CN111397245A - Heat exchange device adopting semiconductor refrigeration and air conditioner - Google Patents
Heat exchange device adopting semiconductor refrigeration and air conditioner Download PDFInfo
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- CN111397245A CN111397245A CN202010314034.3A CN202010314034A CN111397245A CN 111397245 A CN111397245 A CN 111397245A CN 202010314034 A CN202010314034 A CN 202010314034A CN 111397245 A CN111397245 A CN 111397245A
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- heat exchanger
- exchange device
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- heat exchange
- fan
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/20—Casings or covers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0251—Removal of heat by a gas
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
Abstract
The invention discloses a heat exchange device and an air conditioner adopting semiconductor refrigeration, wherein the heat exchange device comprises: the inner heat exchanger is annular; the semiconductor refrigerating device is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device is attached to the outer peripheral wall of the inner heat exchanger; the outer heat exchanger is annular, the outer heat exchanger is sleeved on the inner heat exchanger, and the cold end of the semiconductor refrigerating device is attached to the inner peripheral wall of the outer heat exchanger. According to the heat exchange device, the annular outer heat exchanger is sleeved outside the inner heat exchanger, and the semiconductor refrigerating device is arranged between the inner heat exchanger and the outer heat exchanger, so that heat can be dissipated from the hot end of the semiconductor refrigerating device through the inner heat exchanger, and the temperature of the cold end of the semiconductor refrigerating device is continuously reduced along with the continuous heat dissipation process of the inner heat exchanger, so that the refrigerating effect is improved.
Description
Technical Field
The invention relates to the technical field of heat exchangers, in particular to a heat exchange device adopting semiconductor refrigeration and an air conditioner.
Background
Semiconductor refrigeration, also known as electronic refrigeration or thermoelectric refrigeration, utilizes a P-N junction formed of a special semiconductor material to form a thermocouple pair, which produces the peltier effect, specifically: when an N-type semiconductor material and a P-type semiconductor material are connected into a galvanic couple pair, energy transfer can be generated after direct current is switched on in the circuit, and the current flows to the joint of the P-type element from the N-type element to absorb heat to form a cold end; the junction from the P-type element to the N-type element releases heat to become the hot end. The magnitude of the energy transfer is determined by the magnitude of the current and the log of the elements of semiconductor material N, P.
The semiconductor material and the indoor heat exchanger are utilized, the refrigeration principle is changed, and theoretically, the outdoor unit can be used as an integral body without.
But since the semiconductor itself has electrical resistance, heat is generated when current passes through the semiconductor, thereby affecting heat transfer. The high-efficiency refrigerating capacity of the cold surface can be obtained only by timely and efficiently dissipating the heat of the hot surface, the better the heat dissipation effect of the hot end of the semiconductor heat exchanger is, and the higher the refrigerating efficiency is.
Disclosure of Invention
The invention discloses a heat exchange device adopting semiconductor refrigeration and an air conditioner, and solves the problem of poor refrigeration effect of the existing semiconductor.
According to an aspect of the present invention, there is disclosed a heat exchange device comprising: the inner heat exchanger is annular; the semiconductor refrigerating device is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device is attached to the outer peripheral wall of the inner heat exchanger; the outer heat exchanger is annular, the outer heat exchanger is sleeved on the inner heat exchanger, and the cold end of the semiconductor refrigerating device is attached to the inner peripheral wall of the outer heat exchanger.
Furthermore, the inner peripheral wall of the inner heat exchanger is enclosed into a heat dissipation channel, and a fan is arranged in the heat dissipation channel.
Further, a plurality of cooling fins are arranged on the inner peripheral wall of the inner heat exchanger at intervals.
Furthermore, a water storage tank is arranged on the inner wall of the inner heat exchanger.
Further, the outer heat exchanger is provided with cooling fins on the periphery, and the cooling fins are obliquely arranged.
Further, the plane of the radiating fin forms an included angle with the axis of the outer heat exchanger.
Furthermore, the radiating fins are in multiple groups, the radiating fins in the same group are arranged at intervals along the circumferential direction of the outer heat exchanger, and the multiple groups of radiating fins are arranged at intervals along the axial direction of the outer heat exchanger.
Furthermore, the radiating fins of two adjacent groups are arranged in a one-to-one correspondence and symmetry mode.
Further, the heat exchange device further comprises: the heat insulation layer is arranged between the inner heat exchanger and the outer heat exchanger, and the semiconductor refrigerating device is embedded in the heat insulation layer.
Further, the semiconductor refrigerating device comprises a semiconductor refrigerating sheet.
According to another aspect of the invention, an air conditioner is disclosed, which comprises the heat exchange device.
Further, the air conditioner further includes: the shell, heat transfer device sets up in the shell.
Further, be provided with the baffle in the casing, the baffle will the casing internal part separates into heat transfer chamber and fan chamber, baffle one end with shells inner wall links to each other, the other end with form between the shells inner wall and overflow the passageway, the heat transfer chamber with the fan chamber passes through overflow the passageway intercommunication, still be provided with on the casing with the air intake of heat transfer chamber intercommunication and with the cold wind export of fan chamber intercommunication, heat transfer device sets up the heat transfer intracavity.
Furthermore, the inner heat exchanger is provided with a heat dissipation channel, the shell is further provided with an air return opening and a hot air outlet, and the air return opening and the hot air outlet are communicated with two ends of the heat dissipation channel.
Further, the air conditioner further includes: the second fan is arranged in the fan cavity, the partition plate is located between the heat exchange device and the second fan and used for guiding cold air and condensed water generated by the outer heat exchanger to enter the fan cavity, and the setting position of the partition plate can prevent the condensed water from dropping on the second fan.
Further, the air conditioner further includes: the water receiving tray is arranged in the fan cavity and used for collecting condensed water entering the fan cavity.
Further, the air conditioner also comprises a water pump, and the water pump is arranged on the water pan; and a water storage tank is arranged on the inner wall of the inner heat exchanger, and the water pump is communicated with the water storage tank arranged on the inner heat exchanger through a pipeline.
According to the heat exchange device, the annular outer heat exchanger is sleeved outside the inner heat exchanger, and the semiconductor refrigerating device is arranged between the inner heat exchanger and the outer heat exchanger, so that heat can be dissipated from the hot end of the semiconductor refrigerating device through the inner heat exchanger, and the temperature of the cold end of the semiconductor refrigerating device is continuously reduced along with the continuous heat dissipation process of the inner heat exchanger, so that the refrigerating effect is improved.
Drawings
FIG. 1 is a schematic structural diagram of a heat exchange device according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view of a heat exchange device according to an embodiment of the present invention;
fig. 3 is a schematic structural view of an air conditioner according to an embodiment of the present invention;
legend: 10. an inner heat exchanger; 11. a heat dissipation channel; 12. a water storage tank; 20. a semiconductor refrigeration device; 30. an external heat exchanger; 40. a first fan; 50. a heat sink; 60. a heat-insulating layer; 70. a housing; 71. an air inlet; 72. a cold air outlet; 76. a partition plate; 77. a heat exchange cavity; 78. a fan cavity; 79. an overflow channel; 80. a second fan; 91. a water pan; 92. and (4) a water pump.
Detailed Description
The present invention is further illustrated by the following examples, but is not limited to the details of the description.
As shown in fig. 1 and 2, the present invention discloses a heat exchange device, comprising: the heat exchanger comprises an inner heat exchanger 10, a semiconductor refrigerating device 20 and an outer heat exchanger 30, wherein the inner heat exchanger 10 is annular; the semiconductor refrigerating device 20 is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device 20 is attached to the outer peripheral wall of the inner heat exchanger 10; the outer heat exchanger 30 is annular, the outer heat exchanger 30 is sleeved on the inner heat exchanger 10, and the cold end of the semiconductor refrigerating device 20 is attached to the inner peripheral wall of the outer heat exchanger 30. According to the heat exchange device, the annular outer heat exchanger 30 is sleeved outside the inner heat exchanger 10, and the semiconductor refrigerating device 20 is arranged between the inner heat exchanger and the outer heat exchanger, so that heat can be dissipated from the hot end of the semiconductor refrigerating device 20 through the inner heat exchanger 10, the temperature of the cold end of the semiconductor refrigerating device 20 is gradually reduced in the continuous heat dissipation process of the inner heat exchanger 10, and the refrigerating effect is improved.
In the above embodiment, the inner peripheral wall of the inner heat exchanger 10 is surrounded by the heat dissipation channel 11, and the fan 40 is disposed in the heat dissipation channel 11. According to the heat exchange device, the fan is arranged in the heat dissipation channel 11, so that forced convection can be formed, the heat dissipation effect of the hot end of the semiconductor refrigeration device 20 is improved, and the refrigeration effect of the cold end is improved.
In the above embodiment, the inner peripheral wall of the inner heat exchanger 10 is provided with the plurality of fins 50 at intervals. The heat exchange device of the present invention can greatly improve the heat exchange effect by arranging the plurality of fins 50 on the inner circumferential wall of the inner heat exchanger 10 at intervals.
In the above embodiment, the outer heat exchanger 30 is provided with the fins 50 on the outer periphery, and the fins 50 are arranged obliquely. According to the heat exchange device, the heat radiating fins 50 are obliquely arranged, so that condensed water can conveniently drop to the water receiving tray while the heat exchange area is increased, accumulated water is prevented, the outer heat exchanger 30 is better protected from being corroded by the condensed water, and the service life is prolonged.
In the above embodiment, the plane of the fins 50 forms an angle with the axis of the outer heat exchanger 30. The heat exchange device of the invention can improve the heat exchange area, facilitate the condensed water to drop to the water pan, prevent the accumulated water, better protect the outer heat exchanger 30 from being corroded by the condensed water and prolong the service life.
In the above embodiment, the plurality of sets of fins 50 are arranged, the fins 50 in the same set are arranged at intervals along the circumferential direction of the outer heat exchanger 30, and the plurality of sets of fins 50 are arranged at intervals along the axial direction of the outer heat exchanger 30. The heat exchange device of the invention can improve the heat exchange area, facilitate the condensed water to drop to the water pan, prevent the accumulated water, better protect the outer heat exchanger 30 from being corroded by the condensed water and prolong the service life.
In the above embodiment, a water storage tank (12) is arranged on the inner wall of the inner heat exchanger (10). According to the heat exchange device, the water storage tank 12 is arranged, so that condensed water can be guided into the water storage tank 12, the cold energy of the condensed water is utilized to cool the inner heat exchanger 10, and the heat dissipation effect is improved.
In the above embodiment, the heat dissipation fins 50 of two adjacent groups are arranged in a one-to-one correspondence and symmetrical manner. The heat exchange device of the invention can improve the heat exchange area, facilitate the condensed water to drop to the water pan, prevent the accumulated water, better protect the outer heat exchanger 30 from being corroded by the condensed water and prolong the service life.
In the above embodiment, the heat exchanger further includes: and the insulating layer 60 is arranged between the inner heat exchanger 10 and the outer heat exchanger 30, and the semiconductor refrigerating device 20 is embedded in the insulating layer 60. According to the heat exchange device, the heat insulation layer 60 is arranged between the inner heat exchanger 10 and the outer heat exchanger 30, and the semiconductor refrigerating device 20 is embedded in the heat insulation layer 60, so that the semiconductor refrigerating device 20 can prevent heat exchange through a gap between the inner heat exchanger 10 and the outer heat exchanger 30, and the refrigerating effect is effectively improved.
In the above embodiment, the semiconductor cooling device 20 includes the semiconductor cooling fins.
As shown in fig. 3, according to another aspect of the present invention, an air conditioner is also disclosed, which comprises the above heat exchanging device.
In the above embodiment, the air conditioner further includes: a housing 70, and a heat exchange device disposed within the housing 70. The heat exchange device provided by the invention integrates the indoor heat exchanger by using a new refrigeration principle and a new structural design. The air conditioner installation steps are simplified to the integral type organism, and the whole noise source that reduces behind compressor and the electronic expansion valve that does not have improves user and uses and experience.
In the above embodiment, a partition plate 76 is disposed in the casing 70, the partition plate 76 divides the interior of the casing 70 into a heat exchange chamber 77 and a fan chamber 78, one end of the partition plate 76 is connected to the inner wall of the casing 70, an overflow channel 79 is formed between the other end of the partition plate and the inner wall of the casing 70, the heat exchange chamber 77 is communicated with the fan chamber 78 through the overflow channel 79, the casing 70 is further provided with an air inlet 71 communicated with the heat exchange chamber 77 and a cold air outlet 72 communicated with the fan chamber 78, and the heat exchange device is disposed in the heat exchange chamber 77. The air conditioner of the invention ensures that a flow ventilation channel is formed in the unit by arranging the air inlet 71 and the air outlet 72. After entering from the air inlet 71, the inlet air exchanges heat with the heat exchange device to form cold air and is discharged from the air outlet 72, and considering that the unit is used in a kitchen, the detachable filter assembly is additionally arranged at the air inlet 72 at the top, which is beneficial to self-cleaning of the unit.
In the above embodiment, the inner heat exchanger 10 has the heat dissipation channel 11, and the casing 70 is further provided with the air return opening and the hot air outlet, which are communicated with both ends of the heat dissipation channel 11. The return air inlet is provided with a screen plate which mainly plays a role in protection and prevents the fan running at high speed from accidentally injuring a user,
in the above embodiment, the air conditioner further includes: the second fan 80 is arranged in the fan cavity 78, the partition plate 76 is located between the heat exchange device and the second fan 80, the partition plate 76 is used for guiding cold air and condensed water generated by the outer heat exchanger 30 to enter the fan cavity 78, and the position of the partition plate 76 can prevent the condensed water from dropping on the second fan 80. According to the air conditioner, the second fan 80 is arranged to discharge cold air from the air outlet 72, and the partition plate 76 has two functions, namely, the partition plate is connected with the shell to form a partition, so that condensed water is prevented from directly falling to the air return central area of the second fan 80, and the unit is prevented from blowing water during operation. The second function is to control the wind direction flow in the cold air cavity by the corner design of the tail end of the clapboard 76 and the wall attachment effect, and the device belongs to multiple purposes.
In the above embodiment, the air conditioner further includes: and the water receiving tray 91 is arranged in the fan cavity 78, and the water receiving tray 91 is used for collecting condensed water entering the fan cavity 78.
In the above embodiment, the air conditioner further includes a water pump 92, and the water pump 92 is disposed on the water pan 91; a water storage tank is arranged on the inner wall of the inner heat exchanger 10, and the water pump 92 is communicated with the water storage tank arranged on the inner heat exchanger 10 through a pipeline.
The heat dissipation channel 11 of the air conditioner internal heat exchanger 10 of the invention is not communicated with the cold air cavity, and is communicated with the indoor and outdoor only through the air return inlet and the hot air outlet. After the air conditioner is started, the first motor rotates to drive indoor air to flow outdoors. The surface heat of the inner heat exchanger 10 is brought outdoors, the heat of the hot surface is timely and efficiently dissipated, the efficient refrigerating capacity of the cold surface can be obtained, and the refrigerating efficiency is higher. Two small holes are formed in the horizontal plane of the inner heat exchanger 10, so that a water outlet pipe of the water pump can extend into a part, the inner heat exchanger 10 is provided with a groove at the extending part of the water outlet pipe of the water pump, low-temperature condensate water flows to a water storage tank at the bottom along the surface of the inner heat exchanger 10, and heat of a hot surface is taken away through partial evaporation in the process.
Under the action of the water pump, the condensed water flowing into the water receiving tray 91 is pumped out and then flows into the inner heat exchanger 10, and the condensed water in the water storage tank is ensured not to overflow by controlling the width of the tank and the power of the water pump. Through the cyclic utilization mode, the maximum refrigerating capacity and the energy efficiency of the heat exchanger are improved.
The heat exchange device provided by the invention integrates the indoor heat exchanger by using a new refrigeration principle and a new structural design. The air conditioner installation step is simplified to the integral type organism, reduces the noise source behind whole no compressor and the electronic expansion valve, improves user's use and experiences, and the otter board mainly plays the guard action moreover, prevents that high-speed moving fan from accidentally injuring the user. After air flows through the filter assembly of the air inlet 71 at the top of the shell 70, the air flows to the cold air cavity at the bottom along the annular outer heat exchanger 30, in the process, the outer heat exchanger 30 and the shell 70 are in a symmetrical structure, and the air flow can uniformly flow through the left end and the right end of the outer heat exchanger 30. Water vapor in the indoor air is condensed on the surface of the outer heat exchanger 30 after passing through the outer heat exchanger 30. Thereby realizing heat exchange refrigeration.
In the above embodiment, the air conditioner is used in a kitchen.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. Not all embodiments are exhaustive. All obvious changes and modifications which are obvious to the technical scheme of the invention are covered by the protection scope of the invention.
Claims (17)
1. A heat exchange device, comprising:
the heat exchanger comprises an inner heat exchanger (10), wherein the inner heat exchanger (10) is annular;
the semiconductor refrigerating device (20) is provided with a cold end and a hot end, and the hot end of the semiconductor refrigerating device (20) is attached to the outer peripheral wall of the inner heat exchanger (10);
the outer heat exchanger (30), outer heat exchanger (30) are cyclic annular, outer heat exchanger (30) cover is established on interior heat exchanger (10), the cold junction subsides of semiconductor refrigeration device (20) are established on the internal perisporium of outer heat exchanger (30).
2. The heat exchange device of claim 1,
the heat dissipation device is characterized in that a heat dissipation channel (11) is formed by surrounding the inner peripheral wall of the inner heat exchanger (10), and a first fan (40) is arranged in the heat dissipation channel (11).
3. The heat exchange device of claim 1,
a plurality of cooling fins (50) are arranged on the inner peripheral wall of the inner heat exchanger (10) at intervals.
4. The heat exchange device of claim 1,
and a water storage tank is arranged on the inner wall of the inner heat exchanger (10).
5. The heat exchange device of claim 1,
and the periphery of the outer heat exchanger (30) is provided with cooling fins (50), and the cooling fins (50) are obliquely arranged.
6. The heat exchange device of claim 5,
the plane of the radiating fins (50) forms an included angle with the axis of the outer heat exchanger (30).
7. The heat exchange device of claim 5,
the radiating fins (50) are multiple groups, the radiating fins (50) in the same group are arranged at intervals along the circumferential direction of the outer heat exchanger (30), and the multiple groups of radiating fins (50) are arranged at intervals along the axial direction of the outer heat exchanger (30).
8. The heat exchange device of claim 7,
the radiating fins (50) of the two adjacent groups are arranged in a one-to-one correspondence and symmetry mode.
9. The heat exchange device of claim 1, further comprising:
the heat insulation layer (60) is arranged between the inner heat exchanger (10) and the outer heat exchanger (30), and the semiconductor refrigerating device (20) is embedded in the heat insulation layer (60).
10. The heat exchange device of claim 1,
the semiconductor refrigerating device (20) comprises a semiconductor refrigerating sheet.
11. An air conditioner characterized by comprising the heat exchange device of any one of claims 1 to 10.
12. The air conditioner according to claim 11, further comprising:
a housing (70), the heat exchange device being disposed within the housing (70).
13. The air conditioner according to claim 12,
be provided with baffle (76) in casing (70), baffle (76) will casing (70) internal partitioning is heat transfer chamber (77) and fan chamber (78), baffle (76) one end with casing (70) inner wall links to each other, the other end with form between casing (70) the inner wall and overflow passageway (79), heat transfer chamber (77) with fan chamber (78) pass through overflow passageway (79) intercommunication, still be provided with on casing (70) with air intake (71) of heat transfer chamber (77) intercommunication and with cold wind export (72) of fan chamber (78) intercommunication, heat transfer device sets up in heat transfer chamber (77).
14. The air conditioner according to claim 13,
the inner heat exchanger (10) is provided with a heat dissipation channel (11), the shell (70) is further provided with an air return opening and a hot air outlet, and the air return opening and the hot air outlet are communicated with two ends of the heat dissipation channel (11).
15. The air conditioner according to claim 13, further comprising:
the second fan (80), second fan (80) set up in fan chamber (78), baffle (76) are located heat transfer device with between second fan (80), baffle (76) are used for leading cold wind and the comdenstion water that outer heat exchanger (30) produced to get into fan chamber (78), the position of setting up of baffle (76) can prevent that the comdenstion water from dripping on second fan (80).
16. The air conditioner according to claim 15, further comprising:
the water collecting tray (91) is arranged in the fan cavity (78), and the water collecting tray (91) is used for collecting condensed water entering the fan cavity (78).
17. The air conditioner according to claim 16, further comprising a water pump (92), wherein the water pump (92) is disposed on the water pan (91); a water storage tank is arranged on the inner wall of the inner heat exchanger (10), and the water pump (92) is communicated with the water storage tank arranged on the inner heat exchanger (10) through a pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010314034.3A CN111397245A (en) | 2020-04-20 | 2020-04-20 | Heat exchange device adopting semiconductor refrigeration and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010314034.3A CN111397245A (en) | 2020-04-20 | 2020-04-20 | Heat exchange device adopting semiconductor refrigeration and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111397245A true CN111397245A (en) | 2020-07-10 |
Family
ID=71433313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010314034.3A Pending CN111397245A (en) | 2020-04-20 | 2020-04-20 | Heat exchange device adopting semiconductor refrigeration and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111397245A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114883957A (en) * | 2022-07-08 | 2022-08-09 | 国网山东省电力公司潍坊市寒亭区供电公司 | Ventilation, heat dissipation and dehumidification device of electric power secondary equipment box and electric power secondary equipment box |
-
2020
- 2020-04-20 CN CN202010314034.3A patent/CN111397245A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114883957A (en) * | 2022-07-08 | 2022-08-09 | 国网山东省电力公司潍坊市寒亭区供电公司 | Ventilation, heat dissipation and dehumidification device of electric power secondary equipment box and electric power secondary equipment box |
| CN114883957B (en) * | 2022-07-08 | 2022-11-01 | 国网山东省电力公司潍坊市寒亭区供电公司 | Ventilation, heat dissipation and dehumidification device of electric power secondary equipment box and electric power secondary equipment box |
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