CN105805873A - Novel energy-saving semiconductor air adjusting module - Google Patents
Novel energy-saving semiconductor air adjusting module Download PDFInfo
- Publication number
- CN105805873A CN105805873A CN201610308033.1A CN201610308033A CN105805873A CN 105805873 A CN105805873 A CN 105805873A CN 201610308033 A CN201610308033 A CN 201610308033A CN 105805873 A CN105805873 A CN 105805873A
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound 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[Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound 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[C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N11/00—Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
- H02N11/002—Generators
Abstract
The invention discloses a novel energy-saving semiconductor air adjusting module which comprises a semiconductor chilling plate, temperature difference power generation chips and temperature evening bodies. A heat exchange device is fixed to the surface of one end of the semiconductor chilling plate. The first temperature difference power generation chip or the first temperature evening body or a water container is fixed to the surface of the other end of the semiconductor chilling plate. The second temperature evening body or the second temperature difference power generation chip is fixed to the surface of the other end of the first temperature difference power generation chip or the temperature evening body or the water container. One or more temperature difference power generation chips and/or temperature evening bodies is/are fixed to the surface of the second temperature evening body or the second temperature difference power generation chip in a stacked manner. A radiating device is fixed to the surface of the temperature difference power generation chip on the outmost side or the surface of the temperature evening body on the outmost side. The novel energy-saving semiconductor air adjusting module has the mass beneficial effects of being efficient, capable of saving energy, free of heat or cold emission, free of outdoor machines, simple in structure, small in number of mechanical parts, free of noise, high in reliability, small in installation size, light, low in cost and the like, is suitable for large-batch industrial production and is wide in application field and good in market prospect.
Description
Technical field
The present invention relates to a kind of device utilizing semiconductor chilling plate to carry out air adjustment, especially a kind of novel energy-conserving semiconductor-air simultaneously utilizing thermo-electric generation sheet to carry out energy regenerating regulates module.
Background technology
Conventional air conditioning units, current main product is mainly still the refrigerating plant adopting mechanical compression type, and its basic main element includes compressor, vaporizer, heat exchanger and throttling arrangement, is filled with refrigerant in its performance loop.The comparative maturity of at present this technical development, obtains large-scale application in practice, but there is also many deficiencies, for instance refrigerant (such as freon) exists spillage risk, and not environmentally, power consumption is big, and thermal pollution and noise are big etc..Therefore in prior art, the air-conditioning adopting semiconductor chilling plate design is created, it is possible to solve the problems referred to above preferably.Wherein critical component is semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.It utilizes the Peltier effect of semi-conducting material, when the galvanic couple that unidirectional current is connected into by two kinds of different semi-conducting materials, can absorb heat at the two ends of galvanic couple respectively and release heat, it is possible to achieve the purpose of refrigeration.It need not chemical reaction and mechanical movable part, the advantage such as therefore have that energy-conserving and environment-protective, volume be little, simple in construction, noiseless, startup are fast and be widely used.
In the prior art, disclosed useful semiconductor chilling plate carries out the device of air adjustment, as at a kind of semiconductor refrigerating air conditioner structure that notification number is CN204739708A, include aerator, copper fin, semiconductor chilling plate and water-cooled row, copper fin includes ground and is shaped in the fin of side, bottom surface, fin is arranged on the air-out path of aerator, bottom surface contacts with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, the hot side of semiconductor chilling plate contacts with water-cooled row, and water-cooled row is provided with the water inlet and outlet that are connected respectively with water pipe.
This patent structurally uses the rear-mounted design of fan, and namely aerator is arranged on after copper fin, and air-flow is first blown and is cooled, and air-flow will not absorb the heat that fan self work sends, and improves refrigeration.Utilizing semiconductor chilling plate to freeze, compare the mode of compressor cooling, noiseless, pollution-free, equipment volume is little, cost is low, compact conformation, can apply with on little space refrigeration or portable equipment, and trouble unit is replaced convenient, it is simple to later maintenance.
But, in that patent, adopt the structure of radiating fin, along with the length of fin increases, its cold and hot conduction efficiency will be greatly reduced, and will be restricted when therefore making bigger radiating fin；On the other hand, the heat produced during cooling piece work dispels the heat either directly through water-cooled, it does not have carries out reclaiming efficient utilization, makes the relative energy-saving effect of semiconductor refrigerating air-conditioning be greatly reduced.
Summary of the invention
The present invention is directed to above-mentioned deficiency, it is provided that one utilizes high-efficient semiconductor refrigerating sheet to carry out air adjustment, utilize the novel energy-conserving semiconductor-air that efficient temperature-difference generating sheet carries out energy efficient recycling to regulate module simultaneously.Hot or cold high efficiente callback is converted to electricity by thermo-electric generation sheet and is used and realizes the energy-conservation innovation effect simultaneously will put without cold type without heat or when heating when realizing refrigeration by this module, by switching galvanic positive negative direction and can realize exchanging refrigeration or heat-production functions carrying out a hot or cold turn electricity and recovers energy simultaneously.Therefore the air conditioning high efficiency that this air adjustment module is made is energy-conservation, it does not have outer machine does not need to install outer machine connecting line, forms mobile a tractor serves several purposes flexibly, the air conditioner of convenient installation.
To achieve these goals, the present invention adopt high-efficient semiconductor refrigerating thermo-electric generation chip composition air regulate module technical scheme be:
A kind of novel energy-conserving semiconductor-air regulates module, include semiconductor chilling plate, thermo-electric generation sheet, samming body, described semiconductor chilling plate end surface is fixed with heat-exchange device, thermo-electric generation sheet or samming body or water gallbladder it is fixed with on the other end surface of semiconductor chilling plate, samming body or thermo-electric generation sheet it is fixed with on the other end surface of described thermo-electric generation sheet or samming body or water gallbladder, it is fixed with one and above thermo-electric generation sheet and/or samming body to be arranged under the overlay on the surface of described samming body or thermo-electric generation sheet, in outermost thermo-electric generation chip surface or samming surface, it is fixed with heat abstractor.
Described heat-exchange device is provided around fan.
Described heat-exchange device is the heat pipe with radiating fin or the water circle device with water pump.
Described samming shape is cuboid, pyramid, "L" shaped or " U " font structure.
Described thermo-electric generation chip and/or samming body are provided with insulating barrier, insulating barrier is provided with line layer.
Described line layer at least includes solderable position and electrical connection distribution.
Described fixed form is welding and/or adhesive solidification.
Beneficial effects of the present invention:
The present invention passes through heat-exchange device, for instance heat pipe and fin structure, water gallbladder water tank etc., it is possible to the heat that quickly produced by cooling piece or cold transmit, and by the impact of height or volume size, not only conduction efficiency is higher, and the scope of application is wide.
Arranged by the multiple-layer stacked structure of thermo-electric generation sheet and/or samming body, heat is made full use of generating and reclaims, thus improving generating efficiency further.Wherein the shape of samming body can be designed, the various structures such as such as cuboid, pyramid, "L" shaped, " U " font structure, especially design can be carried out near the first samming shape of thermal source, thus changing space and position distribution, it is simple to carry out modularized design.
It is fixed by the mode of adhesive solidification and welding between cooling piece, thermo-electric generation sheet or water gallbladder, the thermal resistance that traditional mechanical contact, estersil etc. produce can be reduced to greatest extent, not only contribute to the heat transmission heat radiation produced in heat work, more can improve the generating efficiency of thermo-electric generation sheet.
The present invention has energy-efficient, nothing heat or cold type is put, and without outer machine, simple in construction, mechanical part are few, noiseless, reliability high, installation volume is little, lightweight, cost is low waits many merits, is applicable not only to large batch of industrialized production, and application is wide, good market prospects.
Accompanying drawing explanation
Fig. 1 is the generalized section of a preferred embodiment of the present invention；
Fig. 2 is the schematic diagram of another preferred embodiment of the present invention；
Fig. 3 is schematic diagram and the close-up schematic view of another preferred embodiment of the present invention.
Detailed description of the invention
As shown in Figure 1, for a preferred embodiment of the present invention, it is made up of parts such as heat-exchange device 1, semiconductor chilling plate the 2, first thermo-electric generation chip the 3, second samming body 4, outer casing stand 5, radiator the 6, second thermo-electric generation chip the 7, first samming body the 8, first fans 9.Wherein, the end surface of semiconductor chilling plate 2 is fixed with heat-exchange device 1, it is fixed with the first samming body 8 on the other end surface of semiconductor chilling plate 2, it is fixed with the first thermo-electric generation sheet 3 on the other end surface of the first samming body 8, the other end at the first thermo-electric generation sheet 3 is fixed with the second samming body 4, it is fixed with one and above thermo-electric generation sheet and/or samming body on the second samming body 4 surface to be arranged under the overlay, in outermost thermo-electric generation chip surface or samming surface, it is fixed with heat abstractor 6, it is fixed on outer casing stand 5 with upper-part, form a complete module.
In the present embodiment, it is fixed with the first thermo-electric generation sheet 3 on the other end surface of semiconductor chilling plate 2, samming body or water gallbladder can also be adopted to fix, mainly need to be adjusted according to different structures or practical application, same, corresponding thermo-electric generation sheet or the other end surface of samming body or water gallbladder, be fixed with samming body or thermo-electric generation sheet.
Heat-exchange device 1 adopts heat-pipe refrigerating heat exchanger, heat pipe is fixed on the surface of semiconductor chilling plate 2, cold or the hot radiating fin being quickly delivered to by heat pipe on heat pipe that semiconductor chilling plate 2 produces, it is provided around the first fan 9 at heat-exchange device, by the first fan 9, the hot blast around heat pipe and radiating fin or cold wind is sent.In actual applications, heat-exchange device 1 can also adopt the water circle device of water pump as required, or the heat pipe of radiating fin or the water circle device with water pump realize quickly cold or heat exchange simultaneously.
Samming body, refers to that heat conductivity is high, thermal resistance is little, can quickly by heat conduction and equally distributed object or device after being heated, and conventional is a kind of metal in copper, heat pipe, aluminium alloy, phase-change material, carbon fiber, Graphene etc., nonmetal or device.Wherein, the shape of samming body can be cuboid, pyramid, "L" shaped, " U " font structure etc., fixing thermo-electric generation sheet and samming body on its surface, thus the locus changing thermo-electric generation chip and other samming bodies is distributed.
There is insulating barrier in surface configurations such as first thermo-electric generation chip the 3, second samming body the 4, second thermo-electric generation chip the 7, first samming bodies 8, insulating barrier is provided with line layer, adopt enamel or anodic oxidation mode to make.Insulating barrier is provided with line layer, adopts printing, plating, compound or spraying method to make.In general, adopt the mode of traditional printing to be better suitable for, particularly in surface strength and durability degree, be suitable for mass production.Line layer at least includes solderable position and electrical connection distribution, thermo-electric generation chip is separately fixed at solderable position, electrical connection between each thermo-electric generation chip is series connection and/or parallel connection, makes each thermo-electric generation chip be formed and is electrically connected as entirety, unification output voltage and electric current.
On line layer except at least including solderable position and electrical connection distribution, it is also possible to be provided with electrostatic discharge protective circuit, one or more in the circuit such as rectification, pressure limiting, electric current control, to meet different function needs.
In this enforcement arranges, heat abstractor is passive heat radiation, namely adopts radiator 6, preferably employ conventional aluminum alloy material, owing to aluminum alloy materials has high thermal conductivity, at about 230W/mK, and stabilized metal is better, less costly, it is easy to molding by techniques such as aluminium extrusion.Except the radiator 6 of the present embodiment, it is also possible to adopt one or more combinations in heat pipe, fan, water-cooled, aluminium alloy heat radiator, fin radiator etc., to meet varying environment and specific heat load requirement.
Fixed form described in the present embodiment is for welding or solidifies bonding, solidifies bonding as used high heat conduction cement to bond.Can pay the utmost attention to as required and weld, such as surface owing to material is difficult to solder to, it is possible to weld again after surface is coated with a metal level by modes such as plating, compound, sprayings.By the mode welded, its thermal contact resistance can be greatly reduced, and is favorably improved heat conduction efficiency, and this production process of another side is simple, is suitable for the large-scale production of mass, is favorably improved production efficiency, reduces production cost.
As shown in Figure 2, for another preferred embodiment of the present invention, mainly it is made up of semiconductor chilling plate the 2, first thermo-electric generation sheet the 3, second samming body the 4, second thermo-electric generation sheet the 7, first fan 9, cooler the 10, first water circulating pump the 11, second water circulating pump 12, water gallbladder the 13, first water tank the 14, second water tank 15, radiator of water tank the 16, second fan 17, the 3rd water circulating pump 18 etc..Wherein, the surface of semiconductor chilling plate 2 is fixed with water gallbladder 13, it is fixed with the first water tank 14 on the other end surface of semiconductor chilling plate 2, it is fixed with the first thermo-electric generation sheet 3 on the other end surface of described first water tank 14, the other end at the first thermo-electric generation sheet 3 is fixed with the second samming body 4, the second thermo-electric generation sheet 7 is fixed on the other end surface of the second samming body 4, one and above thermo-electric generation sheet and/or samming body it is fixed with on the other end surface of the second thermo-electric generation sheet 7, in outermost thermo-electric generation chip surface or samming surface, it is fixed with heat abstractor.
In the present embodiment, described heat-exchange device is mainly made up of the second water circulating pump 12, cooler 10 and the first fan 9, is the water circle device adopting pipeline communication.Semiconductor chilling plate 2 produce cold or hot by water gallbladder 13 be delivered to inside liquid medium, fluid flow inside is driven by the second thermal cycle water pump 12, the liquid medium temperature within cooler 10 is made to reach balance, it is provided around the first fan 9 at cooler 10, by the first fan 9, the hot blast around cooler 10 or cold wind is sent.
First water tank 14 fixing on cooling piece 2 surface, by the first water circulating pump 11, drives the liquid medium in the first water tank 14 to reach hygral equilibrium, better realizes the cold warm end temperature difference of the second thermo-electric generation sheet 2, improves generating efficiency.
Heat abstractor is in the present embodiment, the same mode adopting water-cooled is dispelled the heat, critical piece is made up of the second water tank 15, radiator of water tank the 16, second fan 17, the 3rd water circulating pump 18 etc., by the 3rd water circulating pump 18, the liquid medium in the second water tank 15 is driven to reach hygral equilibrium, thus the heat that thermo-electric generation sheet hot junction produces is transmitted to radiator of water tank 16, the second fan 17 surrounding air flowing is driven to realize heat exchange heat radiation.
As shown in Figure 3, for another preferred embodiment of the present invention, mainly it is made up of semiconductor chilling plate the 2, first thermo-electric generation sheet 3, samming body 4, radiator the 6, first samming body the 8, first fan 9, cooler the 10, second water circulating pump 12, water gallbladder 13, radiator of water tank the 16, second fan 17, the 3rd water circulating pump 18 etc..
Wherein, it is fixed with semiconductor chilling plate 2 on water gallbladder 13 surface of heat-exchange device, it is fixed with the first samming body 8 on the other end surface of semiconductor chilling plate 2, it is fixed with the first thermo-electric generation sheet 3 on the other end surface of the first samming body 8, one and above thermo-electric generation sheet and/or samming body it is fixed with on the surface of the first thermo-electric generation sheet 3, in outermost thermo-electric generation chip surface or samming surface, it is fixed with heat abstractor.
In the present embodiment, heat-exchange device is made up of parts such as water gallbladder the 13, second water circulating pump the 12, first fan 9, coolers 10.Cold or the hot liquid medium being delivered to water gallbladder 13 internal cavities by water gallbladder 13 that semiconductor chilling plate 2 produces, fluid flow inside is driven by the second thermal cycle water pump 12, the liquid medium temperature within cooler 10 is made to reach balance, it is provided around fan at cooler 10, by fan, the hot blast around cooler 10 or cold wind is sent.Wherein, water gallbladder 13 is the structure of positive six prisms, is internally provided with cavity, and in cavity, distribution has fin, thus increasing conduction surface, improves cold and hot conduction efficiency further.The structure of water gallbladder 13 is generally the hollow polyhedron that class is symmedian prism, is generally the cuboid of hollow, pentagonal prism etc., and the inner chamber in hollow is distributed and can be provided with the structures such as groove, projection or fin, improves the liquid medium contact area built-in with cavity.The hexa-prism surface configuration of this water gallbladder 13, it is possible to expand the quantity of cooling piece and thermo-electric generation chip in the useful space, improves the hot or cold conversion efficiency in unit are.
Heat abstractor critical piece is made up of radiator 6, radiator of water tank the 16, second fan 17, the 3rd water circulating pump 18 etc..Wherein, the inner chamber of six radiators 6 is attached respectively through the terminal at two ends, and forming that the unification of inner chamber interface collects is an import and an outlet.The structure of radiator 6 inner chamber is similar with the structure of water gallbladder 13 inner chamber, by the 3rd water circulating pump 18, the liquid medium driving radiator 6 inner chamber reaches hygral equilibrium, thus the heat that thermo-electric generation sheet hot junction produces is transmitted to radiator of water tank 16, the second fan 17 surrounding air flowing is driven to realize heat exchange heat radiation.
Embodiment described above, the simply present invention more preferably detailed description of the invention, the usual variations and alternatives that those skilled in the art carries out within the scope of technical scheme should be construed as being included in protection scope of the present invention.
Claims (7)
1. a novel energy-conserving semiconductor-air regulates module, include semiconductor chilling plate, thermo-electric generation sheet, samming body, it is characterized in that, described semiconductor chilling plate end surface is fixed with heat-exchange device, thermo-electric generation sheet or samming body or water gallbladder it is fixed with on the other end surface of semiconductor chilling plate, samming body or thermo-electric generation sheet it is fixed with on the other end surface of described thermo-electric generation sheet or samming body or water gallbladder, it is fixed with one and above thermo-electric generation sheet and/or samming body to be arranged under the overlay on the surface of described samming body or thermo-electric generation sheet, in outermost thermo-electric generation chip surface or samming surface, it is fixed with heat abstractor.
2. a kind of novel energy-conserving semiconductor-air regulates module according to claim 1, it is characterised in that described heat-exchange device is provided around fan.
3. a kind of novel energy-conserving semiconductor-air regulates module according to claim 2, it is characterised in that described heat-exchange device is the heat pipe with radiating fin and/or the water circle device with water pump.
4. a kind of novel energy-conserving semiconductor-air adjustment module according to claim 1 or 3, it is characterised in that described samming shape is cuboid, pyramid, "L" shaped or " U " font structure.
5. a kind of novel energy-conserving semiconductor-air regulates module according to claim 4, it is characterised in that be provided with insulating barrier on described thermo-electric generation chip and/or samming body, insulating barrier is provided with line layer.
6. the electrification structure of novel semi-conductor temperature difference chip according to claim 5, it is characterised in that described line layer at least includes solderable position and electrical connection distribution.
7. the electrification structure of novel semi-conductor temperature difference chip according to claim 1 or 6, it is characterised in that described fixed form is welding and/or adhesive solidification.
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Application publication date: 20160727 |