CN204272576U - Control device of liquid cooling and there is the server of this device - Google Patents

Abstract

The utility model discloses a kind of Control device of liquid cooling and have the server of this device, this Control device of liquid cooling comprises the cooling box storing liquid cooled medium; Place operational heat part to be cooled in cooling box, operational heat part is immersed in liquid cooled medium; Liquid cooled medium be insulation fluoridize liquid; Operational heat part is the board carrying electronic working element; The heat that operational heat part produces is passed to cooling box through liquid cooled medium and conducts to outside air through cooling box.Preferably, the liquid cooled medium after heat absorption also can carry out liquid phase conversion heat radiation through cooling line.The utility model changes by wall body heat radiation and gas-liquid phase transition the cooling technology that heat radiation two kinds of modes combine, solve a difficult problem for the high efficiency and heat radiation of server core unit, be particularly useful for the heat dissipation environment of the board of high-density arrangement, and cost is low, the expansion being convenient to system uses.

Description

Liquid cooling device and server with the device

technical field

The utility model relates to the field of cooling control, in particular to a liquid cooling device. In addition, the utility model also relates to a server including the above-mentioned liquid cooling device.

Background technique

In the early days when computers did not generate much heat, passive cooling techniques were widely used. Passive heat dissipation mainly achieves the purpose of heat dissipation by adding metal heat sinks in contact with heating elements to increase the heat dissipation surface area, and the heat is directly transferred to the air. Traditional air-cooled heat dissipation is mainly to install a fan on the passive radiator to speed up the air flow on the surface of the heat sink to enhance the heat dissipation effect. This cooling method is also called air cooling. However, due to the poor heat transfer efficiency and low heat flux density of air, air-cooled servers have congenital defects such as high cooling energy consumption, high noise, low equipment density, and easy dust accumulation, which has become a bottleneck in the development of server cooling technology. Especially with the development of high-performance computers, the layout density of servers is getting higher and higher, and the requirements for cooling technology are becoming more and more stringent. The role played by traditional air cooling technology is becoming more and more stretched.

In this case, liquid cooling technology emerges at the historic moment, and has gradually become the main trend of server cooling technology. Liquid cooling is a quiet and high-efficiency heat dissipation method. Its principle is: the heat absorbing device receives heat from the components to be dissipated and transfers it to the cooling liquid in the heat absorbing device. The pump drives the cooling liquid to flow and transfers the heat to the Dissipate from the heat sink, and the repeated operation will achieve the purpose of heat dissipation. In recent years, with the continuous development and promotion of server liquid cooling technology, many famous technology companies have begun to devote themselves to the research of liquid cooling technology.

As a typical representative of liquid cooling technology, HP introduced liquid cooling technology in the HP Z400 and HP Z800 series workstation products. Since the processor is the main source of heat in the system, the main focus of its solution is on CPU cooling. Figure 1 is a schematic structural diagram of the liquid cooling system in the Z800 workstation. Referring to Figure 1, the heat dissipation device mainly includes: a heat dissipation plate 1, a liquid pump 2, a delivery pipeline 3, a radiator 4, and a heat dissipation fan 5, wherein the heat dissipation plate 1 and The CPU 6 is relatively arranged to transfer the heat generated by the CPU 6 to the liquid through the cooling plate 1, and the liquid is transferred to the delivery pipeline 3 under the action of the liquid pump, and then delivered to the radiator 4 by the delivery pipeline 3, and the heat Dissipated in the radiator 4, spread to the surrounding air, and the heat dissipation fan 5 blows away the hot air to export out of the chassis, so as to prevent the hot air from recirculating, and the cooled liquid flows back to the heat dissipation through the delivery pipeline 3 Plate 1 is used for heat interaction to achieve the purpose of cooling. Since the workstation adopts dual cores, the liquid cooling system also needs to be equipped with two sets of cooling devices, and the liquid cooling technology is aimed at the local heat dissipation of individual components in servers such as CPU and GPU, and has little effect on the ambient temperature of the entire system of the server. It is still difficult to solve the problem of high overall temperature of the server caused by high density. From the perspective of manufacturing and layout, each component that needs to be cooled must be equipped with this cooling device, that is, several sets of cooling devices need to be installed on each motherboard. This device causes the system to be extremely complicated, unsuitable for expansion, and wastes cost.

Utility model content

The utility model provides a liquid cooling device and a server with the device, in order to solve the technical problem that the existing liquid cooling device cannot meet the heat dissipation requirement brought about by the high-density arrangement of boards and cards.

The technical scheme that the utility model adopts is as follows:

According to one aspect of the present invention, a liquid cooling device is provided, including a cooling box storing a liquid cooling medium;

The working heating parts to be cooled are placed in the cooling box, and the working heating parts are soaked in the liquid cooling medium; the liquid cooling medium is insulating fluorinated liquid; the working heating parts are boards carrying electronic working components;

The heat generated by the working heating element is transferred to the cooling box through the liquid cooling medium, and then conducted to the outside air through the cooling box.

Further, the cooling box includes a box body and a box cover, the box body and the box cover are sealed and connected, and the inner wall of the box body is provided with a limiting part for fixing the working heating element.

Further, there is a reserved space in the box body for the liquid cooling medium to perform gas-liquid phase conversion, a cooling pipeline is arranged in the reserved space, a heat exchanger is arranged outside the cooling box, and the outlet of the cooling pipeline is connected to the The inlet of the heat exchanger is connected, the inlet of the cooling pipeline is connected with the outlet of the heat exchanger, and the liquid cooling medium undergoes gas-liquid phase change through the cooling pipeline to dissipate heat.

Further, the heat exchanger is a refrigerator, and a refrigerant for heat exchange is provided in the cooling pipeline, and the refrigerant is Freon.

Further, the heat exchanger is a radiator, and a cooling fluid for heat exchange is provided in the cooling pipeline; a circulation pump is provided between the radiator and the cooling pipeline.

Further, the cooling pipeline is connected with the tank cover, or

The cooling pipeline is connected with the side wall in the box body.

Further, the cooling box is provided with a pressure transmitter for real-time monitoring of pressure changes in the cooling box.

Further, the cooling box is provided with a pressure safety valve, which is used to release the pressure of the cooling box when the pressure in the cooling box reaches a preset threshold.

Further, the liquid cooling device also includes a temperature detector for detecting the temperature of the gas in the cooling box and a controller for controlling the opening/closing of the heat exchanger;

The controller controls the work of the heat exchanger according to the temperature signal of the temperature detector.

According to another aspect of the present invention, there is also provided a server, including the above-mentioned liquid cooling device, and the working heating element is a motherboard card of the server.

The utility model has the following beneficial effects:

The liquid cooling device of the utility model stores a liquid cooling medium in the cooling box, and the working heating element to be cooled is soaked in the liquid cooling medium, so that the heat generated by the working heating element is directly transferred to the cooling box through the liquid cooling medium and cooled. The box is transmitted to the outside air to realize the overall heat dissipation of the board integrated with electronic working components. The heat dissipation efficiency is high, especially suitable for the heat dissipation environment of high-density layout boards, and the cost is low, which is convenient for the expansion of the system.

The server of the utility model can simultaneously radiate heat to a plurality of cooling components on the main board by directly soaking the board card of the main board of the server in the cooling box in which the liquid cooling medium is stored, and has high heat dissipation efficiency, simple structure, and low cost, which is beneficial to Extended use of the system.

In addition to the purposes, features and advantages described above, the present invention has other purposes, features and advantages. Below with reference to figure, the utility model is described in further detail.

Description of drawings

The accompanying drawings constituting a part of this application are used to provide a further understanding of the utility model, and the schematic embodiments of the utility model and their descriptions are used to explain the utility model, and do not constitute an improper limitation of the utility model. In the attached picture:

Fig. 1 is a schematic structural view of a liquid cooling device in the prior art;

Fig. 2 is a schematic structural view of a liquid cooling device in a preferred embodiment of the present invention;

Fig. 3 is a schematic diagram of the heat dissipation principle of the liquid cooling device of the preferred embodiment of the present invention.

Explanation of reference signs:

10. Cooling box; 11. Box body; 12. Box cover; 13. Reserved space;

20. Liquid cooling medium; 30. Cooling pipeline; 40. Heat exchanger;

50. Pressure transmitter; 60. Pressure safety valve; 70. Controller.

Detailed ways

The embodiments of the utility model will be described in detail below in conjunction with the accompanying drawings, but the utility model can be implemented in various ways defined and covered by the claims.

With reference to Fig. 2, the preferred embodiment of the present utility model provides a kind of liquid cooling device, and this liquid cooling device comprises the cooling box body 10 that is stored with liquid cooling medium 20; not shown), in this embodiment, the working heating element is a board card carrying electronic working elements, such as the motherboard of a computer, or the chip of the control circuit, etc., and the working heating element is soaked in the liquid cooling medium 20; this implementation For example, the liquid cooling medium 20 is an insulating fluorinated liquid, and the liquid cooling medium 20 is in direct contact with the working heating element, so the heat generated by the working heating element is transferred to the cooling box 10 through the liquid cooling medium 20 and then conducted to the outside world through the cooling box 10 Air, so as to achieve the purpose of overall cooling of the working heating parts. Preferably, in order to improve the thermal conductivity of the liquid cooling medium 20, the fluorinated liquid can be: CF ₃ CHCl ₂ , C ₄ F ₉ OCH ₃ , C ₃ H ₇ Br, C ₃ Cl ₂ HF ₅ , C ₂ Cl ₂ H ₃ Any one or more of F, C ₂ Cl ₃ F ₃ . In this embodiment, the insulating fluorinated liquid is used as the liquid cooling medium, and the working heating element is immersed in it, thereby forming an immersion liquid cooling device, which is different from the traditional liquid cooling device for the local heat dissipation of a single component. Compared with the defect of high and complex system and high cost, it realizes the overall heat dissipation of the board card integrated with electronic working components, and the heat dissipation efficiency is high, especially suitable for the heat dissipation environment of board cards arranged in high density, and the cost is low, which is convenient for system installation extended use.

Optionally, in this embodiment, the cooling box 10 includes a box body 11 and a box cover 12, the box body 11 and the box cover 12 are sealed and connected, and the inner wall of the box body 11 is provided with a limiter for fixing the working heating element department. In this way, the overall sealing of the liquid cooling device is realized, and the problems of noise and dust pollution of the cooling device are fundamentally solved. In this embodiment, the working heating element is fixed on the side wall of the box body 11 through the card slot, and the working heating element is at a certain distance from the bottom wall of the box body 11, so that the working heating element is fully in contact with the liquid cooling medium 20 , to ensure that the heat generated by the working heating element is exported through the liquid cooling medium 20 in time. Preferably, the box cover 12 and the box body 11 are connected by bolts, and the joint between the box cover 12 and the box body 11 is provided with a sealing gasket for enhancing the sealing effect. More preferably, the cooling box 10 is made of materials with good thermal conductivity, such as stainless steel plates or aluminum substrates and other metal materials, so as to dissipate heat to the outside air in time. In this embodiment, preferably, the shape of the box body 11 is a rectangle. In other embodiments, the shape of the box body 11 can also be a cylinder or a polyhedron. The specific shape and size can be determined according to the shape of the working heating element. , Size and the size of the installation area are determined.

Referring to FIG. 2 , preferably, in order to further improve the heat dissipation effect of the liquid cooling device of this embodiment, a reserved space 13 is provided in the box body 11 for the liquid cooling medium 20 to perform gas-liquid phase conversion, and the reserved space 13 is provided with The cooling pipeline 30 is provided with a heat exchanger 40 outside the cooling box 10 , the outlet of the cooling pipeline 30 communicates with the inlet of the heat exchanger 40 , and the inlet of the cooling pipeline 30 communicates with the outlet of the heat exchanger 40 . When working, the heat generated by the working heating element will be directly transferred to the surrounding liquid cooling medium 20, and part of the heat will be dissipated into the outside air through the cooling box 10, and the heat that is too late to dissipate will continue to accumulate, causing the temperature of the liquid cooling medium 20 to rise. When it reaches its boiling point, the liquid cooling medium 20 will evaporate to take away the heat in the liquid and transfer to the refrigerant vapor, which exists in the sealed reserved space 13, and the cooling pipeline 30 is connected with the refrigerant vapor Heat exchange, the heat is directly conducted to the cooling pipeline 30, and spread to the outside air through the cooling pipeline 30 and the heat exchanger 40, while the refrigerant vapor is liquefied due to heat release, and then falls back into the box body 11, thus realizing a liquid state The gas-liquid phase change of the cooling medium 20 is used to exchange heat with the working heating element. Moreover, this embodiment adopts a structure in which the gas-liquid phase change circulation of the liquid cooling medium 20 in the closed cooling box 10 and the cooling channel of the external heat exchanger 40 are independent of each other, which solves the problem of system maintainability well, and It is beneficial to the expansion and layout of working heating parts.

Preferably, in this embodiment, the height of the liquid cooling medium 20 in the cooling box 10 is based on just submerging the working heating element, so as to reserve more reserved space 13 for gas-liquid phase conversion and heat dissipation. Preferably, the reserved space 13 accounts for more than a quarter of the internal volume of the cooling box 10 . Preferably, the liquid cooling medium 20 is a fluorinated liquid with a boiling point of 35-75 degrees Celsius.

In this embodiment, optionally, in order to enhance the heat exchange efficiency between the cooling pipeline 30 and the refrigerant steam in the reserved space 13, the cooling pipeline 30 adopts a multi-circuit structure formed by bending copper tubes. The path 30 can also be made of other materials with high thermal conductivity and/or other bending structures, so as to enhance the heat conduction efficiency of the cooling pipeline 30 and the contact area between the cooling pipeline 30 and the reserved space 13 . Optionally, the cooling pipeline 30 is connected to the box cover 12 through the auxiliary bracket, or the cooling pipeline 30 is connected to the side wall inside the box body 11 through the auxiliary bracket. In this embodiment, the cooling box 10 is provided with an inlet and outlet for the cooling pipeline 30, the outlet of the cooling pipeline 30 communicates with the inlet of the heat exchanger 40 provided outside the cooling box 10, and the inlet of the cooling pipeline 30 Connected with the inlet of the heat exchanger 40 , the cooling pipeline 30 is filled with refrigerant, and the refrigerant is driven to circulate through the heat exchanger 40 to continuously take away the heat released by the liquefaction of the refrigerant vapor in the cooling box 10 .

Preferably, the heat exchanger 40 is a refrigerator, and the refrigerant in the cooling pipeline 30 is a refrigerant, preferably Freon. In this way, there is no need to provide an additional power device to drive, and through the operation of the refrigerator, the Freon in the cooling pipeline 30 is repeatedly converted into gas and liquid, and the heat is continuously dissipated to the outside air.

In other embodiments, optionally, the heat exchanger 40 is a radiator, and the refrigerant in the cooling pipeline 30 is a cooling liquid for heat exchange; a circulation pump is provided between the radiator and the cooling pipeline 30 to ensure cooling. The liquid circulates in the cooling pipe 30 for heat exchange.

Preferably, in order to facilitate the operator to monitor the pressure change in the cooling box 10 , the cooling box 10 is provided with a pressure transmitter 50 for real-time monitoring of the pressure change in the cooling box 10 . Preferably, the output end of the pressure transmitter 50 is communicatively connected to a local monitoring terminal or a remote monitoring terminal, so that the monitoring personnel can keep abreast of the pressure change value in the cooling box 10 and know whether the operating condition of the system is normal. Preferably, the pressure transmitter 50 is installed on the case cover 12 through a threaded hole on the case cover 12 .

Preferably, the cooling box 10 is provided with a pressure safety valve 60 for releasing the pressure of the cooling box 10 when the pressure inside the cooling box 10 reaches a preset threshold. The pressure safety valve 60 is set to prevent the system pressure from being too high. When the working heating element is fully loaded, a large amount of heat is continuously generated, which will cause the liquid cooling medium 20 to evaporate continuously. If the cooling pipeline 30 cannot liquefy the refrigerant vapor in time, it will cause The pressure in the cooling box 10 rises. If the pressure reaches the safety value of the pressure safety valve 60, the pressure safety valve 60 will automatically open to release the pressure of the cooling box 10 to ensure the safe operation of the system. This situation only exists in extreme cases. In less extreme cases. Preferably, the pressure safety valve 60 is installed on the tank cover 12 through a threaded hole on the tank cover 12 .

Preferably, the liquid cooling device also includes a temperature detector for detecting the temperature of the gas in the cooling box 10 and a controller 70 for controlling the opening/closing of the heat exchanger 40; the controller 70 controls the heat exchanger 40 according to the temperature signal of the temperature detector. Heater 40 works. When the steam temperature in the cooling box 10 reaches the temperature value set by the controller 70, the controller 70 will automatically start the heat exchanger 40, and the heat exchanger 40 will run, thereby driving the circulation of the refrigerant in the cooling pipeline 30 to improve heat dissipation speed; when the steam temperature in the cooling box 10 drops below the temperature value set by the controller 70, the controller 70 will automatically close the heat exchanger 40, and at the same time the refrigerant in the cooling pipeline 30 will stop circulating and reduce the heat dissipation speed. This saves energy consumption.

According to another aspect of the present utility model, there is also provided a server, including the above-mentioned liquid cooling device, wherein the working heating element is a motherboard card of the server. During work, the motherboard boards in the cooling box 10 will continuously generate heat with the operation of the server, referring to Figure 3, and the liquid cooling device mainly dissipates heat from the motherboard boards in the following two ways:

1. Since the motherboard board of the server is in direct contact with the liquid cooling medium 20, and the liquid cooling medium 20 is also in direct contact with the cooling box 10, the heat generated by the motherboard board will be immediately transferred to the surrounding liquid cooling medium 20. Due to fluorination The liquid has excellent thermal conductivity, and can transfer the heat generated by the board to the cooling box 10 made of metal in time, so that the heat can be dissipated to the outside air through the large heat dissipation area of the cooling box 10 . At this time, if the temperature of the motherboard board of the server is kept within a reasonable range, the remaining systems of the cooling device do not need to be started, that is, the circulation system of the cooling pipeline 30 is all in a closed state, and the whole system only needs to pass through the natural cooling of the surface of the cooling box 10. Heat dissipation to achieve the purpose of cooling;

2. The above-mentioned natural heat dissipation method on the surface of the cooling box 10 can generally meet the heat dissipation requirements of the system when the system is empty or at a low load. When the load is high or even fully loaded, electronic components such as the server CPU will generate high heat, which will be completely Passed to the surrounding liquid cooling medium 20, a part of the heat will be dissipated by the above-mentioned first method, and the heat that cannot be dissipated will continue to accumulate, causing the temperature of the refrigerant to rise until it reaches its boiling point (by the type of liquid cooling medium 20 and When the pressure in the cooling box 10 is jointly determined), the liquid cooling medium 20 will evaporate, and take away the heat in the liquid, and transfer to the refrigerant vapor, which exists and is sealed in the upper space of the cooling medium medium in the cooling box. As the steam continues to accumulate, the temperature of the gas will gradually rise. Since the cooling box 10 is equipped with a controller 70, the controller 70 can monitor the steam temperature in real time. The heater 40 is automatically activated, so that the low-temperature refrigerant in the cooling pipeline 30 can be circulated repeatedly. Since the steam in the upper part of the cooling box 10 is in direct contact with the cooling pipeline 30, the heat can be directly transferred to the cooling pipeline 30, and the steam is liquefied due to heat release, and falls back into the box body 11, while the heat is transferred to the cooling pipeline 30. After the pipeline 30, due to the circulation of the low-temperature refrigerant in the cooling pipeline 30, the heat will be continuously taken out to the external heat exchanger 40 through the outlet of the cooling box 10, and finally dissipated into the air. The cooling medium in the cooling box 10 repeats the cycle of gas-liquid phase change in this way to continuously take away heat. Compared with conventional water cooling, it can take away more heat and has better heat dissipation efficiency.

It can be seen from the above description that the liquid cooling device of this embodiment and the server having the device have the following advantages:

1. This embodiment adopts the cooling technology that combines the wall heat dissipation of the cooling box 10 and the gas-liquid phase change conversion heat dissipation, which solves the problem of efficient heat dissipation for the core unit of the server, and is applicable to high-density server clusters. High efficiency, energy saving;

2. Adopt fully enclosed, fanless immersion liquid cooling technology, which solves the problem of noise and dust from the root;

3. The phase-change cycle of the liquid cooling medium 20 in the closed cooling box 10 is independent of the cooling channel of the external heat exchanger, which solves the problem of system maintainability and facilitates the expansion of server functions and Flexible layout;

4. Through the unique self-adaptive external heat exchanger control and pressure relief mode, the energy saving and long-term safe and stable operation of the server are guaranteed.

The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (10)

1. a Control device of liquid cooling, is characterized in that, comprises the cooling box (10) storing liquid cooled medium (20);

Place operational heat part to be cooled in described cooling box (10), described operational heat part is immersed in described liquid cooled medium (20); Described liquid cooled medium (20) fluoridizes liquid for insulation; Described operational heat part is the board carrying electronic working element;

The heat that described operational heat part produces is passed to described cooling box (10) through described liquid cooled medium (20) and conducts to outside air through described cooling box (10).

2. Control device of liquid cooling according to claim 1, is characterized in that,

Described cooling box (10) comprises box-like body (11) and case lid (12), described box-like body (11) and described case lid (12) are tightly connected, and the inwall of described box-like body (11) is provided with the limiting section for fixing described operational heat part.

3. Control device of liquid cooling according to claim 2, is characterized in that,

The headspace (13) carrying out liquid phase conversion for described liquid cooled medium (20) is provided with in described box-like body (11), described headspace (13) place is provided with cooling line (30), heat exchanger (40) is provided with outside described cooling box (10), the outlet of described cooling line (30) is communicated with the entrance of described heat exchanger (40), the entrance of described cooling line (30) and the outlet of described heat exchanger (40), described liquid cools medium (20) carries out gas-liquid phase transition conversion with heat radiation by described cooling line (30).

4. Control device of liquid cooling according to claim 3, is characterized in that,

Described heat exchanger (40) is refrigeration machine, and described cooling line is provided with the cold-producing medium being convenient to exchange heat in (30), and described cold-producing medium is freon.

5. Control device of liquid cooling according to claim 3, is characterized in that,

Described heat exchanger (40) is radiator, and described cooling line is provided with the cooling fluid being convenient to exchange heat in (30); Circulating pump is provided with between described radiator and described cooling line (30).

6. the Control device of liquid cooling according to claim 4 or 5, is characterized in that,

Described cooling line (30) is connected with described case lid (12), or

Described cooling line (30) is connected with the sidewall in described box-like body (11).

7. Control device of liquid cooling according to claim 6, is characterized in that,

Described cooling box (10) is provided with the pressure transmitter (50) for cooling box described in Real-Time Monitoring (10) interior pressure change.

8. Control device of liquid cooling according to claim 7, is characterized in that,

Described cooling box (10) is provided with pressure safety valve (60), carries out pressure release when reaching predetermined threshold value for the force value in described cooling box (10) to described cooling box (10).

9. Control device of liquid cooling according to claim 6, is characterized in that,

Described Control device of liquid cooling also comprises the temperature monitor for detecting described cooling box (10) interior gas temperature and the controller (70) for controlling described heat exchanger (40) On/Off;

Described controller (70) controls the work of described heat exchanger (40) according to the temperature signal of described temperature monitor.

10. a server, is characterized in that, comprise as arbitrary in claim 1 to 9 as described in Control device of liquid cooling, described operational heat part is the motherboard card of described server.