play thermal-insulated effect, avoids the heat influence that radiator unit 23 gived off leads cold spare 21, guarantees lead cold spare 21 lead cold effect.

Furthermore, a third mounting hole 213 is formed at a side of the cold conducting member 21 close to the sponge frame 24, fourth mounting holes 242 are formed through both sides of the mounting opening 241 of the sponge frame 24, a fifth mounting hole 2313 is formed through the heat dissipating plate 2311, and a fastening member such as a screw, a bolt, etc. sequentially penetrates through the fifth mounting hole 2313, the fourth mounting hole 242 and the third mounting hole 213 to clamp and mount the semiconductor refrigeration device 22 between the cold conducting member 21 and the heat dissipating assembly 23, where it should be noted that a mounting gap is left at a position of the heat dissipating fin 2312 corresponding to the fifth mounting hole 2313 of the heat dissipating plate 2311 for the fastening member to pass through.

Further, the semiconductor refrigeration system comprises a shell 5, wherein the shell 5 comprises a shell cover 51 and a shell body 52, the shell cover 51 is arranged on the shell body 52, the semiconductor refrigeration system 2, the water tank 3 and the water pump 4 are all arranged in the shell body 52, and the semiconductor refrigeration system 2, the water tank 3 and the water pump 4 are all arranged in the shell body 52, so that the semiconductor refrigeration system 2, the water tank 3 and the water pump 4 can be operated more stably and are prevented from being influenced by the external environment;

the shell 52 is provided with at least one ventilation opening 521, the ventilation opening 521 is arranged at the corresponding heat dissipation fan of the shell 52, and the heat dissipation fan is convenient to discharge hot air to the outside of the shell 52 due to the arrangement of the at least one ventilation opening 521 on the shell 52;

the shell body 52 is equipped with first inlet tube 522 and first outlet pipe 523, the end of intaking of first inlet tube 522 with the play water end of water route circulation pad 11 is linked together, the play water end of first inlet tube 522 with the end of intaking of water pump 4 is linked together, the end of intaking of first outlet pipe 523 with the play water end of water tank 3 is linked together, the play water end of first outlet pipe 523 with the end of intaking of water route circulation pad 11 is linked together, through the shell body 52 sets up the inlet tube with the outlet pipe, realize water pump 4, water tank 3 with the transport of cold water between the water route circulation pad 11 guarantees the constant temperature effect.

More specifically, the semiconductor refrigeration system further comprises a battery 6, the housing 52 is provided with a partition 524, a receiving cavity 525 is formed between the partition 524 and the side wall of the housing 52, the battery 6 is detachably installed in the receiving cavity 525, and the battery 6 is used for supplying power to the semiconductor refrigeration system 2.

The battery 6 is arranged, so that power can be supplied to the semiconductor refrigeration system 2, the normal operation of the semiconductor refrigeration system 2 is ensured, and the battery 6 is detachably mounted in the accommodating cavity 525, so that when the electric quantity of the battery 6 is too low, a fully charged new battery 6 can be replaced in time, the replacement operation is simple and convenient, the endurance time of the air-conditioning suit is increased conveniently, the long-time use requirement of the air-conditioning suit is met, and particularly, the battery 6 can be detachably mounted in the accommodating cavity 525 through a locking part such as a screw, a bolt and the like;

in addition, by arranging the partition 524, the battery 6 can be isolated from the semiconductor refrigeration system 2, so that the influence of the wet water of the battery 6 on the normal use of the battery 6 is avoided, and the safety of the battery 6 in the charging process and the use process is effectively ensured.

Specifically, the waterway circulation pad 11 comprises a plurality of waterway pipelines 111 which are communicated with each other, and a second water inlet pipe 112 and a second water outlet pipe 113 are arranged below the waterway circulation pad 11;

one end of the second water inlet pipe 112 is communicated with the water channel 111, and the other end of the second water inlet pipe 112 is communicated with the water outlet end of the first water outlet pipe 523;

one end of the second water outlet pipe 113 is communicated with the waterway pipeline 111, and the other end of the second water outlet pipe 113 is communicated with the water inlet end of the first water inlet pipe 522.

Through setting up water route pipeline 111, second inlet tube 112 and second outlet pipe 113, can realize semiconductor refrigerating system 2 with cold water transport between water route pipeline 111 is convenient for cold water gets into in the water route circulation pad 11.

Specifically, the waterway circulation pad 11 is attached to the inner layer of the clothes main body 1, wherein the waterway circulation pad 11 may be disposed in the inner layer of the back side of the clothes main body 1 or in the inner layer of the front side of the clothes main body 1, but is not limited to the above arrangement.

Preferably, the garment body 1 may be in various forms such as a long sleeve, a vest, a five-sleeve, a nine-sleeve, etc., but is not limited to the above forms.

Further, as shown in fig. 11 to 14, the semiconductor constant temperature air-conditioning suit may also adopt a structure with a water cooling head pipeline 7, the semiconductor constant temperature air-conditioning suit comprises a suit body 1, a semiconductor refrigerating system 2, a water tank 3 and a water pump 4, and the suit body 1 is provided with a waterway circulation pad 11;

the semiconductor refrigeration system 2 comprises a cold conducting piece 21, a water-cooling head pipeline 7, a heat preservation cover 8, a semiconductor refrigeration device 22 and a heat dissipation component 23, wherein the semiconductor refrigeration device 22 is clamped between the cold conducting piece 21 and the heat dissipation component 23, a mounting groove 214 is formed in one side, close to the semiconductor refrigeration device 22, of the cold conducting piece 21, the water-cooling head pipeline 7 is embedded in the mounting groove 214, so that the cold end face of the semiconductor refrigeration device 22 is attached to the cold conducting piece 21 and the water-cooling head pipeline 7, the hot end face of the semiconductor refrigeration device 22 is attached to the heat dissipation component 23, and the heat preservation cover 8 is arranged on one side, far away from the semiconductor refrigeration device 22, of the cold conducting piece 21;

the water inlet end of the water pump 4 is communicated with the water outlet end of the waterway circulation cushion 11, the water outlet end of the water pump 4 is communicated with the water inlet end of the water-cooling head pipeline 7, the water outlet end of the water-cooling head pipeline 7 is communicated with the water inlet end of the water tank 3, and the water outlet end of the water tank 3 is communicated with the water inlet end of the waterway circulation cushion 11;

through the cold junction surface laminating setting of semiconductor refrigeration device 22 water-cooling head pipeline 7 utilizes the high coefficient of thermal conductivity of water-cooling head pipeline 7 will semiconductor refrigeration device 22's cold volume is derived fast and is right water in the water-cooling head pipeline 7 cools off the cooling, and the circular telegram back, water pump 4 gives water-cooling head pipeline 7 supplies water, and the process semiconductor refrigeration device 22's cold junction surface refrigerates, cold conduction piece 21 conducts cold volume to water-cooling head pipeline 7 is right water in the water-cooling head pipeline 7 cools off the cooling, and the cold water after the refrigeration passes through the pipeline and flows to in the water tank 3, is linked together through the water route circulation pad 11 sub-pipeline that sets up on water tank 3 and the clothes, and then realizes the clothes constant temperature.

Specifically, the water-cooling head pipeline 7 is made of a metal material, and a metal pipeline with high thermal conductivity coefficient such as copper and silver can be selected, and a copper pipeline is preferably selected to reduce the cost; the shape of the water-cooling head pipe 7 may be an M shape, an S shape, or the like, but is not limited to the above shape, and by setting the shape of the water-cooling head pipe 7 to be an M shape or an S shape, the contact area of the water-cooling head pipe 7 with the semiconductor refrigeration device 22 may be enlarged, and the cold conduction effect may be enhanced.

The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.

Claims (10)

1. A semiconductor constant-temperature air-conditioning suit is characterized by comprising a suit body, a semiconductor refrigerating system, a water tank and a water pump;

the clothes main body is provided with a waterway circulation pad in an attaching manner;

the semiconductor refrigeration system comprises a cold conduction piece, a semiconductor refrigeration device and a heat dissipation assembly, wherein one end of the cold conduction piece is attached to one side face of the water tank, the semiconductor refrigeration device is clamped between the other end of the cold conduction piece and the heat dissipation assembly, so that the cold end face of the semiconductor refrigeration device is attached to the cold conduction piece, and the hot end face of the semiconductor refrigeration device is attached to the heat dissipation assembly;

the water inlet end of the water pump is communicated with the water outlet end of the waterway circulation cushion, the water outlet end of the water pump is communicated with the water inlet end of the water tank, and the water outlet end of the water tank is communicated with the water inlet end of the waterway circulation cushion.

2. The semiconductor constant-temperature air-conditioning suit of claim 1, wherein the cold-conducting piece is integrally provided on one side of the water tank.

3. The semiconductor constant-temperature air conditioning suit according to claim 1, wherein a mounting groove is formed in one side face of the water tank, and the cold conducting piece is detachably embedded in the mounting groove;

and one side of the cold guide piece, which is close to the water tank, is provided with cold guide fins, and the cold guide fins are positioned in the mounting grooves.

4. The semiconductor constant temperature air conditioning suit of claim 1, wherein the heat dissipation assembly comprises a heat slug and at least one heat dissipation fan, the heat slug comprising a heat dissipation plate and heat dissipation fins;

the hot end face of the semiconductor refrigerating device is attached to the heat dissipation plate, and the heat dissipation fins are arranged on one side, far away from the semiconductor refrigerating device, of the heat dissipation plate;

the heat radiation fan is arranged on the side face of the ventilation channel of the heat radiation fin.

5. The semiconductor constant-temperature air-conditioning suit according to claim 4, wherein two cooling fans are arranged, and the two cooling fans are symmetrically arranged on two sides of the ventilation channel of the cooling fin.

6. The semiconductor constant temperature air conditioning suit of claim 4, wherein the heat dissipation assembly further comprises a heat dissipation fan housing, and the heat dissipation fan housing is provided on an outer housing of the heat dissipation fan.

7. The semiconductor constant-temperature air-conditioning suit according to claim 4, wherein the semiconductor refrigeration system further comprises a sponge frame, an installation port is arranged in the middle of the sponge frame in a penetrating mode, and the semiconductor refrigeration device is clamped in the installation port of the sponge frame.

8. The semiconductor constant-temperature air-conditioning suit according to claim 4, further comprising a shell, wherein the shell comprises a shell cover and a shell body, the shell cover is arranged on the shell body, and the semiconductor refrigeration system, the water tank and the water pump are all arranged in the shell body;

the shell body is provided with at least one ventilation opening, and the ventilation opening is arranged at the corresponding heat dissipation fan of the shell body;

the water pump is characterized in that the shell body is provided with a first water inlet pipe and a first water outlet pipe, the water inlet end of the first water inlet pipe is communicated with the water outlet end of the water path circulation pad, the water outlet end of the first water inlet pipe is communicated with the water inlet end of the water pump, the water inlet end of the first water outlet pipe is communicated with the water outlet end of the water tank, and the water outlet end of the first water outlet pipe is communicated with the water inlet end of the water path circulation pad.

9. The semiconductor constant-temperature air-conditioning suit according to claim 8, further comprising a battery, wherein the shell body is provided with a partition plate, a containing cavity is formed between the partition plate and the side wall of the shell body, the battery is detachably mounted in the containing cavity, and the battery is used for supplying power to the semiconductor refrigeration system.

10. The semiconductor constant-temperature air-conditioning suit according to claim 8, wherein the waterway circulation pad comprises a plurality of waterway pipelines which are communicated with each other, and a second water inlet pipe and a second water outlet pipe are arranged below the waterway circulation pad;

one end of the second water inlet pipe is communicated with the waterway pipeline, and the other end of the second water inlet pipe is communicated with the water outlet end of the first water outlet pipe;

one end of the second water outlet pipe is communicated with the water channel pipeline, and the other end of the second water outlet pipe is communicated with the water inlet end of the first water inlet pipe.

Images