CN217880181U

CN217880181U - Shell based on computer heat dispersion

Info

Publication number: CN217880181U
Application number: CN202221637692.7U
Authority: CN
Inventors: 卿培文; 杜东
Original assignee: Baiyi Data Shanghai Co ltd
Current assignee: Baiyi Data Shanghai Co ltd
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2022-11-22
Anticipated expiration: 2032-06-27

Abstract

The utility model belongs to the technical field of the computer shell, specifically be a shell based on computer heat dispersion, include: the device comprises a hollow upper shell with a front opening, wherein two sides of the lower surface of the upper shell inwards form supporting edges; a bottom cover detachably connected with the lower side of the supporting edge; cold air inlets are equidistantly arranged on the bottom cover body. The heat generated by the electronic device in the upper side mounting space inside the electronic device is absorbed by the receiving end, is transmitted downwards by the conducting end and is dissipated by the radiating end; the peripheral temperature of the heat dissipation end is high, the ambient air is heated, the heated air is discharged from the hot air outlet, cold air on the lower side of the bottom cover enters the upper shell from the cold air inlet, the air in the upper shell is supplemented, the heat dissipation end is blown from two sides, the heat is conducted to the air and is output from the hot air outlet, and therefore unidirectional flowing air flow is formed without adding power equipment driven by the air.

Description

Shell based on computer heat dispersion

Technical Field

The utility model relates to a computer shell technical field specifically is a shell based on computer heat dispersion.

Background

When the computer is used, because the surface of the electronic device can emit a large amount of heat, the heat needs to be emitted in time, and the influence on the normal work of the electronic device is avoided.

Usually, a fan is used for heat dissipation, so that noise is generated in the heat dissipation mode, and work and rest of people around are affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a shell based on computer heat dispersion to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a housing based on heat dissipation performance of a computer, comprising:

the device comprises a hollow upper shell with a front side opening, wherein two sides of the lower surface of the upper shell inwards form supporting edges;

a bottom cover detachably connected with the lower side of the supporting edge;

the cold air inlets are formed in the bottom cover body at equal intervals, heat conducting assemblies are arranged in the upper shell at equal intervals, and the heat conducting assemblies and the cold air inlets are staggered;

and hot air outlets are uniformly formed in the lower part of the side wall of the upper shell and at the position corresponding to the heat conducting assembly.

Furthermore, the upper shell is made of plastic, and the bottom cover is made of aluminum alloy or stainless steel.

Further, the downside is provided with the supporting diaphragm in the upper shell, the both ends of supporting diaphragm support the support edge in both sides, heat-conducting component is including the receiving terminal that is located the upside, the conduction end that is located the middle part and the heat dissipation end that is located the downside, receiving terminal, heat dissipation end are located the last downside of supporting diaphragm respectively, the conduction end runs through the supporting diaphragm, and does not contact between conduction end, the supporting diaphragm, hot air exitus is located the downside of supporting diaphragm.

Furthermore, the upper surface of the supporting edge is concave to form a clamping groove, and the end part of the supporting clapboard is clamped in the clamping groove.

Furthermore, the receiving end comprises a metal heat conduction strip and a heat conduction silicone grease layer which is uniformly paved on the upper surface of the metal heat conduction strip, and the upper part of the heat conduction silicone grease layer is an installation space.

Furthermore, bumps embedded in the heat-conducting silicone grease layer are uniformly arranged on the upper surface of the metal heat-conducting strip.

Further, the conduction end is the support column with metal heat conduction strip integrated into one piece, offer the via hole that is used for the support column to pass on the supporting baffle, and the internal diameter of via hole is greater than the outer wall diameter of support column, the lower surface of metal heat conduction strip is provided with the support piece that is used for supporting the metal heat conduction strip, coaxial arrangement between support column, the via hole.

Further, the supporting part is an elastic supporting part.

Further, the heat dissipation end is a heat dissipation fin arranged at the bottom end of the support column.

Compared with the prior art, the beneficial effects of the utility model are that:

1) The heat generated by the electronic device in the upper side mounting space inside the electronic device is absorbed by the receiving end, is transmitted downwards by the conducting end and is dissipated by the radiating end;

2) The peripheral temperature of the heat dissipation end is higher, the ambient air is heated, the heated air is discharged from the hot air outlet, cold air on the lower side of the bottom cover enters the upper shell from the cold air inlet, the air in the upper shell is supplemented, the heat dissipation end is blown from two sides, the heat is conducted to the air and is output from the hot air outlet, and therefore the unidirectional flowing air flow is formed without adding power equipment driven by the air.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 1 in accordance with the present invention;

FIG. 3 is a gas flow diagram of FIG. 2 in accordance with the present invention;

fig. 4 is a schematic structural view of the heat conducting assembly of the present invention.

In the figure: 1 upper shell, 2 bottom covers, 3 supporting partition boards, 4 heat conducting components, 41 metal heat conducting strips, 42 supporting columns 43 radiating fins, 44 bumps, 45 heat-conducting silicone grease layers, 46 supporting pieces, 5 cold air inlets and 6 hot air outlets.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example (b):

referring to fig. 1-4, the present invention provides a technical solution: a housing based on heat dissipation from a computer, comprising:

the device comprises a hollow upper shell 1 with an opening at the front side, wherein two sides of the lower surface of the upper shell 1 inwards form supporting edges;

a bottom cover 2 detachably connected with the lower side of the supporting edge; the upper shell 1 is made of plastic, and the bottom cover 2 is made of aluminum alloy or stainless steel;

the cold air inlets 5 are formed in the bottom cover 2 body at equal intervals, the heat conducting components 4 are arranged in the upper shell 1 at equal intervals, and the heat conducting components 4 and the cold air inlets 5 are staggered;

and hot air outlets 6 are uniformly formed in the lower part of the side wall of the upper shell 1 and in the positions corresponding to the heat conducting components 4. Go up the casing 1 in the downside be provided with supporting diaphragm 3, supporting diaphragm 3's both ends support at the support edge of both sides, and the upper surface indent on support edge forms the draw-in groove, 3 tip cards of supporting diaphragm are in the draw-in groove, heat-conducting component 4 is including the receiving terminal that is located the upside, the conduction end that is located the middle part and the heat dissipation end that is located the downside, receiving terminal, heat dissipation end are located supporting diaphragm 3's last downside respectively, the conduction end runs through supporting diaphragm 3, and contactless between conduction end, the supporting diaphragm 3, hot air exitus 6 is located supporting diaphragm 3's downside.

The receiving end comprises a metal heat conduction strip 41 and a heat conduction silicone grease layer 45 uniformly paved on the upper surface of the metal heat conduction strip 41, and the upper part of the heat conduction silicone grease layer 45 is an installation space. The upper surface of the metal heat conduction strip 41 is uniformly provided with bumps 44 embedded in a heat conduction silicone grease layer 45.

The conduction end is the support column 42 with metal heat conduction strip 41 integrated into one piece, offer the via hole that is used for support column 42 to pass on the support baffle 3, and the internal diameter of via hole is greater than the outer wall diameter of support column 42, the lower surface of metal heat conduction strip 41 is provided with the support piece 46 that is used for supporting metal heat conduction strip 41, and support piece 46 is elastic support piece, coaxial arrangement between support column 42, the via hole.

The radiating end is a radiating fin 43 arranged at the bottom end of the supporting column 42.

The working principle is as follows: the installation space is used for installing the electronic device, the bottom cover 2 is separated from the upper shell 1, so that the space at the lower side of the upper shell 1 is exposed, the electronic device is installed in the upper shell 1 from the space, then, the supporting partition plate 3 is embedded from the opening or the lower side at the front side of the upper shell 1, the heat conduction assembly 4 is integrated on the supporting partition plate 3 in advance, and the installation structure of the supporting partition plate 3 and the heat conduction assembly 4 is shown in fig. 2 and 4.

Make heat conduction silicone grease layer 45 attached on electronic device, perhaps scribble heat conduction silicone grease layer 45 on electronic device in advance for metal heat conduction strip 41, lug 44 are attached at heat conduction silicone grease layer 45, through the setting of lug 44, make the area of contact of heat conduction silicone grease layer 45 and metal heat conduction strip 41 increase, and heat conduction is faster.

Through the arrangement of the supporting member 46, the metal heat conduction strip 41 can be elastically supported on the supporting partition plate 3, under the elastic force of the supporting member 46, the metal heat conduction strip 41 and the heat conduction silicone grease layer 45 are elastically supported on the surface of the electronic device, and the metal heat conduction strip 41 and the heat conduction silicone grease layer 45 are specifically arranged according to the shape of the electronic device.

The heat conducting silicone layer 45 and the metal heat conducting strips 41 absorb heat and conduct the heat downwards through the supporting columns 42 and the radiating fins 43.

The heat radiating fins 43 guide the heat to the lower side of the supporting partition plate 3, the air on the lower side of the supporting partition plate 3 is heated by the heat radiating fins 43, the air on the lower side of the supporting partition plate 3 expands and is discharged from the hot air outlet 6, and the cold air on the lower side of the bottom cover 2 enters the upper shell 1 from the lower part through the cold air inlet 5 for supplementation.

The cold air on the lower side rises and blows the hot air outlet 6, the heat dissipation effect is achieved, the cold air is blocked by the supporting partition plate 3, and the hot air rarely enters the installation space.

The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, it will be obvious to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A housing based on heat dissipation performance of a computer, comprising:

the device comprises a hollow upper shell (1) with a front side opening, wherein two sides of the lower surface of the upper shell (1) inwards form supporting edges;

a bottom cover (2) detachably connected with the lower side of the supporting edge;

the cold air inlet (5) is formed in the bottom cover (2) body at equal intervals, the heat conducting components (4) are arranged in the upper shell (1) at equal intervals, and the heat conducting components (4) and the cold air inlet (5) are staggered;

and hot air outlets (6) are uniformly formed in the lower part of the side wall of the upper shell (1) and in the positions corresponding to the heat conducting components (4).

2. A computer heat dissipation based housing as recited in claim 1, wherein: the upper shell (1) is made of plastic, and the bottom cover (2) is made of aluminum alloy or stainless steel.

3. A computer heat dissipation based housing as recited in claim 1, wherein: go up the casing (1) interior downside and be provided with supporting diaphragm (3), the both ends of supporting diaphragm (3) support the edge in the support of both sides, heat-conducting component (4) are including the receiving terminal that is located the upside, the conduction end that is located the middle part and the heat dissipation end that is located the downside, receiving terminal, heat dissipation end are located the last downside of supporting diaphragm (3) respectively, the conduction end runs through supporting diaphragm (3), and contactless between conduction end, supporting diaphragm (3), hot air exitus (6) are located the downside of supporting diaphragm (3).

4. A computer heat dissipation based housing as recited in claim 3, wherein: the upper surface of the supporting edge is concave inwards to form a clamping groove, and the end part of the supporting clapboard (3) is clamped in the clamping groove.

5. A computer heat dissipation based housing as recited in claim 3, wherein: the receiving end comprises a metal heat conduction strip (41) and a heat conduction silicone grease layer (45) which is uniformly laid on the upper surface of the metal heat conduction strip (41), and the upper part of the heat conduction silicone grease layer (45) is an installation space.

6. The heat dissipation performance based computer case of claim 5, wherein: the upper surface of the metal heat conduction strip (41) is uniformly provided with bumps (44) embedded in the heat conduction silicone layer (45).

7. A computer heat dissipation based housing as recited in claim 5, wherein: the utility model discloses a heat conduction strip, including metal heat conduction strip (41), conduction end be with metal heat conduction strip (41) integrated into one piece's support column (42), offer the via hole that is used for support column (42) to pass on supporting baffle (3), and the internal diameter of via hole is greater than the outer wall diameter of support column (42), the lower surface of metal heat conduction strip (41) is provided with support piece (46) that are used for supporting metal heat conduction strip (41), coaxial arrangement between support column (42), the via hole.

8. A computer heat dissipation based housing as recited in claim 7, wherein: the support (46) is a resilient support.

9. A computer heat dissipation based housing as recited in claim 7, wherein: the heat dissipation end is a heat dissipation fin (43) arranged at the bottom end of the support column (42).