CN220307674U

CN220307674U - Water cooling structure of power supply module

Info

Publication number: CN220307674U
Application number: CN202321875680.2U
Authority: CN
Inventors: 肖建伟
Original assignee: Shenzhen Lorentz Technology Co ltd
Current assignee: Shenzhen Lorentz Technology Co ltd
Priority date: 2023-07-17
Filing date: 2023-07-17
Publication date: 2024-01-05
Anticipated expiration: 2033-07-17

Abstract

The utility model belongs to the technical field of cooling, and discloses a water cooling structure of a power supply module, which comprises a heat conduction assembly, a cooling pipeline and a driving pump; the heat conduction component is attached to the power supply module and used for absorbing heat of the power supply module; one end of the cooling pipeline is connected with the heat conduction component, and cooling liquid flows in the cooling pipeline; the driving pump is communicated with the cooling pipeline and used for driving cooling liquid in the cooling pipeline to flow through the heat conduction assembly; the water cooling structure is arranged on the power supply module, so that the heat conduction assembly is attached to the surface of the power supply module, the heat of the power supply module is absorbed by utilizing the heat conduction principle, the heat is absorbed by utilizing the surface contact of the heat conduction material, the heat conduction effect is better, meanwhile, the entering of dust and water vapor is effectively avoided without passing through a device, and the power supply module can stably operate for a long time; therefore, the design not only improves the cooling efficiency, but also helps to improve the reliability and service life of the power supply module.

Description

Water cooling structure of power supply module

Technical Field

The utility model relates to the technical field of cooling, in particular to a water cooling structure of a power supply module.

Background

Because the heat of the internal devices of the mobile power supply is considered to easily cause the thermal attenuation of the devices, a cooling and radiating structure is required to be installed in the power supply device so as to reduce the temperature of the internal devices of the power supply and maintain the normal operation of the devices.

The common internal cooling and radiating structure of the power supply in the prior art is an air-cooled structure, and the specific structure is that a fan is arranged at a position corresponding to the side wall of the device, a radiating air channel flowing through the power supply is formed in the device, and heat is brought out of the system; the disadvantage of this structure is that during the operation of the fan, dust and water vapor can be sucked into the machine, and the device is wetted, which results in the reduction of the reliability of the circuit device and even in the case of short circuit; and the appearance of the device is required to be combined with the air inlet and outlet holes for design, so that the appearance design is inconvenient.

In view of this, there is a need for an improvement in the cooling and heat dissipation structure of the power supply in the prior art to solve the technical problem that the reliability of the power supply is reduced when the power supply works for a long time.

Disclosure of Invention

The utility model aims to provide a water cooling structure of a power supply module, which solves the technical problems.

To achieve the purpose, the utility model adopts the following technical scheme:

a water cooling structure of a power module, comprising:

the heat conduction assembly is attached to the power supply module and used for absorbing heat of the power supply module;

one end of the cooling pipeline is connected with the heat conduction assembly, and cooling liquid flows in the cooling pipeline;

and the driving pump is communicated with the cooling pipeline and used for driving cooling liquid in the cooling pipeline to flow through the heat conduction assembly.

Optionally, the heat conduction assembly is provided with a water inlet and a water outlet, a first inner channel for cooling liquid circulation is arranged in the heat conduction assembly, and two ends of the first inner channel are respectively communicated with the cooling pipeline through the water inlet and the water outlet.

Optionally, the heat conduction assembly comprises a first heat conduction plate and a second heat conduction plate perpendicular to the first heat conduction plate;

the first inner channel passes through the first heat-conducting plate and the second heat-conducting plate in sequence.

Optionally, the water cooling structure of the power module further includes:

the heat dissipation assembly comprises a heat radiator and a heat dissipation fan, a second inner channel for cooling liquid to circulate is formed in the heat radiator, and one end of the cooling pipeline is communicated with the second inner channel.

Optionally, the radiator comprises a radiating shell, the radiating shell is provided with a mounting groove, and the radiating fan is mounted in the mounting groove;

a plurality of radiating fins which are arranged side by side are arranged on one end face of the radiating shell, and two ends of each radiating fin are respectively connected with the cooling pipeline.

Optionally, the cooling pipeline includes a first pipeline and a second pipeline, and two ends of the first pipeline and the second pipeline are respectively connected with the heat conduction component and the heat dissipation component to form a circulation pipeline.

Optionally, the driving pump includes a housing assembly, a liquid storage assembly for storing cooling liquid is disposed in the housing assembly, and the first pipeline is disposed through the liquid storage assembly;

one side of the liquid storage component is provided with a hydraulic driving component, and the driving end of the hydraulic driving component is communicated with the liquid storage component and used for driving cooling liquid in the liquid storage component to flow along the first pipeline.

Optionally, a heat insulation board is arranged between the second pipeline and the liquid storage component.

Optionally, the heat conducting component is one of a heat conducting copper plate, an alloy aluminum plate, a graphite plate or a ceramic plate.

Optionally, the heat conduction assembly is attached to a surface of the power module and is provided with an insulating layer.

Compared with the prior art, the utility model has the following beneficial effects: the water cooling structure is arranged on the power supply module, so that the heat conduction assembly is attached to the surface of the power supply module, the heat of the power supply module is absorbed by utilizing the heat conduction principle, and the cooling liquid in the cooling pipeline flows through the heat conduction assembly along the cooling pipeline under the action of the driving pump, so that the heat of the heat conduction assembly is taken away, and the heat conduction assembly continuously maintains good heat conduction and heat dissipation effects; the water cooling structure can absorb heat by utilizing the surface contact of the heat conducting material, has better heat conduction effect, does not need to pass through devices through fluid, effectively avoids the entry of dust and water vapor, and can stably operate for a long time; therefore, the design not only improves the cooling efficiency, but also helps to improve the reliability and service life of the power supply module.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.

The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are not intended to limit the scope of the utility model, since any modification, variation in proportions, or adjustment of the size, etc. of the structures, proportions, etc. should be considered as falling within the spirit and scope of the utility model, without affecting the effect or achievement of the objective.

FIG. 1 is a schematic diagram of a water cooling structure and a power module according to the present embodiment;

FIG. 2 is a schematic diagram of a water cooling structure according to the present embodiment;

fig. 3 is a schematic structural diagram of a heat conduction assembly of the water cooling structure of the present embodiment;

FIG. 4 is a simplified schematic diagram of the internal piping of the driving pump of the water cooling structure according to the present embodiment;

FIG. 5 is a schematic diagram of the water cooling structure and the power module according to the embodiment;

fig. 6 is a schematic diagram of a water cooling structure and a power module according to the embodiment.

Illustration of: the heat conduction assembly 1, the water inlet 11, the water outlet 12, the first heat conduction plate 13, the second heat conduction plate 14, the cooling pipeline 2, the first pipeline 21, the second pipeline 22, the driving pump 3, the shell assembly 31, the liquid storage assembly 32, the hydraulic driving assembly 33, the heat dissipation assembly 4, the heat radiator 41, the heat dissipation fan 42, the heat dissipation shell 411, the mounting groove 412, the heat dissipation fin 413 and the power supply module 5.

Detailed Description

In order to make the objects, features and advantages of the present utility model more comprehensible, the technical solutions in the embodiments of the present utility model are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.

Referring to fig. 1 to 6, an embodiment of the present utility model provides a water cooling structure of a power module 5, including a heat conduction assembly 1, a cooling pipeline 2 and a driving pump 3, where the heat conduction assembly 1 is attached to the power module 5 and is used for absorbing heat of the power module 5; one end of the cooling pipeline 2 is connected with the heat conduction component 1, and cooling liquid flows in the cooling pipeline 2; the driving pump 3 is communicated with the cooling pipeline 2 and is used for driving the cooling liquid in the cooling pipeline 2 to flow through the heat conduction assembly 1. Wherein the cooling liquid is one of high-flow liquids, such as water or cooling oil, for example.

The working principle of the utility model is as follows: the water cooling structure is arranged on the power supply module 5, so that the heat conduction assembly 1 is attached to the surface of the power supply module 5, the heat of the power supply module 5 is absorbed by utilizing the heat conduction principle, and the cooling liquid in the cooling pipeline 2 flows through the heat conduction assembly 1 along the cooling pipeline 2 under the action of the driving pump 3, so that the heat of the heat conduction assembly 1 is taken away, and the heat conduction assembly 1 continuously maintains good heat conduction and heat dissipation effects; compared with the cooling and radiating structure in the prior art, the water cooling structure can absorb heat by utilizing the surface contact of the heat conducting material, has better heat conduction effect, does not need to pass through devices through fluid, effectively avoids the entry of dust and water vapor, and can stably operate the power module 5 for a long time; therefore, the design not only improves the cooling efficiency, but also helps to improve the reliability and service life of the power module 5.

In this embodiment, the heat conduction assembly 1 is provided with a water inlet 11 and a water outlet 12, a first inner channel for circulating cooling liquid is formed in the heat conduction assembly 1, and two ends of the first inner channel are respectively communicated with the cooling pipeline 2 through the water inlet 11 and the water outlet 12.

It should be noted that, the heat conducting component 1 is used as a core part of the water cooling structure, the cooling liquid enters the heat conducting component 1 through the water inlet 11 and flows in the inner channel, and further flows out from the water outlet 12, so that the cooling liquid has a flowing liquid channel in the heat conducting component 1, and heat absorbed by the heat conducting component 1 can be taken away in the flowing process of the cooling liquid; namely, the heat conduction component 1 in the present embodiment plays a role of heat transfer as a heat conduction medium.

The first inner channels are arranged in a plurality of modes; illustratively, a plurality of bending channels are sequentially connected in series to form an integral first inner channel, so that the cooling liquid and the heat conducting component 1 have larger contact area, and the heat transfer efficiency of the cooling liquid is improved.

Among them, it is preferable that the heat conduction member 1 is one of a heat conduction copper plate, an alloy aluminum plate, a graphite plate, and a ceramic plate, and the heat conduction member 1 may be composed of different materials having strong heat conductivity to efficiently absorb and conduct heat.

Further described, the heat conducting component 1 is attached to a surface of the power module and is provided with an insulating layer, so that direct contact between the power module 5 and the heat conducting component 1 is avoided, short-circuit of components on the surface of the power module 5 can be prevented, the stability of circuit operation is improved, and meanwhile, a protective layer can be provided, and potential problems caused by overheating are avoided.

Specifically, the heat conduction assembly 1 includes a first heat conduction plate 13, and a second heat conduction plate 14 disposed perpendicularly to the first heat conduction plate 13; the first inner passage passes through the first heat conductive plate 13 and the second heat conductive plate 14 in sequence.

Referring to fig. 3, the heat conducting assembly 1 in this embodiment is L-shaped, and has two vertically arranged first heat conducting plates 13 and second heat conducting plates 14, where the first heat conducting plates 13 and the second heat conducting plates 14 are respectively attached to different components on the PCB of the power supply assembly; taking the layout of the devices of the PCB in the illustration as an example, the first heat-conducting plate 13 is attached to the coil, and the second heat-conducting plate is attached to the triode device, and the triode device is vertically arranged, so that the design of the second heat-conducting plate 14 can be well matched; it is further explained that in order to facilitate the circulation of the cooling liquid, the water inlet 11 is arranged on the first heat conducting plate 13, and the water outlet 12 is arranged on the second heat conducting plate 14, so that the cooling liquid in the heat conducting assembly 1 can flow in a direction from top to bottom.

In this embodiment, the water cooling structure of the power module 5 further includes a heat dissipating component 4, the heat dissipating component 4 includes a heat sink 41 and a heat dissipating fan 42, a second inner channel for flowing cooling liquid is provided in the heat sink 41, and one end of the cooling pipeline 2 is communicated with the second inner channel.

As shown in fig. 1 and fig. 2, the other end of the cooling pipeline in the solution is further provided with a heat dissipating component 4, which has the function of conveying the cooling liquid absorbing the heat of the heat conducting component 1 into the radiator 41, and through the cooperation of the cooling fan 42 and the second inner channel, the air cooling effect of the cooling liquid is achieved, the cooled cooling liquid returns to the cooling pipeline again, so that an integral circulating cooling liquid flow pipeline is formed, the loss of the cooling liquid is reduced, the cost is reduced, and the normal operation of each element in the power module 5 is protected.

Specifically, the radiator 41 includes a heat dissipation housing 411, the heat dissipation housing 411 is provided with a mounting slot 412, and the heat dissipation fan 42 is mounted in the mounting slot 412; one end surface of the heat dissipation shell 411 is provided with a plurality of heat dissipation fins 413 which are arranged side by side, and two ends of the heat dissipation fins 413 are respectively connected with the cooling pipeline 2. Wherein a plurality of cooling fins 413 are disposed at intervals from each other. The cooling fan may be one of an axial flow fan, a blower, or a centrifugal fan.

Referring to fig. 5, the cooling fan 42 in this embodiment is mounted on the cooling housing 411, and a plurality of cooling fins 413 are disposed on the cooling housing 411 at positions corresponding to the cooling fan 42, so that air flow generated when the cooling fan 42 operates can flow through the cooling fins 413, so as to cool the cooling fins 413; further designed, the cooling fins 413 are arranged to be hollow structures, two ends of the cooling fins 413 are respectively connected with the cooling pipeline 2, so that heat fluid flowing in the cooling pipeline can be rapidly cooled after being cooled by the cooling fan 42, cooled cooling liquid is formed, and the cooling liquid is recycled along the circulating flow of the cooling pipeline.

In the present embodiment, as shown in conjunction with fig. 2, the cooling pipe 2 includes a first pipe 21 and a second pipe 22, and both ends of the first pipe 21 and the second pipe 22 are connected with the heat conduction assembly 1 and the heat dissipation assembly 4, respectively, to form a circulation pipe. The first pipe 21 and the second pipe 22 are respectively arranged side by side, and are arranged in the shell of the power module 5 along a preset path, and preferably, a fixing structure can be arranged on the inner wall of the shell of the power module 5 to position the cooling pipe; wherein, in order to facilitate distinguishing the first pipe 21 from the second pipe 22, the first pipe 21 is for flowing the cooling liquid with low temperature, and the second pipe 22 is for flowing the cooling liquid with a certain temperature (i.e. the cooling liquid flowing out from the heat conducting assembly 1). The two pipelines are combined to form a circulating liquid flow pipeline, so that the recycling of the cooling liquid is realized, and the cooling liquid can be limited in the circulating pipeline.

Further illustratively, the drive pump 3 includes a housing assembly 31, a reservoir assembly 32 for storing a cooling fluid disposed within the housing assembly 31, and the first conduit 21 disposed through the reservoir assembly 32; one side of the liquid storage assembly 32 is provided with a hydraulic driving assembly 33, and a driving end of the hydraulic driving assembly 33 is communicated with the liquid storage assembly 32 and is used for driving cooling liquid in the liquid storage assembly 32 to flow along the first pipeline 21. As a preferred embodiment, a heat shield is provided between the second conduit 22 and the reservoir assembly 32.

Referring to fig. 4, a simple schematic diagram of the internal pipeline of the driving pump with the water cooling structure according to the present embodiment is not a physical design size structure, but is merely a schematic diagram illustrating the trend of the internal pipeline of the driving pump 3; the driving pump 3 serves as a core power part of the whole cooling system and is mainly responsible for driving the cooling liquid to flow along the cooling pipeline 2. The housing assembly 31 is a surrounding structure for the drive pump 3 and is responsible for housing the various components inside, which are provided with a reservoir assembly 32 for storing the cooling liquid. In operation of the drive pump 3, the cooling liquid in the reservoir assembly will be forced to flow towards the cooling circuit 2.

The liquid storage component 32 is arranged in the shell component 31 and is a container specially used for storing cooling liquid; the first conduit 21 passes through the reservoir assembly 32 to form a channel for the flow of cooling liquid.

The hydraulic drive assembly 33 is provided on one side of the liquid storage assembly 32 and is a force source for driving the flow of the cooling liquid. Through the hydraulic driving assembly 33, the cooling liquid in the liquid storage assembly 32 can be pushed to flow along the first pipeline 21, so that the water cooling effect of the power supply module 5 is realized.

In use, the hydraulic drive assembly 33 drives the cooling liquid in the liquid storage assembly 32 to flow into the heat conduction assembly 1 along the first pipeline 21 and take away heat thereof, thereby achieving a cooling effect. The hydraulic drive assembly 33 maintains the continuous flow of the cooling liquid in the liquid storage assembly 32 by hydraulic power, thereby enabling the entire cooling system to be stably operated.

The above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. The utility model provides a water cooling structure of power module, its characterized in that includes:

the heat conduction assembly (1) is attached to the power supply module (5) and used for absorbing heat of the power supply module (5);

a cooling pipeline (2), one end of which is connected with the heat conduction component (1), and cooling liquid flows in the cooling pipeline (2);

and the driving pump (3) is communicated with the cooling pipeline (2) and is used for driving cooling liquid in the cooling pipeline (2) to flow through the heat conduction assembly (1).

2. The water cooling structure of the power module according to claim 1, wherein the heat conducting assembly (1) is provided with a water inlet (11) and a water outlet (12), a first inner channel for cooling liquid circulation is formed in the heat conducting assembly (1), and two ends of the first inner channel are respectively communicated with the cooling pipeline (2) through the water inlet (11) and the water outlet (12).

3. The water cooling structure of a power module according to claim 2, characterized in that the heat conducting assembly (1) comprises a first heat conducting plate (13) and a second heat conducting plate (14) arranged perpendicular to the first heat conducting plate (13);

the first inner channel passes through the first heat-conducting plate (13) and the second heat-conducting plate (14) in sequence.

4. The water cooling structure of a power module of claim 1, further comprising:

the heat dissipation assembly (4) comprises a heat radiator (41) and a heat dissipation fan (42), a second inner channel for cooling liquid to circulate is formed in the heat radiator (41), and one end of the cooling pipeline (2) is communicated with the second inner channel.

5. The water cooling structure of a power module according to claim 4, wherein the radiator (41) comprises a heat dissipation housing (411), the heat dissipation housing (411) is provided with a mounting groove (412), and the heat dissipation fan (42) is mounted in the mounting groove (412);

one end face of the heat dissipation shell (411) is provided with a plurality of heat dissipation fins (413) which are arranged side by side, and two ends of each heat dissipation fin (413) are respectively connected with the cooling pipeline (2).

6. The water cooling structure of a power module according to claim 4, wherein the cooling pipeline (2) comprises a first pipeline (21) and a second pipeline (22), and two ends of the first pipeline (21) and the second pipeline (22) are respectively connected with the heat conducting component (1) and the heat radiating component (4) to form a circulation pipeline.

7. The water cooling structure of the power module according to claim 6, wherein the driving pump (3) comprises a housing assembly (31), a liquid storage assembly (32) for storing cooling liquid is arranged in the housing assembly (31), and the first pipeline (21) is arranged through the liquid storage assembly (32);

one side of the liquid storage assembly (32) is provided with a hydraulic driving assembly (33), and the driving end of the hydraulic driving assembly (33) is communicated with the liquid storage assembly (32) and used for driving cooling liquid in the liquid storage assembly (32) to flow along the first pipeline (21).

8. The water cooling structure of the power module according to claim 7, wherein a heat insulation plate is provided between the second pipe (22) and the liquid storage assembly (32).

9. The water cooling structure of a power module according to claim 1, wherein the heat conducting component (1) is one of a heat conducting copper plate, an alloy aluminum plate, a graphite plate or a ceramic plate.

10. The water cooling structure of the power module according to claim 1, wherein an insulating layer is disposed on a surface of the heat conducting component (1) attached to the power module.