CN111258394A - Low-cost water-cooling case and water-cooling method thereof - Google Patents
Low-cost water-cooling case and water-cooling method thereof Download PDFInfo
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- CN111258394A CN111258394A CN202010324859.3A CN202010324859A CN111258394A CN 111258394 A CN111258394 A CN 111258394A CN 202010324859 A CN202010324859 A CN 202010324859A CN 111258394 A CN111258394 A CN 111258394A
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- water
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- water bag
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- General Engineering & Computer Science (AREA)
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- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a low-cost water-cooled case, which comprises a case body, wherein a power supply fan for supplying air into the case is arranged at the tail end of the case body, and a plurality of heat dissipation air holes are formed in the left side surface or the right side surface of the case body; the machine case also comprises a long sheet-shaped water bag, wherein magnetic suction blocks are arranged at two ends of the water bag and are respectively used for sucking the side surface and the right side surface of the machine case body; a closed-loop cooling water channel is formed in the water bag; the water bag is provided with a water pump for driving the cooling liquid in the cooling water channel to circulate and a semiconductor refrigerating sheet for cooling the cooling liquid; through holes are formed on the water bag and correspond to part or all of the plurality of heat dissipation air holes; the water bag is provided with a radiating fin group for radiating the heating sheet of the semiconductor refrigerating sheet at the through hole; through this kind of mode, water cooling equipment need not specific installation space, and commonality and portability are high, and the dismouting is also very convenient, need not professional operation knowledge, and water-cooling radiating effect is good.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a low-cost water-cooling case and a water-cooling method thereof.
Background
The machine case is the core assembly of server, and the water cooling equipment that adopts at present mostly needs reserve out suitable installation space on the mainboard, and commonality and portability are extremely low, and the dismouting is complicated, often needs the professional to operate for the price of this type of water cooling equipment also remains high for a long time.
Disclosure of Invention
The invention aims to solve the technical problem of providing a low-cost water-cooled case and a water-cooling method of the low-cost water-cooled case aiming at the defects in the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
a low-cost water-cooling case is constructed and comprises a case body, wherein a power supply fan for supplying air to the inside of the case is arranged at the tail end of the case body, and a plurality of heat dissipation air holes are formed in the left side surface or the right side surface of the case body; the machine case further comprises a long-sheet-shaped water bag, wherein magnetic suction blocks are arranged at two ends of the water bag and are respectively used for sucking the side surface and the right side surface of the machine case body; a closed-loop cooling water channel is formed in the water bag; the water sac is provided with a water pump for driving the cooling liquid in the cooling water channel to circulate and a semiconductor refrigerating sheet for cooling the cooling liquid; through holes are formed in the water bag and correspond to part or all of the plurality of heat dissipation air holes; the water bag is provided with a radiating fin group radiating for the heating sheet of the semiconductor refrigerating sheet at the position of the through hole.
According to the low-cost water-cooled case, the annular magnet is detachably arranged on the inner side surface of the through hole.
The low-cost water-cooling case comprises a cooling fin group, a ring magnet and a plurality of cooling fins, wherein the cooling fin group comprises an iron ring which is correspondingly adsorbed to the ring magnet; one end of the radiating fin exceeds the metal net, extends to the upper part of the semiconductor refrigerating sheet and is attached to the heating surface of the semiconductor refrigerating sheet.
The low-cost water-cooling case further comprises a wind shield sheet opposite to the metal net, the area of the wind shield sheet is smaller than that of the metal net, and the wind shield sheet and the metal net are respectively positioned on two sides of the radiating fins; the wind shield sheet is fixedly connected with part or all of the plurality of radiating fins.
The low-cost water-cooling case is characterized in that a plurality of magnetic columns are arranged on the heating surface of the semiconductor refrigerating sheet; the radiating fin group also comprises an iron radiating fin; the radiating fin is attached to the heating surface of the semiconductor refrigerating fin and is provided with an inserting hole matched with the magnetic column; and the plurality of radiating fins are fixedly connected with the radiating fin.
The low-cost water-cooling case is characterized in that the water bag is rectangular; the cooling water channels comprise a plurality of sections of parallel water channels distributed along the length direction of the water bag; the adjacent parallel water channels are communicated end to end in sequence, and the two parallel water channels on the outermost side are communicated to form a closed loop.
The low-cost water cooling case is characterized in that the plurality of parallel water channels are embedded with the cold guide plates, and the plurality of cold guide plates are transversely distributed and fixedly connected with the refrigerating surfaces of the semiconductor refrigerating plates at the outer ends.
According to the low-cost water-cooling case, the control panel is arranged on the water bag, and the semiconductor refrigeration sheet and the water pump are controlled by the control panel; and a USB power-taking connector is arranged on the control panel.
According to the low-cost water-cooling case, the magnetic suction blocks are arranged at the corners of the water bag.
A water cooling method for a low-cost water cooling machine case comprises the following steps: the water bag is placed on the case body, the through hole is aligned with the heat dissipation air hole, and the left end and the right end of the water bag are respectively adsorbed and fixed with the left side surface and the right side surface of the case body through the magnetic absorption blocks; the water pump is started and the semiconductor refrigerating piece is opened, the refrigerating surface of the semiconductor refrigerating piece cools the cooling liquid in the water bag, the cooling liquid circularly flows along the cooling water channel through the water pump, the cooling capacity is uniformly distributed, the heat of the case body is absorbed to realize the water cooling purpose, meanwhile, the power supply fan on the case body supplies air to the inside of the case body, the air is exhausted through the heat dissipation air hole, the air flowing speed of the heat dissipation fin group is accelerated, and the heat is dissipated from the heating surface of the semiconductor refrigerating piece.
The invention has the beneficial effects that: the water bag is placed on the case body, the through hole is aligned with the heat dissipation air hole, and the left end and the right end of the water bag are respectively adsorbed and fixed with the left side surface and the right side surface of the case body through the magnetic absorption blocks; the water pump is started, the semiconductor refrigerating sheet is turned on, the refrigerating surface of the semiconductor refrigerating sheet cools the cooling liquid in the water bag, the cooling liquid circularly flows along the cooling water channel through the water pump, so that the cooling capacity is uniformly distributed, the heat of the case body is absorbed to realize the water cooling purpose, meanwhile, the power supply fan on the case body supplies air to the inside of the case body, the air is exhausted through the heat radiating air holes, the air flowing speed of the heat radiating fin group is accelerated, and the heat is radiated for the heating surface of the semiconductor refrigerating sheet; through this kind of mode, water cooling equipment need not specific installation space, and commonality and portability are high, and the dismouting is also very convenient, need not professional operation knowledge, and water-cooling radiating effect is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described with reference to the accompanying drawings and embodiments, wherein the drawings in the following description are only part of the embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive efforts according to the accompanying drawings:
FIG. 1 is a rear view of a low cost water cooled enclosure (semiconductor cooling fins and fin sets not shown) in accordance with a preferred embodiment of the present invention;
FIG. 2 is a side view of a low cost water cooled enclosure of the preferred embodiment of the present invention (semiconductor chilling plates and fin packs not shown);
FIG. 3 is a schematic diagram of the water bag of the low-cost water-cooled cabinet according to the preferred embodiment of the invention;
FIG. 4 is a cross-sectional view of a low cost water cooled enclosure water bladder in accordance with a preferred embodiment of the present invention;
FIG. 5 is a side view of a low cost cooling fin assembly for a water-cooled enclosure in accordance with a preferred embodiment of the present invention;
FIG. 6 is an assembled cross-sectional view of a low cost water-cooled chassis heat sink and semiconductor chilling plate according to a preferred embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without inventive step, are within the scope of the present invention.
As shown in fig. 1 and referring to fig. 2-6, the low-cost water-cooled enclosure of the preferred embodiment of the present invention includes an enclosure body 1, a power supply fan 10 for supplying air to the interior of the enclosure is disposed at the tail end of the enclosure body 1, and a plurality of heat dissipation air holes 11 are disposed on the left side surface or the right side surface of the enclosure body 1; the machine case further comprises a long sheet-shaped water bag 2, wherein magnetic suction blocks 20 are arranged at two ends of the water bag 2, and the magnetic suction blocks 20 at the two ends are respectively used for sucking the side surface and the right side surface of the machine case body 1; a closed loop cooling water channel 21 is formed in the water bag 2; the water bag 2 is provided with a water pump 22 for driving the cooling liquid in the cooling water channel 21 to circulate and a semiconductor refrigerating sheet 23 for cooling the cooling liquid; a through hole 24 is formed on the water bag 2, and the through hole 24 corresponds to part or all of the plurality of heat dissipation air holes; the water bag 2 is provided with a radiating fin group 25 for radiating the heating sheet of the semiconductor refrigerating sheet at the position of the through hole 24; the water bag 2 is placed on the case body 1, the through hole 24 is aligned with the heat dissipation air hole, and the left end and the right end of the water bag 2 are respectively adsorbed and fixed with the left side surface and the right side surface of the case body 1 through the magnetic absorption block 20; the water pump 22 is started, the semiconductor refrigerating sheet 23 is started, the refrigerating surface of the semiconductor refrigerating sheet 23 cools the cooling liquid in the water bag 2, the cooling liquid circularly flows along the cooling water channel through the water pump 22, so that the cooling capacity is uniformly distributed, the heat of the case body 1 is absorbed to realize the purpose of water cooling, meanwhile, the power supply fan 10 on the case body 1 enters air into the case body 1 and exhausts the air through the heat-dissipating air hole 11, the air flowing speed of the heat-dissipating fin group 25 is accelerated, and the heat of the heating surface of the semiconductor refrigerating sheet 23 is dissipated; by the mode, the water cooling equipment (water bag) does not need a specific installation space, the universality and the transportability are extremely high, the disassembly and the assembly are very convenient, professional operation knowledge is not needed, and the water cooling and heat dissipation effect is good;
it should be noted that, chassis body 1 is under normal operating condition, and the wind that comes out from heat dissipation gas pocket 11 can be very stable, and because water pocket 2 absorbs heat to chassis body 1's persistence, the air-out temperature can be far less than the heating face of semiconductor heating piece to can realize the purpose of dispelling the heat to the heating face of semiconductor heating piece, whole in-process can consume the electric energy, accords with the law of conservation of energy.
Preferably, the inner side surface of the through hole 24 is detachably provided with a ring magnet 240; be convenient for adsorb machine case body 1, ensure stability.
Preferably, the heat dissipation fin set 25 includes an iron ring 250 correspondingly adsorbed to the ring magnet 240, a metal mesh 251 is fixedly disposed in the iron ring 250, and a plurality of parallel heat dissipation fins 252 are disposed on the metal mesh 251; one end of the heat dissipation fin 252 exceeds the metal mesh 251, extends to the upper part of the semiconductor refrigeration sheet 23 and is attached to the heating surface of the semiconductor refrigeration sheet; when the heat dissipation device is installed, the ring-shaped magnet 240 adsorbs the fixing iron ring 250 to fix the whole heat dissipation fin group 25, and the wind from the through hole 24 blows to the metal mesh and the heat dissipation fins to dissipate heat.
Preferably, the heat sink further comprises a wind shield 253 facing the metal mesh 251, the area of the wind shield 253 is smaller than that of the metal mesh 251, and the wind shield 253 and the metal mesh 251 are respectively located at two sides of the heat dissipation fin 252; the windshield 253 is fixedly connected with part or all of the plurality of radiating fins 252; the wind on the wind blocking plate is blown out from both ends along the length direction of the heat radiating fin by the wind blocking plate 253, so that part of the wind passes through the heating surface of the semiconductor cooling plate 23, thereby improving the heat radiating effect of the semiconductor cooling plate 23.
Preferably, a plurality of magnetic columns 230 are arranged on the heating surface of the semiconductor cooling plate 23; the fin set 25 further includes an iron fin 254; the heat sink 254 is attached to the heat generating surface of the semiconductor cooling plate 23, and is provided with an insertion hole 2540 matching with the magnetic pole 230; the plurality of radiating fins 252 are fixedly connected with the radiating fins 254; one end of the radiating fin close to the semiconductor refrigerating piece 23 is also adsorbed and fixed through the magnetic column and the radiating fin, stability is guaranteed, meanwhile, the radiating fin is arranged to help to improve heat conduction efficiency, and then radiating effect of the semiconductor refrigerating piece is improved.
Preferably, the water bag 2 is rectangular; the cooling water channel 21 comprises a plurality of sections of parallel water channels 210 distributed along the length direction of the water bag 2; the adjacent parallel water channels 210 are communicated end to end in sequence, and the two outermost parallel water channels 210 are communicated to form a closed loop; of course, other channel shapes are possible here.
Preferably, the plurality of parallel water channels 210 are embedded with the cold guide plates 26, and the plurality of cold guide plates 26 are transversely distributed and fixedly connected with the refrigerating surfaces of the semiconductor refrigerating plates 23 at the outer ends; the sealing performance and the transmission of cold energy are convenient to guarantee.
Preferably, the water bag 2 is provided with a control panel 27, and the semiconductor refrigerating sheet 23 and the water pump 22 are controlled by the control panel 27; a USB power-taking connector 270 is arranged on the control panel 27; is convenient to connect on the case body 1 for taking electricity.
Preferably, each corner of the water bag 2 is provided with a magnetic suction block 20; the stability is good.
A water cooling method for a low-cost water cooling machine case comprises the following steps: the water bag is placed on the case body, the through hole is aligned with the heat dissipation air hole, and the left end and the right end of the water bag are respectively adsorbed and fixed with the left side surface and the right side surface of the case body through the magnetic absorption blocks; the water pump is started, the semiconductor refrigerating sheet is turned on, the refrigerating surface of the semiconductor refrigerating sheet cools the cooling liquid in the water bag, the cooling liquid circularly flows along the cooling water channel through the water pump, so that the cooling capacity is uniformly distributed, the heat of the case body is absorbed to realize the water cooling purpose, meanwhile, the power supply fan on the case body supplies air to the inside of the case body, the air is exhausted through the heat radiating air holes, the air flowing speed of the heat radiating fin group is accelerated, and the heat is radiated for the heating surface of the semiconductor refrigerating sheet; through this kind of mode, water cooling equipment need not specific installation space, and commonality and portability are high, and the dismouting is also very convenient, need not professional operation knowledge, and water-cooling radiating effect is good.
It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. A low-cost water-cooling case comprises a case body, wherein a power supply fan for supplying air to the inside of the case is arranged at the tail end of the case body, and a plurality of heat dissipation air holes are formed in the left side surface or the right side surface of the case body; the machine case is characterized by further comprising a long-sheet-shaped water bag, wherein magnetic suction blocks are arranged at two ends of the water bag and are respectively used for adsorbing the side surface and the right side surface of the machine case body; a closed-loop cooling water channel is formed in the water bag; the water sac is provided with a water pump for driving the cooling liquid in the cooling water channel to circulate and a semiconductor refrigerating sheet for cooling the cooling liquid; through holes are formed in the water bag and correspond to part or all of the plurality of heat dissipation air holes; the water bag is provided with a radiating fin group radiating for the heating sheet of the semiconductor refrigerating sheet at the position of the through hole.
2. The low-cost water-cooled cabinet according to claim 1, wherein the inner surface of the through hole is detachably provided with a ring-shaped magnet.
3. The low-cost water-cooled cabinet according to claim 2, wherein the radiating fin group comprises an iron ring correspondingly adsorbed to the annular magnet, a metal mesh is fixedly arranged in the iron ring, and a plurality of parallel radiating fins are arranged on the metal mesh; one end of the radiating fin exceeds the metal net, extends to the upper part of the semiconductor refrigerating sheet and is attached to the heating surface of the semiconductor refrigerating sheet.
4. The low-cost water-cooled cabinet according to claim 3, further comprising a wind shield facing the metal mesh, wherein the area of the wind shield is smaller than that of the metal mesh, and the wind shield and the metal mesh are respectively located on two sides of the heat dissipation fins; the wind shield sheet is fixedly connected with part or all of the plurality of radiating fins.
5. The low-cost water-cooled cabinet according to claim 3, wherein a plurality of magnetic columns are arranged on the heating surface of the semiconductor refrigeration plate; the radiating fin group also comprises an iron radiating fin; the radiating fin is attached to the heating surface of the semiconductor refrigerating fin and is provided with an inserting hole matched with the magnetic column; and the plurality of radiating fins are fixedly connected with the radiating fin.
6. The low-cost water-cooled cabinet of any one of claims 1 to 5, wherein the water bladder is rectangular; the cooling water channels comprise a plurality of sections of parallel water channels distributed along the length direction of the water bag; the adjacent parallel water channels are communicated end to end in sequence, and the two parallel water channels on the outermost side are communicated to form a closed loop.
7. The low-cost water-cooled cabinet according to claim 6, wherein a plurality of the parallel water channels are embedded with a plurality of the cold-guiding sheets, and the plurality of the cold-guiding sheets are transversely distributed and fixedly connected with the outer ends of the plurality of the semiconductor refrigerating sheets.
8. The low-cost water-cooled cabinet according to claim 6, wherein a control panel is arranged on the water bag, and the semiconductor refrigeration sheet and the water pump are controlled by the control panel; and a USB power-taking connector is arranged on the control panel.
9. The low-cost water-cooled cabinet according to claim 6, wherein the magnetic blocks are arranged at the corners of the water bag.
10. A water cooling method for a low-cost water cooling cabinet according to any one of claims 1 to 9, characterized by comprising the following steps: the water bag is placed on the case body, the through hole is aligned with the heat dissipation air hole, and the left end and the right end of the water bag are respectively adsorbed and fixed with the left side surface and the right side surface of the case body through the magnetic absorption blocks; the water pump is started and the semiconductor refrigerating piece is opened, the refrigerating surface of the semiconductor refrigerating piece cools the cooling liquid in the water bag, the cooling liquid circularly flows along the cooling water channel through the water pump, the cooling capacity is uniformly distributed, the heat of the case body is absorbed to realize the water cooling purpose, meanwhile, the power supply fan on the case body supplies air to the inside of the case body, the air is exhausted through the heat dissipation air hole, the air flowing speed of the heat dissipation fin group is accelerated, and the heat is dissipated from the heating surface of the semiconductor refrigerating piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010324859.3A CN111258394A (en) | 2020-04-23 | 2020-04-23 | Low-cost water-cooling case and water-cooling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010324859.3A CN111258394A (en) | 2020-04-23 | 2020-04-23 | Low-cost water-cooling case and water-cooling method thereof |
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| CN111258394A true CN111258394A (en) | 2020-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010324859.3A Pending CN111258394A (en) | 2020-04-23 | 2020-04-23 | Low-cost water-cooling case and water-cooling method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112527067A (en) * | 2020-12-21 | 2021-03-19 | 刘良仓 | Water-cooled machine case with protection mechanism |
| CN115446210A (en) * | 2022-09-13 | 2022-12-09 | 科佳(长兴)模架制造有限公司 | A but, cooling die carrier for new energy automobile mould |
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