CN213178890U - Heat dissipation device and refrigeration equipment - Google Patents
Heat dissipation device and refrigeration equipment Download PDFInfo
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- CN213178890U CN213178890U CN202021232492.4U CN202021232492U CN213178890U CN 213178890 U CN213178890 U CN 213178890U CN 202021232492 U CN202021232492 U CN 202021232492U CN 213178890 U CN213178890 U CN 213178890U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 139
- 238000005057 refrigeration Methods 0.000 title claims abstract description 61
- 239000004065 semiconductor Substances 0.000 claims abstract description 50
- 238000001816 cooling Methods 0.000 claims description 29
- 230000000903 blocking effect Effects 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of the heat abstractor of refrigeration chip, a heat abstractor and refrigeration plant is disclosed. The heat dissipation device is used for dissipating heat of the semiconductor refrigeration sheet and comprises a shell with an accommodating cavity, a heat radiator and a heat dissipation fan; the radiator and the radiating fan are arranged in the accommodating cavity in parallel; the radiator is provided with a semiconductor refrigeration sheet; the shell is provided with an air inlet and an air outlet; the radiator is provided with a heat dissipation channel, the air inlet is communicated with the air suction opening of the heat dissipation fan, and the air outlet of the heat dissipation fan is communicated with the air outlet through the heat dissipation channel. This refrigeration plant includes the utility model discloses a heat abstractor. The utility model discloses a heat abstractor and refrigeration plant all have better radiating effect, realization that can be quick is to the heat dissipation of semiconductor refrigeration piece, simultaneously reduce cost.
Description
Technical Field
The utility model belongs to the technical field of the heat abstractor of semiconductor refrigeration piece, concretely relates to heat abstractor and refrigeration plant.
Background
The traditional refrigeration equipment mostly uses freon refrigeration, but the freon refrigeration mode has pollution, has been eliminated gradually at present, and the purpose that refrigeration and heating are realized to the semiconductor refrigeration piece by direct current absorption heat respectively and the heat of giving off at the both ends of galvanic couple, accords with the environmental protection requirement, adopts the semiconductor refrigeration piece refrigeration to have obtained extensive application. However, the refrigeration efficiency of the semiconductor refrigeration piece is not high relative to the heating efficiency, so in order to improve the refrigeration efficiency, a heat dissipation device is generally added near the refrigeration piece, the temperature of the hot end is reduced as fast as possible, the temperature difference between the cold end and the hot end is reduced, and the heat dissipation effect of the heat dissipation device directly influences the refrigeration effect of the refrigeration piece.
SUMMERY OF THE UTILITY MODEL
The poor problem of heat abstractor radiating effect in order to solve present semiconductor refrigeration piece, the utility model provides a heat abstractor.
Another object of the present invention is to provide a refrigeration apparatus.
In order to solve the problem, the utility model discloses a following scheme realizes:
a heat dissipating double-fuselage, is used for carrying on the heat dissipation to the semiconductor refrigeration chip, including the body with holding chamber, radiator and radiator fan; the radiator and the radiating fan are arranged in the accommodating cavity in parallel; the radiator is provided with a semiconductor refrigeration sheet; the shell is provided with an air inlet and an air outlet; the radiator is provided with a radiating channel;
the air inlet is communicated with the air suction opening of the cooling fan, and the air outlet of the cooling fan is communicated with the air outlet through the cooling channel.
The utility model has the further improvement that the heat dissipation device also comprises a first wind shielding component with a wind inlet channel; the first wind shielding assembly is arranged between the shell and the heat dissipation fan so that air entering the accommodating cavity from the air inlet enters the heat dissipation fan through the air inlet channel.
The utility model has the further improvement that the heat dissipation device also comprises a second wind blocking component with an air outlet channel; the second air blocking assembly is installed between the shell and the radiator so that air flowing out of the heat dissipation channel sequentially flows out of the accommodating cavity through the air outlet channel and the air outlet.
The utility model has the further improvement that the first wind shielding component comprises a wind inlet ring; the air inlet ring is installed between the shell and the heat dissipation fan, and the air inlet ring surrounds the air inlet and is arranged to form the air inlet channel.
The utility model has the further improvement that the second wind-blocking component comprises an air-out guard plate; the air outlet protective plate is arranged between the shell and the radiator and is arranged around the air outlet to form the air outlet channel.
The utility model discloses a further improvement point lies in, heat dissipation channel's quantity is two at least, and is adjacent heat dissipation channel is parallel to each other.
The utility model has the further improvement that the shell comprises a bottom shell and a cover plate, and the cover plate is covered on the bottom shell to form the accommodating cavity;
the bottom shell is provided with the air inlet and the air outlet, and a first fixing piece and a second fixing piece are arranged on the bottom shell; the first fixing piece is connected with the radiator; the second fixing piece is arranged around the air inlet, and the second fixing piece is connected with the heat dissipation fan.
The utility model discloses a further improvement point lies in, the casing still includes the frame, the frame mounting the drain pan with between the apron.
The utility model discloses a further improvement lies in, the radiator includes heating panel and at least two fin; the two radiating fins are arranged on one side surface of the radiating plate in parallel, and the other side surface of the radiating plate is connected with the semiconductor refrigerating sheet; and a heat dissipation channel is formed between any two adjacent heat dissipation fins.
The utility model also provides a refrigerating device, which comprises a refrigerating device body, a semiconductor refrigerating sheet and the heat dissipation device; the semiconductor refrigeration piece is installed on a radiator of the heat dissipation device, and the heat dissipation device is connected with the refrigeration equipment body.
Compared with the prior art, adopt above-mentioned scheme the utility model discloses a heat abstractor's beneficial effect does:
because the radiator and the cooling fan of the utility model are arranged in the containing cavity of the shell in parallel, the height of the cooling device of the utility model can be reduced, thereby reducing the material consumption and the cost;
because the semiconductor refrigeration piece is arranged on the radiator, the temperature of the semiconductor refrigeration piece can be quickly transmitted to the radiator, so that the temperature of air in the heat dissipation channel is changed, air outside the shell firstly enters the accommodating cavity from the air inlet and then enters the heat dissipation channel through the heat dissipation fan to mix the air in the heat dissipation channel, namely, the temperature of the air in the heat dissipation channel is adjusted, and meanwhile, the heat dissipation of the radiator can also be realized; the mixed air finally flows out of the accommodating cavity of the shell through the air outlet end and the air outlet of the heat dissipation channel under the action of the heat dissipation fan, and heat dissipation of the semiconductor refrigeration sheet is achieved.
And the utility model discloses a refrigeration plant has the cost lower, and the heat dissipation is fast, characteristics that refrigeration effect is good.
Drawings
Fig. 1 is an exploded schematic view of a heat dissipation device provided in embodiment 1 of the present invention;
fig. 2 is a schematic cross-sectional view of a heat dissipation device provided in embodiment 1 of the present invention under a visual sense;
fig. 3 is a schematic view of an assembly structure of a heat dissipation device provided in embodiment 1 of the present invention, with a cover plate removed, in which arrows represent the air flowing direction.
Fig. 4 is a schematic cross-sectional view of a heat dissipation device provided in embodiment 1 of the present invention under another visual condition;
fig. 5 is a schematic view of an assembly structure of a heat dissipation device provided in embodiment 1 of the present invention, with a cover plate and a heat dissipation fan removed;
fig. 6 is a schematic structural diagram of a bottom shell of a heat dissipation device according to embodiment 1 of the present invention;
fig. 7 is another schematic structural diagram of a bottom case of a heat dissipation device according to embodiment 1 of the present invention;
in the figure: 1. a housing; 2. a heat sink; 3. a heat radiation fan; 4. a first wind shielding assembly; 5. a second wind blocking assembly; 11. an air inlet; 12. an air outlet; 13. a bottom case; 14. a cover plate; 15. a frame; 21. a heat dissipation channel; 22. a heat dissipation plate; 23. a heat sink; 131. a first fixing member; 132. a second fixing member; 41. an air inlet ring; 51. an air outlet guard plate.
Detailed Description
In order to make the above objects, features, advantages, etc. of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "axial", "radial", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Example 1
The present embodiment provides a heat dissipation apparatus, as shown in fig. 1-7, referring to fig. 1, the heat dissipation apparatus of the present embodiment includes a housing 1 having an accommodating cavity, a heat sink 2 and a heat dissipation fan 3; the radiator 2 and the radiating fan 3 are arranged in parallel in the accommodating cavity; the radiator 2 is provided with a semiconductor refrigeration sheet; the shell 1 is provided with an air inlet 11 and an air outlet 12; the heat sink 2 has a heat dissipation channel 21;
the air inlet 11 is communicated with an air inlet of the heat dissipation fan 3, and the air outlet of the heat dissipation fan 3 is communicated with the air outlet 12 through a heat dissipation channel 21.
Because the radiator 2 and the cooling fan 3 of the present embodiment are installed in parallel in the accommodating cavity of the housing 1, the height of the cooling device of the present embodiment can be reduced, and further, the material consumption and the cost are reduced;
because the semiconductor refrigeration piece is arranged on the radiator 2, the temperature of the semiconductor refrigeration piece can be quickly transferred to the radiator 2, and the temperature of the air in the heat dissipation channel 21 is further changed; if the air in the heat dissipation channel 21 is not blown out of the accommodating cavity of the housing 1 quickly, the heat dissipation effect of the heat dissipation device of the embodiment on the semiconductor chilling plate will be reduced, so the housing 1 of the embodiment has the air inlet 11 and the air outlet 12; the radiator 2 is provided with a heat dissipation channel 21, the air inlet 11 is communicated with the air suction opening of the heat dissipation fan 3, and the air outlet of the heat dissipation fan 3 is communicated with the air outlet 12 through the heat dissipation channel 21; when the heat dissipation device is used, the heat dissipation fan 3 is started firstly, air outside the shell 1 enters the accommodating cavity from the air inlet 11 firstly, then is sucked by the air suction port of the heat dissipation fan 3, and enters the heat dissipation channel 21 through the air outlet of the heat dissipation fan 3 to mix the air in the heat dissipation channel 21, namely, the temperature of the air in the heat dissipation channel 21 is adjusted, and meanwhile, the heat dissipation of the heat sink 2 can be realized; the mixed air finally flows out of the accommodating cavity of the shell 1 through the air outlet end of the heat dissipation channel 21 and the air outlet 12 under the action of the heat dissipation fan 3, so that the heat dissipation of the semiconductor refrigeration sheet is realized.
Because the semiconductor refrigeration piece is provided with the hot end and the cold end, the hot end of the semiconductor refrigeration piece can be directly connected with the radiator 2 in the embodiment, and the cold end of the semiconductor refrigeration piece can also be directly connected with the radiator 2, so that the semiconductor refrigeration piece can be selected according to actual conditions;
for example, when the hot end of the semiconductor cooling fin is connected with the heat sink 2 of this embodiment, the temperature of the air in the heat dissipation channel 21 rises, and at this time, when the air outside the housing 1 enters the heat dissipation channel 21, the air is cooled, and meanwhile, a certain cooling effect is also exerted on the heat sink 2; finally, under the action of the cooling fan 3, the cooled air rapidly flows out of the shell 1 from the air outlet 12, so that the cooling of the hot end of the semiconductor refrigerating sheet is realized, the temperature difference between the hot end and the cold end of the semiconductor refrigerating sheet is reduced, and the refrigerating effect of the semiconductor refrigerating sheet is improved.
When the cold end of the semiconductor refrigeration sheet is connected with the radiator 2 in the embodiment, the temperature of the air in the heat dissipation channel 21 is reduced, and at the moment, the air outside the shell 1 enters the heat dissipation channel 21, so that the air is heated, and meanwhile, a certain heating effect is also exerted on the radiator 2; finally, under the action of the cooling fan 3, the heated air rapidly flows out of the shell 1 from the air outlet 12, so that the heating of the cold end of the semiconductor refrigerating sheet is realized, the temperature difference between the hot end and the cold end of the semiconductor refrigerating sheet is reduced, and the working efficiency of the semiconductor refrigerating sheet is improved.
Preferably, the air suction opening of the cooling fan 3 is directly communicated with the air inlet 11, and the air outlet of the cooling fan 3 is directly communicated with the air outlet end of the cooling channel 21, so that the cooling speed of the semiconductor refrigerating sheet can be increased.
Further, as shown in fig. 3, the heat dissipation device of the present embodiment further includes a first wind shielding assembly 4 having a wind inlet channel; the first wind shielding component 4 is installed between the casing 1 and the heat dissipation fan 3 so that air entering the accommodating cavity from the air inlet 11 enters the heat dissipation fan 3 through the air inlet channel, thus the air sucked by the heat dissipation fan 3 can be prevented from diffusing in the accommodating cavity of the casing 1, and the air volume of the air outlet of the heat dissipation fan 3 is reduced.
Further, as shown in fig. 3, the heat dissipation device of the present embodiment further includes a second wind blocking assembly 5 having an air outlet channel; second wind subassembly 5 is installed between casing 1 and radiator 2 so that the air that flows out from heat dissipation channel 21 flows out the holding chamber through air-out passageway, air outlet 12 in proper order, can be with the quick holding chamber of drawing forth of the air that flows out from heat dissipation channel 21 like this, and avoid partial air to spread at the holding intracavity, further improvement is to the radiating rate of semiconductor refrigeration piece.
Further, as shown in fig. 5 and 7, the first wind shielding assembly 4 includes a wind inlet ring 41; the air inlet ring 41 is installed between the housing 1 and the heat dissipation fan 3, and the air inlet ring 41 is disposed around the air inlet 11 to form an air inlet passage.
Preferably, the air inlet ring 41 is connected to the fixing seat of the second fixing member 132, when the heat dissipation fan 3 is mounted on the fixing seat, a heat dissipation gap is formed between the heat dissipation fan 3 and the bottom case 13, at this time, because the air inlet ring 41 is connected to the fixing seat and arranged around the air inlet 11, the air inlet ring 41 seals the heat dissipation gap, and air entering from the air inlet 11 is prevented from diffusing into the accommodating cavity of the housing 1 from the heat dissipation gap, so that the air volume of the heat dissipation fan 3 is prevented from being reduced;
further, as shown in fig. 5 and 7, the second wind blocking assembly 5 includes a wind outlet guard plate 51; the air outlet guard plate 51 is installed between the housing 1 and the heat sink 2, and the air outlet guard plate 51 is arranged around the air outlet 12 to form an air outlet channel.
Preferably, one end of the air outlet protection plate 51 is connected with the bottom case 13, and the other end extends to the air outlet end of the heat sink 2; when the cover plate 14 is covered on the bottom case 13, an air outlet channel is formed among the air outlet protective plate 51, the radiator 2, the bottom case 13 and the cover plate 14, and the air outlet 12 is communicated with the air outlet channel, so that air flowing out of the heat dissipation channel 21 of the radiator 2 is prevented from diffusing in the accommodating cavity of the shell 1;
in this embodiment, the number of the air outlets 12 is at least two, and one of the air outlets is communicated with the heat dissipation channel 21 through an air outlet channel; the other group is only communicated with the accommodating cavity, and the heat dissipation of the accommodating cavity in the shell 1 is realized by utilizing the temperature difference between the inside and the outside of the shell 1.
Further, as shown in fig. 1, and fig. 5-7, the housing 1 of the present embodiment includes a bottom shell 13 and a cover plate 14, wherein the cover plate 14 is disposed on the bottom shell 13 to form an accommodating cavity;
an air inlet 11 and an air outlet 12 are formed in the bottom case 13, and a first fixing member 131 is arranged on the bottom case 13 and connected with the heat sink 2, so that the heat sink 2 is stably mounted in the accommodating cavity.
Preferably, the first fixing member 131 includes a first fixing column and a fixing rib; the radiator 2 is provided with a bayonet matched with the fixing rib, the fixing rib is arranged in the bayonet of the radiator 2, and the radiator 2 is convenient to position when the radiator 2 is installed; the first fixing column is provided with a threaded hole, when the radiator 2 is matched with the fixing rib, the threaded hole of the first fixing column is just aligned with the fixing hole of the radiator 2, and the radiator 2 is in threaded connection with the first fixing column through a screw or a bolt.
The bottom shell 13 is further provided with a second fixing member 132; the second fixing member 132 is disposed around the air inlet 11, and the second fixing member 132 is connected to the heat dissipation fan 3, so that the heat dissipation fan 3 is stably installed in the accommodating chamber.
Preferably, the second fixing member 132 includes a second fixing column and a fixing seat; the fixed seat is arranged around the air inlet 11 and is used for supporting the radiating fan 3; the second fixing column is provided with a threaded hole and is in threaded connection with the cooling fan 3 through a screw or a bolt.
Preferably, the bottom of the bottom shell 13 is provided with an air inlet 11, and the side wall of the bottom shell 13 is provided with an air outlet 12; the number of the air outlets 12 is at least two, wherein one air outlet 12 is used for communicating the accommodating cavity with the outside of the shell 1, so that air in the accommodating cavity can be rapidly diffused to the outside of the shell 1; the other air outlet 12 is used for communicating the heat dissipation channel 21 with the outside of the housing 1, and can enable air in the heat dissipation channel 21 to be rapidly diffused to the outside of the housing 1.
Preferably, the cover plate 14 may also be provided with an air inlet 11, which forms an up-and-down air inlet with the air inlet 11 on the bottom shell 13, and the heat dissipation fan 3 may be a turbo fan.
Preferably, a heat-conducting silicone grease is arranged between the cover plate 14 and the semiconductor chilling plate, and the heat-conducting silicone grease is used for rapidly transferring the temperature of the semiconductor chilling plate to the cover plate 14.
Preferably, the cover plate 14 has good thermal conductivity, and the material thereof may be aluminum, stainless steel, or the like.
Preferably, the housing 1 is further provided with a through hole communicated with the accommodating cavity, and the through hole can be used for accommodating an electric wire;
preferably, the bottom case 13 is provided with a first groove, the cover plate 14 is provided with a second groove, and when the cover plate 14 covers the bottom case 13, the first groove and the second groove are matched to form a through hole for accommodating an electric wire.
Further, the housing 1 further includes a frame 15, and the frame 15 is installed between the bottom case 13 and the cover plate 14, so as to further increase the volume of the accommodating cavity and increase the heat dissipation space.
Further, as shown in fig. 1, 3-5, the heat sink 2 further includes a heat dissipation plate 22 and at least two heat dissipation fins 23; the two radiating fins 23 are arranged on one side surface of the radiating plate 22 in parallel, and the other side surface of the radiating plate 22 is connected with the semiconductor refrigerating fin; a heat dissipation channel 21 is formed between any two adjacent heat dissipation fins 23;
the heat dissipation plate 23 and the heat dissipation plate 22 have good thermal conductivity, and the material thereof may be aluminum, stainless steel, etc.; in addition, the heat dissipation plate 23 also has a function of quickly dispersing the heat of the semiconductor cooling fins.
Preferably, the number of the heat dissipation channels 21 is at least two, and the adjacent heat dissipation channels 21 are parallel to each other; the air inlet end of the heat dissipation channel 21 parallel to each other is directly communicated with the air outlet of the heat dissipation fan 3, and the air outlet end of the heat dissipation channel 21 is directly communicated with the air outlet 12 through the air outlet channel formed by the air outlet protection plate 51, the radiator 2, the bottom case 13 and the cover plate 14, so that the air can flow in a short distance, and a quick heat dissipation effect can be achieved.
Preferably, the distance between every two radiating fins 23 is 3mm to 5 mm.
Preferably, the heat dissipation fan 3 of the present embodiment may be selected according to actual situations, and may be, for example, a centrifugal fan in the morning.
Further, as shown in fig. 4, the heat dissipation fan 3 of the present embodiment includes a housing having a cavity, a turbine disposed in the cavity, and an upper air inlet, a lower air inlet and an air outlet formed on the housing; the upper air suction opening is communicated with an air inlet 11 formed in the cover plate 14, and the lower air suction opening is communicated with the air inlet 11 formed in the bottom of the bottom shell 13, so that the purpose of simultaneously sucking air up and down is realized, and the air suction quantity is increased; the turbine changes the flow direction of the air in the chamber, and the air sucked into the chamber finally blows out the heat dissipation fan 3 from the air outlet, directly enters the heat dissipation channel 21 parallel to the air flow direction, and finally flows out of the shell 1 from the air outlet 12.
The working process of the heat dissipation device of the embodiment is as follows:
the connection of the hot end of the semiconductor cooling plate to the heat sink 2 is described as an example:
starting the heat dissipation fan 3, wherein air outside the housing 1 enters the accommodating cavity of the housing 1 from the air inlet 11 and directly enters an air suction opening of the heat dissipation fan 3 (such as a vortex fan) through an air inlet channel formed by an air inlet ring 41; then, under the action of the cooling fan 3, the sucked air is directly blown into the cooling channel 21 parallel to the air flow direction from the air outlet of the cooling fan 3 and is mixed with the hot air in the cooling channel 21, so that the air in the cooling channel 21 is cooled, the cooling fins 23 and the cooling plates 22 are cooled, and the refrigerating effect of the semiconductor refrigerating fins is prevented from being influenced due to the large temperature difference between the cold end and the hot end of the semiconductor refrigerating fins; the cooled air directly flows out of the casing 1 from the air outlet 12 through an air outlet channel formed by the air outlet protective plate 51, the radiator 2, the bottom shell 13 and the cover plate 14, and the heat dissipation rate is improved.
Example 2
The embodiment provides a refrigeration device, which comprises a refrigeration device body, a semiconductor refrigeration piece and the heat dissipation device of the embodiment 1; the semiconductor refrigeration piece is arranged on a radiator of the heat dissipation device, and the heat dissipation device is connected with the refrigeration equipment body.
The heat dissipation device dissipates heat of the semiconductor refrigeration sheet, and can improve the refrigeration effect of the refrigeration equipment of the embodiment.
The refrigeration equipment of the embodiment can be an air conditioner, a refrigerator, an ice chest and the like.
In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the described parent features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A heat dissipating double-fuselage, is used for carrying on the heat dissipation to the semiconductor refrigeration chip, characterized by, including the body (1) with holding chamber, heat sink (2) and radiator fan (3); the radiator (2) and the radiating fan (3) are arranged in the accommodating cavity in parallel; the radiator (2) is provided with a semiconductor refrigeration sheet; an air inlet (11) and an air outlet (12) are arranged on the shell (1); the heat sink (2) has a heat dissipation channel (21);
the air inlet (11) is communicated with an air suction opening of the cooling fan (3), and an air outlet of the cooling fan (3) is communicated with the air outlet (12) through the cooling channel (21).
2. The heat sink according to claim 1, further comprising a first wind shielding assembly (4) having a wind inlet channel; the first wind shielding assembly (4) is installed between the shell (1) and the heat dissipation fan (3) so that air entering the accommodating cavity from the air inlet (11) enters the heat dissipation fan (3) through the air inlet channel.
3. The heat sink according to claim 1, further comprising a second wind shield member (5) having a wind outlet channel; the second air blocking component (5) is installed between the shell (1) and the radiator (2) so that air flowing out of the heat dissipation channel (21) flows out of the accommodating cavity through the air outlet channel and the air outlet (12) in sequence.
4. The heat sink as claimed in claim 2, characterised in that the first wind deflector assembly (4) comprises a wind deflector (41); the air inlet ring (41) is installed between the shell (1) and the heat dissipation fan (3), and the air inlet ring (41) is arranged around the air inlet (11) to form the air inlet channel.
5. The heat sink as recited in claim 3, wherein the second wind shield assembly (5) comprises a wind shield plate (51); the air outlet protective plate (51) is installed between the shell (1) and the radiator (2), and the air outlet protective plate (51) is arranged around the air outlet (12) to form the air outlet channel.
6. The heat dissipating device according to any of claims 1 to 5, wherein the number of the heat dissipating channels (21) is at least two, and the adjacent heat dissipating channels (21) are parallel to each other.
7. The heat sink according to any one of claims 1-5, wherein the housing (1) comprises a bottom shell (13) and a cover plate (14), the cover plate (14) being arranged on the bottom shell (13) to form the accommodating cavity;
the bottom shell (13) is provided with the air inlet (11) and the air outlet (12), and the bottom shell (13) is provided with a first fixing piece (131) and a second fixing piece (132); the first fixing piece (131) is connected with the radiator (2); the second fixing member (132) is disposed around the air inlet (11), and the second fixing member (132) is connected to the heat dissipation fan (3).
8. The heat sink as recited in claim 7, characterized in that the housing (1) further comprises a frame (15), the frame (15) being mounted between the bottom shell (13) and the cover plate (14).
9. The heat sink according to any of claims 1-5, characterized in that the heat sink (2) comprises a heat dissipating plate (22) and at least two fins (23); the radiating fins (23) are arranged on one side surface of the radiating plate (22) in parallel, and the other side surface of the radiating plate (22) is connected with the semiconductor refrigerating fin; and a heat dissipation channel (21) is formed between any two adjacent heat dissipation fins (23).
10. Refrigeration equipment, which is characterized by comprising a refrigeration equipment body, a semiconductor refrigeration piece and the heat dissipation device of any one of claims 1 to 9, wherein the semiconductor refrigeration piece is arranged on a heat dissipation device of the heat dissipation device, and the heat dissipation device is connected with the refrigeration equipment body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021232492.4U CN213178890U (en) | 2020-06-29 | 2020-06-29 | Heat dissipation device and refrigeration equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021232492.4U CN213178890U (en) | 2020-06-29 | 2020-06-29 | Heat dissipation device and refrigeration equipment |
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| Publication Number | Publication Date |
|---|---|
| CN213178890U true CN213178890U (en) | 2021-05-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021232492.4U Active CN213178890U (en) | 2020-06-29 | 2020-06-29 | Heat dissipation device and refrigeration equipment |
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| CN (1) | CN213178890U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113519957A (en) * | 2021-08-09 | 2021-10-22 | 纪萍 | Air conditioning device for helmet |
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2020
- 2020-06-29 CN CN202021232492.4U patent/CN213178890U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113519957A (en) * | 2021-08-09 | 2021-10-22 | 纪萍 | Air conditioning device for helmet |
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