CN113280527B - Heat exchange device special for semiconductor refrigeration equipment - Google Patents
Heat exchange device special for semiconductor refrigeration equipment Download PDFInfo
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- CN113280527B CN113280527B CN202110743703.3A CN202110743703A CN113280527B CN 113280527 B CN113280527 B CN 113280527B CN 202110743703 A CN202110743703 A CN 202110743703A CN 113280527 B CN113280527 B CN 113280527B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
Abstract
The invention discloses a special heat exchange device for semiconductor refrigeration equipment, which comprises a cold end regulating device, a hot end regulating device, a communicating pipe and a communicating valve, wherein the cold end regulating device and the hot end regulating device are respectively clamped on the upper surface and the lower surface of a refrigeration module, the cold end regulating device and the hot end regulating device are in symmetrical structures, insulating heat conducting plates on the cold end and the hot end of the refrigeration module are respectively subjected to temperature homogenization regulation through the cold end regulating device and the hot end regulating device, and the communicating state of heat exchange pipes at the cold end and the hot end is regulated through the communicating valve to exchange heat for the refrigeration module.
Description
Technical Field
The invention relates to the technical field of refrigeration, in particular to a special heat exchange device for semiconductor refrigeration equipment.
Background
The semiconductor refrigerator is a device for producing cold by using the thermo-electric effect of a semiconductor. When two different metals are connected by a conductor and direct current is applied, the temperature at one junction is reduced and the temperature at the other junction is increased. If the power supply is connected in reverse, the temperature at the junction changes inversely. This phenomenon is known as the peltier effect, also known as the thermo-electric effect. The thermoelectric effect of pure metal is small, and if one N-type semiconductor and one P-type semiconductor are used instead of metal, the effect is much larger. After the power supply is switched on, electron hole pairs are generated near the upper contact, the internal energy is reduced, the temperature is reduced, and heat is absorbed to the outside, namely the cold end. The other end is called a hot end because the electron hole pair is compounded, the internal energy is increased, the temperature is raised, and heat is released to the environment. The temperature difference and cold quantity generated by a pair of semiconductor thermoelectric elements are very small, and the practical semiconductor refrigerator is formed by combining a plurality of pairs of thermoelectric elements in parallel and series connection, and is also called a thermopile. Therefore, in a long-term operation state of the semiconductor, the temperature generated on the conducting plate for connecting the N, P type semiconductor is larger than the temperature difference between the temperature on the conducting plate at the connecting end of the N, P type semiconductor and the temperature on the conducting plate at the center, so that the temperature transmitted from the conducting plate to the conducting insulating plate is not uniform, the damage of the refrigeration module is easily caused, the material of the conducting insulating plate is generally ceramic material, and particularly, the cracking damage of the conducting insulating plate is easily caused when the power supply is switched between positive connection and negative connection.
Therefore, the technical personnel in the field provide a special heat exchange device for semiconductor refrigeration equipment to solve the problems in the background technology.
Disclosure of Invention
In order to achieve the purpose, the invention provides the following technical scheme: a heat exchange device special for semiconductor refrigeration equipment comprises a cold end regulating device, a hot end regulating device, a communicating pipe and a communicating valve, wherein the cold end regulating device and the hot end regulating device are respectively clamped on the upper surface and the lower surface of a refrigeration module and are of symmetrical structures;
the cold end regulating device comprises air guide boxes, temperature guide plates, heat exchange tubes, backflow tubes, a cover plate and an air inducing device, wherein the heat exchange tubes are laid on the cold end surface of the refrigeration module in a shape of a circular ring and are gradually reduced, three groups of the heat exchange tubes are stacked in parallel, the backflow tubes are communicated with ports of the heat exchange tubes arranged in the air inducing device at the center of the refrigeration module, the air guide boxes are correspondingly arranged at the four corner ends of the air inducing device and the refrigeration module, the heat exchange tubes between the adjacent air guide boxes are sleeved with the longitudinal temperature guide plates in a clamping manner and are horizontally arranged at equal intervals, and the cover plate is arranged at the upper ends of the temperature guide plates;
and the heat exchange tubes on the upper layer of the cold end and the upper layer of the hot end, the heat exchange tubes on the middle layer of the cold end and the middle layer of the hot end, and the heat exchange tubes on the lower layer of the cold end and the heat exchange tubes on the lower layer of the hot end are communicated through independent communicating tubes, and each group of communicating tubes is provided with a communicating valve.
As a preferred technical scheme of the invention, the casing of the air guide box is of a right-angle stepped structure, a flow guide device is mounted at each stepped corner of the air guide box, the temperature conduction plate is also of a trapezoidal right-angle stepped structure, and an air guide hole is formed in the flat casing of the air guide box, which is vertical to the temperature conduction plate.
As a preferred technical solution of the present invention, the flow guiding device includes a flow guiding element and a flow dividing element, and the flow dividing element is symmetrically disposed at left and right sides of the flow guiding element and located near a center of the air guiding hole.
According to a preferred technical scheme, the flow guide element comprises a square plate, a T-shaped plate and an arc-shaped flow guide plate, four side plate surfaces of the square plate are all in an arc-shaped shape, a strip-shaped slideway is arranged in the square plate from the upper left corner end to the lower right corner end, a tensioning elastic piece is installed in the strip-shaped slideway, and the upper left end of the tensioning elastic piece is connected with a straight rod end of the T-shaped plate embedded in the strip-shaped slideway;
arc-shaped slide rails are arranged on the side plate surfaces of the square plates close to the left side and the upper side, arc-shaped guide plates are connected to the upper ends of the arc-shaped slide rails in a sliding mode, and the upper ends of the two groups of arc-shaped guide plates are connected to the two ends of the arc-shaped panel of the T-shaped plate in a hinged mode respectively;
and the left lower end and the right upper end of the T-shaped plate block are provided with rollers, symmetrical winding motors are further arranged in the T-shaped plate block, the output ends of the winding motors are connected with pull ropes, and the pull ropes are wound on the outer sides of the rollers and connected with the lower ends of the arc-shaped guide plates.
As a preferred technical scheme of the invention, the shunting element comprises a fixed wheel, a rotating shaft and a shunting fan, wherein the axis of the fixed wheel is rotationally connected with the rotating shaft through a one-way bearing, and the shunting fan is fixedly sleeved on the outer side of the rotating shaft.
As a preferred technical solution of the present invention, the flow dividing elements located at the upper and lower sides are rotated clockwise and counterclockwise in a single direction, respectively.
As a preferred technical scheme of the invention, the induced draft device comprises an induced draft fan, uniform scattering blocks, a motor and an induced draft arc plate, wherein the uniform scattering blocks are arranged right below the induced draft fan, the induced draft arc plate is arranged at the edge of the outer side of the lower end of each uniform scattering block, a certain gap is reserved between the adjacent end faces of the induced draft arc plates, and the uniform scattering blocks are driven to rotate by the motor.
As a preferred technical scheme of the invention, a straight pipeline in a heat exchange pipe which is tightly attached to an insulating heat conduction plate in the refrigeration module is a square pipeline, and a homogenizing element is also arranged on the square pipeline between the adjacent temperature conduction plates;
the homogenizing elements comprise two groups of inclined homogenizing boxes, expanders are arranged in the homogenizing boxes, pistons are fixed at the output ends of the expanders, and temperature monitoring elements are arranged on the bottom end faces of the pistons.
As a preferable technical solution of the present invention, the front homogenizing tank is inclined 15 ° to the right, the rear homogenizing tank is inclined 15 ° to the left, and the lower end of the homogenizing tank is directed to both ends of the conduction plate for connecting the N-type semiconductor and the P-type semiconductor in the interior of the refrigeration module.
Compared with the prior art, the invention provides a special heat exchange device for semiconductor refrigeration equipment, which has the following beneficial effects:
1. according to the invention, the cold end regulating device and the hot end regulating device are independently operated, and are matched with the structures such as the air inducing device and the temperature conducting plate, cold air and hot air are generated above and below the refrigerating module under the operation of the refrigerating module, the temperatures above and below the refrigerating module can form consistent temperatures through the structural arrangement of the communicating pipe, and the heat exchange pipe attached to the refrigerating module is of a square structure, so that the contact area with the refrigerating module is increased, and the heat exchange efficiency is improved.
2. The invention improves the fluency of air circulation in the equipment by the stepped air guide box and the temperature conduction plate, the temperature of the conducting liquid in the heat exchange tube is monitored by the homogenizing element and is transmitted to the winding motor in real time, and the winding motors are independently adjusted according to the temperature in the heat exchange tubes on the surfaces of the refrigeration modules at different positions, so that the corresponding winding motors are promoted to increase horsepower, further, the air flow rate and the flow rate entering the temperature conduction plates are improved, thereby the temperature of the upper surface and the lower surface of the refrigeration module is uniformly distributed, the insulating conduction plate is uniformly heated, the temperature difference change of the N, P type semiconductor connecting end is larger due to the adjustment and change of the temperature, thereby effectual protection insulation conduction board, and make the even transmission of temperature of this equipment conduction when refrigeration, heating, in the cold and hot exchange process, can not produce great difference in temperature in the twinkling of an eye.
Drawings
FIG. 1 is a schematic view of a heat exchange device according to the present invention;
FIG. 2 is an enlarged schematic view of a top view structure of the cold end regulating device of the present invention;
FIG. 3 is an enlarged view of the structure at A of the present invention;
FIG. 4 is an enlarged view of the structure of the flow-guiding device of the present invention;
FIG. 5 is an enlarged view of the structure of the air inducing device of the present invention;
FIG. 6 is an enlarged view of the internal structure of the refrigeration module according to the present invention;
in the figure: 1. a refrigeration module; 2. a cold end regulating device; 3. a hot end regulating device; 4. a wind guide box; 5. a temperature conductive plate; 6. a heat exchange pipe; 7. a return pipe; 8. a cover plate; 9. an air inducing device; 10. a communicating pipe; 11. a communication valve; 12. a homogenizing element; 13. a flow guide device; 14. a flow guide element; 15. a shunt element; 16. a fixed wheel; 17. a rotating shaft; 18. a shunt fan; 19. a square plate; 20. a T-shaped plate; 21. tensioning the elastic member; 22. an arc-shaped guide plate; 23. pulling a rope; 24. a roller; 25. a winding motor; 26. a fan guide; 27. a motor; 28. evenly dispersing blocks; 29. an air inducing arc plate; 30. an insulating heat-conducting plate; 31. a retractor; 32. a piston; 33. a temperature monitoring element.
Detailed Description
Referring to fig. 1-6, the present invention provides a technical solution: a heat exchange device special for semiconductor refrigeration equipment comprises a cold end regulating device 2, a hot end regulating device 3, a communicating pipe 10 and a communicating valve 11, wherein the cold end regulating device 2 and the hot end regulating device 3 are respectively clamped on the upper surface and the lower surface of a refrigeration module 1, and the cold end regulating device 2 and the hot end regulating device 3 are of symmetrical structures;
the cold end regulation and control device 2 comprises air guide boxes 4, temperature conduction plates 5, heat exchange tubes 6, backflow tubes 7, cover plates 8 and an air inducing device 9, the heat exchange tubes 6 are laid on the cold end surface of the refrigeration module 1 in a shape of a circle which is gradually reduced, three groups of the heat exchange tubes are stacked in parallel, the backflow tubes 7 are communicated with ports of the heat exchange tubes 6 which are arranged in the air inducing device 9 at the center of the refrigeration module 1, the air guide boxes 4 are correspondingly arranged at the four corner ends of the air inducing device 9 and the refrigeration module 1, the longitudinal temperature conduction plates 5 are clamped and sleeved on the heat exchange tubes 6 between the adjacent air guide boxes 4 and are horizontally arranged at equal intervals, and the cover plates 8 are arranged at the upper ends of the temperature conduction plates 5;
and the heat exchange tubes on the upper layer of the cold end and the upper layer of the hot end, the heat exchange tubes on the middle layer of the cold end and the middle layer of the hot end, and the heat exchange tubes on the lower layer of the cold end and the heat exchange tubes on the lower layer of the hot end are communicated through independent communicating tubes 10, and each group of communicating tubes is provided with a communicating valve 11.
As a preferred embodiment, the heat exchange tubes and the return tubes in the cold end regulating device are communicated through return pumps (not shown in the figure), three sets of return pumps are correspondingly arranged, the structural form of the hot end regulating device is the same as that of the cold end regulating device, and the corresponding return pumps in the cold end regulating device and the hot end regulating device are also communicated through corresponding communication tubes.
In this embodiment, the case shell of air guide box 4 is right angle notch cuttype structure, and guiding device 13 is all installed at every ladder turning thereof, temperature conduction board 5 also is trapezoidal right angle notch cuttype structure, just the wind-guiding hole has been seted up on the dull and stereotyped case shell that is vertical structure with temperature conduction board 5 in the air guide box 4.
In this embodiment, the flow guiding device 13 includes a flow guiding element 14 and a flow dividing element 15, the flow dividing element 15 is symmetrically disposed at the left and right sides of the flow guiding element 14 and is located near the center of the air guiding hole, and the flow guiding device guides the sucked air to the cavities between the corresponding temperature conducting plates, so as to promote temperature conduction and uniform heat and cold dissipation of the heat exchanging pipe.
In this embodiment, the diversion element 14 includes a square plate 19, a T-shaped plate 20, and an arc-shaped diversion plate 22, four side plates of the square plate 19 are all in an arc shape, and a strip-shaped slideway is formed in the square plate from the upper left corner to the lower right corner, a tensioning elastic member 21 is installed in the strip-shaped slideway, and the upper left end of the tensioning elastic member 21 is connected with a straight rod end of the T-shaped plate 20 embedded in the strip-shaped slideway;
arc-shaped slide rails are arranged on the side plate surfaces of the square plate 19 close to the left side and the upper side, arc-shaped guide plates 22 are connected to the upper ends of the arc-shaped slide rails in a sliding manner, and the upper ends of the two groups of arc-shaped guide plates 22 are respectively hinged to the two ends of the arc-shaped panel of the T-shaped plate 20;
the left lower end and the right upper end of the T-shaped plate block 20 are both provided with rollers 24, symmetrical winding motors 25 are further mounted in the T-shaped plate block, the output ends of the winding motors 25 are connected with pull ropes 23, and the pull ropes 23 are wound on the outer sides of the rollers 24 and connected with the lower ends of the arc-shaped guide plates 22;
as a preferred embodiment, the most centrally located flow guiding element is not provided with T-shaped plates, but only consists of square plates.
In this embodiment, the shunt element 15 includes a fixed wheel 16, a rotating shaft 17 and a shunt fan 18, the axis of the fixed wheel 16 is rotatably connected with the rotating shaft 17 through a one-way bearing, and the shunt fan 18 is fixedly sleeved on the outer side of the rotating shaft 17.
In this embodiment, the shunting elements 15 on the upper and lower sides rotate clockwise and counterclockwise in a single direction, respectively.
In this embodiment, the induced draft device 9 includes an induced fan 26, a uniform scattering block 28, a motor 27 and an induced draft arc plate 29, the uniform scattering block 28 is installed right below the induced fan 26, the induced draft arc plate 29 is installed at the outer edge of the lower end of the uniform scattering block 28, a certain gap is left between the adjacent end faces of the uniform scattering block 28, and the uniform scattering block 28 is driven by the motor 27 to rotate;
as the best embodiment, four groups of air inducing arc plates are arranged and are respectively arranged at the air inlets of the corresponding air inducing boxes, and the air inducing devices which are arranged in parallel with the air inlets of the temperature conducting plates positioned at the centers are also arranged.
In this example. The straight pipeline in the heat exchange tube 6 tightly attached to the insulating heat conducting plate 30 in the refrigeration module 1 is a square pipeline, and a homogenizing element 12 is further arranged in the square pipeline between the adjacent temperature conducting plates 5;
the homogenizing element 12 comprises two groups of inclined homogenizing boxes, a telescopic device 31 is arranged in each homogenizing box, a piston 32 is fixed at the output end of each telescopic device 31, and a temperature monitoring element 33 is arranged on the bottom end face of each piston 32;
as the best embodiment, sensing elements are arranged in the winding motor, the temperature monitoring element, the induced fan and other driving structures, information data monitored by the temperature monitoring element are processed and then transmitted to the winding motor, and the inflow air quantity in the temperature conduction plate can be regulated and controlled by the winding motor;
as a preferred embodiment, adjacent homogenization boxes alternately pump and discharge, namely if the left-side homogenization box is in pumping, the right-side homogenization box is in pushing discharge.
In this embodiment, the front homogenizing box is inclined 15 ° to the right, the rear homogenizing box is inclined 15 ° to the left, and the lower end of the homogenizing box points to both ends of the conducting plate for connecting the N-type semiconductor and the P-type semiconductor in the interior of the refrigeration module 1.
In the specific implementation, after power is on, electrons in the circuit flow from the P-type semiconductor to the N-type semiconductor, the conduction plate connected with the semiconductor above the circuit forms a cold end, the conduction plate below the circuit forms a hot end, the temperature of the cold end of the local conduction plate at the upper contact end of the N, P-type semiconductor is lower than that of the conduction plate at the center, the temperature of the hot end of the local conduction plate at the lower contact end of the N, P-type semiconductor is higher than that of the conduction plate at the center, the conduction liquid in the heat exchange tube is absorbed by the expansion piece after the operation of the box at the front, and then the homogenization box at the rear is operated, so that the conduction liquid impacts the position at the upper end and the lower end of the N, P-type semiconductor to absorb the lower temperature and the higher temperature, so that the temperature on the conduction plate is uniformly dispersed, if the liquid flows reversely, in the homogenization box at the rear, the cold end regulating device and the hot end regulating device respectively circulate and flow, if the communicating pipe is opened through the communicating valve and the backflow direction of the backflow pump in the cold end regulating device or the hot end regulating device is changed, the conducting liquid in the cold end regulating device and the conducting liquid in the hot end regulating device are mixed and regulated, and meanwhile, the temperature sensing element is used for monitoring to achieve the required heating or refrigerating temperature or the self temperature regulation and control.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (8)
1. The utility model provides a be used for special heat transfer device of semiconductor refrigeration plant, its includes cold junction regulation and control device (2), hot junction regulation and control device (3), communicating pipe (10) and communicating valve (11), its characterized in that: the cold end regulating device (2) and the hot end regulating device (3) are respectively clamped on the upper surface and the lower surface of the refrigeration module (1), and the cold end regulating device (2) and the hot end regulating device (3) are of symmetrical structures;
the cold end regulating device (2) comprises air guide boxes (4), temperature conducting plates (5), heat exchange tubes (6), backflow tubes (7), cover plates (8) and an air inducing device (9), the heat exchange tubes (6) are laid on the cold end face of the refrigeration module (1) in a shape of a circle which is reduced step by step, three groups of the heat exchange tubes are arranged in a parallel stacking mode, the backflow tubes (7) are communicated with ports of the heat exchange tubes (6) which are arranged in the air inducing device (9) at the center of the refrigeration module (1), the air inducing device (9) and four corner ends of the refrigeration module (1) are correspondingly provided with the air guide boxes (4), the heat exchange tubes (6) between the adjacent air guide boxes (4) are clamped with the longitudinal temperature conducting plates (5) in a horizontal equidistant arrangement mode, and the upper ends of the temperature conducting plates (5) are provided with the cover plates (8);
the heat exchange tubes positioned on the upper layer of the cold end are communicated with the heat exchange tubes on the upper layer of the hot end, the heat exchange tubes on the middle layer of the cold end are communicated with the heat exchange tubes on the middle layer of the hot end, the heat exchange tubes on the lower layer of the cold end are communicated with the heat exchange tubes on the lower layer of the hot end through independent communicating tubes (10), and each communicating tube is provided with a communicating valve (11);
a straight pipeline in the heat exchange pipe (6) tightly attached to an insulating heat conduction plate (30) in the refrigeration module (1) is a square pipeline, and a homogenizing element (12) is further installed in the square pipeline between the adjacent temperature conduction plates (5);
the homogenizing element (12) comprises two groups of inclined homogenizing boxes, a telescopic device (31) is installed inside each homogenizing box, a piston (32) is fixed at the output end of each telescopic device (31), and a temperature monitoring element (33) is installed on the bottom end face of each piston (32).
2. The heat exchange device special for the semiconductor refrigeration equipment as claimed in claim 1, wherein: lead bellows (4) case shell and all install guiding device (13) for right angle notch cuttype structure, its every ladder turning, temperature conduction board (5) also are trapezoidal right angle notch cuttype structure, just lead and seted up the wind-guiding hole on the dull and stereotyped case shell that is vertical structure with temperature conduction board (5) in bellows (4).
3. The heat exchange device special for the semiconductor refrigeration equipment as claimed in claim 2, wherein: the flow guide device (13) comprises flow guide elements (14) and flow dividing elements (15), wherein the flow dividing elements (15) are symmetrically arranged on the left side and the right side of the flow guide elements (14) and are positioned at the centers close to the air guide holes.
4. The heat exchange device special for the semiconductor refrigeration equipment as recited in claim 3, wherein: the flow guide element (14) comprises a square plate (19), a T-shaped plate (20) and an arc-shaped flow guide plate (22), four side plate surfaces of the square plate (19) are in arc-shaped forms, a strip-shaped slideway is arranged in the square plate from the upper left corner to the lower right corner, a tensioning elastic part (21) is installed in the strip-shaped slideway, and the upper left end of the tensioning elastic part (21) is connected with a straight rod end of the T-shaped plate (20) embedded in the strip-shaped slideway;
arc-shaped sliding rails are arranged on the side plate surfaces of the square plates (19) close to the left side and the upper side, arc-shaped guide plates (22) are connected to the upper ends of the arc-shaped sliding rails in a sliding mode, and the upper ends of the two groups of arc-shaped guide plates (22) are connected to the two ends of the arc-shaped panel of the T-shaped plate (20) in a hinged mode respectively;
and the left lower end and the right upper end of the T-shaped plate (20) are provided with rollers (24), the interior of the T-shaped plate is also provided with symmetrical winding motors (25), the output ends of the winding motors (25) are connected with pull ropes (23), and the pull ropes (23) are wound on the outer sides of the rollers (24) and connected with the lower ends of the arc-shaped guide plates (22).
5. The heat exchange device special for the semiconductor refrigeration equipment as recited in claim 3, wherein: shunt element (15) include tight pulley (16), pivot (17) and reposition of redundant personnel fan (18), tight pulley (16) axle center is passed through one-way bearing and is connected with pivot (17) rotation, pivot (17) outside fixed cover has reposition of redundant personnel fan (18).
6. The heat exchange device special for the semiconductor refrigeration equipment as recited in claim 5, wherein: the flow dividing elements (15) positioned on the upper side and the lower side respectively rotate clockwise and anticlockwise in a single direction.
7. The heat exchange device special for the semiconductor refrigeration equipment as claimed in claim 1, wherein: the induced draft device (9) comprises an induced draft fan (26), uniform scattering blocks (28), a motor (27) and an induced draft arc plate (29), the uniform scattering blocks (28) are installed under the induced draft fan (26), the induced draft arc plate (29) is installed at the edge of the outer side of the lower end of each uniform scattering block (28), a certain gap is reserved between adjacent end faces of the induced draft arc plate and the adjacent end faces of the induced draft arc plate, and the uniform scattering blocks (28) are driven to rotate by the motor (27).
8. The heat exchange device special for the semiconductor refrigeration equipment as claimed in claim 1, wherein: the front homogenizing box inclines 15 degrees to the right, the rear homogenizing box inclines 15 degrees to the left, and the lower end of the homogenizing box points to two ends of a conduction plate used for connecting an N-type semiconductor and a P-type semiconductor in the refrigerating module (1).
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11289038A (en) * | 1998-04-02 | 1999-10-19 | Oki Electric Ind Co Ltd | Electronic temperature adjusting device |
| JP2002111076A (en) * | 2000-09-29 | 2002-04-12 | Toshiba Corp | Thermoelectric conversion module and heat exchanger using it |
| JP2002198575A (en) * | 2000-10-19 | 2002-07-12 | Murata Mfg Co Ltd | Thermoelectric transducer and its manufacturing method |
| CN203083194U (en) * | 2012-12-18 | 2013-07-24 | 中国海洋石油总公司 | Semiconductor refrigeration device |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN106016885A (en) * | 2015-03-24 | 2016-10-12 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating device |
| CN109346595A (en) * | 2018-08-22 | 2019-02-15 | 江苏大学 | A kind of staged thermoelectric generation film and its height of pin determine method |
| CN212517238U (en) * | 2020-06-06 | 2021-02-09 | 河南鸿昌电子有限公司 | Uniform-temperature semiconductor refrigerating piece |
| CN214791559U (en) * | 2021-01-28 | 2021-11-19 | 宁波方太厨具有限公司 | Heat exchanger for air conditioner outdoor unit and air conditioner outdoor unit |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2769785Y (en) * | 2004-09-27 | 2006-04-05 | 赵厚福 | Special radiator for semiconductor refrigerating assembly |
| CN201017908Y (en) * | 2007-02-14 | 2008-02-06 | 汪洋 | Closed type semiconductor refrigerator |
| CN101188269A (en) * | 2007-12-18 | 2008-05-28 | 徐慧英 | An improved electric cooling and heating component driven by semiconductor temperature difference |
| KR20150106328A (en) * | 2012-06-25 | 2015-09-21 | 지엠제트 에너지 인코퍼레이티드 | Thermoelectric power generation system using gradient heat exchanger |
| CN103811652A (en) * | 2014-01-22 | 2014-05-21 | 杜效中 | Novel thermoelectric semiconductor device manufacturing method capable of separating cold end and hot end |
| CN204923553U (en) * | 2015-09-02 | 2015-12-30 | 北京三相典创科技有限公司 | A air -cooled semiconductor refrigerator for circulative cooling system |
| CN108028306B (en) * | 2015-09-18 | 2022-01-25 | 三菱综合材料株式会社 | Thermoelectric conversion module and thermoelectric conversion device |
| CN205690564U (en) * | 2016-05-26 | 2016-11-16 | 杭州帝赐科技有限公司 | A kind of cooling fan refrigeration panel and this cooling fan |
| CN209605477U (en) * | 2019-03-14 | 2019-11-08 | 淄博职业学院 | Domestic beverage is classified refrigeration equipment |
| CN211233443U (en) * | 2019-12-03 | 2020-08-11 | 北京乐普医疗科技有限责任公司 | Reagent dish refrigerating plant |
| CN212057887U (en) * | 2020-04-23 | 2020-12-01 | 成都华芯众合电子科技有限公司 | Teaching instrument is with small-size constant temperature equipment based on semiconductor refrigeration piece group |
| CN112008936A (en) * | 2020-08-21 | 2020-12-01 | 广州特种承压设备检测研究院 | Heat dissipation device for hot-press forming machine, hot-press forming machine and heat dissipation method |
| CN113594344A (en) * | 2021-07-30 | 2021-11-02 | 浙江珵美科技有限公司 | Refrigeration chip heat dissipation device and use method |
-
2021
- 2021-07-01 CN CN202110743703.3A patent/CN113280527B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11289038A (en) * | 1998-04-02 | 1999-10-19 | Oki Electric Ind Co Ltd | Electronic temperature adjusting device |
| JP2002111076A (en) * | 2000-09-29 | 2002-04-12 | Toshiba Corp | Thermoelectric conversion module and heat exchanger using it |
| JP2002198575A (en) * | 2000-10-19 | 2002-07-12 | Murata Mfg Co Ltd | Thermoelectric transducer and its manufacturing method |
| CN203083194U (en) * | 2012-12-18 | 2013-07-24 | 中国海洋石油总公司 | Semiconductor refrigeration device |
| CN106016885A (en) * | 2015-03-24 | 2016-10-12 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating device |
| CN105091400A (en) * | 2015-09-16 | 2015-11-25 | 广东富信科技股份有限公司 | Thermoelectric cooling integrated system |
| CN109346595A (en) * | 2018-08-22 | 2019-02-15 | 江苏大学 | A kind of staged thermoelectric generation film and its height of pin determine method |
| CN212517238U (en) * | 2020-06-06 | 2021-02-09 | 河南鸿昌电子有限公司 | Uniform-temperature semiconductor refrigerating piece |
| CN214791559U (en) * | 2021-01-28 | 2021-11-19 | 宁波方太厨具有限公司 | Heat exchanger for air conditioner outdoor unit and air conditioner outdoor unit |
Non-Patent Citations (1)
| Title |
|---|
| Temperature gradient characteristics and effect on optimal thermoelectric performance in exhaust power-generation systems;Wei He et.al;《Applied Energy》;20191224;全文 * |
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