CN212517238U - Uniform-temperature semiconductor refrigerating piece - Google Patents
Uniform-temperature semiconductor refrigerating piece Download PDFInfo
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- CN212517238U CN212517238U CN202021019591.4U CN202021019591U CN212517238U CN 212517238 U CN212517238 U CN 212517238U CN 202021019591 U CN202021019591 U CN 202021019591U CN 212517238 U CN212517238 U CN 212517238U
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Abstract
The utility model relates to a semiconductor refrigeration piece technical field, the name is a samming semiconductor refrigeration piece, including a plurality of metal blocks, a plurality of semiconductor crystalline grains and two ceramic insulation boards, the semiconductor crystalline grain include N type semiconductor crystalline grain and P type semiconductor crystalline grain, semiconductor crystalline grain end connection metal block forms the refrigeration unit, a plurality of refrigeration unit arrays set up between two metal blocks; the method is characterized in that: the semiconductor die has a structure in which the cross section of the die around the cooling element is larger than that of the die in the middle of the cooling element. The semiconductor refrigerating element has the advantages that the temperature of the side parts and the temperature of the middle part of the semiconductor refrigerating element are more consistent, and some installation requirements can be met.
Description
Technical Field
The utility model relates to a semiconductor refrigeration spare technical field.
Background
The principle of operation of semiconductor chillers was based on the peltier principle, and this effect was first discovered by j.a.c peltier in 1834, i.e. using an electrical circuit consisting of two different semiconductors a and B and passing a direct current, some other heat is released at one of the joints (hot side) and the other joint absorbs heat (cold side), and this phenomenon caused by the peltier effect is reversible, changing the direction of the current, the heat releasing and absorbing joints changing accordingly.
The semiconductor refrigerating element has no mechanical transmission part, no noise and no liquid or gas working medium during working, so that the semiconductor refrigerating element does not pollute the environment, refrigerating parameters are not influenced by the space direction and gravity, and the semiconductor refrigerating element can normally work under the condition of large mechanical overload; the refrigeration rate can be conveniently adjusted by adjusting the working current; the refrigerator can be changed from a refrigerating state to a heating working state by switching the current direction; the semiconductor refrigerator has the advantages of high action speed, long service life and easy control, so the semiconductor refrigerator is widely applied to daily life.
The semiconductor refrigerating element comprises a plurality of metal blocks, a plurality of N-type semiconductor crystals, P-type semiconductor crystals and two ceramic insulating plates, wherein the N-type semiconductor crystals and the P-type semiconductor crystals are arrayed between metal conductors, and the ceramic insulating plates are arranged on the outer sides of the metal conductors.
In the prior art, each semiconductor crystal on a semiconductor cooling device is of the same size, so that the entire semiconductor cooling device cannot meet some use requirements due to the fact that the side edge part dissipates heat quickly, for example, the temperature around the cold side of the semiconductor cooling device is higher than the middle temperature, and the temperature around the hot side of the semiconductor cooling device is lower than the middle temperature, so that the side part and the middle part of the semiconductor cooling device are different.
Disclosure of Invention
The present invention aims at overcoming the said demerits and providing one kind of semiconductor refrigerating part with homogeneous temperature capable of making the temperature of the side part and the middle part of the semiconductor refrigerating part consistent and meeting some installation requirement.
The technical scheme of the utility model is realized like this: a temperature-equalizing semiconductor refrigeration piece comprises a plurality of metal blocks, a plurality of semiconductor crystal grains and two ceramic insulation plates, wherein the semiconductor crystal grains comprise N-type semiconductor crystal grains and P-type semiconductor crystal grains, the end parts of the semiconductor crystal grains are connected with the metal blocks to form refrigeration units, and a plurality of refrigeration units are arranged between the two metal blocks in an array manner; the method is characterized in that: the semiconductor die has a structure in which the cross section of the die around the cooling element is larger than that of the die in the middle of the cooling element.
Specifically, the area of the cross section of the crystal grain around the cooling member is 1.1 to 1.2 times the area of the cross section of the crystal grain in the middle of the cooling member.
Further, the crystal grains around the refrigerating element mean at least two rows of crystal grains around the refrigerating element.
The utility model has the advantages that: the semiconductor refrigerating element has the advantages that the temperature of the side parts and the temperature of the middle part of the semiconductor refrigerating element are more consistent, and some installation requirements can be met.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic cross-sectional view in the direction a-A, B-B (90 degree turn) of fig. 1.
Wherein: 1. metal block 2, semiconductor crystal grain 3, ceramic insulating board.
Detailed Description
The invention is further illustrated by the following figures and examples.
As shown in fig. 1 and 2, a temperature-equalizing semiconductor refrigeration piece comprises a plurality of metal blocks 1, a plurality of semiconductor crystal grains 2 and two ceramic insulating plates 3, wherein the semiconductor crystal grains comprise an N-type semiconductor crystal grain and a P-type semiconductor crystal grain, the metal blocks are connected with the end parts of the semiconductor crystal grains to form refrigeration units, and a plurality of refrigeration units are arranged between the two metal blocks in an array manner; the method is characterized in that: the semiconductor die has a structure in which the cross section of the die around the cooling element is larger than that of the die in the middle of the cooling element.
As shown, the semiconductor die of M is larger than the other die.
By the arrangement, the crystal grains with large cross section area have the effect of higher refrigerating and heating efficiency, and can balance the difference of temperature difference of each part of the refrigerating piece caused by the peripheral temperature reduction and temperature rise of the semiconductor refrigerating piece, thereby achieving the purpose of the utility model.
Specifically, the area of the cross section of the crystal grain around the cooling member is 1.1 to 1.2 times larger than that of the cross section of the crystal grain in the middle of the cooling member.
Further, the crystal grains around the refrigerating element mean at least two rows of crystal grains around the refrigerating element.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (3)
1. A temperature-equalizing semiconductor refrigeration piece comprises a plurality of metal blocks, a plurality of semiconductor crystal grains and two ceramic insulation plates, wherein the semiconductor crystal grains comprise N-type semiconductor crystal grains and P-type semiconductor crystal grains, the end parts of the semiconductor crystal grains are connected with the metal blocks to form refrigeration units, and a plurality of refrigeration units are arranged between the two metal blocks in an array manner; the method is characterized in that: the semiconductor die has a structure in which the cross section of the die around the cooling element is larger than that of the die in the middle of the cooling element.
2. The uniform temperature semiconductor chilling element of claim 1, wherein: the area of the cross section of the crystal grains around the cooling element is 1.1-1.2 times of the cross section of the crystal grains in the middle of the cooling element.
3. The uniform temperature semiconductor cooling element according to claim 1 or 2, wherein: the crystalline grains around the refrigerating element mean crystalline grains of at least two rows around the refrigerating element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021019591.4U CN212517238U (en) | 2020-06-06 | 2020-06-06 | Uniform-temperature semiconductor refrigerating piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021019591.4U CN212517238U (en) | 2020-06-06 | 2020-06-06 | Uniform-temperature semiconductor refrigerating piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212517238U true CN212517238U (en) | 2021-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021019591.4U Active CN212517238U (en) | 2020-06-06 | 2020-06-06 | Uniform-temperature semiconductor refrigerating piece |
Country Status (1)
| Country | Link |
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| CN (1) | CN212517238U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
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2020
- 2020-06-06 CN CN202021019591.4U patent/CN212517238U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113280527A (en) * | 2021-07-01 | 2021-08-20 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
| CN113280527B (en) * | 2021-07-01 | 2022-07-15 | 哈尔滨商业大学 | Heat exchange device special for semiconductor refrigeration equipment |
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