CN214791559U - Heat exchanger for air conditioner outdoor unit and air conditioner outdoor unit - Google Patents
Heat exchanger for air conditioner outdoor unit and air conditioner outdoor unit Download PDFInfo
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- CN214791559U CN214791559U CN202120249935.9U CN202120249935U CN214791559U CN 214791559 U CN214791559 U CN 214791559U CN 202120249935 U CN202120249935 U CN 202120249935U CN 214791559 U CN214791559 U CN 214791559U
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Abstract
The heat exchanger for the outdoor unit of the air conditioner comprises a heat exchange tube (3) and heat dissipation fins (4), and is characterized by further comprising a semiconductor refrigerating piece (5), wherein the semiconductor refrigerating piece (5) is provided with a first working part (51) and a second working part (52) which are respectively used as a cold end and a hot end, the first working part (51) is attached to or adjacent to the heat exchange tube (3), and the second working part (52) is connected with the heat dissipation fins (4). The application also discloses an air condensing units who has above-mentioned heat exchanger. Compared with the prior art, this application can realize initiative heat transfer and then improve the heat transfer effect.
Description
Technical Field
The utility model belongs to the technical field of air conditioning, concretely relates to a heat exchanger and air condensing units for air condensing units.
Background
Most of existing air conditioners comprise an indoor unit and an outdoor unit, wherein a compressor, a heat exchanger, a heat dissipation fan and the like are arranged in the outdoor unit, and the heat exchanger can exchange heat for media coming out of the compressor, transfer heat to nearby air and discharge the heat through the heat dissipation fan.
The existing method for improving the heat exchange performance of the outdoor unit of the air conditioner mainly comprises the following steps:
firstly, the morphological structure of a heat exchanger is changed so as to bring a more reasonable wind field under the same fan rotating speed; for example, in the patent application of the invention with application number CN201410013514.0, namely "outdoor unit of air conditioner and air conditioner" (application publication number CN103759344A), in order to improve the heat exchange efficiency, the heat exchanger is designed into a U-shaped structure to increase the heat exchange area of the heat exchanger; as another example, the structure disclosed in the invention patent application CN201911362331.9, namely corrugated fin, corrugated fin tube structure, heat exchange device and air conditioner outdoor unit (application publication No. CN111023865A), increases the heat exchange area of the fin by changing the structure of the fin, thereby enhancing heat exchange.
Aiming at the temperature distribution condition of the refrigerant in the heat exchanger, the arrangement of refrigerant pipes and fins is reasonably improved;
thirdly, spraying condensed water to accelerate heat exchange; for example, in the structure disclosed in the patent application CN201610667387.5 for heat exchange (application publication No. CN106196339A), a spraying device is provided in an air conditioner external unit, and the spraying device is used to physically cool the radiator body, so as to improve the heat dissipation efficiency of the radiator.
The method comprises the steps that firstly, the heat exchanger structure is improved, the effect that the heat exchange efficiency is enhanced by achieving a larger wind receiving area or obtaining larger wind quantity is achieved, the method is also passive heat exchange in nature, the heat exchange efficiency is limited, and the improved structure is not obvious in improvement of the heat exchange efficiency;
the second method is a reasonable calandria design for the temperature distribution condition of each part of the refrigerant in the refrigerant pipe, and the method is still based on the principle of air cooling passive heat exchange, so that the improvement of the heat efficiency is limited;
the third method is a heat exchange method combining air cooling and water cooling, but the spray water mode has many adverse effects on the service life of the mechanical structure of the external machine.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the first technical problem to provide a heat exchanger for air condensing units that can realize initiative heat transfer in order to improve the heat transfer effect to the current situation of prior art.
The utility model aims to solve the second technical problem that an air condensing units with above-mentioned heat exchanger is provided.
The utility model provides a technical scheme that above-mentioned first technical problem adopted does: the heat exchanger for the outdoor unit of the air conditioner comprises a heat exchange tube and radiating fins and is characterized by further comprising a semiconductor refrigerating piece, wherein the semiconductor refrigerating piece is provided with a first working part and a second working part which are respectively used as a cold end and a hot end, the first working part is attached to or adjacent to the heat exchange tube, and the second working part is connected with the radiating fins.
In order to improve the heat exchange effect, furthermore, the semiconductor refrigeration piece is of a hollow cylindrical structure, the outer peripheral wall and the inner peripheral wall of the semiconductor refrigeration piece are respectively provided with the first working part and the second working part, the heat exchange tube is wound on the outer peripheral wall of the semiconductor refrigeration piece, and the radiating fins are arranged inside the semiconductor refrigeration piece and connected with the inner peripheral wall of the semiconductor refrigeration piece.
For further improving the heat exchange effect, a groove body for the heat exchange tube to be coiled in is arranged on the peripheral wall of the semiconductor refrigeration piece, and the groove wall of the groove body is attached to at least the local outer wall of the heat exchange tube. Therefore, the contact area between the heat exchange tube and the semiconductor refrigerating piece can be increased, and the heat exchange performance is further improved.
Furthermore, the cross section of the semiconductor refrigerating piece is C-shaped, and an opening extending along the axial direction is formed in the cylinder wall of the semiconductor refrigerating piece. Therefore, the installation of the radiating fins is convenient.
Furthermore, the radiating fins are at least three and radially arranged in the semiconductor refrigeration piece at intervals along the circumferential direction, and an axially extending channel is formed between every two adjacent radiating fins. So, the flow of air current is not influenced in the arrangement of passageway, and the air current can take away the heat when passing through the passageway, and then effectively realizes the heat dissipation function.
In each scheme, the power supply circuit is used for supplying power to the semiconductor refrigerating element and changing the direction of current passing through the semiconductor refrigerating element so as to enable the cold end and the hot end to be mutually converted. Make the heat exchanger of this application be applicable to air conditioner refrigeration, heating operating mode simultaneously.
The utility model provides a technical scheme that above-mentioned second technical problem adopted does: an outdoor unit of an air conditioner having the heat exchanger as described above, characterized in that: the heat exchanger is arranged in the machine shell, and the radiating fins of the heat exchanger are positioned on a flow path of the airflow.
Compared with the prior art, the utility model has the advantages of: by additionally arranging the semiconductor refrigerating piece, a first working part (cold end or hot end) of the semiconductor refrigerating piece acts on the heat exchange tube, so that the heat exchange tube can actively exchange heat with the first working part of the semiconductor refrigerating piece, and the temperature of a medium in the heat exchange tube is effectively increased or reduced; and compare in current heat transfer mode, this application can form bigger difference in temperature, and then can strengthen the heat transfer, improves heat exchange efficiency, and then improves the efficiency of air conditioner complete machine. The radiating fins arranged act on the second working part, and can distribute heat or cold generated by second work of the semiconductor refrigeration piece, so that the semiconductor refrigeration piece can work stably, and the service life of the semiconductor refrigeration piece can be prolonged. And the structure is simple, and the implementation is convenient.
Drawings
Fig. 1 is a schematic structural view of a heat exchanger and a fan in an embodiment of the present invention;
fig. 2 is a schematic structural view of the heat exchanger and the fan at another view angle in the embodiment of the present invention;
fig. 3 is a schematic structural view of the heat exchanger and the fan at another view angle in the embodiment of the present invention;
fig. 4 is a sectional view of the heat exchanger and the fan in the embodiment of the present invention;
fig. 5 is a schematic view of a local connection structure of the power supply and the semiconductor refrigerating element according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the following embodiments.
As shown in fig. 1-5, for the utility model discloses a heat exchanger and air condensing units's a preferred embodiment for air condensing units, wherein air condensing units is including the casing that has air intake and air outlet, locate in the casing with drive air current by the fan 1 of air intake flow direction air outlet, locate heat exchanger and power supply circuit 2 in the casing.
The structure of the above-mentioned housing and fan 1 can be designed with reference to the prior art.
The heat exchanger comprises a heat exchange tube 3, a radiating fin 4 and a semiconductor refrigerating piece 5. The semiconductor refrigerating element 5 has a first working portion 51 as a cold end and a second working portion 52 as a hot end (of course, the first working portion may also be a hot end, and correspondingly, the second working portion is a cold end), the first working portion 51 is attached to the heat exchange tube 3, and the second working portion 52 is connected to the heat dissipation fin 4. The concrete structure is as follows:
the semiconductor refrigerating element 5 is a hollow cylindrical structure, and the cylindrical wall of the semiconductor refrigerating element is provided with an opening 50 extending along the axial direction, so that the cross section of the semiconductor refrigerating element 5 is C-shaped. The outer peripheral wall and the inner peripheral wall of the semiconductor refrigerating piece 5 are respectively the first working part 51 and the second working part 52, a groove body 53 is arranged on the outer peripheral wall of the semiconductor refrigerating piece 5, and the groove bodies 53 are distributed in a bow shape along the circumferential direction; the heat exchange tube 3 is wound on the outer peripheral wall of the semiconductor refrigerating element 5 and inserted into the groove body 53, and the groove wall of the groove body 53 is attached to the local outer wall of the heat exchange tube 3.
The radiating fins 4 are arranged inside the semiconductor refrigerating piece 5 and connected with the inner peripheral wall of the semiconductor refrigerating piece 5, specifically, at least three radiating fins 4 are radially arranged inside the semiconductor refrigerating piece 5 at intervals along the circumferential direction, and an axially extending channel 40 is formed between every two adjacent radiating fins 4. In this embodiment, the fan 1 is disposed outside the end portion of the semiconductor cooling element 5, and is opposite to the heat dissipation fins 40, the heat dissipation fins 4 are located on the flow path of the air flow, and the extending direction of the channel 40 is the same as the flow direction of the air flow.
The power circuit 2 supplies power to the semiconductor refrigerating element 5, and can change the direction of current passing through the semiconductor refrigerating element 5, so that the cold end and the hot end are mutually converted. In order to change the direction of the current passing through the semiconductor refrigerating element 5, the change of the positive and negative poles of the power supply can be realized.
When the air conditioner refrigerates, the semiconductor refrigerating piece 5 is electrified to operate, and due to the Peltier effect, the outer peripheral wall of the semiconductor refrigerating piece 5 is a cold end, and the inner peripheral wall of the semiconductor refrigerating piece is a hot end. The heat exchange tube 3 is adhered to the groove body 53 on the outer peripheral wall of the semiconductor refrigerating element 5, and a refrigerant with high temperature circulates inside the heat exchange tube 3. Because thermoelectric refrigeration effect can form very low surface temperature at the periphery wall of semiconductor refrigeration spare 5, and the direct cell wall with the cell body 53 on the periphery wall of the 3 outer walls of heat exchange tube is laminated mutually, and the high temperature refrigerant forms huge difference in temperature with the low temperature cold junction, and the heat transfer process is heat conduction, and this process is electric energy drive's initiative type heat handling process, compares in traditional difference in temperature little, the passive heat transfer type heat exchanger of heat convection, promotion by a relatively large margin of heat exchange efficiency ability. At the moment, the inner peripheral wall of the semiconductor refrigerating element 5 is the hot end, the heat of the hot end can be led out by the radiating fins 4, and the fan 1 is used for taking away the heat, so that the semiconductor refrigerating element 5 caused by overheating of the hot end is prevented from being damaged.
When the air conditioner heats, the power supply is reversed, at the moment, the outer peripheral wall of the semiconductor refrigerating element 5 is a hot end, the inner peripheral wall is a cold end, and a refrigerant with low temperature runs in the heat exchange tube 3. The low-temperature refrigerant exchanges heat with the hot end of the semiconductor refrigerating piece 5, so that the heating purpose is achieved, the heat of the hot end of the semiconductor refrigerating piece 5 is taken away, and the semiconductor refrigerating piece 5 is prevented from being damaged due to overheating. Compared with the traditional heat exchanger, the heat exchange efficiency in winter can be greatly improved in the process. And the cold quantity of the cold end of the semiconductor refrigerating piece 5 is led out by the radiating fin and is taken away by the fan 1.
Claims (7)
1. The heat exchanger for the outdoor unit of the air conditioner comprises a heat exchange tube (3) and heat dissipation fins (4), and is characterized by further comprising a semiconductor refrigerating piece (5), wherein the semiconductor refrigerating piece (5) is provided with a first working part (51) and a second working part (52) which are respectively used as a cold end and a hot end, the first working part (51) is attached to or adjacent to the heat exchange tube (3), and the second working part (52) is connected with the heat dissipation fins (4).
2. The heat exchanger of claim 1, wherein: the semiconductor refrigerating piece (5) is of a hollow cylindrical structure, the outer peripheral wall and the inner peripheral wall of the semiconductor refrigerating piece are respectively provided with the first working part (51) and the second working part (52), the heat exchange tube (3) is wound on the outer peripheral wall of the semiconductor refrigerating piece (5), and the heat dissipation fins (4) are arranged inside the semiconductor refrigerating piece (5) and connected with the inner peripheral wall of the semiconductor refrigerating piece (5).
3. The heat exchanger of claim 2, wherein: the outer peripheral wall of the semiconductor refrigerating piece (5) is provided with a groove body (53) for the heat exchange tube (3) to be coiled in, and the groove wall of the groove body (53) is attached to at least the local outer wall of the heat exchange tube (3).
4. The heat exchanger of claim 2, wherein: the cross section of the semiconductor refrigerating piece (5) is C-shaped, and an opening (50) extending along the axial direction is formed in the cylinder wall of the semiconductor refrigerating piece.
5. The heat exchanger of claim 2, wherein: the number of the radiating fins (4) is at least three, the radiating fins are arranged in the semiconductor refrigerating piece (5) at intervals along the circumferential direction, and an axially extending channel (40) is formed between every two adjacent radiating fins (4).
6. The heat exchanger of any one of claims 1 to 5, wherein: the power supply circuit (2) is used for supplying power to the semiconductor refrigerating piece (5) and changing the direction of current passing through the semiconductor refrigerating piece (5) so as to enable the cold end and the hot end to be mutually converted.
7. An outdoor unit of an air conditioner having the heat exchanger as claimed in any one of claims 1 to 6, wherein: the heat exchanger is arranged in the machine shell, and the heat radiating fins (4) of the heat exchanger are positioned on a flow path of the airflow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120249935.9U CN214791559U (en) | 2021-01-28 | 2021-01-28 | Heat exchanger for air conditioner outdoor unit and air conditioner outdoor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120249935.9U CN214791559U (en) | 2021-01-28 | 2021-01-28 | Heat exchanger for air conditioner outdoor unit and air conditioner outdoor unit |
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| Publication Number | Publication Date |
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| CN214791559U true CN214791559U (en) | 2021-11-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120249935.9U Active CN214791559U (en) | 2021-01-28 | 2021-01-28 | Heat exchanger for air conditioner outdoor unit and air conditioner outdoor unit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
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2021
- 2021-01-28 CN CN202120249935.9U patent/CN214791559U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
| CN113280527B (en) * | 2021-07-01 | 2022-07-15 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
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