CN220305771U - Micro computer host with integrated space liquid cooling heat dissipation function - Google Patents
Micro computer host with integrated space liquid cooling heat dissipation function Download PDFInfo
- Publication number
- CN220305771U CN220305771U CN202321976146.0U CN202321976146U CN220305771U CN 220305771 U CN220305771 U CN 220305771U CN 202321976146 U CN202321976146 U CN 202321976146U CN 220305771 U CN220305771 U CN 220305771U
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- Prior art keywords
- fan
- shell
- heat dissipation
- air inlet
- heat
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 43
- 238000001816 cooling Methods 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 title claims abstract description 16
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 11
- 230000005855 radiation Effects 0.000 description 4
- 238000002791 soaking Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000001754 anti-pyretic effect Effects 0.000 description 1
- 239000002221 antipyretic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the field of machinery, in particular to a microcomputer host. A microcomputer host with integrated space liquid cooling and heat dissipation functions comprises a microcomputer host body, wherein the microcomputer host body comprises a shell, the shell is provided with a shell main air inlet and a shell air outlet, and the left side wall and the right side wall of the shell are respectively provided with a shell auxiliary air inlet; a vacuum cavity vapor chamber is arranged above the main board, radiating fins are arranged above the vacuum cavity vapor chamber, and a fan is arranged in the shell. The utility model collects external wind flow by combining the main air inlet of the shell and the auxiliary air inlet of the shell, the auxiliary air inlet of the fan can also absorb heat energy emitted by the main board, absorbs heat to evaporate and diffuse the heat energy to the heat dissipation fins by the main board by means of the vacuum cavity vapor chamber, and then blows out of the shell by the fan, thereby having better heat dissipation effect on the whole parts and main heat sources in the shell of the microcomputer, realizing the purposes of heat exchange, heat dissipation and heat dissipation, and effectively guaranteeing the normal use effect of the microcomputer.
Description
Technical Field
The utility model relates to the field of machinery, in particular to a microcomputer host.
Background
The miniature computer host, also called mini computer host, has the advantages of small volume, space saving, low power consumption, cost saving, environmental protection and the like, however, the conventional heat dissipation system design of the miniature computer host on the market in the prior art dissipates heat through the cooperation of a plurality of copper pipes, heat dissipation fins and fans, however, the heat dissipation mode cannot achieve a better heat dissipation effect on a heat source in the miniature computer host, namely, a main board in the miniature computer host cannot fully dissipate heat during operation, and the problems of higher operation temperature, influence on normal use of the miniature computer host and the like still exist; some microcomputer hosts on the market use VC modules to dissipate heat, namely, the vacuum cavity vapor chamber is used for dissipating heat to a main board, but the heat still exists in a shell of the microcomputer host, cannot be rapidly discharged from a heat dissipation port of the shell, cannot achieve a heat dissipation effect on components such as a battery module in the microcomputer host, and also has the problems that the heat dissipation effect is poor, normal use of the microcomputer host is affected, and the like.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
The utility model aims to provide a microcomputer host with an integrated space liquid cooling heat dissipation function, so as to solve at least one technical problem.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the microcomputer host with the integrated space liquid cooling and heat dissipation functions comprises a microcomputer host body, wherein the microcomputer host body comprises a shell, and a main board is arranged in the shell;
a vacuum cavity vapor chamber is arranged above the main board, a plurality of heat dissipation fins which are uniformly distributed are arranged above the vacuum cavity vapor chamber, and the heat dissipation fins are arranged at a position close to an air outlet of the shell;
the air conditioner is characterized in that a fan is arranged in the shell, the fan is arranged above the vacuum cavity vapor chamber and is positioned at the front side of the radiating fins, a main fan air inlet, an auxiliary fan air inlet and a fan air outlet are arranged on the fan, the main fan air inlet and the auxiliary fan air inlet are respectively arranged on the upper side part and the lower side part of the fan, the fan air outlet is arranged at the rear part of the fan, and the blowing direction of the fan air outlet faces the air outlet of the shell.
And the vacuum cavity vapor chamber is fixedly bonded on the main board through heat conduction silicone grease.
The radiating fins are fixed on the vacuum cavity vapor chamber through welding.
And a separation strip for preventing heat flow from flowing back is arranged between the radiating fins and the fan.
The isolating strip is made of strip isolating cotton.
A fan mounting bracket is arranged in the shell, the fan is fixed on the fan mounting bracket through a bolt, and the isolating strip is arranged on the upper side of the contact part of the fan mounting bracket and the radiating fins.
The shell is internally provided with a battery module, and the battery module is arranged between the main air inlet of the shell and the fan.
A dustproof net is arranged at the auxiliary air inlet of the shell.
The utility model provides a microcomputer host with an integrated space liquid cooling heat dissipation function, which integrates a main air inlet of a shell and an auxiliary air inlet of the shell into a whole to collect external air flow, then enters the main air inlet of the fan and the auxiliary air inlet of the fan, the auxiliary air inlet of the fan can also absorb heat energy emitted by a main board, absorbs heat and evaporates the heat energy to the heat dissipation fins by a vacuum cavity vapor chamber to the main board, and then blows out of the shell by the fan, thereby achieving better heat dissipation effect to the whole components and main heat sources in the shell of the microcomputer host, realizing the purposes of heat exchange and antipyretic heat dissipation, and effectively guaranteeing the normal use effect of the microcomputer host.
Drawings
FIG. 1 is a schematic view of a portion of a structure in a housing of the present utility model;
FIG. 2 is a schematic diagram of a portion of the structure of the housing of the present utility model;
fig. 3 is a schematic view of a part of the structure of the present utility model.
Detailed Description
The following describes the embodiments of the present utility model further with reference to the drawings.
As shown in fig. 1 to 3, a microcomputer host with an integrated space liquid cooling and heat dissipation function comprises a microcomputer host body, wherein the microcomputer host body comprises a shell 1, a main board 8 is arranged in the shell 1, a main shell air inlet 10 and a main shell air outlet are respectively arranged on the front side and the rear side of the shell 1, and a secondary shell air inlet 2 is arranged on the left side wall and the right side wall of the shell 1; a vacuum cavity vapor chamber 9 is arranged above the main board 8, a plurality of heat dissipation fins 7 which are uniformly distributed are arranged above the vacuum cavity vapor chamber 9, and the heat dissipation fins 7 are arranged near the air outlet of the shell; the inside of the shell 1 is provided with a fan 4, the fan 4 is arranged above the vacuum cavity soaking plate 9 and is positioned at the front side of the radiating fins 7, the fan 4 is provided with a main fan air inlet 5, an auxiliary fan air inlet and an auxiliary fan air outlet, the main fan air inlet 5 and the auxiliary fan air inlet are respectively arranged on the upper side part and the lower side part of the fan 4, the fan air outlet is arranged at the rear part of the fan 4, and the blowing direction of the fan air outlet faces the shell air outlet. According to the design, the microcomputer host with the integrated space liquid cooling heat dissipation function is provided, external air flow is collected through the combination of the main air inlet 10 of the shell and the auxiliary air inlet 2 of the shell, then the external air flow enters the main air inlet 5 of the fan 4 and the auxiliary air inlet of the fan, the auxiliary air inlet of the fan can also absorb heat energy emitted by the main board 8, the heat energy is absorbed and evaporated by the main board 8 to be diffused to the heat dissipation fins 7 by means of the vacuum cavity vapor chamber 9, and then the heat energy is blown out of the shell 1 by the fan 4, so that a better heat dissipation effect is achieved for the whole parts and main heat sources in the shell 1 of the microcomputer host, the purposes of heat exchange and heat dissipation are achieved, and the normal use effect of the microcomputer host is effectively ensured.
The vacuum chamber vapor chamber 9 is pressed on the main board 8 through heat conduction silicone grease, so that heat conduction between the vacuum chamber vapor chamber 9 and the main board 8 is facilitated. In order to ensure the connection effect between the vacuum chamber vapor chamber 9 and the main board 8, the vacuum chamber vapor chamber 9 and the main board 8 are also fixed by screws.
The heat radiation fins 7 are fixed on the vacuum cavity soaking plate 9 through welding so as to facilitate heat conduction between the heat radiation fins 7 and the vacuum cavity soaking plate 9.
And a spacer bar 6 for preventing heat flow from flowing back is arranged between the heat radiation fins 7 and the fan 4, the heat flow at the heat radiation fins 7 is prevented from flowing back into the main air inlet 5 of the fan 4 by the spacer bar 6, and the spacer bar 6 can be made of strip-shaped insulating cotton.
In order to be convenient for fixed fan 4, be equipped with the fan installing support in the casing 1, fan 4 passes through the bolt fastening on the fan installing support, and spacer 6 sets up the upside in fan installing support and radiator fin 7 contact department. A gap of 0.8-1.0mm is reserved between the lower surface of the fan 4 and the vacuum chamber vapor chamber 9 so as to facilitate the air intake of the auxiliary air inlet of the fan.
The battery module 3 is arranged in the shell 1, the battery module 3 is arranged between the shell main air inlet 10 and the fan 4, air flowing in from the shell main air inlet 10 is split by the battery module 3, and meanwhile convection heat dissipation is formed for the battery module 3, so that the battery module 3 can work in a microcomputer host.
A dust screen is arranged at the auxiliary air inlet 2 of the shell to reduce dust from entering the shell 1.
When the microcomputer host works, air flowing in from the main air inlet 10 of the shell is split by the battery module 3, and meanwhile, convection heat dissipation is formed for the battery module 3, after the air flowing in from the auxiliary air inlet 2 of the shell is converged, the air enters the main air inlet 5 of the fan 4, the auxiliary air inlet of the fan 4 mainly absorbs heat flow emitted above the main board 8, and then the air is uniformly rotated at a high speed through the fan 4 and discharged from the air outlet of the shell close to the heat dissipation fins 7, so that the purposes of heat exchange, heat dissipation and heat dissipation are achieved in time for integral parts and main heat sources in the microcomputer host, and the normal use effect of the microcomputer host is effectively ensured.
Finally, it should be noted that: the present utility model is not limited to the preferred embodiments, but can be modified or substituted for some of the technical features described in the above embodiments by those skilled in the art, although the present utility model has been described in detail with reference to the above embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (8)
1. The microcomputer host with the integrated space liquid cooling and heat dissipation functions comprises a microcomputer host body, wherein the microcomputer host body comprises a shell, and a main board is arranged in the shell;
a vacuum cavity vapor chamber is arranged above the main board, a plurality of heat dissipation fins which are uniformly distributed are arranged above the vacuum cavity vapor chamber, and the heat dissipation fins are arranged at a position close to an air outlet of the shell;
the air conditioner is characterized in that a fan is arranged in the shell, the fan is arranged above the vacuum cavity vapor chamber and is positioned at the front side of the radiating fins, a main fan air inlet, an auxiliary fan air inlet and a fan air outlet are arranged on the fan, the main fan air inlet and the auxiliary fan air inlet are respectively arranged on the upper side part and the lower side part of the fan, the fan air outlet is arranged at the rear part of the fan, and the blowing direction of the fan air outlet faces the air outlet of the shell.
2. The microcomputer host with integrated space liquid cooling and heat dissipation function as claimed in claim 1, wherein the vacuum chamber vapor chamber is fixed on the main board by heat conduction silicone grease pressure bonding.
3. The microcomputer host with integrated space liquid cooling and heat dissipation function as set forth in claim 1, wherein the heat dissipation fins are fixed on the vacuum chamber vapor chamber by welding.
4. The microcomputer host with integrated space liquid cooling heat dissipation function as defined in claim 1, wherein a spacer for preventing heat flow back flow is arranged between the heat dissipation fins and the fan.
5. The microcomputer host with integrated space liquid cooling function as claimed in claim 4, wherein the isolation strip is a strip-shaped isolation cotton.
6. The microcomputer host with integrated space liquid cooling and heat dissipating function as set forth in claim 4, wherein a fan mounting bracket is provided in the housing, the fan is fixed to the fan mounting bracket by a bolt, and the spacer is provided on an upper side of a contact portion between the fan mounting bracket and the heat dissipating fins.
7. The microcomputer host with integrated space liquid cooling and heat dissipation function as defined in claim 1, wherein a battery module is arranged in the shell, and the battery module is arranged between the main air inlet of the shell and the fan.
8. The microcomputer host with integrated space liquid cooling and heat dissipating function as set forth in claim 1, wherein the housing secondary air inlet is provided with a dust screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976146.0U CN220305771U (en) | 2023-07-25 | 2023-07-25 | Micro computer host with integrated space liquid cooling heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321976146.0U CN220305771U (en) | 2023-07-25 | 2023-07-25 | Micro computer host with integrated space liquid cooling heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220305771U true CN220305771U (en) | 2024-01-05 |
Family
ID=89373249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321976146.0U Active CN220305771U (en) | 2023-07-25 | 2023-07-25 | Micro computer host with integrated space liquid cooling heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220305771U (en) |
-
2023
- 2023-07-25 CN CN202321976146.0U patent/CN220305771U/en active Active
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |