CN214846537U - Heat dissipation case capable of reducing air inlet temperature - Google Patents
Heat dissipation case capable of reducing air inlet temperature Download PDFInfo
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- CN214846537U CN214846537U CN202121229479.8U CN202121229479U CN214846537U CN 214846537 U CN214846537 U CN 214846537U CN 202121229479 U CN202121229479 U CN 202121229479U CN 214846537 U CN214846537 U CN 214846537U
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- heat dissipation
- fixed mounting
- case
- semiconductor refrigeration
- cold
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 54
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 238000005057 refrigeration Methods 0.000 claims abstract description 16
- 206010020649 Hyperkeratosis Diseases 0.000 claims abstract description 7
- 230000001681 protective effect Effects 0.000 claims description 12
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a quick-witted case technical field dispels the heat, and discloses a can reduce heat dissipation machine case of air inlet temperature, including protecting sheathing, the positive inboard fixed mounting of protecting sheathing has the cold junction heat dissipation, the radiating back fixed mounting of cold junction has the semiconductor refrigeration piece, the radiating back fixed mounting of cold junction has the thermal-insulated callus on the sole that is located the semiconductor refrigeration piece outside, the back of semiconductor refrigeration piece and thermal-insulated callus on the sole all with the positive fixed connection of hot junction radiator, the top fixedly connected with mounting bracket of hot junction radiator, the inboard fixed mounting of mounting bracket has radiator fan. The heat dissipation case capable of reducing the air inlet temperature can meet the requirement of a high-power case with efficient heat dissipation, can effectively solve the heat dissipation problem of a high-power device in a high-temperature environment and prolong the service life of the power device, is simple in structure, convenient to install and stable in performance, and fundamentally guarantees the performance requirement of the high-power device in the high-temperature environment.
Description
Technical Field
The utility model relates to a heat dissipation machine case technical field specifically is a can reduce heat dissipation machine case of air inlet temperature.
Background
The heat dissipation case is widely used in the field of high-power electronic equipment, the current high-power electrical devices are various, common heat dissipation modes are forced air cooling heat dissipation, a water cooling scheme can be adopted in a few special environments, when forced air cooling is adopted, the heat dissipation case is particularly important for the air inlet temperature of the case, along with the increase of the power consumption of the power devices and the increase of the environment temperature of the operation of the case, the heat dissipation conditions of the power devices are greatly reduced, the heat dissipation efficiency of the whole case can generate great influence along with the increase of the power devices, and the service life of the power devices can be reduced to a certain extent, so that the heat dissipation case capable of reducing the air inlet temperature is provided to solve the problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a can reduce heat dissipation machine case of air inlet temperature possesses the cold wind needs that can satisfy the air intake to guarantee that the radiating efficiency of quick-witted case satisfies the advantage of the good operation of power device, solved along with the increase of the consumption of power device and the rising of the ambient temperature of machine case operation, the heat dissipation condition greatly reduced of power device, the radiating efficiency of whole machine case also can produce great influence thereupon, and can reduce the life's of power device problem to a certain extent.
(II) technical scheme
For the cold wind needs that can satisfy the air intake of realizing the aforesaid to guarantee that the radiating efficiency of quick-witted case satisfies the purpose of power device good operation, the utility model provides a following technical scheme:
the utility model provides a can reduce heat dissipation machine case of air inlet temperature, includes protecting sheathing, the positive inboard fixed mounting of protecting sheathing has the cold junction heat dissipation, the radiating back fixed mounting of cold junction has the semiconductor refrigeration piece, the radiating back fixed mounting of cold junction has the thermal-insulated callus on the sole that is located the semiconductor refrigeration piece outside, the back of semiconductor refrigeration piece and thermal-insulated callus on the sole all with the positive fixed connection of hot junction radiator, the top fixedly connected with mounting bracket of hot junction radiator, the inboard fixed mounting of mounting bracket has radiator fan.
As a further aspect of the present invention: the protective housing comprises a shell and two cover plates, the two cover plates are distributed on the top of the shell in the left-right direction, and the shell is connected with the cover plates through screws.
As a further aspect of the present invention: a plurality of air inlets are formed in the front face of the shell, and a plurality of air outlets are formed in the back face of the shell and the top of the right side cover plate.
As a further aspect of the present invention: and heat-conducting silicone grease is attached to the outer part of the semiconductor refrigerating sheet, and the front surface and the back surface of the semiconductor refrigerating sheet are respectively contacted with the cold-end heat dissipation device and the hot-end heat dissipation device.
As a further aspect of the present invention: the radiating fins at the cold ends are perpendicular to the air inlet formed in the front face of the protective shell to form a cold air duct, and a protective net is fixedly mounted on the outer side of the radiating fan.
(III) advantageous effects
Compared with the prior art, the utility model provides a can reduce heat dissipation machine case of air inlet temperature possesses following beneficial effect:
the heat dissipation case capable of reducing the air inlet temperature can meet the requirement of a high-power case with efficient heat dissipation, can effectively solve the heat dissipation problem of a high-power device in a high-temperature environment and prolong the service life of the power device, is simple in structure, convenient to install and stable in performance, and fundamentally guarantees the performance requirement of the high-power device in the high-temperature environment.
Drawings
FIG. 1 is a front view of the structure of the present invention;
FIG. 2 is a top view of the present invention;
fig. 3 is a schematic view of the structural mounting frame of the present invention.
In the figure: 1 protective housing, 2 cold junction heat dissipations, 3 hot junction radiators, 4 semiconductor refrigeration pieces, 5 heat insulation foot pads, 6 mounting racks and 7 cooling fans.
Detailed Description
The preferred embodiments of the present invention will be described with reference to the accompanying drawings, which should not be construed as limiting the invention.
It should be noted that these drawings are simplified schematic views, and the basic structure of the present invention is described only in a schematic manner, and therefore, only the configuration related to the present invention is shown.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, a heat dissipation case capable of reducing inlet air temperature comprises a protective case 1, the protective case 1 comprises a casing and two cover plates, the two cover plates are distributed on the top of the casing in the left-right direction, the casing and the cover plates are connected by screws, the front of the casing is provided with a plurality of air inlets, the back of the casing and the top of the right cover plate are both provided with a plurality of air outlets, the inner side of the front of the protective case 1 is fixedly provided with a cold end heat dissipation 2, fins of the cold end heat dissipation 2 are perpendicular to the air inlets formed on the front of the protective case 1 to form a cold air duct, the back of the cold end heat dissipation 2 is fixedly provided with a semiconductor refrigeration sheet 4, the outer part of the semiconductor refrigeration sheet 4 is attached with heat-conducting silicone grease, the front and the back of the semiconductor refrigeration sheet 4 are respectively contacted with the cold end heat dissipation 2 and the hot end heat dissipation 3, the back of the cold end heat dissipation 2 is fixedly provided with a heat insulation foot pad 5 positioned on the outer side of the semiconductor refrigeration sheet 4, the back of semiconductor refrigeration piece 4 and thermal-insulated callus on the sole 5 all with the positive fixed connection of hot junction radiator 3, the top fixedly connected with mounting bracket 6 of hot junction radiator 3, the inboard fixed mounting of mounting bracket 6 has radiator fan 7, radiator fan 7's outside fixed mounting has the protection network to reach the cold wind needs that can satisfy the air intake, thereby guarantee that the radiating efficiency of quick-witted case satisfies the purpose of power device good operation.
In conclusion, the heat dissipation case capable of reducing the air inlet temperature can meet the requirement of a high-power case capable of efficiently dissipating heat, can effectively solve the heat dissipation problem of a high-power device in a high-temperature environment and prolong the service life of the power device, is simple in structure, convenient to install and stable in performance, and fundamentally guarantees the performance requirement of the high-power device in the high-temperature environment, so that the problems that the heat dissipation condition of the power device is greatly reduced along with the increase of the power consumption of the power device and the rise of the ambient temperature of the operation of the case, the heat dissipation efficiency of the whole case can be greatly influenced therewith, and the service life of the power device can be reduced to a certain extent are solved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a can reduce heat dissipation machine case of air inlet temperature, includes protecting sheathing (1), its characterized in that: the utility model discloses a semiconductor refrigeration device, including protective housing (1), the positive inboard fixed mounting of cold junction heat dissipation (2), the back fixed mounting of cold junction heat dissipation (2) has semiconductor refrigeration piece (4), the back fixed mounting of cold junction heat dissipation (2) has thermal-insulated callus on the sole (5) that is located the semiconductor refrigeration piece (4) outside, the back of semiconductor refrigeration piece (4) and thermal-insulated callus on the sole (5) all with the positive fixed connection of hot junction radiator (3), the top fixedly connected with mounting bracket (6) of hot junction radiator (3), the inboard fixed mounting of mounting bracket (6) has radiator fan (7).
2. The heat dissipation case of claim 1, wherein the heat dissipation case comprises: the protective casing (1) comprises a casing and two cover plates, wherein the two cover plates are distributed on the top of the casing from left to right, and the casing is connected with the cover plates through screws.
3. The heat dissipation case of claim 2, wherein the heat dissipation case comprises: a plurality of air inlets are formed in the front face of the shell, and a plurality of air outlets are formed in the back face of the shell and the top of the right side cover plate.
4. The heat dissipation case of claim 1, wherein the heat dissipation case comprises: and heat-conducting silicone grease is attached to the outer part of the semiconductor refrigerating sheet (4), and the front surface and the back surface of the semiconductor refrigerating sheet (4) are respectively contacted with the cold-end heat dissipation device (2) and the hot-end heat dissipation device (3).
5. The heat dissipation case of claim 1, wherein the heat dissipation case comprises: fins of the cold end heat dissipation (2) are perpendicular to an air inlet formed in the front face of the protective shell (1) to form a cold air duct, and a protective net is fixedly mounted on the outer side of the heat dissipation fan (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121229479.8U CN214846537U (en) | 2021-05-31 | 2021-05-31 | Heat dissipation case capable of reducing air inlet temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121229479.8U CN214846537U (en) | 2021-05-31 | 2021-05-31 | Heat dissipation case capable of reducing air inlet temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214846537U true CN214846537U (en) | 2021-11-23 |
Family
ID=78800418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121229479.8U Active CN214846537U (en) | 2021-05-31 | 2021-05-31 | Heat dissipation case capable of reducing air inlet temperature |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214846537U (en) |
-
2021
- 2021-05-31 CN CN202121229479.8U patent/CN214846537U/en active Active
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