CN205537254U - Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator - Google Patents

Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator Download PDF

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Publication number
CN205537254U
CN205537254U CN201521110355.2U CN201521110355U CN205537254U CN 205537254 U CN205537254 U CN 205537254U CN 201521110355 U CN201521110355 U CN 201521110355U CN 205537254 U CN205537254 U CN 205537254U
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China
Prior art keywords
heat
fins
carrier
exchanging
transfer
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Active
Application number
CN201521110355.2U
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Chinese (zh)
Inventor
吴勇
陶海波
刘建如
王定远
李鹏
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Qingdao Haier Refrigerator Co Ltd
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Qingdao Haier Refrigerator Co Ltd
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Priority to CN201521110355.2U priority Critical patent/CN205537254U/en
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Abstract

The utility model relates to a heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator. Particularly, the utility model provides a heat transfer device, it includes first heat transfer portion, first heat transfer portion has: two fin groups, every fin group have the fin that a plurality of parallel intervals set up, and just two fins are organized and are set up along the length direction interval of fin, with an axial fan, axial fan's rotation axis is located between two fins group, and axial fan takes and arranges in two fins groups to clearance in organizing to every fin between per two adjacent fins blows the air current, or the clearance suction air current between per two adjacent fins in organizing from every fin. Furthermore, the utility model also provides a semiconductor refrigeration refrigerator that has this heat transfer device. The utility model discloses a two fins groups are arranged in because use an axial fan to take simultaneously to heat transfer device and semiconductor refrigeration refrigerator, can reduce heat transfer device's volume, the heat dissipation of specially adapted semiconductor refrigeration refrigerator.

Description

Heat-exchanger rig and there is the semiconductor freezer of this heat-exchanger rig
Technical field
This utility model relates to refrigerating equipment, particularly relates to a kind of heat-exchanger rig and has this heat exchange dress The semiconductor freezer put.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate to pass through heat pipe heat radiation And conduction technique and automatic pressure-transforming Variable flow control technology realize refrigeration, it is not necessary to refrigeration working medium and mechanical movement portion Part, solves the application problem of the traditional mechanical refrigerator such as medium pollution and mechanical vibration.But, partly lead The cold end of body cooling piece, while refrigeration, can produce substantial amounts of heat, for ensureing quasiconductor system in its hot junction Cold is reliably continued for work, needs to dispel the heat hot junction in time, but for half in prior art The hot-side heat dissipation of conductor cooling piece generally use by arrange axial flow blower fin is carried out forced convertion dissipate The scheme of heat, to improve heat exchange efficiency, but the volume of radiating fin own is bigger;It addition, at radiating fin The side of group arranges axial flow blower, with the gap blow flow between the fin adjacent to each two, or from often Gap suction airflow between two adjacent fins.The volume ratio of this heat exchanger is relatively big, needs to install The problems such as space is big, are not suitable for installing in less space.Additionally, hot-side heat dissipation is typically by increase The rotating speed of blower fan and power reach the purpose of heat radiation, and radiating efficiency difference and the big energy consumption of noise are high.
Utility model content
A purpose of the present utility model is intended to overcome at least one defect of existing heat-exchanger rig, it is provided that one Planting the heat-exchanger rig of novel structure, it has less volume, is particularly well-suited to semiconductor freezer heat radiation.
One of this utility model first aspect further objective is that the noise as far as possible reducing heat-exchanger rig.
One purpose of this utility model second aspect is to provide for a kind of having partly leading of above-mentioned heat-exchanger rig System cold refrigerator.
According to an aspect of the present utility model, this utility model provides a kind of for semiconductor freezer Heat-exchanger rig.This heat-exchanger rig includes that the first heat exchanging part, described first heat exchanging part have:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and said two Fins set is spaced setting along the length direction of described fin;With
One axial flow blower, the rotation axis of described axial flow blower is between two described fins set, and institute State axial flow blower to be placed in said two fins set, with each two adjacent fins in each described fins set Between gap blow flow, or gap between each two adjacent fins sucks gas from each described fins set Stream.
Alternatively, described heat-exchanger rig also includes the second heat exchanging part, with described first heat exchanging part about a geometry Plane symmetry is arranged.
Alternatively, described heat-exchanger rig also includes:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
One fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at one The two ends of individual described heat-transfer device;
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at separately The two ends of heat-transfer device described in.
Alternatively, each described heat-transfer device includes:
Heat-conducting substrate, has heat-transfer surface hot linked with described thermal source or low-temperature receiver;With
Many heat carriers, the length direction along described fin is spaced, and every described heat carrier includes fixing In described heat-conducting substrate middle part heat carrier section and be positioned at heat carrier section both sides, described middle part, be perpendicular to described Two end straight heat carrier sections of geometrical plane, two end straight heat carrier sections of every described heat carrier are respectively Extend through the poling hole of each fin being mounted thereon.
Alternatively, the middle part heat carrier section of every described heat carrier includes: middle part straight heat carrier section, Yi Jifen Two the connection heat carrier sections not extended to both sides from the two ends of described middle part straight heat carrier section;And
In each described heat-transfer device, multiple described middle parts straight heat carrier section is in same plane, multiple Described end straight heat carrier section is in same plane, and between the adjacent middle part straight heat carrier section of each two Distance between the end straight heat carrier section that distance is adjacent less than each two, described middle part straight heat carrier section and institute State the distance between heat-transfer surface less than the distance between described end straight heat carrier section and described heat-transfer surface.
Alternatively, every described heat carrier is heat pipe.
Alternatively, the width of each described fin is the 1/7 to 3/7 of its length.
Alternatively, the distance between two fins set of described first heat exchanging part is less than the width of each described fin Degree.
According to second aspect of the present utility model, this utility model provides a kind of semiconductor freezer, bag Include inner bag, semiconductor chilling plate and be arranged at the heat-insulation layer on rear side of described inner bag, especially, also including:
Back cover, it defines installing space with the rear surface of described heat-insulation layer, and offers the first air intake on it Mouthful, and it is positioned at two the first air outlets of described first air inlet both sides;With
Any of the above-described kind of heat-exchanger rig, two fins set of its first heat exchanging part and axial flow blower are mounted on institute State in installing space and be between two described first air outlets;And
Two fins set of described first heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly Thermally coupled;
The axial flow blower of described first heat exchanging part is configured to promote air-flow to enter described from described first air inlet In axial flow blower, after flow to two fins set of described first heat exchanging part, with the wing with each described fins set Sheet carries out heat exchange, after from two described first air outlets flow out described installing spaces.
Alternatively, described first air outlet is arranged at the top of another described first air outlet;
The second air inlet and two the second air outlets, described second air outlet it is further opened with on described back cover Being arranged at the top of another described second air outlet, described second air inlet is arranged at two described second air-out Between Kou;And
Two fins set of the second heat exchanging part of described heat-exchanger rig and axial flow blower are mounted on described installation In space and be between two described second air outlets;And
Two fins set of described second heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly Thermally coupled;
The axial flow blower of described second heat exchanging part is configured to promote air-flow to enter described from described second air inlet In axial flow blower, after flow to two fins set of described second heat exchanging part, with the wing with each described fins set Sheet carries out heat exchange, after from two described second air outlets flow out described installing spaces.
Heat-exchanger rig of the present utility model and semiconductor freezer are because use an axial flow blower to take simultaneously It is placed in two fins set, the volume of heat-exchanger rig can be reduced, be particularly well-suited to the heat radiation of semiconductor freezer. Additionally, there are two heat exchanging part and each heat exchanging part has two fins set and also can improve the heat radiation of heat-exchanger rig Area.Use an axial flow blower to make air-flow flow through from two fins set simultaneously, axial flow blower profit can be improved By rate, and the noise of heat-exchanger rig can be reduced.
According to below in conjunction with the accompanying drawing detailed description to this utility model specific embodiment, those skilled in the art Will become more apparent from of the present utility model above-mentioned and other purposes, advantage and feature.
Accompanying drawing explanation
Describe in detail more of the present utility model the most by way of example, and not by way of limitation Specific embodiment.Reference identical in accompanying drawing denotes same or similar parts or part.This area It is to be understood by the skilled artisans that what these accompanying drawings were not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic elevational view of the heat-exchanger rig according to one embodiment of this utility model;
Fig. 2 is the schematic side elevation of the heat-exchanger rig according to one embodiment of this utility model;
Fig. 3 is the schematic side elevation of the semiconductor freezer according to one embodiment of this utility model;
Fig. 4 is the schematic rear view of the semiconductor freezer according to one embodiment of this utility model.
Detailed description of the invention
Fig. 1 and Fig. 2 is the schematic main of the heat-exchanger rig 600 according to one embodiment of this utility model respectively View and side view.As depicted in figs. 1 and 2, this utility model embodiment provides a kind of for quasiconductor The heat-exchanger rig 600 of refrigerator, it can include the first heat exchanging part 610.First heat exchanging part 610 can have Two fins set 611 and axial flow blower 612.Each fins set 611 has the wing that multiple parallel interval is arranged Sheet, and with cold end/hot junction thermally coupled directly or indirectly of the semiconductor chilling plate in semiconductor freezer, And two fins set 611 can be spaced along the length direction of fin and arrange.The rotation axis position of axial flow blower 612 Between two fins set 611, and axial flow blower 612 is placed in two fins set 611, with to each Gap blow flow between each two adjacent fins in fins set, or the adjacent wing of each two from each fins set Gap suction airflow between sheet, thus take away the cold/heat on fin.Two fins set 611 share one Axial flow blower 612, and axial flow blower 612 is in the most special position, not only can make heat-exchanger rig 600 Volume smaller, and this axial flow blower 612 can be made full use of, reduce the noise of heat-exchanger rig.Preferably, The width of each fin is the 1/7 to 3/7 of its length.The width of each fins set 611 is the length of each fin The 1/3 to 2/3 of degree.Distance between two fins set 611 of the first heat exchanging part 610 is less than the width of fin.
In embodiments more of the present utility model, as depicted in figs. 1 and 2, heat-exchanger rig 600 also can wrap Include the second heat exchanging part 610'.Second heat exchanging part 610' also can have two fins set 611, axial flow blower 612, And be arranged symmetrically with about a geometrical plane with the first heat exchanging part 610, to improve heat exchange efficiency further.
In some embodiments of this embodiment, heat-exchanger rig 600 also includes two heat-transfer devices 630, Each heat-transfer device 630 is symmetrical about above-mentioned geometrical plane, and the middle part of each heat-transfer device 630 is configured to Heat or cold is absorbed from thermal source or low-temperature receiver.One fins set 611 of the first heat exchanging part 610 and the second heat exchange One fins set 611 of portion 610' is arranged at the two ends of a heat-transfer device 630;First heat exchanging part 610 Another fins set 611 of another fins set 611 and the second heat exchanging part 610' is arranged at another heat-transfer device 630 Two ends.It is to say, this heat-exchanger rig 600 simultaneously can absorb heats or cold from two thermals source, and often One corresponding thermal source or the heat of low-temperature receiver or cold can be transferred to the first heat exchanging part 610 by individual heat-exchanger rig 600 A fins set 611 and a fins set 611 of the second heat exchanging part 610'.
Specifically, each heat-transfer device 630 includes heat-conducting substrate 631 and Duo Gen heat carrier 632.Heat conduction base Plate 631 has heat-transfer surface hot linked with thermal source or low-temperature receiver.Many heat carriers 632 can be along the length side of fin To being spaced.And, every heat carrier 632 can be heat pipe, including being fixed in heat-conducting substrate 631 Portion's heat carrier section and two that be positioned at heat carrier section both sides, middle part, to be perpendicular to geometrical plane straight heat carriers in end Section.The middle part heat carrier section of every heat carrier 632 includes: middle part straight heat carrier section, and respectively from middle part Two connection heat carrier sections that the two ends of straight heat carrier section extend to both sides.Two ends of every heat carrier 632 Portion's straight heat carrier section extends respectively through the poling hole of each fin being mounted thereon.
Preferably, in each heat-transfer device 630, multiple middle parts straight heat carrier section is in same plane, Multiple ends straight heat carrier section is in same plane, and between the adjacent middle part straight heat carrier section of each two Distance between the end straight heat carrier section that distance is adjacent less than each two, multiple middle parts straight heat carrier Duan Yuhuan Distance between hot side is less than the distance between multiple ends straight heat carrier section and heat-transfer surface.So arrange, can make to change Thermal 600 has special structure, it is simple to heat-exchanger rig 600 is installed on semiconductor freezer.
The straight heat carrier section in middle part is fixed connected mode with heat-conducting substrate 631 and can is: heat-conducting substrate 631 only has Having a base plate, it is opposing offers multiple holding tank in heat-transfer surface side;The middle part of many heat carriers 632 Straight heat carrier section is by the embedding holding tank that presses, and this mode connects reliably, thermal resistivity is low.The straight heat conduction in middle part Body section and heat-conducting substrate 631 fix connected mode: heat-conducting substrate 631 can have base plate and cover plate, The opposing of base plate offers multiple holding tank in heat-transfer surface side;The straight heat carrier in middle part of many heat carriers 632 Section is by the embedding holding tank that presses;It is opposing in heat-transfer surface side that cover plate is installed on heat-conducting substrate 631, with the end The middle part straight heat carrier section of many heat carriers 632 is folded in therebetween by plate.
In some alternative embodiments, each heat-transfer device 630 can be the heat-conducting plate of strip, one The middle part of side is heat-transfer surface.Four fins set 611 are respectively arranged at the two ends of two heat-conducting plates, each wing The fin of sheet group 611 extends from the another side of heat-conducting plate.Heat-conducting plate can be plate-type heat-pipe.At other In alternative embodiment, two fins set 611 of the first heat exchanging part 610 are mountable to a heat-transfer device On 630, two fins set 611 of the second heat exchanging part 610' are mountable on another heat-transfer device 630.Tool Body ground, each heat-transfer device 630 can include heat-conducting substrate 631 and many single u-shaped heat-conductive thermo tube.Each U The middle part of type heat-conductive thermo tube can be by the hot junction thermally coupled of heat-conducting substrate 631 with semiconductor chilling plate.Each U The two ends of type heat-conductive thermo tube are provided with a fins set 611.
Further, this utility model embodiment additionally provides and a kind of uses partly leading of above-mentioned heat-exchanger rig 600 System cold refrigerator, Fig. 3 and Fig. 4 is the semiconductor freezer according to one embodiment of this utility model respectively Schematic side elevation and rearview.As shown in Figure 3 to Figure 4, the semiconductor freezer of the present embodiment can Including semiconductor module 100, inner bag 200, shell, chamber door 300 and heat-insulation layer 400.In inner bag 200 Define storage space.The shell of semiconductor freezer generally there are two kinds of structures, one be pin-connected panel, I.e. it is assembled into a complete casing by top cover, left side plate, back cover 510, lower shoe etc..Another kind is Monoblock type, will become an inverted " u " font by top cover with left side plate rolling on request, referred to as U shell, then with Back cover 510, lower shoe point is welded into casing.The semiconductor freezer of this utility model embodiment is preferably used Monoblock type shell, i.e. shell include U shell and back cover 510.Back cover 510 can be positioned on rear side of inner bag 200 The rear surface of heat-insulation layer 400 define and on installing space, and back cover 510, offer the first air inlet, with And it is positioned at two the first air outlets of the first air inlet both sides.
In this embodiment, the semiconductor module 100 of semiconductor freezer can include semiconductor chilling plate, Cold end heat-exchanger rig and hot junction heat-exchanger rig.Heat-insulation layer 400 on rear side of the rear wall of inner bag 200 and inner bag 200 On offer installing hole.Cold end heat-exchanger rig can include cool guiding block, cold scattering substrate, be formed on cold scattering substrate Multiple cold scattering fins, and for the cold scattering fan of forced convertion cold scattering.Cool guiding block and semiconductor chilling plate It is installed in installing hole, and the rear surface of cool guiding block thermally contacts with the cold end surface of semiconductor chilling plate.
Hot junction heat-exchanger rig can be the heat-exchanger rig 600 in any of the above-described embodiment, its first heat exchanging part 610 Two fins set 611 and axial flow blower 612 be mounted in installing space and be in two the first air outlets Between.And, the hot junction of two fins set of the first heat exchanging part 610 611 and semiconductor chilling plate directly or Thermally coupled indirectly.The axial flow blower 612 of the first heat exchanging part 610 is configured to promote air-flow from the first air inlet Enter in axial flow blower 612, after flow to two fins set 611 of the first heat exchanging part 610, with each wing The fin of sheet group 611 carries out heat exchange, after from two first air outlets flow out installing spaces.
In order to improve heat exchange efficiency, heat-exchanger rig 600 farther includes the second heat exchanging part 610'.One first Air outlet is arranged at the top of another the first air outlet.The second air inlet and two it are further opened with on back cover 510 Second air outlet, second air outlet is arranged at the top of another the second air outlet, and the second air inlet is arranged Between two the second air outlets.First air inlet and the second air inlet at sustained height, the first air-out Mouth and the second air outlet are at sustained height.Two fins of the second heat exchanging part 610' of heat-exchanger rig 600 Group 611 and axial flow blower 612 are mounted in installing space and are between two the second air outlets.And, Two fins set 611 of the second heat exchanging part 610' are with the direct or indirect underground heat in hot junction of semiconductor chilling plate even Connect;The axial flow blower 612 of the second heat exchanging part 610' is configured to promote air-flow to enter axial flow wind from the second air inlet In machine 612, after flow to two fins set of the second heat exchanging part, carry out heat exchange with the fin with each fins set, After from two second air outlets flow out installing spaces.
In this embodiment, semiconductor module 100 can be two, is vertically spaced setting, to improve Refrigerating efficiency.Heat-exchanger rig 600 may also include two heat-transfer devices 630.Leading of each heat-transfer device 630 The hot junction of the heat-transfer surface of hot substrate 631 and a semiconductor chilling plate contacts against, with by each quasiconductor system The heat of cold is transferred to the first heat exchanging part 610 and the second heat exchanging part 610'.
So far, although those skilled in the art will appreciate that the most detailed to illustrate and describe this practicality new Multiple exemplary embodiments of type, but, in the case of without departing from this utility model spirit and scope, still Can directly determine according to this utility model disclosure or derive the many meeting this utility model principle Other variations or modifications.Therefore, scope of the present utility model is it is understood that and regard as covering all these Other variations or modifications.

Claims (10)

1. the heat-exchanger rig for semiconductor freezer, it is characterised in that include the first heat exchanging part, institute State the first heat exchanging part to have:
Two fins set, each described fins set has the fin that multiple parallel interval is arranged, and said two Fins set is spaced setting along the length direction of described fin;With
One axial flow blower, the rotation axis of described axial flow blower is between two described fins set, and institute State axial flow blower to be placed in said two fins set, with each two adjacent fins in each described fins set Between gap blow flow, or gap between each two adjacent fins sucks gas from each described fins set Stream.
Heat-exchanger rig the most according to claim 1, it is characterised in that also include:
Second heat exchanging part, is arranged symmetrically with about a geometrical plane with described first heat exchanging part.
Heat-exchanger rig the most according to claim 2, it is characterised in that also include:
Two heat-transfer devices, each described heat-transfer device is symmetrical about described geometrical plane, and
The middle part of each described heat-transfer device is configured to absorb heat or cold from thermal source or low-temperature receiver;
One fins set of described first heat exchanging part and a fins set of described second heat exchanging part are arranged at one The two ends of individual described heat-transfer device;
Another fins set of described first heat exchanging part and another fins set of described second heat exchanging part are arranged at separately The two ends of heat-transfer device described in.
Heat-exchanger rig the most according to claim 3, it is characterised in that each described heat-transfer device includes:
Heat-conducting substrate, has heat-transfer surface hot linked with described thermal source or low-temperature receiver;With
Many heat carriers, the length direction along described fin is spaced, and every described heat carrier includes fixing In described heat-conducting substrate middle part heat carrier section and be positioned at heat carrier section both sides, described middle part, be perpendicular to described Two end straight heat carrier sections of geometrical plane, two end straight heat carrier sections of every described heat carrier are respectively Extend through the poling hole of each fin being mounted thereon.
Heat-exchanger rig the most according to claim 4, it is characterised in that
The middle part heat carrier section of every described heat carrier includes: middle part straight heat carrier section, and respectively from described Two connection heat carrier sections that the two ends of the straight heat carrier section in middle part extend to both sides;And
In each described heat-transfer device, multiple described middle parts straight heat carrier section is in same plane, multiple Described end straight heat carrier section is in same plane, and between the adjacent middle part straight heat carrier section of each two Distance between the end straight heat carrier section that distance is adjacent less than each two, described middle part straight heat carrier section and institute State the distance between heat-transfer surface less than the distance between described end straight heat carrier section and described heat-transfer surface.
Heat-exchanger rig the most according to claim 4, it is characterised in that
Every described heat carrier is heat pipe.
Heat-exchanger rig the most according to claim 1, it is characterised in that
The width of each described fin is the 1/7 to 3/7 of its length.
Heat-exchanger rig the most according to claim 1, it is characterised in that
Distance between two fins set of described first heat exchanging part is less than the width of each described fin.
9. a semiconductor freezer, including inner bag, semiconductor chilling plate be arranged on rear side of described inner bag Heat-insulation layer, it is characterised in that also include:
Back cover, it defines installing space with the rear surface of described heat-insulation layer, and offers the first air intake on it Mouthful, and it is positioned at two the first air outlets of described first air inlet both sides;With
Heat-exchanger rig according to any one of claim 1 to 8, two fins of its first heat exchanging part Group and axial flow blower are mounted in described installing space and are between two described first air outlets;And
Two fins set of described first heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly Thermally coupled;
The axial flow blower of described first heat exchanging part is configured to promote air-flow to enter described from described first air inlet In axial flow blower, after flow to two fins set of described first heat exchanging part, with the wing with each described fins set Sheet carries out heat exchange, after from two described first air outlets flow out described installing spaces.
Semiconductor freezer the most according to claim 9, it is characterised in that
One described first air outlet is arranged at the top of another described first air outlet;
The second air inlet and two the second air outlets, described second air outlet it is further opened with on described back cover Being arranged at the top of another described second air outlet, described second air inlet is arranged at two described second air-out Between Kou;And
Two fins set of the second heat exchanging part of described heat-exchanger rig and axial flow blower are mounted on described installation In space and be between two described second air outlets;And
Two fins set of described second heat exchanging part are with the hot junction of described semiconductor chilling plate directly or indirectly Thermally coupled;
The axial flow blower of described second heat exchanging part is configured to promote air-flow to enter described from described second air inlet In axial flow blower, after flow to two fins set of described second heat exchanging part, with the wing with each described fins set Sheet carries out heat exchange, after from two described second air outlets flow out described installing spaces.
CN201521110355.2U 2015-12-24 2015-12-24 Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator Active CN205537254U (en)

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CN201521110355.2U CN205537254U (en) 2015-12-24 2015-12-24 Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator

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Application Number Priority Date Filing Date Title
CN201521110355.2U CN205537254U (en) 2015-12-24 2015-12-24 Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105466261A (en) * 2015-12-24 2016-04-06 青岛海尔电冰箱有限公司 Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105466261A (en) * 2015-12-24 2016-04-06 青岛海尔电冰箱有限公司 Heat exchange device and semiconductor refrigeration refrigerator provided with heat exchange device

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