CN216352195U - Liquid-cooled heat dissipation structure for notebook computer - Google Patents
Liquid-cooled heat dissipation structure for notebook computer Download PDFInfo
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- CN216352195U CN216352195U CN202123291030.7U CN202123291030U CN216352195U CN 216352195 U CN216352195 U CN 216352195U CN 202123291030 U CN202123291030 U CN 202123291030U CN 216352195 U CN216352195 U CN 216352195U
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Abstract
The utility model discloses a liquid-cooled heat dissipation structure for a notebook computer, which comprises a mounting bracket, a mounting plate, a liquid-cooled pad and a semiconductor refrigerating device, wherein the mounting bracket is arranged on the mounting plate; the liquid cooling pad is detachably arranged on the front surface of the mounting plate, a liquid cooling pipe is arranged inside the liquid cooling pad, and the liquid cooling pad is used for cooling the notebook computer after cooling liquid is introduced into the liquid cooling pipe; the semiconductor refrigerating device is close to the liquid cooling pad and is arranged, the semiconductor refrigerating device is provided with a liquid outlet and a liquid inlet, the liquid cooling pipe is provided with a liquid inlet nozzle and a liquid outlet nozzle, the liquid outlet and the liquid inlet nozzle are connected through a liquid inlet pipe, the liquid outlet nozzle and the liquid inlet are connected through a liquid outlet pipe, the semiconductor refrigerating device is used for cooling liquid to form cooling liquid, and the cooling liquid is led into the liquid cooling pipe. The liquid-cooled heat radiation structure for the notebook computer provided by the technical scheme can effectively reduce noise while improving the heat radiation performance, and is favorable for solving the technical problem that the existing water-cooled heat radiator can not continuously radiate heat.
Description
Technical Field
The utility model relates to the technical field of radiators, in particular to a liquid-cooled heat dissipation structure for a notebook computer.
Background
Because notebook computer internally mounted has numerous electrical components, for example floppy drive, hard disk, optical drive, CPU, DRAM, mainboard, battery, display card etc. these electrical components all arrange in narrow and small notebook casing, the heat concentrates the production, be difficult for self-transmission heat dissipation, especially in hot summer, be difficult to the heat dissipation more, and when the high temperature, easily make electrical component ageing, lead to life to reduce, when main electrical component is overheated, electrical component automatic protection, can reduce frequency work, the performance can reduce, influence use experience.
The existing notebook computer generally radiates heat through a built-in heat radiation system or an external radiator, but the heat radiation performance of the built-in heat radiation system of the existing notebook computer is limited, and the heat radiation requirement of the notebook computer is difficult to meet.
When the notebook computer is used, the processor and other loads in work and operation can generate a large amount of heat, and the protection of internal components of the notebook computer is usually provided with a shell with heat dissipation holes for protection, but the heat dissipation effect of electrical elements and the like is reduced, so that the notebook computer is often required to be additionally provided with heat dissipation equipment for auxiliary heat dissipation, and the equipment is an external heat sink; the conventional external radiator is generally large in size, large in noise and low in efficiency, the conventional external radiator only conducts ventilation and heat dissipation on the notebook computer independently, and the heat dissipation exhaust air is hot air which absorbs heat, so that the temperature of the surrounding environment can be increased along with the progress of heat dissipation, the subsequent heat dissipation and ventilation effects can be further reduced, and inconvenience is brought to use. Although there is a radiator for cooling and dissipating heat of a notebook computer by a water cooling method in the prior art, after water absorbs heat of the notebook computer, the water after heat absorption cannot be cooled again, so that heat dissipation performance is limited, and a user can only ensure the heat dissipation performance of the water cooling radiator by replacing water in the radiator or waiting for the water in the radiator to cool and dissipate heat naturally, which brings inconvenience to the use.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a liquid-cooled heat dissipation structure for a notebook computer, which can effectively reduce noise while improving heat dissipation performance, can effectively solve the technical problems of high noise and low efficiency caused by the heat dissipation mode of the existing notebook computer, is beneficial to solving the technical problem that the existing water-cooled heat radiator cannot continuously dissipate heat, and has the advantages of simple structure, convenience in installation and reliable performance.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a liquid-cooled heat dissipation structure for a notebook computer comprises a mounting bracket, a mounting plate, a liquid-cooled pad and a semiconductor refrigeration device, wherein the mounting plate is erected on the mounting bracket, and the front surface of the mounting plate is used for supporting the notebook computer;
the liquid cooling pad is detachably arranged on the front surface of the mounting plate, a liquid cooling pipe is arranged inside the liquid cooling pad, and the liquid cooling pad is used for cooling the notebook computer after cooling liquid is introduced into the liquid cooling pipe; the semiconductor refrigerating device is arranged close to the liquid cooling pad, the semiconductor refrigerating device is provided with a liquid outlet and a liquid inlet, the liquid cooling pipe is provided with a liquid inlet nozzle and a liquid outlet nozzle, the liquid outlet and the liquid inlet nozzle are connected through a liquid inlet pipe, the liquid outlet nozzle and the liquid inlet nozzle are connected through a liquid outlet pipe, the semiconductor refrigerating device is used for cooling liquid to form cooling liquid, and the cooling liquid is introduced into the liquid cooling pipe;
the semiconductor refrigerating device comprises a liquid storage tank, a cold guide head, a liquid pump and a semiconductor refrigerating module, wherein a cooling pipe is arranged inside the cold guide head, the cooling pipe, the liquid storage tank and the liquid pump are sequentially connected through a pipeline, the interiors of the cooling pipe, the liquid storage tank and the liquid pump are mutually communicated, a liquid outlet is positioned at one side of the liquid storage tank, the liquid outlet is mutually communicated with the liquid storage tank, and a liquid inlet is mutually communicated with the liquid pump; the semiconductor refrigeration module is close to lead the cold junction setting, just the semiconductor refrigeration module is equipped with the semiconductor refrigeration piece, just the cold junction face of semiconductor refrigeration piece with lead the cold junction and laminate each other.
Preferably, the liquid cooling pipe is a multi-layer Z-shaped winding device, and the liquid cooling pipe covers all the areas of the liquid cooling pad.
Preferably, the semiconductor refrigeration module further comprises a heat dissipation member, the semiconductor refrigeration piece is provided with the cold end face and the hot end face, and the hot end face and the heat dissipation member are attached to each other.
Preferably, the semiconductor refrigeration module further comprises a heat dissipation fan, the heat dissipation fan is disposed on two sides of the heat dissipation member, and a working end of the heat dissipation fan is aligned with the heat dissipation member.
Preferably, the radiating piece includes heating panel and a plurality of radiating fin, the front of heating panel with the hot terminal surface pastes mutually, the back mounted of heating panel has the interval to set up radiating fin, just radiating fin's extending direction orientation radiator fan.
Preferably, the semiconductor refrigeration module further comprises a baffle plate, the baffle plate is arranged between the heat dissipation piece and the heat dissipation fan, one end of the baffle plate is connected with one side, facing the semiconductor refrigeration piece, of the heat dissipation fan, and the other end of the baffle plate is connected with the front face of the heat dissipation plate.
Preferably, the semiconductor refrigeration module further comprises a heat preservation piece, the heat preservation piece is mounted on the front surface of the heat dissipation piece, and the cold conduction head and the semiconductor refrigeration piece are both mounted inside the heat preservation piece; the back of the heat preservation piece is provided with an avoidance hole, and the hot end face is exposed out of the back of the heat preservation piece through the avoidance hole and is attached to the heat dissipation piece.
Preferably, the heat preservation piece includes demountable installation's first heat preservation shell and second heat preservation shell, first heat preservation shell with the second heat preservation shell encloses jointly and encloses to be used for the installation lead the cold head with the installation cavity of semiconductor refrigeration piece, just the back of second heat preservation shell has been seted up dodge the hole.
Preferably, the refrigeration device further comprises a protective shell, wherein the protective shell is used for mounting the semiconductor refrigeration device; a plurality of ventilation openings are formed in the protective shell, and the ventilation openings are close to the heat dissipation fan.
Preferably, the liquid storage box further comprises a liquid exchange cover, the top of the liquid storage box is provided with a liquid exchange port, and the liquid exchange cover is used for opening or closing the liquid exchange port.
The technical scheme provided by the embodiment of the application can have the following beneficial effects:
1. liquid cooling pad detachably installs between notebook computer and mounting panel, and the mounting panel plays the supporting role to the liquid cooling pad, when not needing supplementary heat dissipation, can dismantle the liquid cooling pad from the mounting panel to use the mounting panel as ordinary backup pad, the installation is swiftly convenient, is convenient for push away the area.
2. The liquid cooling pad is internally provided with the liquid cooling pipe which is used for cooling the heating area at the bottom of the notebook computer after the cooling liquid is introduced into the liquid cooling pipe, so that the cooling and heat dissipation effects on the notebook computer are achieved, the structure is simple, and the performance is reliable.
3. Through semiconductor refrigerating plant with liquid cooling to lead to liquid cooling pipe with the coolant liquid, semiconductor refrigerating plant can be put near the optional position of liquid cooling pad, can also be through the length of adjusting feed liquor pipe and drain pipe between semiconductor refrigerating plant and the liquid cooling pad simultaneously, makes semiconductor refrigerating plant can realize placing on table, under the table according to the in-service use condition, reduces the interference to user or other people.
4. The semiconductor refrigerating device comprises a liquid storage tank, a cold guide head, a liquid pump and a semiconductor refrigerating module, and a cooling pipe is arranged inside the cold guide head; the liquid storage tank is used for storing liquid, the cold guide head is used for storing cold energy generated by the semiconductor refrigeration module and transmitting the cold energy to the cooling pipe, the liquid in the cooling pipe is cooled and then becomes cooling liquid, and the liquid pump provides power for liquid flowing. The semiconductor refrigerating device 4 is utilized to cool the cooling liquid absorbing heat again, so that the liquid in the liquid cooling type heat dissipation structure can be recycled and continuously dissipated, the use physical examination of a user is met, and the technical problem that the existing water cooling type radiator cannot continuously dissipate heat is solved.
5. The notebook computer is cooled and radiated in a circulating water cooling mode, the radiating performance is good, the efficiency is high, a complex mechanical structure which is used for radiating in an air cooling mode in the prior art is omitted, the size of a radiating structure and a compression radiating structure can be effectively simplified, mute radiating is convenient to realize, and the cooling device is safe, reliable, convenient, practical, low in manufacturing cost and wide in application range.
Drawings
Fig. 1 is a diagram illustrating a usage status of a liquid-cooled heat dissipation structure for a notebook computer according to the present invention.
Fig. 2 is a schematic structural diagram of a liquid-cooled heat dissipation structure for a notebook computer according to the present invention.
Fig. 3 is a partial schematic structural view of a liquid-cooled heat dissipation structure for a notebook computer according to the present invention.
FIG. 4 is a partial schematic view of a liquid-cooled heat dissipation structure for a notebook computer according to the present invention.
Wherein: the cooling device comprises a mounting bracket 1, a fixing clamping groove 11, a mounting plate 2, a first ventilation hole 21, a liquid cooling pad 3, a liquid cooling pipe 31, a liquid inlet pipe 32, a liquid outlet pipe 33, a second ventilation hole 34, a semiconductor refrigerating device 4, a liquid storage tank 41, a cold guide head 42, a cooling pipe 421, a liquid pump 43, a semiconductor refrigerating module 44, a semiconductor refrigerating sheet 441, a cold end surface 4411, a radiating piece 442, a radiating plate 4421, a radiating fin 4422, a radiating fan 443, a baffle 444, a heat insulating piece 445, a first heat insulating shell 4451, a second heat insulating shell 4452, a notebook computer 5, a protective shell 6, a ventilation hole 61 and a liquid changing cover 7.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The technical scheme provides a liquid-cooled heat dissipation structure for a notebook computer, which comprises a mounting bracket 1, a mounting plate 2, a liquid-cooled pad 3 and a semiconductor refrigerating device 4, wherein the mounting plate 2 is erected on the mounting bracket 1, and the front surface of the mounting plate 2 is used for supporting a notebook computer 5;
the liquid cooling pad 3 is detachably mounted on the front surface of the mounting plate 2, a liquid cooling pipe 31 is arranged inside the liquid cooling pad 3, and the liquid cooling pad 3 is used for cooling the notebook computer 5 after cooling liquid is introduced into the liquid cooling pipe 31; the semiconductor refrigerating device 4 is arranged close to the liquid cooling pad 3, the semiconductor refrigerating device 4 is provided with a liquid outlet and a liquid inlet, the liquid cooling pipe 31 is provided with a liquid inlet nozzle and a liquid outlet nozzle, the liquid outlet and the liquid inlet nozzle are connected through a liquid inlet pipe 32, the liquid outlet nozzle and the liquid inlet nozzle are connected through a liquid outlet pipe 33, and the semiconductor refrigerating device 4 is used for cooling liquid to form cooling liquid and introducing the cooling liquid into the liquid cooling pipe 31;
the semiconductor refrigerating device 4 comprises a liquid storage tank 41, a cold conducting head 42, a liquid pump 43 and a semiconductor refrigerating module 44, wherein a cooling pipe 421 is arranged inside the cold conducting head 42, the cooling pipe 421, the liquid storage tank 41 and the liquid pump 43 are sequentially connected through a pipeline, the cooling pipe 421, the liquid storage tank 41 and the liquid pump 43 are mutually communicated, the liquid outlet is positioned on one side of the liquid storage tank 41, the liquid outlet is mutually communicated with the liquid storage tank 41, and the liquid inlet is mutually communicated with the liquid pump 43; the semiconductor refrigeration module 44 is arranged close to the cold guide head 42, the semiconductor refrigeration module 44 is provided with a semiconductor refrigeration piece 441, and the cold end surface 4411 of the semiconductor refrigeration piece 441 is attached to the cold guide head 42.
Because notebook computer internally mounted has numerous electrical components, for example floppy drive, hard disk, optical drive, CPU, DRAM, mainboard, battery, display card etc. these electrical components all arrange in narrow and small notebook casing, the heat concentrates the production, be difficult for self-transmission heat dissipation, especially in hot summer, be difficult to the heat dissipation more, and when the high temperature, easily make electrical component ageing, lead to life to reduce, when main electrical component is overheated, electrical component automatic protection, can reduce frequency work, the performance can reduce, influence use experience.
The existing notebook computer generally radiates heat through a built-in heat radiation system or an external radiator, but the built-in heat radiation system of the existing notebook computer has limited heat radiation performance and is difficult to meet the heat radiation requirement of the notebook computer; in addition, the existing external radiator is generally large in size, large in noise and low in efficiency, is not favorable for carrying and using, and is difficult to meet the requirements of users.
In order to effectively reduce noise while improving heat dissipation performance, solve the technical problems of large noise and low efficiency caused by the heat dissipation mode of the existing notebook computer, and simultaneously avoid the situation that the temperature of the surrounding environment is increased along with the progress of heat dissipation and further the effect of subsequent heat dissipation and ventilation is reduced caused by the heat dissipation mode in the prior art, the technical scheme provides a liquid-cooled heat dissipation structure for the notebook computer, as shown in fig. 1-4, which comprises a mounting bracket 1, a mounting plate 2, a liquid-cooled pad 3 and a semiconductor refrigerating device 4, wherein the mounting plate 2 is erected on the mounting bracket 1, and the front surface of the mounting plate 2 is used for supporting a notebook computer 5; specifically, liquid cooling pad 3 detachably installs in the front of mounting panel 2 to liquid cooling pad 3 is arranged in between notebook computer 5 and the mounting panel 2 in order to dispel the heat to notebook computer 5, and mounting panel 2 plays the supporting role to liquid cooling pad 3, when not needing supplementary heat dissipation, can dismantle liquid cooling pad 3 from mounting panel 2, and use mounting panel 2 as ordinary backup pad, and the installation is swiftly convenient, is convenient for push away the area. More specifically, the inside of the liquid cooling pad 3 is provided with the liquid cooling pipe 31 for cooling the heating area at the bottom of the notebook computer 5 after the cooling liquid is introduced into the liquid cooling pipe 31, so that the notebook computer 5 is cooled and dissipated, and the liquid cooling pad is simple in structure and reliable in performance.
Furthermore, the scheme is also provided with a semiconductor refrigerating device 4 which is used for cooling liquid to form cooling liquid and leading the cooling liquid into the liquid cooling pipe 31, wherein the semiconductor refrigerating device 4 is arranged close to the liquid cooling pad 3, and the semiconductor refrigerating device 4 and the liquid cooling pipe 31 are connected through a liquid inlet pipe 32 and a liquid outlet pipe 33. Semiconductor refrigerating plant 4 in this scheme can be put in near the optional position of liquid cooling pad 3, can also be simultaneously through the length of adjusting feed liquor pipe 32 and drain pipe 33 between semiconductor refrigerating plant 4 and the liquid cooling pad 3, make semiconductor refrigerating plant 4 can realize placing on table, under the table according to the in-service use condition, reduce the interference to user or other people.
It should be noted that the mounting bracket 1 in this scheme may be a commercially available notebook computer fixing bracket or a commercially available folding bracket, and the mounting and the use of the liquid-cooled heat dissipation structure in this scheme can be completed only by placing the mounting plate 2 on which the semiconductor refrigeration device 3 is mounted on the commercially available mounting bracket 1, so that the mounting is quick and convenient, and the carrying is convenient. Preferably, this scheme can also set up fixed knot structure on the installing support 1, makes mounting panel 2 install in installing support 1 through fixed knot constructs detachably to reinforcing mounting panel 2's installation stability further promotes user's use physical examination. Preferably, the fixing structure in this embodiment may be a fixing slot 11, a fixing column (not shown in the figure), or the like, which can prevent the mounting plate 2 from displacing on the mounting bracket 1, and is not limited herein.
Preferably, the mounting plate 2 is provided with a plurality of first ventilation holes 21, the liquid cooling pad 3 is provided with a plurality of second ventilation holes 34, and the first ventilation holes 21 and the second ventilation holes 34 are convenient for ventilation and heat dissipation of the notebook computer 5.
Furthermore, the semiconductor refrigeration device 4 of the present embodiment includes a liquid storage tank 41, a cold conducting head 42, a liquid pump 43, and a semiconductor refrigeration module 44, and a cooling pipe 421 is disposed inside the cold conducting head 42; the liquid storage tank 41 is used for storing liquid. The cold conducting head 42 is used for storing cold energy generated by the semiconductor refrigeration module 44 and transmitting the cold energy to the cooling pipe 421, so that liquid in the cooling pipe 421 is changed into cooling liquid after being refrigerated; preferably, the cold conducting head 42 may be a metal block or the like, and is not limited herein. The liquid pump 43 powers the flow of liquid. The semiconductor refrigerating sheet 441 is used for refrigerating and is manufactured by using the peltier effect, wherein the peltier effect is a phenomenon that when direct current passes through a galvanic couple formed by two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration piece 441 is made of two semiconductor materials to form a hot end and a cold end, the cold end continuously absorbs heat to realize refrigeration, and the hot end continuously releases heat.
The working flow of the semiconductor refrigerating device 4 in the scheme is as follows:
the cooling liquid in the liquid storage tank 41 is discharged to the liquid inlet pipe 32 through the liquid outlet, and then enters the liquid cooling pipe 31 through the liquid inlet nozzle, the heat exchange between the cooling liquid and the heating area of the notebook computer 5 is performed, the temperature of the notebook computer 5 is reduced and the heat is dissipated, the cooling liquid absorbing the heat is discharged to the liquid outlet pipe 33 through the liquid outlet nozzle, and then enters the liquid pump 43 through the liquid inlet, the liquid pump 43 pumps the cooling liquid absorbing the heat to the cooling pipe 421 in the cold guiding head 42, the semiconductor refrigeration module 44 generates the cold energy and transmits the cold energy to the cooling pipe 421 through the cold guiding head 42, so that the cooling liquid absorbing the heat is cooled again, and then the cooling liquid cooled again returns to the liquid storage tank 41, and the cycle is performed. In this embodiment, the liquid for cooling the notebook computer may be water, which is not limited herein.
Although there is a radiator for cooling and dissipating heat of a notebook computer by a water cooling method in the prior art, after water absorbs heat of the notebook computer, the water after heat absorption cannot be cooled again, so that heat dissipation performance is limited, and a user can only ensure the heat dissipation performance of the water cooling radiator by replacing water in the radiator or waiting for the water in the radiator to cool and dissipate heat naturally, which brings inconvenience to the use. The scheme utilizes the semiconductor refrigerating device 4 to cool the cooling liquid after absorbing heat again, is favorable for the liquid in the liquid cooling type heat radiation structure to be recycled and continuously radiated, meets the use physical examination of a user, and solves the technical problem that the existing water cooling type radiator cannot continuously radiate heat.
The cooling and heat dissipation of the notebook computer 5 is realized through the circulating water cooling mode, the cooling and heat dissipation device is good in heat dissipation performance and high in efficiency, a complex mechanical structure which is used for dissipating heat in an air cooling mode in the prior art is omitted, the size of a heat dissipation structure and a compression heat dissipation structure can be effectively simplified, mute heat dissipation is convenient to realize, and the cooling and heat dissipation device is safe, reliable, convenient, practical, low in manufacturing cost and wide in application range.
More specifically, the liquid cooling pipe 31 is disposed in a multi-layer Z-shaped winding manner, and the liquid cooling pipe 31 covers the entire area of the liquid cooling pad 3.
In a preferred embodiment of the present technical solution, the liquid cooling pipe 31 is a multi-layer Z-shaped winding device, and the liquid cooling pipe 31 covers all areas of the liquid cooling pad 3, which is beneficial to ensuring that the cooling liquid flows at all positions of the liquid cooling pad 3, and ensuring uniform cooling of the bottom of the notebook computer 5, thereby improving the heat dissipation effect of the liquid cooling type heat dissipation structure.
More specifically, the semiconductor refrigeration module 44 further includes a heat dissipation member 442, and the semiconductor refrigeration sheet 441 has the cold end surface 4411 and a hot end surface, and the hot end surface is attached to the heat dissipation member 442.
More specifically, the semiconductor cooling module 44 further includes a heat dissipation fan 443, the heat dissipation fan 443 is disposed on two sides of the heat dissipation member 442, and a working end of the heat dissipation fan 443 is aligned with the heat dissipation member 442.
In an embodiment of the present disclosure, the semiconductor cooling module 44 further includes a heat dissipation fan 443, and the heat dissipation fan 443 is disposed to effectively accelerate the air flow, so as to improve the heat dissipation efficiency of the semiconductor cooling module 44; specifically, the heat dissipation fans 443 are disposed on two sides of the heat dissipation member 442, and the working ends of the heat dissipation fans 443 are aligned with the heat dissipation member 442, which is more favorable for accelerating the air flow around the heat dissipation member 442, and further accelerates the heat dissipation.
The heat dissipation fan 443 in the present embodiment may be an axial flow fan or a vortex flow fan, and is not limited herein.
More specifically, the heat sink 442 includes a heat sink 4421 and a plurality of heat dissipation fins 4422, the front surface of the heat sink 4421 is attached to the hot end surface, the heat dissipation fins 4422 are mounted on the back surface of the heat sink 4421 at intervals, and the extension direction of the heat dissipation fins 4422 faces the heat dissipation fan 443.
The heat dissipation element 442 in the present solution includes a heat dissipation plate 4421 and a plurality of heat dissipation fins 4422, the front surface of the heat dissipation plate 4421 is attached to the hot end surface, the heat dissipation fins 4422 are installed on the back surface of the heat dissipation plate 4421 at intervals, a through flow channel is formed between the plurality of heat dissipation fins 4422 to guide air, so that the contact area between the air and the heat dissipation element 442 is increased, the heat dissipation effect is improved, the extension direction of the heat dissipation fins 4422 faces the heat dissipation fan 443, and the heat dissipation fan 443 is convenient to drive the air near the heat dissipation element 442 to smoothly flow between the heat dissipation fins 4422.
More specifically, the semiconductor cooling module 44 further includes a baffle 444, the baffle 444 is disposed between the heat dissipating member 442 and the heat dissipating fan 443, one end of the baffle 444 is connected to one side of the heat dissipating fan 443 facing the semiconductor cooling sheet 441, and the other end of the baffle 444 is connected to the front surface of the heat dissipating plate 4421.
In a preferred embodiment of the present technical solution, the semiconductor refrigeration module 44 further includes a baffle 444, the baffle 444 is disposed between the heat sink 442 and the heat dissipation fan 443, and the baffle 444 is disposed to avoid that heat generated by the hot end surface of the semiconductor refrigeration sheet 441 affects a cooling effect of the cold conducting head 42 on liquid in the cooling pipe 421, so as to achieve a purpose of saving energy consumption.
More specifically, the semiconductor refrigeration module 44 further includes a thermal insulation member 445, the thermal insulation member 445 is mounted on the front surface of the heat dissipation member 442, and the cold conducting head 42 and the semiconductor refrigeration sheet 441 are both mounted inside the thermal insulation member 445; an avoidance hole is formed in the back surface of the heat-insulating member 445, and the hot end surface is exposed out of the back surface of the heat-insulating member 445 through the avoidance hole and attached to the heat dissipation member 442.
Further, the semiconductor refrigeration module 44 further includes a heat preservation member 445, the heat preservation member 445 is mounted on the front surface of the heat dissipation member 442, the cold conducting head 42 and the semiconductor refrigeration sheet 441 are both mounted inside the heat preservation member 445 to play a role in heat insulation, and heat generated by the hot end surface of the semiconductor refrigeration sheet 441 is prevented from being transferred to the cold end surface, so that the refrigeration effect of the semiconductor refrigeration module 44 is influenced; and the back of the thermal insulation piece 445 is provided with an avoidance hole (not marked in the figure), and the hot end surface is exposed out of the back of the thermal insulation piece 445 through the avoidance hole, so that the mutual attachment of the hot end surface and the heat dissipation piece 442 is ensured on the premise of ensuring the thermal insulation effect of the thermal insulation piece 445.
It should be noted that the heat retaining member 445 used in the present embodiment may be a heat insulating sponge.
Further, the heat preservation member 445 includes a first heat preservation shell 4451 and a second heat preservation shell 4452 which are detachably mounted, the first heat preservation shell 4451 and the second heat preservation shell 4452 together enclose a mounting cavity for mounting the cold conducting head 42 and the semiconductor refrigeration piece 441, and the avoiding hole is formed in the back surface of the second heat preservation shell 4452.
In a preferred embodiment of the present technical solution, the thermal insulation member 445 includes a first thermal insulation shell 4451 and a second thermal insulation shell 4452 which are detachably mounted, and the first thermal insulation shell 4451 and the second thermal insulation shell 4452 together enclose a mounting cavity for mounting the cold conducting head 42 and the semiconductor chilling plate 441, so as to facilitate mounting and dismounting the cold conducting head 42 and the semiconductor chilling plate 441.
Preferably, the first thermal insulation shell 4451 and the second thermal insulation shell 4452 in this embodiment may be fixedly mounted by fasteners (not shown in the drawings), which is beneficial to ensuring stable mounting of the thermal insulation member 445 and avoiding the occurrence of relative displacement between the cold conducting head 42 and the semiconductor refrigeration piece 441 during use, thereby affecting the cooling effect of the liquid in the cooling pipe 421.
It should be noted that, the fastening member in this embodiment may be a screw, a bolt, or other structural members for fixing and installing.
Further, the refrigerator further comprises a protective shell 6, wherein the protective shell 6 is used for mounting the semiconductor refrigeration device 4; the protective casing 6 is provided with a plurality of ventilation openings 61, and the ventilation openings 61 are disposed near the heat dissipation fan 443.
Furthermore, the liquid-cooled heat dissipation structure for the notebook computer further comprises a protective shell 6 for mounting the semiconductor refrigeration device 4, which protects the semiconductor refrigeration device 4 and is beneficial to prolonging the service life of the semiconductor refrigeration device 4. Furthermore, the protective shell 6 is provided with a plurality of ventilation openings 61, the ventilation openings 61 are arranged close to the heat dissipation fan 443, and the ventilation openings 61 are arranged to facilitate the ambient air entering the protective shell 6 to exchange the air with the gas whose temperature rises due to the heat generated by the hot end of the semiconductor cooling fin 322, so as to perform a heat dissipation function.
Further, the liquid exchange device further comprises a liquid exchange cover 7, a liquid exchange port is formed in the top of the liquid storage tank 41, and the liquid exchange cover 7 is used for opening or closing the liquid exchange port.
In a preferred embodiment of the present invention, the liquid-cooled heat dissipation structure further includes a liquid exchange cover 7, a liquid exchange port is opened at the top of the liquid storage tank 41, the liquid exchange cover 7 is used for opening or closing the liquid exchange port, and a user can exchange the circulating liquid in the semiconductor refrigeration device 4 through the liquid exchange port, thereby avoiding odor of the liquid due to long-term use.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (10)
1. A liquid-cooled heat radiation structure for notebook computer, its characterized in that: the liquid cooling pad comprises a mounting bracket, a mounting plate, a liquid cooling pad and a semiconductor refrigerating device, wherein the mounting plate is erected on the mounting bracket, and the front surface of the mounting plate is used for supporting a notebook computer;
the liquid cooling pad is detachably arranged on the front surface of the mounting plate, a liquid cooling pipe is arranged inside the liquid cooling pad, and the liquid cooling pad is used for cooling the notebook computer after cooling liquid is introduced into the liquid cooling pipe; the semiconductor refrigerating device is arranged close to the liquid cooling pad, the semiconductor refrigerating device is provided with a liquid outlet and a liquid inlet, the liquid cooling pipe is provided with a liquid inlet nozzle and a liquid outlet nozzle, the liquid outlet and the liquid inlet nozzle are connected through a liquid inlet pipe, the liquid outlet nozzle and the liquid inlet nozzle are connected through a liquid outlet pipe, the semiconductor refrigerating device is used for cooling liquid to form cooling liquid, and the cooling liquid is introduced into the liquid cooling pipe;
the semiconductor refrigerating device comprises a liquid storage tank, a cold guide head, a liquid pump and a semiconductor refrigerating module, wherein a cooling pipe is arranged inside the cold guide head, the cooling pipe, the liquid storage tank and the liquid pump are sequentially connected through a pipeline, the interiors of the cooling pipe, the liquid storage tank and the liquid pump are mutually communicated, a liquid outlet is positioned at one side of the liquid storage tank, the liquid outlet is mutually communicated with the liquid storage tank, and a liquid inlet is mutually communicated with the liquid pump; the semiconductor refrigeration module is close to lead the cold junction setting, just the semiconductor refrigeration module is equipped with the semiconductor refrigeration piece, just the cold junction face of semiconductor refrigeration piece with lead the cold junction and laminate each other.
2. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 1, wherein: the liquid cooling pipe is arranged in a multi-layer Z-shaped winding mode, and the liquid cooling pipe covers all the areas of the liquid cooling pad.
3. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 1, wherein: the semiconductor refrigeration module further comprises a heat dissipation piece, the semiconductor refrigeration piece is provided with the cold end face and the hot end face, and the hot end face is attached to the heat dissipation piece.
4. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 3, wherein: the semiconductor refrigeration module further comprises cooling fans, wherein the cooling fans are arranged on two sides of the cooling piece, and the working ends of the cooling fans are aligned with the cooling piece.
5. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 4, wherein: the heat dissipation piece comprises a heat dissipation plate and a plurality of heat dissipation fins, the front face of the heat dissipation plate is attached to the hot end face, the back face of the heat dissipation plate is provided with the heat dissipation fins at intervals, and the extension directions of the heat dissipation fins face the heat dissipation fan.
6. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 5, wherein: the semiconductor refrigeration module further comprises a baffle plate, the baffle plate is arranged between the heat dissipation piece and the heat dissipation fan, one end of the baffle plate is connected with one side, facing the semiconductor refrigeration piece, of the heat dissipation fan, and the other end of the baffle plate is connected with the front face of the heat dissipation plate.
7. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 3, wherein: the semiconductor refrigeration module further comprises a heat preservation piece, the heat preservation piece is installed on the front face of the heat dissipation piece, and the cold conduction head and the semiconductor refrigeration piece are installed inside the heat preservation piece; the back of the heat preservation piece is provided with an avoidance hole, and the hot end face is exposed out of the back of the heat preservation piece through the avoidance hole and is attached to the heat dissipation piece.
8. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 7, wherein: the heat preservation piece includes demountable installation's first heat preservation shell and second heat preservation shell, first heat preservation shell with the second heat preservation shell encloses jointly and encloses to be used for the installation lead the cold head with the installation cavity of semiconductor refrigeration piece, just the back of second heat preservation shell has been seted up dodge the hole.
9. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 4, wherein: the protective shell is used for mounting the semiconductor refrigerating device; a plurality of ventilation openings are formed in the protective shell, and the ventilation openings are close to the heat dissipation fan.
10. The liquid-cooled heat dissipating structure for a notebook computer as claimed in claim 1, wherein: the liquid storage tank is characterized by further comprising a liquid exchange cover, wherein a liquid exchange port is formed in the top of the liquid storage tank, and the liquid exchange cover is used for opening or closing the liquid exchange port.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202123291030.7U CN216352195U (en) | 2021-12-24 | 2021-12-24 | Liquid-cooled heat dissipation structure for notebook computer |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114967202A (en) * | 2022-05-06 | 2022-08-30 | 湖南中合科技有限公司 | Liquid crystal display television with multiple-effect heat dissipation performance |
| CN116056422A (en) * | 2022-12-30 | 2023-05-02 | 中国科学院空间应用工程与技术中心 | Detachable cold plate of online cabinet operation box and operation box liquid cooling system |
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2021
- 2021-12-24 CN CN202123291030.7U patent/CN216352195U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114967202A (en) * | 2022-05-06 | 2022-08-30 | 湖南中合科技有限公司 | Liquid crystal display television with multiple-effect heat dissipation performance |
| CN116056422A (en) * | 2022-12-30 | 2023-05-02 | 中国科学院空间应用工程与技术中心 | Detachable cold plate of online cabinet operation box and operation box liquid cooling system |
| CN116056422B (en) * | 2022-12-30 | 2023-08-25 | 中国科学院空间应用工程与技术中心 | Detachable cold plate of online cabinet operation box and operation box liquid cooling system |
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