CN216352194U

CN216352194U - Direct cooling type heat dissipation structure for notebook computer

Info

Publication number: CN216352194U
Application number: CN202123291023.7U
Authority: CN
Inventors: 刘康; 高俊岭; 甘平
Original assignee: Guangdong Fuxin Electronic Technology Co ltd
Current assignee: Guangdong Fuxin Electronic Technology Co ltd
Priority date: 2021-12-24
Filing date: 2021-12-24
Publication date: 2022-04-19
Anticipated expiration: 2031-12-24

Abstract

The utility model discloses a direct cooling type heat dissipation structure for a notebook computer, which comprises a mounting bracket, a mounting plate and a semiconductor refrigeration device, wherein the mounting plate is detachably erected on the mounting bracket; the semiconductor refrigerating device comprises a cold guide piece and a semiconductor refrigerating module, and the cold guide piece is positioned between the mounting plate and the semiconductor refrigerating module; the semiconductor refrigeration module is provided with a semiconductor refrigeration piece, the cold end face of the semiconductor refrigeration piece is exposed out of the front face of the semiconductor refrigeration module, the front face of the cold guide piece is attached to the back face of the mounting plate, and the back face of the cold guide piece is attached to the cold end face. The direct cooling type heat radiation structure for the notebook computer, which is provided by the technical scheme, can effectively reduce noise while improving the heat radiation performance, is favorable for satisfying the use physical examination of users, solves the technical problems of large noise and low efficiency caused by the heat radiation mode of the existing notebook computer, and has the advantages of simple and reasonable structure, convenience and rapidness in installation, easiness in cleaning and low cost.

Description

Direct cooling type heat dissipation structure for notebook computer

Technical Field

The utility model relates to the technical field of radiators, in particular to a direct cooling type radiating structure for a notebook computer.

Background

Because notebook computer internally mounted has numerous electrical components, for example floppy drive, hard disk, optical drive, CPU, DRAM, mainboard, battery, display card etc. these electrical components all arrange in narrow and small notebook casing, the heat concentrates the production, be difficult for self-transmission heat dissipation, especially in hot summer, be difficult to the heat dissipation more, and when the high temperature, easily make electrical component ageing, lead to life to reduce, when main electrical component is overheated, electrical component automatic protection, can reduce frequency work, the performance can reduce, influence use experience.

The existing notebook computer generally radiates heat through a built-in heat radiation system or an external radiator, but the heat radiation performance of the built-in heat radiation system of the existing notebook computer is limited, and the heat radiation requirement of the notebook computer is difficult to meet.

When the notebook computer is used, the processor and other loads in work and operation can generate a large amount of heat, and the protection of internal components of the notebook computer is usually provided with a shell with heat dissipation holes for protection, but the heat dissipation effect of electrical elements and the like is reduced, so that the notebook computer is often required to be additionally provided with heat dissipation equipment for auxiliary heat dissipation, and the equipment is an external heat sink; the conventional external radiator is generally large in size, large in noise and low in efficiency, the conventional external radiator only conducts ventilation and heat dissipation on the notebook computer independently, and the heat dissipation exhaust air is hot air which absorbs heat, so that the temperature of the surrounding environment can be increased along with the progress of heat dissipation, the subsequent heat dissipation and ventilation effects can be further reduced, and inconvenience is brought to use.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a direct cooling type heat dissipation structure for a notebook computer, which can effectively reduce noise while improving heat dissipation performance, is beneficial to satisfying the use physical examination of users, solves the technical problems of high noise and low efficiency caused by the existing heat dissipation mode of the notebook computer, and has the advantages of simple and reasonable structure, convenient and quick installation, easy cleaning and low cost.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a direct cooling type heat dissipation structure for a notebook computer comprises a mounting bracket, a mounting plate and a semiconductor refrigerating device, wherein the mounting plate is detachably erected on the mounting bracket, the front surface of the mounting plate is used for supporting the notebook computer, and the back surface of the mounting plate is used for mounting the semiconductor refrigerating device;

the semiconductor refrigerating device comprises a cold guide piece and a semiconductor refrigerating module, and the cold guide piece is positioned between the mounting plate and the semiconductor refrigerating module; the semiconductor refrigeration module is provided with a semiconductor refrigeration piece, the cold end face of the semiconductor refrigeration piece is exposed on the front face of the semiconductor refrigeration module, the front face of the cold guide piece is attached to the back face of the mounting plate, and the back face of the cold guide piece is attached to the cold end face.

Preferably, the semiconductor refrigeration module comprises a first shell, a semiconductor refrigeration piece, a heat dissipation piece and a second shell which are sequentially arranged towards the back direction of the semiconductor refrigeration module, and the semiconductor refrigeration piece and the heat dissipation piece are both arranged in an installation cavity which is formed by the first shell and the second shell in a surrounding mode;

the first shell is provided with a first mounting hole, and the first mounting hole is used for mounting the cold guide piece; the semiconductor refrigeration piece is provided with the cold end face and the hot end face, the cold end face is exposed out of the front face of the semiconductor refrigeration module through the first mounting hole and is attached to the back face of the cold conducting piece; the hot end face is attached to the heat dissipation piece.

Preferably, the semiconductor refrigeration module further comprises a heat insulator disposed between the first housing and the heat sink; and a second mounting hole is formed in the plate surface of the heat insulation piece, and the second mounting hole is used for mounting the semiconductor refrigeration piece.

Preferably, the second shell is provided with a plurality of air inlet holes.

Preferably, a plurality of air outlet holes are formed in the first shell and/or the second shell, and the air outlet holes are located on the side face of the first shell and/or the second shell.

Preferably, the semiconductor refrigeration module further comprises a frameless fan, the back surface of the heat dissipation member is recessed inwards to form a mounting position, and the frameless fan is embedded in the heat dissipation member through the mounting position.

Preferably, the semiconductor refrigeration module further comprises a vortex fan, the heat dissipation member and the vortex fan are mounted on the back surface of the heat insulation member in parallel, and an air outlet of the vortex fan is aligned with the heat dissipation member.

Preferably, the heat dissipation member includes a heat dissipation plate and a plurality of radiating fins, the front of heat dissipation plate with the hot terminal surface is pasted mutually, the back mounting of heat dissipation plate has the interval setting radiating fins.

Preferably, the mounting plate is provided with a plurality of vent holes, and the vent holes are arranged at positions avoiding the air inlet of the notebook computer.

Preferably, the mounting plate is made of metal.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

1. the mounting plate is detachably erected on the mounting support, the front face of the mounting plate is used for supporting the notebook computer, the back face of the mounting plate is used for mounting the semiconductor refrigerating device, and the semiconductor refrigerating device dissipates heat and cools the notebook computer through a semiconductor refrigerating technology. The mounting bracket can be a commercially available notebook computer fixing bracket or a commercially available folding bracket, and the installation and the use of the direct cooling type heat dissipation structure in the scheme can be completed only by placing the mounting plate provided with the semiconductor refrigeration device on the commercially available mounting bracket, so that the mounting bracket is fast and convenient to install and is convenient to carry.

2. The semiconductor refrigerating device comprises a cold guide piece and a semiconductor refrigerating module, and the cold guide piece is positioned between the mounting plate and the semiconductor refrigerating module; the semiconductor refrigeration module is used for refrigerating, and the cold conducting piece conducts cold energy generated by the semiconductor refrigeration module to the mounting plate, so that the notebook computer in contact with the mounting plate achieves a cooling effect.

3. The semiconductor refrigeration module is provided with a semiconductor refrigeration piece, the cold end face of the semiconductor refrigeration piece is exposed out of the front face of the semiconductor refrigeration module, and the back face of the cold conduction piece is attached to the cold end face; the notebook computer is cooled and radiated in a semiconductor refrigeration mode, the heat radiation performance is good, the efficiency is high, a complex mechanical structure which is used for radiating in air cooling, water cooling and other modes in the prior art is omitted, the size of a heat radiation structure and a compression heat radiation structure can be effectively simplified, the mute heat radiation is convenient to realize, and the notebook computer cooling system is safe, reliable, convenient, practical, low in manufacturing cost and wide in application range.

Drawings

Fig. 1 is a first usage state diagram of a direct cooling heat dissipation structure for a notebook computer according to the present invention.

FIG. 2 is a second usage state diagram of the direct cooling heat dissipation structure for a notebook computer according to the present invention.

FIG. 3 is an exploded view of a direct-cooling heat dissipation structure for a notebook computer according to a first embodiment of the present invention.

Fig. 4 is an exploded view of a mounting plate and a semiconductor cooling device according to a first embodiment of the direct-cooling heat dissipation structure for a notebook computer according to the present invention.

Fig. 5 is an exploded view of another perspective of the mounting plate and the semiconductor cooler according to the first embodiment of the present invention in a direct-cooling heat dissipation structure for a notebook computer.

FIG. 6 is an exploded view of a second embodiment of a direct-cooling heat dissipation structure for a notebook computer according to the present invention.

Fig. 7 is an exploded view of the mounting plate and the semiconductor cooling device of the second embodiment of the direct-cooling heat dissipation structure for notebook computers according to the present invention.

Fig. 8 is an exploded view of the mounting plate and the semiconductor cooling device of the second embodiment of the direct-cooling heat dissipation structure for notebook computers according to the present invention from another perspective.

Wherein: the cooling device comprises a mounting bracket 1, a fixing clamping groove 11, a mounting plate 2, a vent hole 21, a counter bore 22, a semiconductor refrigerating device 3, a cold guide piece 31, a fixing hole 311, a semiconductor refrigerating module 32, a first shell 321, a first mounting hole 3211, a semiconductor refrigerating sheet 322, a cold end face 3221, a hot end face 3222, a heat dissipation piece 323, a heat dissipation plate 3231, a heat dissipation fin 3232, a second shell 324, an air inlet hole 3241, an air outlet hole 3242, a heat insulation piece 325, a second mounting hole 3251, a frameless fan 326, an eddy fan 327 and a notebook computer 4.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The technical scheme provides a direct cooling type heat dissipation structure for a notebook computer, which comprises a mounting bracket 1, a mounting plate 2 and a semiconductor refrigerating device 3, wherein the mounting plate 2 is detachably erected on the mounting bracket 1, the front surface of the mounting plate 2 is used for supporting the notebook computer 4, and the back surface of the mounting plate 2 is used for mounting the semiconductor refrigerating device 3;

the semiconductor refrigerating device 3 comprises a cold guide piece 31 and a semiconductor refrigerating module 32, and the cold guide piece 31 is positioned between the mounting plate 2 and the semiconductor refrigerating module 32; semiconductor refrigeration module 32 is equipped with semiconductor refrigeration piece 322, just the cold junction face 3221 of semiconductor refrigeration piece 322 expose in the front of semiconductor refrigeration module 32, the front of leading cold spare 31 laminate in the back of mounting panel 2, the back of leading cold spare 31 laminate in cold junction face 3221.

The existing notebook computer generally radiates heat through a built-in heat radiation system or an external radiator, but the built-in heat radiation system of the existing notebook computer has limited heat radiation performance and is difficult to meet the heat radiation requirement of the notebook computer; in addition, the existing external radiator is generally large in size, large in noise and low in efficiency, is not favorable for carrying and using, and is difficult to meet the requirements of users.

In order to effectively reduce noise while improving heat dissipation performance, satisfy user's use physical examination, solve the technical problem that the noise that the radiating mode of current notebook computer brought is big, inefficiency, this technical scheme has provided a direct cooling formula heat radiation structure for notebook computer, as shown in fig. 1-8, including installing support 1, mounting panel 2 and semiconductor refrigerating plant 3, wherein, installing support 1 is the installation carrier of mounting panel 2 and semiconductor refrigerating plant 3, mounting panel 2 detachably erects in installing support 1, the front of mounting panel 2 is used for supporting notebook computer 4, the back of mounting panel 2 is used for installing semiconductor refrigerating plant 3, semiconductor refrigerating plant 3 carries out the heat dissipation cooling to the heating area of notebook computer bottom through semiconductor refrigeration technology. It should be noted that the mounting bracket 1 in this scheme may be a commercially available notebook computer fixing bracket or a commercially available folding bracket, and the mounting and the use of the direct cooling type heat dissipation structure in this scheme can be completed only by placing the mounting plate 2 on which the semiconductor refrigeration device 3 is mounted on the commercially available mounting bracket 1, so that the mounting is quick and convenient, and the carrying is convenient.

Preferably, this scheme can also set up fixed knot structure on installing support 1, makes mounting panel 2 install in installing support 1 through 11 detachably of fixed knot construct to reinforcing mounting panel 2's installation stability further promotes user's use physical examination. Preferably, the fixing structure in this embodiment may be a fixing slot 11, a fixing column (not shown in the figure), or the like, which can prevent the mounting plate 2 from displacing on the mounting bracket 1, and is not limited herein.

Specifically, the semiconductor refrigeration device 3 in the present embodiment includes a cold guide 31 and a semiconductor refrigeration module 32, and the cold guide 31 is located between the mounting plate 2 and the semiconductor refrigeration module 32; the semiconductor refrigeration module 32 is used for refrigerating, and the cold conduction piece 31 conducts cold energy generated by the semiconductor refrigeration module 32 to the mounting plate 2, so that the notebook computer 4 in contact with the mounting plate 2 achieves a cooling effect. The cold guide 31 in this embodiment may be a structural member such as a metal plate that can perform an energy transmission function, and is not limited herein.

More specifically, the semiconductor refrigeration module 32 is provided with the semiconductor refrigeration sheet 322, the cold end surface 3221 of the semiconductor refrigeration sheet 322 is exposed on the front surface of the semiconductor refrigeration module 32, the front surface of the cold guide member 31 is attached to the back surface of the mounting plate 2, and the back surface of the cold guide member 31 is attached to the cold end surface 3221. The semiconductor refrigeration sheet 322 is made by using the peltier effect, which is a phenomenon that when direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigeration sheet 322 is made of two semiconductor materials to form a hot end and a cold end, and the cold end continuously absorbs heat to realize refrigeration; the hot end continues to release heat. The notebook computer is cooled and radiated by a semiconductor refrigeration mode, the radiating performance is good, the efficiency is high, a complex mechanical structure which is used for radiating in the prior art in air cooling, water cooling and other modes is omitted, the size of the radiating structure and the size of the compression radiating structure can be effectively simplified, the mute radiating is convenient to realize, and the notebook computer cooling system is safe, reliable, convenient, practical, low in manufacturing cost and wide in application range.

Preferably, the mounting plate 2 and the cold guiding member 31 in this embodiment can be connected by a fastening member (not shown), so as to achieve a fixed connection between the mounting plate 2 and the semiconductor cooling device 3. Specifically, the mounting plate 2 is provided with a counter bore 22, the cold conducting piece 31 is provided with a fixing hole 311, the fastening piece penetrates through the counter bore 22 and the fixing hole 311, the mounting plate 2 is connected to the semiconductor refrigerating device 3, and the plane of the surface of the installed fastening piece is lower than the plane of the front surface of the mounting plate 2, so that the protruding fastening piece is prevented from influencing the stable installation of the notebook computer on the mounting plate 2. It should be noted that, the fastening member in this scheme may be a screw, a bolt, or other structural members for achieving fixed installation.

More specifically, the semiconductor refrigeration module 32 includes a first housing 321, the semiconductor refrigeration sheet 322, a heat dissipation member 323 and a second housing 324, which are sequentially arranged toward a back side direction of the semiconductor refrigeration module, and both the semiconductor refrigeration sheet 322 and the heat dissipation member 323 are installed inside an installation cavity defined by the first housing 321 and the second housing 324;

the first housing 321 is provided with a first mounting hole 3211, and the first mounting hole 3211 is used for mounting the cold conducting piece 31; the semiconductor refrigeration piece 322 is provided with the cold end surface 3221 and the hot end surface 3222, and the cold end surface 3221 is exposed out of the front surface of the semiconductor refrigeration module 32 through the first mounting hole 3211 and attached to the back surface of the cold conducting piece 31; the hot end face 3222 is attached to the heat sink 323.

The semiconductor refrigeration module 32 in the present scheme includes a first housing 321, a semiconductor refrigeration sheet 322, a heat dissipation member 323 and a second housing 324, where the first housing 321 and the second housing 324 jointly enclose an installation cavity for installing the semiconductor refrigeration sheet 322 and the heat dissipation member 323, and protect the semiconductor refrigeration sheet 322 and the heat dissipation member 323.

Further, the first housing 321 is provided with a first mounting hole 3211 for mounting the cold conducting piece 31, so that stable mounting between the cold conducting piece 31 and the semiconductor refrigeration module 32 can be effectively ensured, and relative displacement between the cold conducting piece 31 and the semiconductor refrigeration module 32 in the use process is avoided, thereby ensuring effective transmission of cold energy and ensuring the cooling and heat dissipation effects of the heat dissipation structure. The heat sink 323 plays a role in dissipating heat of the semiconductor refrigeration sheet 322, so that the hot end surface 3222 of the semiconductor refrigeration sheet 322 is attached to the heat sink 323, which is beneficial to quickly dissipating heat generated by the semiconductor refrigeration sheet 322 and accelerating the refrigeration efficiency of the semiconductor refrigeration module 32.

More specifically, the semiconductor refrigeration module 32 further includes a heat insulator 325, and the heat insulator 325 is disposed between the first housing 321 and the heat sink 323; a second mounting hole 3251 is formed in the plate surface of the heat insulation member 325, and the second mounting hole 3251 is used for mounting the semiconductor refrigeration sheet 322.

In the scheme, the semiconductor refrigeration module 32 further comprises a heat insulation piece 325, and the heat insulation piece 325 is arranged between the first shell 321 and the heat dissipation piece 323 to play a role in heat insulation, so that heat generated by the hot end of the semiconductor refrigeration piece 322 is prevented from being transferred to the cold end, and the refrigeration effect of the semiconductor refrigeration module 32 is further influenced; further, the second mounting hole 3251 for mounting the semiconductor refrigeration piece 322 is formed in the plate surface of the heat insulation piece 325, so that the semiconductor refrigeration piece 322 can be effectively stably mounted in the semiconductor refrigeration module 32, the semiconductor refrigeration piece 322 is prevented from being displaced in the use process, the effective transmission of cold is guaranteed, and the cooling and heat dissipation effects of the heat dissipation structure are guaranteed.

It should be noted that the heat insulating member 325 used in this embodiment may be a heat insulating sponge.

More specifically, the second housing 324 defines a plurality of air inlet holes 3241.

In the scheme, the second housing 324 is provided with the plurality of air inlet holes 3241, and the positions of the air inlet holes 3241 correspond to the positions of the frameless fan 326 or the vortex fan 327, so that the external normal-temperature air can enter the semiconductor refrigeration module 32 to exchange gas with the temperature increased due to the heating of the hot end of the semiconductor refrigeration sheet 322, and the heat dissipation effect is achieved.

In a further description, the first housing 321 and/or the second housing 324 are provided with a plurality of air outlet holes 3242, and the air outlet holes 3242 are located on a side surface of the first housing 321 and/or the second housing 324.

Furthermore, the first shell 321 and/or the second shell 324 of the present disclosure are provided with a plurality of air outlet holes 3242, the air outlet holes 3242 are located on the side surface of the first shell 321 and/or the second shell 324, and the air inlet holes 3241 and the air outlet holes 3242 are cooperatively arranged, so that the speed of gas exchange inside and outside the semiconductor refrigeration module 32 is increased, and the heat dissipation efficiency of the semiconductor refrigeration module 32 is improved.

More specifically, the semiconductor refrigeration module 32 further includes a frameless fan 326, a mounting position is recessed in a back surface of the heat sink 323, and the frameless fan 326 is mounted on the heat sink 323 through the mounting position.

In the first embodiment of the present disclosure, as shown in fig. 3 to 5, the semiconductor cooling module 32 further includes a frameless fan 326, and the frameless fan 326 can effectively accelerate air flow, so as to improve the heat dissipation efficiency of the semiconductor cooling module 32; furthermore, the back surface of the heat dissipation member 323 is recessed inwards to form a mounting position, the frameless fan 326 is embedded in the heat dissipation member 323 through the mounting position, and the embedding of the frameless fan 326 is beneficial to further reducing the volume of the heat dissipation structure, so that the body of the heat dissipation structure becomes thinner and is more convenient to carry.

More specifically, the semiconductor refrigeration module 32 further includes a vortex fan 327, the heat sink 323 and the vortex fan 3234 are mounted on the back surface of the heat insulation member 325 in parallel, and an air outlet of the vortex fan 327 is aligned with the heat sink 323.

In the second embodiment of the present technical solution, as shown in fig. 4 to 6, the semiconductor refrigeration module 32 further includes a vortex fan 327, and the arrangement of the vortex fan 327 can also effectively accelerate the air flow, so as to improve the heat dissipation efficiency of the semiconductor refrigeration module 32; further, the heat sink 323 and the vortex fan 3234 are installed on the back of the heat insulation component 325 in parallel, and the air outlet of the vortex fan 327 is aligned with the heat sink 323, so that the depth of the heat sink structure can be effectively reduced on the premise of ensuring the heat dissipation efficiency, and the body of the heat sink structure becomes thinner and more convenient to carry.

More specifically, the heat dissipation plate 323 includes a heat dissipation plate 3231 and a plurality of heat dissipation fins 3232, a front surface of the heat dissipation plate 3231 is attached to the hot end 3222, and the heat dissipation fins 3232 are installed on a back surface of the heat dissipation plate 3231 at intervals.

The heat dissipation member 323 in the scheme comprises a heat dissipation plate 3231 and a plurality of heat dissipation fins 3232, the front surface of the heat dissipation plate 3231 is attached to the hot end surface 3222, the heat dissipation fins 3232 are arranged at intervals on the back surface of the heat dissipation plate 3231, and a through flow channel is formed between the plurality of heat dissipation fins 3232 to guide air, so that the contact area between the air and the heat dissipation member 323 is increased, and the heat dissipation effect is improved.

More specifically, the mounting plate 2 is provided with a plurality of vent holes 21, and the vent holes 21 are formed at positions avoiding the air inlet of the notebook computer 4.

In an embodiment of the technical solution, the mounting plate 2 is provided with a plurality of vent holes 21, and the vent holes 21 are mainly arranged to allow hot air generated by a heat dissipation system built in the notebook computer 4 to be dissipated from the vent holes 21, so that the hot air is prevented from staying near the mounting plate 2, the temperature near the mounting plate 2 is increased, and the refrigeration effect of the semiconductor refrigeration module 2 is reduced; and the opening position of the vent hole 21 avoids the air inlet of the notebook computer 4, thereby effectively preventing hot air from entering the notebook computer 4 again from the air inlet, and reducing the heat dissipation performance of the built-in heat dissipation system of the notebook computer 4.

More specifically, the mounting plate 2 is made of metal.

The material of installation 2 of this scheme is the metal, can further promote the transmission effect of cold volume. Further, the bonding area between the semiconductor refrigeration module 32 and the mounting plate 2 is not limited to the side avoiding the vent hole of the mounting plate 2, but can also be extended to the vent hole of the mounting plate 2, that is, the cooling capacity transferred by the semiconductor refrigeration module 32 during refrigeration can cover the whole mounting plate 2, when the air inlet of the notebook computer 4 sucks air, the air is cooled by the refrigeration effect of the mounting plate 2 and then changed into cold air to enter the notebook computer 4, and meanwhile, the cooling effect is achieved, and the heat dissipation effect is further improved.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.

The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the utility model and should not be construed in any way as limiting the scope of the utility model. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.

Claims

1. A direct cooling type heat radiation structure for notebook computer, its characterized in that: the semiconductor refrigeration device comprises a mounting bracket, a mounting plate and a semiconductor refrigeration device, wherein the mounting plate is detachably erected on the mounting bracket, the front surface of the mounting plate is used for supporting a notebook computer, and the back surface of the mounting plate is used for mounting the semiconductor refrigeration device;

2. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 1, wherein: the semiconductor refrigeration module comprises a first shell, a semiconductor refrigeration piece, a radiating piece and a second shell which are sequentially arranged towards the back direction of the semiconductor refrigeration module, and the semiconductor refrigeration piece and the radiating piece are both arranged in an installation cavity which is formed by the first shell and the second shell in a surrounding mode;

3. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 2, wherein: the semiconductor refrigeration module further comprises a thermal insulation member disposed between the first housing and the heat sink; and a second mounting hole is formed in the plate surface of the heat insulation piece, and the second mounting hole is used for mounting the semiconductor refrigeration piece.

4. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 3, wherein: the second shell is provided with a plurality of air inlet holes.

5. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 4, wherein: a plurality of air outlet holes are formed in the first shell and/or the second shell, and the air outlet holes are located in the side face of the first shell and/or the second shell.

6. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 5, wherein: the semiconductor refrigeration module further comprises a frameless fan, the back surface of the heat dissipation piece is inwards recessed to form a mounting position, and the frameless fan is embedded in the heat dissipation piece through the mounting position.

7. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 5, wherein: the semiconductor refrigeration module further comprises a vortex fan, the heat dissipation piece and the vortex fan are mounted on the back face of the heat insulation piece in parallel, and an air outlet of the vortex fan is aligned with the heat dissipation piece.

8. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 2, wherein: the heat dissipation piece comprises a heat dissipation plate and a plurality of heat dissipation fins, the front face of the heat dissipation plate is attached to the hot end face, and the heat dissipation fins are arranged at intervals on the back face of the heat dissipation plate.

9. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 1, wherein: a plurality of ventilation holes are formed in the mounting plate, and air inlets of the notebook computer are avoided at the positions where the ventilation holes are formed.

10. The direct-cooling heat dissipation structure for notebook computers as claimed in claim 1, wherein: the mounting plate is made of metal.