CN203040101U - Water cooling device used for cooling electronic device - Google Patents

Water cooling device used for cooling electronic device Download PDF

Info

Publication number
CN203040101U
CN203040101U CN 201320034973 CN201320034973U CN203040101U CN 203040101 U CN203040101 U CN 203040101U CN 201320034973 CN201320034973 CN 201320034973 CN 201320034973 U CN201320034973 U CN 201320034973U CN 203040101 U CN203040101 U CN 203040101U
Authority
CN
China
Prior art keywords
heat
water
cooling
exchanger
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320034973
Other languages
Chinese (zh)
Inventor
周哲明
周发明
Original Assignee
周哲明
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 周哲明 filed Critical 周哲明
Priority to CN 201320034973 priority Critical patent/CN203040101U/en
Application granted granted Critical
Publication of CN203040101U publication Critical patent/CN203040101U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model relates to a water cooling device used for cooling an electronic device, more specifically to a device used for cooling computer equipment such as a cooling server rack, a server, network equipment, a PC, a notebook computer, etc. The water cooling device comprises a water cooling system and a thermal conduction system. The water cooling system comprises a cooling water pipeline, a water cooling plate, a buckler and an external cold water source; the buckler separates the cooling water pipeline and the water cooling plate from the computer equipment so as to avoid damage of the computer equipment caused by leakage of the water cooling system. The thermal conduction system comprises a main cold-heat exchanger and an additional cold-heat exchanger, wherein the additional cold- heat exchanger comprises a thermal conduction cold-heat exchanger and a convection cold-heat exchanger. The thermal conduction system absorbs heat emitted to the air by a computer through heat absorption fins or conducts heat generated by computer components with large calorific value through a heat conduction metal plate and transmits the heat to the water cooling system through heat pipes. The scheme has the advantages of substantially raising computer equipment heat dissipation efficiency, reducing heat dissipation energy consumption and performing waterproof protection on computer equipment.

Description

A kind of water cooling equipment for cooling electronic apparatus
Technical field
The utility model relates to electronic equipment, and the row who particularly relates to the heat of computer equipments generations such as server cabinet, server, the network equipment, PC, notebook computer looses.
Background technology
Along with the development of information technology, the integrated level of electronic equipment is more and more higher, and the performance of computer and server is more and more stronger, and its corresponding power is also increasing, has also brought the caloric value of continuous rising when bringing performance boost.Current, data center and high performance computing service device also developing towards the direction of high density, higher computing capability more, have meanwhile also brought higher energy consumption and heat density, for these equipment cool off and cut down the consumption of energy into very big challenge.
Data center generally takes the method for wind-cooling heat dissipating at present, and its drawback is the low and energy consumption height of radiating efficiency.The mode that air-supply is freezed under traditional machine room precision air conditioner perforate floor of generally adopting for example, the maximum heat dissipation capacity of separate unit rack is 3KW ~ 5KW, and the high blade server frame power of 42U can be up to 15KW now.Relevant statistics shows that the energy resource consumption of refrigeration plant will account for about 50% of whole data center energy consumption.
Also there is certain restriction in the development of wind-cooling heat dissipating in addition.Fundamental formular according to heat radiation is Q=G* Δ T*C (Q: general refrigeration ability, G: flow, Δ T: the temperature difference, C: specific heat coefficient).Use air-cooledly, under the geostationary situation of specific heat coefficient C, the raising of total heat dissipation capacity need improve flow G and Δ T, namely needs to improve wind speed and reduces the cold wind temperature.It is limited in, and wind speed is subjected to the restriction of equipment ability to bear on the one hand, is difficult to satisfy more highdensity computation requirement.More high wind speed and lower cold wind temperature need consume the more energy on the other hand.
The specific heat of water coefficient is 3500 times more than of air, uses water-cooled can significantly improve radiating efficiency and cut down the consumption of energy.
Existing Water Cooling Technology aspect, a part of scheme is by directly at the big computer part of caloric value (as CPU) refrigerant displacement pipeline being installed, the heat that equipment distributes is directly taken away by tube contacts, and a part of scheme is by the water-cooled door system server cabinet to be cooled off.But the risk that these schemes all exist cooling water to reveal, cooling water is revealed may directly cause damage to equipment.The applicant has proposed the solution of sealing water-cooled in application 201110132047.X, though solved the problem of computer equipment being carried out waterproofing protection, its shortcoming is higher to the cost of electronic equipment sealing.
Summary of the invention
For solve that air-cooled radiating efficiency is low in the existing heat dissipating method, energy consumption is high and water-cooled to the problem of equipment protection deficiency; the utility model provides a kind of can keep apart the equipment of using water-cooling with computer equipment and water-cooled parts; this equipment not only radiating efficiency height, energy consumption is low, and can carry out waterproofing protection to computer equipment.
The technical scheme that its technical problem that solves the utility model adopts is:
A kind of water cooling equipment for cooling electronic apparatus comprises water-cooling system and hot conducting system.Water-cooling system comprises cooling water pipeline, cooled plate, bucker and outside cold water source; Bucker is kept apart cooling water pipeline and cooled plate and computer equipment, and the cooling water that is used for leaking drains into the place away from computer equipment; Outside cold water source can be machine room or building in water-cooling system, perhaps can be formed by cooling water tank and fan; Outside cold water source is connected with cooled plate by cooling water pipeline.
Hot conducting system comprises main cool-heat-exchanger and additional cool-heat-exchanger.Main cool-heat-exchanger can be thermal conductive metal plate, and thermal conductive metal plate is installed on the bucker of water-cooling system, and a side of thermal conductive metal plate is connected with the cooled plate of water-cooling system, and the opposite side of thermal conductive metal plate is connected with additional cool-heat-exchanger.Main cool-heat-exchanger can also be a kind of heat pipe water-cooled combination heat dissipation equipment that the applicant proposes in application 201220208750.4, the water-cooled parts of heat pipe water-cooled combination heat dissipation equipment are connected with the cooling water pipeline of water-cooling system, its water proof parts are installed on the bucker of water-cooling system, the computer part that the evaporation ends of its heat pipe and cabinet internal heat generation amount are big is connected, and perhaps is connected with additional cool-heat-exchanger.
Additional cool-heat-exchanger comprises heat conduction cool-heat-exchanger and convection current cool-heat-exchanger.Heat conduction cool-heat-exchanger comprises heat pipe and thermal conductive metal plate, evaporation ends and the condensation end of heat pipe are welded with thermal conductive metal plate, the computer part that caloric value in the thermal conductive metal plate of the evaporation ends of heat pipe and the cabinet is big closely contacts, can conduct heat fast, the thermal conductive metal plate of the condensation end of heat pipe is connected with main cool-heat-exchanger.The convection current cool-heat-exchanger comprises heat pipe, thermal conductive metal plate, heat absorption fin and fan, the heat absorption fin is installed in the evaporation ends of heat pipe, fan is installed near the heat absorption fin, be used for hot-air is blowed to the heat absorption fin, the condensation end of heat pipe is welded with thermal conductive metal plate, and the thermal conductive metal plate of the condensation end of heat pipe is connected with main cool-heat-exchanger.
The beneficial effects of the utility model are, can significantly improve the radiating efficiency of computer equipment, reduce the heat radiation energy consumption, can also carry out waterproofing protection to computer equipment.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Among the figure, 1. cooling water pipeline, 2. cooled plate, 3. bucker, 4. cooling water tank, 5. fan, 6. thermal conductive metal plate, 7. heat conduction cool-heat-exchanger, 8. convection current cool-heat-exchanger, 9 heat pipes, the 10. evaporation ends of heat pipe, the condensation end of 11. heat pipes, 12. the heat absorption fin, 13. cabinets, 14.CPU, 15. hard disk, 16. power supplys.
Embodiment
Below in conjunction with drawings and Examples the utility model is further specified.
As shown in Figure 1, embodiment of the present utility model is a kind of water cooling equipment for blade server.
As shown in Figure 1:
A kind of water cooling equipment for blade server comprises water-cooling system and hot conducting system.Water-cooling system comprises (1) cooling water pipeline, (2) cooled plate, (3) bucker and outside cold water source; (3) bucker is kept apart (1) cooling water pipeline and (2) cooled plate and computer equipment; Outside cold water source can be machine room or building in water-cooling system, perhaps can be formed by (4) cooling water tank and (5) fan; Outside cold water source is connected with (2) cooled plate by (1) cooling water pipeline.Hot conducting system comprises main cool-heat-exchanger and additional cool-heat-exchanger.Main cool-heat-exchanger is (6) thermal conductive metal plate, (6) thermal conductive metal plate is installed on water-cooling system (3) bucker, (6) side of thermal conductive metal plate is connected with (2) cooled plate of water-cooling system, and the opposite side of (6) thermal conductive metal plate is connected with additional cool-heat-exchanger.
Additional cool-heat-exchanger comprises (7) heat conduction cool-heat-exchanger and (8) convection current cool-heat-exchanger.(7) heat conduction cool-heat-exchanger comprises (9) heat pipe and (6) thermal conductive metal plate, (10) condensation end of the evaporation ends of heat pipe and (11) heat pipe is welded with (6) thermal conductive metal plate, and the interior parts such as (14) CPU, (15) hard disk and (16) power supply of (6) thermal conductive metal plate of the evaporation ends of (10) heat pipe and (13) cabinet closely contact.(11) (6) thermal conductive metal plate of the condensation end of heat pipe is connected with (6) thermal conductive metal plate of main cool-heat-exchanger.(8) the convection current cool-heat-exchanger comprises (9) heat pipe, (6) thermal conductive metal plate, (12) heat absorption fin and (5) fan, (12) the heat absorption fin is installed in the evaporation ends of (10) heat pipe, (5) fan is installed near (12) heat absorption fin, (11) condensation end of heat pipe is welded with (6) thermal conductive metal plate, and (6) thermal conductive metal plate of the condensation end of (11) heat pipe is connected with (6) thermal conductive metal plate of main cool-heat-exchanger.

Claims (6)

1. water cooling equipment that is used for cooling electronic apparatus, it is characterized in that: comprise water-cooling system and hot conducting system, described water-cooling system comprises cooling water pipeline, cooled plate, bucker and outside cold water source; Described hot conducting system comprises main cool-heat-exchanger and additional cool-heat-exchanger; Described additional cool-heat-exchanger comprises heat conduction cool-heat-exchanger and convection current cool-heat-exchanger.
2. water cooling equipment according to claim 1 is characterized in that: described bucker is kept apart described cooling water pipeline and described cooled plate and computer equipment; Described outside cold water source is connected with described cooled plate by described cooling water pipeline; Described outside cold water source can be machine room or building in water-cooling system, perhaps can be formed by cooling water tank and fan.
3. water cooling equipment according to claim 1, it is characterized in that: a kind of of described main cool-heat-exchanger is thermal conductive metal plate, described thermal conductive metal plate is installed on the bucker of described water-cooling system, one side of described thermal conductive metal plate is connected with the cooled plate of described water-cooling system, and the opposite side of described thermal conductive metal plate is connected with described additional cool-heat-exchanger.
4. water cooling equipment according to claim 1 is characterized in that: a kind of of described main cool-heat-exchanger is heat pipe water-cooled combination heat dissipation equipment; The water-cooled parts of described heat pipe water-cooled combination heat dissipation equipment are connected with the cooling water pipeline of described water-cooling system; The water proof parts of described heat pipe water-cooled combination heat dissipation equipment are installed on the bucker of described water-cooling system; The computer part that the evaporation ends of the heat pipe of described heat pipe water-cooled combination heat dissipation equipment and cabinet internal heat generation amount are big is connected, and perhaps is connected with described additional cool-heat-exchanger.
5. water cooling equipment according to claim 1 is characterized in that: described heat conduction cool-heat-exchanger comprises heat pipe and thermal conductive metal plate; The evaporation ends of described heat pipe and condensation end are welded with described thermal conductive metal plate, the computer part that caloric value in the thermal conductive metal plate of the evaporation ends of described heat pipe and the cabinet is big closely contacts, can conduct heat fast, the thermal conductive metal plate of the condensation end of described heat pipe is connected with described main cool-heat-exchanger.
6. water cooling equipment according to claim 1, it is characterized in that: described convection current cool-heat-exchanger comprises heat pipe, thermal conductive metal plate, heat absorption fin and fan; Described heat absorption fin is installed in the evaporation ends of described heat pipe, and described fan is installed near the described heat absorption fin, and the condensation end of described heat pipe is welded with described thermal conductive metal plate; The thermal conductive metal plate of the condensation end of described heat pipe is connected with described main cool-heat-exchanger.
CN 201320034973 2013-01-23 2013-01-23 Water cooling device used for cooling electronic device Expired - Fee Related CN203040101U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320034973 CN203040101U (en) 2013-01-23 2013-01-23 Water cooling device used for cooling electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320034973 CN203040101U (en) 2013-01-23 2013-01-23 Water cooling device used for cooling electronic device

Publications (1)

Publication Number Publication Date
CN203040101U true CN203040101U (en) 2013-07-03

Family

ID=48692183

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320034973 Expired - Fee Related CN203040101U (en) 2013-01-23 2013-01-23 Water cooling device used for cooling electronic device

Country Status (1)

Country Link
CN (1) CN203040101U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103338618A (en) * 2013-07-12 2013-10-02 曲昭波 Network cabinet with refrigeration and extinguishment functions
CN104423503A (en) * 2013-08-28 2015-03-18 英业达科技有限公司 Server
CN104501326A (en) * 2014-11-12 2015-04-08 北京百度网讯科技有限公司 Heat-dissipating system and method
CN105929917A (en) * 2016-04-28 2016-09-07 浪潮集团有限公司 Mute heat dissipation system and mute heat dissipation method applied to server
CN106535555A (en) * 2015-09-09 2017-03-22 合肥通用制冷设备有限公司 Air conditioner system of electronic device
CN107787168A (en) * 2017-10-19 2018-03-09 刘华英 A kind of high in the clouds calculation server rack of multiple heat dissipation
CN110678045A (en) * 2019-09-30 2020-01-10 联想(北京)有限公司 Heat dissipation system

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103338618A (en) * 2013-07-12 2013-10-02 曲昭波 Network cabinet with refrigeration and extinguishment functions
CN104423503A (en) * 2013-08-28 2015-03-18 英业达科技有限公司 Server
CN104501326A (en) * 2014-11-12 2015-04-08 北京百度网讯科技有限公司 Heat-dissipating system and method
CN104501326B (en) * 2014-11-12 2017-08-11 北京百度网讯科技有限公司 A kind of cooling system and method
CN106535555B (en) * 2015-09-09 2020-03-17 合肥通用制冷设备有限公司 Air conditioning system of electronic equipment
CN106535555A (en) * 2015-09-09 2017-03-22 合肥通用制冷设备有限公司 Air conditioner system of electronic device
CN105929917A (en) * 2016-04-28 2016-09-07 浪潮集团有限公司 Mute heat dissipation system and mute heat dissipation method applied to server
CN107787168A (en) * 2017-10-19 2018-03-09 刘华英 A kind of high in the clouds calculation server rack of multiple heat dissipation
CN107787168B (en) * 2017-10-19 2019-08-16 重庆德为通信技术有限公司 A kind of cloud calculation server cabinet of multiple heat dissipation
CN110678045A (en) * 2019-09-30 2020-01-10 联想(北京)有限公司 Heat dissipation system

Similar Documents

Publication Publication Date Title
CN203040101U (en) Water cooling device used for cooling electronic device
Haywood et al. Thermodynamic feasibility of harvesting data center waste heat to drive an absorption chiller
CN102791107B (en) Sealing and water-cooling method and equipment for cooling electronic equipment
CN104519722A (en) Liquid cooling device and server with same
CN203786651U (en) Liquid cooling system of server and server comprising liquid cooling system
CN202351605U (en) Projector and radiating device
CN103687450B (en) Wiring board heat transfer for aeronautical product optimizes module
CN106132177A (en) A kind of cooling system of inverter
CN204272576U (en) Control device of liquid cooling and there is the server of this device
CN202587734U (en) Water-cooling combined heat dissipation equipment for heat pipe
CN203105043U (en) Convection cool-heat exchanger and water cooling equipment
CN202050634U (en) Sealing water cooling device for cooling electronic equipment
CN203480400U (en) Water-cooling radiating device for flat computer
CN201035493Y (en) Non-noise liquid cooling computer cabinet
CN204906945U (en) Heat abstractor with damping nature
TWI487473B (en) Cooling system for date center
CN106132176A (en) A kind of Rack whole machine cabinet fin-tube type cooling system
CN2921938Y (en) Radiating device
CN203149473U (en) Low-noise computer heat radiator
CN207424799U (en) A kind of large server heat radiating device special
CN206452654U (en) A kind of electronics rack
CN103249282A (en) Heat pipe water cooling combined heat dissipation device
CN204695198U (en) A kind of notebook computer cooler pad
CN203445106U (en) CPU cooling device
CN204560105U (en) Heat-pipe radiator

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130703

Termination date: 20190123