CN216347246U - Refrigerating machine - Google Patents

Abstract

The utility model discloses a refrigerator, which comprises: the box body is provided with a mounting cavity; the semiconductor refrigeration piece is positioned in the mounting cavity; the refrigerating assembly comprises a cold air duct and a refrigerating piece, and the refrigerating piece is positioned in the cold air duct and is in contact with the cold end of the semiconductor refrigerating piece; the heat dissipation assembly comprises a hot air channel and a heat dissipation sheet, and the heat dissipation sheet is positioned in the hot air channel and is in contact with the hot end of the semiconductor refrigeration sheet; and a first fan is arranged in the cold air channel, and/or a second fan is arranged in the hot air channel. The refrigerator provided by the utility model integrates the refrigeration and heat dissipation functions, the fan is favorable for improving the refrigeration or heat dissipation effect and improving the working performance of the refrigerator, and the refrigerator is simple in structure, small in overall size, convenient to carry and use for users and wide in application range.

Description

Refrigerating machine

Technical Field

The utility model relates to the technical field of manufacturing of electrical equipment, in particular to a refrigerating machine.

Background

Semiconductor refrigeration technology is comparatively ripe technique, but present semiconductor refrigeration is used on large-scale household electrical appliances such as refrigerator, gradevin mostly, and is bulky, and inconvenient removal has caused certain limitation to user's use, has the space of improvement.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model aims to provide a refrigerator which is simple in structure, small in size, convenient to carry and high in applicability.

The refrigerator according to the embodiment of the present invention includes: the box body is provided with a mounting cavity; the semiconductor refrigeration piece is positioned in the mounting cavity; the refrigerating assembly comprises a cold air duct and a refrigerating piece, and the refrigerating piece is positioned in the cold air duct and is in contact with the cold end of the semiconductor refrigerating piece; the heat dissipation assembly comprises a hot air channel and a heat dissipation sheet, and the heat dissipation sheet is positioned in the hot air channel and is in contact with the hot end of the semiconductor refrigeration sheet; and a first fan is arranged in the cold air channel, and/or a second fan is arranged in the hot air channel.

The refrigerator provided by the embodiment of the utility model integrates the functions of refrigeration and heat dissipation, is beneficial to improving the refrigeration or heat dissipation effect by arranging the fan, improves the working performance of the refrigerator, has a simple structure and a small overall volume, is convenient for a user to carry and use, and has a wide application range.

The refrigerator according to the embodiment of the present invention further includes: the heat preservation piece, the heat preservation piece install in the installation intracavity, the semiconductor refrigeration piece install in the heat preservation piece.

According to the refrigerator provided by the embodiment of the utility model, the refrigerating piece comprises a refrigerating part and a first fin part, the refrigerating part extends into the heat preservation piece to be contacted with the cold end, and the first fin part is positioned in the cold air duct.

According to the refrigerator provided by the embodiment of the utility model, the refrigerating assembly further comprises an air duct shell, the air duct shell is connected with the box body to limit the cold air duct, and the air duct shell is provided with a first air inlet and a first air outlet which are communicated with the cold air duct.

According to the refrigerator provided by the embodiment of the utility model, the first air inlet and the first air outlet are respectively arranged on two opposite side walls of the air duct shell.

According to the refrigerator provided by the embodiment of the utility model, the radiating fin comprises a radiating part and a second fin part, the radiating part is connected with the box body and is in contact with the hot end, and the second fin part is positioned in the hot air channel.

According to the refrigerator provided by the embodiment of the utility model, the heat dissipation assembly further comprises a heat dissipation support, and the heat dissipation support is connected with the heat dissipation part and defines the hot air channel with the heat dissipation part.

According to the refrigerator provided by the embodiment of the utility model, the heat dissipation bracket comprises the mounting plate and the mounting seat, the mounting plate is connected with the heat dissipation part and defines the second air inlet, the second fan is arranged on the mounting seat, and the mounting seat is provided with the second air outlet.

According to the refrigerator provided by the embodiment of the utility model, two ends of the hot air duct are opened and two second air inlets are formed, and the second air outlet is positioned in the middle of the hot air duct.

The refrigerator according to the embodiment of the present invention further includes: the battery, the battery with refrigeration subassembly or radiator unit detachably links to each other, just the battery is used for to semiconductor refrigeration piece power supply.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural view of a refrigerator according to an embodiment of the present invention;

fig. 2 is a schematic structural view (another view) of a refrigerator according to an embodiment of the present invention;

FIG. 3 is a side view of a chiller according to an embodiment of the present invention;

FIG. 4 is a cross-sectional view taken at A-A of FIG. 3;

FIG. 5 is a cross-sectional view taken at B-B of FIG. 3;

FIG. 6 is an enlarged view of a chiller according to an embodiment of the present invention;

fig. 7 is an enlarged view (another view angle) of a refrigerator according to an embodiment of the present invention;

fig. 8 is a structural schematic view of a duct case of a refrigerator according to an embodiment of the present invention;

fig. 9 is a schematic structural view (another view) of an air duct casing of a refrigerator according to an embodiment of the present invention;

fig. 10 is a schematic structural view of a first fan of a refrigerator according to an embodiment of the present invention;

fig. 11 is a schematic structural view of a refrigerating sheet of a refrigerator according to an embodiment of the present invention;

fig. 12 is a schematic structural view of a cabinet of a refrigerator according to an embodiment of the present invention;

fig. 13 is a schematic structural view of a heat retaining member of a refrigerator according to an embodiment of the present invention;

fig. 14 is a schematic structural view of a cooling fin of a refrigerator according to an embodiment of the present invention;

fig. 15 is a schematic structural view of a second fan of a refrigerator according to an embodiment of the present invention;

fig. 16 is a schematic structural view of a heat radiation bracket of a refrigerator according to an embodiment of the present invention.

Reference numerals:

the refrigerating machine (100) is provided with a refrigerating machine,

the refrigeration assembly 1, the refrigeration sheet 11, the refrigeration part 111, the first fin part 112, the cold air duct 113, the air duct shell 12, the first air inlet 121, the first air outlet 122, the pipe connector 123, the first fan 13, the clamping cavity 14, the buckle 141,

the heat dissipation assembly 2, the heat dissipation plate 21, the heat dissipation portion 211, the second fin portion 212, the hot air duct 213, the heat dissipation bracket 22, the mounting plate 221, the side plate 222, the middle plate 223, the mounting seat 224, the second air inlet 231, the second air outlet 232, the second fan 24,

the box 3, installation cavity 31, semiconductor refrigeration piece 4, heat preservation 5, heat preservation chamber 51, battery 6, connecting hole a.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

The following describes a refrigerator 100 according to an embodiment of the present invention with reference to fig. 1 to 16, where the refrigerator 100 integrates the functions of refrigeration and heat dissipation, and is beneficial to improve the refrigeration or heat dissipation effect by installing a fan, so as to improve the working performance of the refrigerator 100, and the refrigerator 100 has a simple structure, a small overall volume, is convenient for a user to carry and use, and has a wide application range.

As shown in fig. 1 to 16, a refrigerator 100 according to an embodiment of the present invention includes: the refrigerator comprises a box body 3, a semiconductor refrigerating sheet 4, a refrigerating assembly 1 and a heat dissipation assembly 2.

Wherein, the box body 3 has a mounting cavity 31, that is, the box body 3 is configured as a hollow structure, so as to form the hollow mounting cavity 31 in the interior of the box body 3, and when the design is specific, the mounting cavity 31 may be configured as an open cavity penetrating along the thickness direction of the box body 3, as shown in fig. 6, 7 and 12, the mounting cavity 31 is open at both sides of the thickness direction of the box body 3, that is, the whole of the box body 3 is configured as an annular frame structure.

The semiconductor refrigeration piece 4 is used for realizing refrigeration, and it can be understood that the semiconductor refrigeration piece 4 is provided with a cold end and a hot end, namely when the semiconductor refrigeration piece 4 is actually operated, the cold end temperature of the semiconductor refrigeration piece 4 is lower and can be used for realizing cold exchange with external airflow or objects, and meanwhile, the hot end temperature of the semiconductor refrigeration piece 4 is higher and can be used for realizing heat exchange with the external airflow or objects.

Semiconductor refrigeration piece 4 is used for with box 3 fixed mounting, if set up semiconductor refrigeration piece 4 in installation cavity 31 to make box 3 play structure protection and safe heat retaining effect in semiconductor refrigeration piece 4's circumference, wherein, it needs to explain that semiconductor refrigeration piece 4 is electrical control element, can set up semiconductor refrigeration piece 4's circuit isotructure in box 3, in order to reduce the occupation of all the other installation space.

The refrigeration assembly 1 comprises a cold air duct 113 and a refrigeration sheet 11, wherein the cold air duct 113 is constructed as an airflow channel with two open ends, that is, the cold air duct 113 can be provided with a first air inlet 121 and a first air outlet 122, so that external airflow enters the cold air duct 113 and flows out from the first air outlet 122, wherein the refrigeration sheet 11 is located in the cold air duct 113, and the refrigeration sheet 11 is in contact with the cold end of the semiconductor refrigeration sheet 4, that is, in the operation process of the semiconductor refrigeration sheet 4, the cold energy generated by the cold end can be transmitted to the refrigeration sheet 11 in a direct contact mode, so that the refrigeration sheet 11 is in a lower temperature state in the cold air duct 113, that is, the refrigeration sheet 11 can exchange the cold energy with the airflow in the cold air duct 113, and thus cooling the airflow in the cold air duct 113.

Therefore, after the semiconductor refrigerating sheet 4 is started to operate, as shown in fig. 4, the cold end of the semiconductor refrigerating sheet 4 refrigerates and conveys cold energy to the refrigerating sheet 11, meanwhile, airflow in the external space enters the cold air duct 113 from the first air inlet 121, and contacts with the refrigerating sheet 11 in the cold air duct 113, so that the temperature of the airflow is effectively reduced, the airflow can flow out from the first air outlet 122 after the temperature of the airflow is reduced, and the airflow is blown to the demand position of a user, and therefore the cold energy conveying for the user can be realized. That is to say, the refrigerator 100 of the present invention can be used as an air conditioning device in an indoor space to cool the air flow in the space where the user is located, so as to achieve the cooling effect, ensure that the user is in a comfortable and low temperature environment, and improve the comfort of the user.

The heating assembly includes a hot air duct 213 and a heat sink 21, wherein the hot air duct 213 can be provided with a second air inlet 231 and a second air outlet 232, so that an external air flow enters the hot air duct 213 and flows out from the second air outlet 232, wherein the heat sink 21 is located in the hot air duct 213, and the heat sink 21 contacts with the hot end of the semiconductor chilling plate 4, that is, during the operation of the semiconductor chilling plate 4, the heat generated by the hot end can be transferred to the heat sink 21 by direct contact, so that the heat sink 21 is in a higher temperature state in the hot air duct 213, that is, the heat sink 21 can exchange heat with the air flow in the hot air duct 213, thereby achieving the heat dissipation effect of the heat sink 21.

Therefore, after the semiconductor chilling plate 4 is started to operate, as shown in fig. 5, the hot end of the semiconductor chilling plate 4 heats and conveys heat to the radiating fin 21, meanwhile, air flow in the external space enters the hot air duct 213 from the second air inlet 231 and contacts with the radiating fin 21 in the hot air duct 213, so that the air flow takes away the heat at the radiating fin 21, the radiating fin 21 is ensured to be in a lower temperature state, continuous heat dissipation of the hot end of the semiconductor chilling plate 4 is realized, the problem that the structure of the semiconductor chilling plate 4 is damaged due to overhigh temperature of the hot end is avoided, and the structural safety of the semiconductor chilling plate 4 is improved. Certainly, the refrigerator 100 of the present invention can be used as an air conditioning device in an indoor space, so that the hot air flow discharged from the hot air duct 213 can heat the air flow in the space where the user is located, thereby achieving a heating effect, ensuring that the user is in a comfortable and high temperature environment, and improving the comfort of the user.

During specific design, the first fan 13 may be disposed in the cold air duct 113, the first fan 13 is configured to drive airflow in the cold air duct 113 to flow, and the first fan 13 may drive airflow at the first air inlet 121 to flow toward the first air outlet 122, so as to achieve continuous flow of airflow in the cold air duct 113, and promote circulation flow in the external space and the cold air duct 113, thereby, when refrigerating through the semiconductor chilling plate 4, the first fan 13 may achieve a pushing effect on airflow in the cold air duct 113, and thereby enhance the refrigerating effect of the refrigerator 100. And, the second fan 24 can be disposed in the hot air duct 213, the second fan 24 is used for driving the air flow in the hot air duct 213 to flow, and specifically, the second fan 24 can drive the air flow at the second air inlet 231 to flow toward the second air outlet 232, so as to realize the continuous flow of the air flow in the hot air duct 213 and promote the circulation flow in the external space and the hot air duct 213, thereby, when the semiconductor chilling plate 4 is used for chilling and the heat generated at the hot end thereof is large, the second fan 24 can realize the pushing effect on the air flow in the hot air duct 213, thereby enhancing the heat dissipation effect on the semiconductor chilling plate 4.

It should be noted that, the first fan 13 and the second fan 24 in the present invention may be optional, that is, the first fan 13 may be independently arranged, or the second fan 24 may be independently arranged, or the first fan 13 and the second fan 24 may be simultaneously arranged, so that the refrigeration and heat dissipation effects of the refrigerant are favorably ensured.

The refrigerator 100 according to the embodiment of the present invention integrates the refrigeration and heat dissipation functions, and the fan is favorable for improving the refrigeration or heat dissipation effect, thereby improving the working performance of the refrigerator 100, and the refrigerator 100 has a simple structure, a small overall volume, is convenient for a user to carry and use, and has a wide application range.

In some embodiments, chiller 100 further comprises: the heat insulating member 5, wherein, as shown in fig. 13, the heat insulating member 5 has a heat insulating cavity 51, that is, the heat insulating member 5 is configured as a hollow structure, so as to form the hollow heat insulating cavity 51 inside the heat insulating member 5, and when specifically designed, the heat insulating cavity 51 may be configured as an open cavity penetrating along the thickness direction of the heat insulating member 5, as shown in fig. 13, the heat insulating cavity 51 is open at both sides of the thickness direction of the heat insulating member 5, so that the whole body of the heat insulating member 5 is configured as an annular frame structure, wherein, the heat insulating member 5 is installed in the installation cavity 31, as the heat insulating member 5 may be fixedly installed on the box body 3 by a connecting member, specifically, a plurality of connecting holes a may be correspondingly provided in the heat insulating member 5 and the box body 3, so as to fixedly connect the heat insulating member 5 and the box body 3 by a bolt structure penetrating through the connecting holes a.

Wherein, semiconductor refrigeration piece 4 is installed in heat preservation 5, semiconductor refrigeration piece 4 fixed mounting is in heat preservation chamber 51 promptly, and heat preservation 5 makes for insulation material, so that heat preservation 5 can play heat retaining effect in semiconductor refrigeration piece 4's circumference, thereby make the cold volume and the discharge that the heat can be oriented of semiconductor refrigeration piece 4 production, can derive towards refrigeration piece 11 under the guide effect of heat preservation 5 like the cold volume that semiconductor refrigeration piece 4 produced, the heat that semiconductor refrigeration piece 4 produced can derive towards fin 21 under the guide effect of heat preservation 5 simultaneously.

In some embodiments, as shown in fig. 11, the chilling plate 11 includes a chilling part 111 and a first fin part 112, wherein the chilling part 111 may be configured in a plate shape, and the plate shape has a large thickness, and when actually installed, one side of the chilling part 111 may be extended into the insulation cavity 51 of the insulation member 5 so that the side of the chilling part 111 is in contact with the cold end of the semiconductor chilling plate 4. Meanwhile, the first fin part 112 is fixedly connected with the refrigerating part 111, and if the first fin part 112 and the refrigerating part 111 are integrated into an integral structure, cold energy transfer can be realized between the refrigerating part 111 and the first fin part 112, so that when the semiconductor refrigerating sheet 4 operates for refrigeration, cold energy generated at the cold end can be transferred to the refrigerating part 111 and transferred to the first fin part 112 through the refrigerating part 111, and the first fin part 112 is positioned in the cold air duct 113, so that the first fin part 112 transfers the cold energy to the inner space of the cold air duct 113, and cooling effect on airflow in the cold air duct 113 is realized.

As shown in fig. 11, the first fin portion 112 may include a plurality of sub-fins distributed in parallel and spaced apart on the surface of the cooling portion 111, so that the first fin portion 112 may have a large contact area, so that the airflow in the cold air duct 113 can maximally contact with the first fin portion 112. It should be noted that, when the plurality of sub-fins are actually arranged, the cooling gap defined between two adjacent sub-fins may be communicated with the cold air duct 113, and the extending direction of the cooling gap is the same as the flowing direction of the air flow in the cold air duct 113, so as to prevent the sub-fins from generating flow resistance to the air flow in the cold air duct 113, ensure that the cooling air flow smoothly flows, and improve the refrigeration effect of the refrigerator 100.

In some embodiments, as shown in fig. 6 to 9, the refrigeration assembly 1 further includes a duct case 12, the duct case 12 being connected to the cabinet 3 to define a cool air duct 113, wherein the duct case 12 is constructed in a hollow structure and one side of the duct case 12 is open, and the open side of the duct case 12 may be connected to the cabinet 3 such that the duct case 12 and the cabinet 3 together define the cool air duct 113. During specific installation, a plurality of connecting holes a can be formed in the air duct shell 12, and a plurality of connecting holes a can be formed in the box body 3, so that the air duct shell 12 and the box body 3 are connected through a plurality of connecting pieces penetrating through the connecting holes a, and the detachable connection of the air duct shell 12 and the box body 3 is realized.

As shown in fig. 8, the air duct shell 12 is provided with a first air inlet 121 and a first air outlet 122, wherein both the first air inlet 121 and the first air outlet 122 are used for communicating with the cold air duct 113, so that external air flow can enter the cold air duct 113 from the first air inlet 121 through the side wall of the air duct shell 12, and after cold energy exchange with the cooling fins 11 is realized in the cold air duct 113, the external air flow can flow out of the cold air duct 113 from the first air outlet 122 through the side wall of the air duct shell 12, thereby realizing a cooling process of the external air flow.

The first air inlet 121 may be configured as a plurality of spaced meshes, and the plurality of meshes may be configured as elongated holes, so that the width of each mesh is small, thereby playing a role of filtering external air flow, avoiding interference of external impurities into the cold air duct 113 and the first fan 13, and facilitating improvement of the safety of the refrigerator 100. As shown in fig. 8, a pipe interface 123 may be disposed at the first air outlet 122, so that a user may set a cooling pipeline at the first air outlet 122 according to a requirement, thereby implementing directional discharge of cold air and satisfying more diverse cooling requirements of the user.

In some embodiments, the first air inlet 121 and the first air outlet 122 are respectively disposed on two different sidewalls, such as two opposite sidewalls of the air duct shell 12. As shown in fig. 8, a plurality of meshes of the first air inlet 121 are disposed on the left side wall of the air duct shell 12, and the first air outlet 122 is disposed on the right side wall of the air duct shell 12, and when the air duct shell is specifically designed, the first air inlet 121 and the first air outlet 122 can be disposed opposite to each other, so that the air flow entering from the first air inlet 121 can directly flow out from the first air outlet 122 without substantial air flow diversion after the air flow enters the cold air duct 113.

From this, do benefit to the efficiency that increases the air current and flow in cold wind channel 113, increase the airflow in cold wind channel 113 in the unit interval, the circulation efficiency of reinforcing refrigerator 100 and outside air current to do benefit to the refrigeration effect that increases refrigerator 100.

In some embodiments, the heat sink 21 includes a heat sink portion 211 and a second fin portion 212, the heat sink portion 211 may be configured to be plate-shaped, and the heat sink portion 211 has a larger surface area, and when actually installed, the heat sink portion 211 may be attached to the box body 3, so that the heat sink portion 211 is fixedly connected to the box body 3, wherein the side of the heat sink portion 211 facing the box body 3 has a larger surface area, the heat sink portion 211 may be in contact with the hot end of the semiconductor chilling plate 4, and it may be ensured that the heat sink portion 211 has a larger contact area with the hot end of the semiconductor chilling plate 4, thereby enhancing the heat sink effect of the heat sink portion 211 on the hot end of the semiconductor chilling plate 4.

Meanwhile, the second fin portion 212 and the heat dissipating portion 211 are fixedly connected, and if the two portions are integrated into an integral structure, the heat dissipating portion 211 and the second fin portion 212 can achieve cold energy transfer, so that when the semiconductor chilling plate 4 operates to dissipate heat, heat generated at the hot end of the semiconductor chilling plate can be transferred to the heat dissipating portion 211 and transferred to the second fin portion 212 through the heat dissipating portion 211, and the second fin portion 212 is located in the hot air duct 213, so that the second fin portion 212 conducts the heat to the inner space of the hot air duct 213, that is, the air flow in the hot air duct 213 can effectively cool and dissipate the second fin portion 212.

As shown in fig. 14, the second fin portion 212 may include a plurality of sub-fins which are distributed on the surface of the heat dissipation portion 211 in parallel and spaced apart, so that the second fin portion 212 may have a large contact area, so that the air flow in the hot air duct 213 can maximally contact with the second fin portion 212. It should be noted that, when the plurality of sub-fins are actually disposed, the heat dissipation gap defined between two adjacent sub-fins may be communicated with the hot air duct 213, and the extending direction of the heat dissipation gap is the same as the flowing direction of the air flow in the hot air duct 213, so as to prevent the sub-fins from generating flow resistance to the air flow in the hot air duct 213, ensure that the heat dissipation air flow smoothly flows, and improve the heat dissipation effect of the refrigerator 100.

In some embodiments, as shown in fig. 6-7 and 16, the heat dissipation assembly 2 further includes a heat dissipation bracket 22, the heat dissipation bracket 22 is used for fixing the second fan 24, and the heat dissipation bracket 22 is connected to the heat dissipation portion 211 to form a frame structure defining the hot air duct 213 together with the heat dissipation portion 211.

That is, the heat dissipation bracket 22 and the heat dissipation plate 21 are fixedly connected to form a main structure of the heat dissipation assembly 2, wherein the heat dissipation plate 21 is fixedly connected to the case 3 and the semiconductor chilling plate 4, the heat dissipation bracket 22 and the heat dissipation plate 21 can be connected to define a hot air channel 213 therebetween for air flow, and the second fan 24 is further mounted on the heat dissipation bracket 22, so that the second fan 24 drives the air flow in the hot air channel 213 and performs a cooling function on the sub-fins of the heat dissipation plate 21 during the flow process.

In some embodiments, the heat-dissipating bracket 22 includes two parts fixedly connected, and specifically includes a mounting plate 221 and a mounting seat 224, wherein, as shown in fig. 16, the mounting plate 221 is configured as a channel plate, i.e., the mounting plate 221 includes two side plates 222 and a middle plate 223, the two side plates 222 are spaced apart and oppositely disposed in parallel, the middle plate 223 is connected between the two side plates 222, and the middle plate 223 is connected with the edges of the side plates 222, so that the mounting plate 221 is configured as a channel groove with one side open, thereby, after the mounting plate 221 is connected with the heat sink 21, the open side of the channel groove is closed, and the hot channel 213 is formed between the mounting plate 221 and the heat sink 21.

After the mounting plate 221 is connected to the heat dissipating portion 211, a second air inlet 231 is defined therebetween, that is, a notch of the air duct groove is formed as the second air inlet 231, wherein the second fan 24 is disposed on the mounting base 224, for example, the second fan 24 is detachably connected to the mounting base 224, and as shown in fig. 16, the mounting base 224 has a second air outlet 232, that is, the second air inlet 231 and the second air outlet 232 are communicated through the hot air duct 213.

As shown in fig. 16, the second air outlet 232 is configured as a plurality of spaced mesh holes, and the plurality of mesh holes may be configured as elongated holes, so that the width of each mesh hole is small, thereby playing a role of filtering the external air flow, and preventing external impurities from entering into the mounting seat 224 and interfering with the second fan 24, which is beneficial to improving the safety of the refrigerator 100.

In some embodiments, two ends of the hot air duct 213 are open, and two second air inlets 231 are formed at two ends of the hot air duct 213, so that the two second air inlets 231 can simultaneously achieve air intake, and as shown in fig. 16, the mounting seat 224 is disposed in the middle region of the mounting plate 221, so that the second air outlet 232 is located in the middle of the hot air duct 213, so that after the semiconductor chilling plate 4 is opened and operated, as shown in fig. 5, the two second air inlets 231 respectively intake air from two sides of the refrigerator 100 at the same time to increase the air intake of the refrigerator 100, and at the same time, after the air flows from two sides converge at the middle, the air flows out of the refrigerator 100 from the middle second air outlet 232.

In some embodiments, chiller 100 further comprises: the battery 6, wherein the battery 6 may be connected to the refrigeration component 1 or connected to the heat dissipation component 2, and the connection manner may be detachable, for example, the battery 6 may be fixedly connected to the refrigeration component 1 by clipping, so that the battery 6 is fixedly mounted on the refrigerator 100.

As shown in fig. 9, a concave clamping cavity 14 is formed on one side of the air duct shell 12 away from the refrigerating plate 11, a buckle 141 is arranged on a side wall of the clamping cavity 14, the buckle 141 is installed on the air duct shell 12 in a deformable manner, wherein, as shown in fig. 9, the four buckles 141 are four, and the four buckles 141 are respectively located on two side walls of the clamping cavity 14, which are oppositely arranged, and the buckle 141 is provided with a boss protruding toward the clamping cavity 14, the battery 6 can be installed in the clamping cavity 14, and the battery 6 can be clamped and fixed in the clamping cavity 14 through the four buckles 141, so that the battery 6 is prevented from being separated from the refrigerating assembly 1.

And the battery 6 is used for supplying power to the semiconductor refrigeration piece 4, that is, the semiconductor refrigeration piece 4 in the utility model can directly supply power through the battery 6 without connecting with a separate power supply for power supply. This allows the refrigerator 100 to be flexibly installed at any position in space by restricting the position of the battery 6, thereby increasing the flexibility of use of the refrigerator 100.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features.

In the description of the present invention, "a plurality" means two or more.

In the description of the present invention, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween.

In the description of the utility model, "above", "over" and "above" a first feature in a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the utility model have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A refrigerator (100) comprising:

a box body (3), wherein the box body (3) is provided with a mounting cavity (31);

the semiconductor refrigeration piece (4), the semiconductor refrigeration piece (4) is positioned in the installation cavity (31);

the refrigeration assembly (1) comprises a cold air duct (113) and refrigeration pieces (11), and the refrigeration pieces (11) are located in the cold air duct (113) and are in contact with cold ends of the semiconductor refrigeration pieces (4);

the heat dissipation assembly (2) comprises a hot air channel (213) and a heat dissipation sheet (21), wherein the heat dissipation sheet (21) is positioned in the hot air channel (213) and is in contact with the hot end of the semiconductor refrigeration sheet (4);

a first fan (13) is arranged in the cold air channel (113), and/or a second fan (24) is arranged in the hot air channel (213).

2. The chiller (100) of claim 1, further comprising: the heat preservation piece (5), heat preservation piece (5) install in installation cavity (31), semiconductor refrigeration piece (4) install in heat preservation piece (5).

3. Refrigerator (100) according to claim 2, characterized in that the refrigeration sheet (11) comprises a refrigeration portion (111) and a first fin portion (112), the refrigeration portion (111) extending into the thermal insulation (5) to be in contact with the cold end, the first fin portion (112) being located in the cold air duct (113).

4. The chiller (100) of claim 1, wherein the refrigeration assembly (1) further comprises an air duct housing (12), the air duct housing (12) being connected to the cabinet (3) to define the cold air duct (113), the air duct housing (12) having a first air inlet (121) and a first air outlet (122) in communication with the cold air duct (113).

5. The refrigerating machine (100) according to claim 4, wherein the first air inlet opening (121) and the first air outlet opening (122) are respectively provided on two opposite side walls of the air duct housing (12).

6. The refrigerator (100) of claim 1, wherein the heat sink (21) comprises a heat sink portion (211) and a second fin portion (212), the heat sink portion (211) being connected to the cabinet (3) and being in contact with the hot end, the second fin portion (212) being located within the hot air duct (213).

7. The refrigerating machine (100) according to claim 6, wherein the heat dissipating assembly (2) further comprises a heat dissipating bracket (22), the heat dissipating bracket (22) being connected to the heat dissipating portion (211) and defining the hot air duct (213) with the heat dissipating portion (211).

8. The chiller (100) of claim 7, wherein the heat sink bracket (22) comprises a mounting plate (221) and a mounting seat (224), the mounting plate (221) is connected to the heat sink portion (211) and defines a second air inlet (231), the second fan (24) is disposed on the mounting seat (224), and the mounting seat (224) has a second air outlet (232).

9. The refrigerator (100) of claim 8, wherein the hot air duct (213) is open at both ends and forms two of the second air inlets (231), and the second air outlet (232) is located at a middle portion of the hot air duct (213).

10. The chiller (100) of claim 1, further comprising: the battery (6), battery (6) with refrigeration subassembly (1) or radiator unit (2) detachably link to each other, just battery (6) are used for to semiconductor refrigeration piece (4) power supply.

Images