CN219961151U - Heat abstractor and power amplifier - Google Patents
Heat abstractor and power amplifier Download PDFInfo
- Publication number
- CN219961151U CN219961151U CN202223072352.7U CN202223072352U CN219961151U CN 219961151 U CN219961151 U CN 219961151U CN 202223072352 U CN202223072352 U CN 202223072352U CN 219961151 U CN219961151 U CN 219961151U
- Authority
- CN
- China
- Prior art keywords
- module
- heat
- heat dissipation
- power amplifier
- refrigeration module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005057 refrigeration Methods 0.000 claims abstract description 61
- 230000017525 heat dissipation Effects 0.000 claims abstract description 60
- 238000010438 heat treatment Methods 0.000 claims abstract description 33
- 238000001816 cooling Methods 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims description 19
- 230000003321 amplification Effects 0.000 claims description 12
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 12
- 238000001514 detection method Methods 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 238000000034 method Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005676 thermoelectric effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipation device and a power amplifier, which are applied to the technical field of heat dissipation devices and are used for solving the problem that the traditional heat dissipation device in the prior art cannot meet the requirement of targeted heat dissipation on the temperature of each power amplifier tube of the power amplifier. The heat dissipating device provided by the utility model comprises: at least one refrigeration module and a heat dissipation module; the first surface of each refrigeration module is fixedly arranged on the first surface of the heat dissipation module, an external heating device is arranged on the second surface of each refrigeration module, and the first input end and the second input end of each refrigeration module are respectively connected with an external power supply; the refrigeration module is used for preparing cold energy and reducing the temperature of an external heating device; the heat dissipation module is used for absorbing heat of the refrigeration module and dissipating the heat. Therefore, by correspondingly arranging one refrigeration module for each external heating device, the refrigeration module corresponding to the external heating device with the cooling requirement can be used for refrigerating, so that the external heating device can be cooled in a targeted manner.
Description
Technical Field
The present utility model relates to the field of heat sinks, and in particular, to a heat dissipation device and a power amplifier.
Background
The power amplifier is used as an amplifier capable of generating maximum power output to drive a load under a given distortion rate, and has wide application in electronic products such as televisions and mobile phones.
At present, the power loss of the power amplifier is large, the heating of the power amplifier tube is serious, and a heat dissipation device is generally required to be arranged for the power amplifier tube. The existing heat dissipation device is mainly arranged in a mode that a heat dissipation device is uniformly arranged for power amplification tubes in a power amplifier, and the heat dissipation device can only uniformly dissipate heat for the power amplification tubes. Because the working temperature difference of each power amplifier tube is different in the working process of the power amplifier, the traditional heat dissipation device cannot meet the problem that the temperature of each power amplifier tube of the power amplifier tube is subjected to targeted heat dissipation, and the problem that the power synthesis efficiency and the service life difference of each power amplifier tube are reduced due to the working temperature difference can be indirectly caused.
Disclosure of Invention
The embodiment of the utility model provides a heat dissipation device and a power amplifier, which are used for solving the problem that the traditional heat dissipation device in the prior art cannot meet the requirement of targeted heat dissipation on the temperature of each power amplifier tube of the power amplifier.
In one aspect, a heat dissipating device provided by an embodiment of the present utility model includes: at least one refrigeration module and a heat dissipation module;
the first surface of each refrigeration module in the at least one refrigeration module is fixedly arranged on the first surface of the heat dissipation module, an external heating device is arranged on the second surface of each refrigeration module in the at least one refrigeration module, and the first input end and the second input end of each refrigeration module in the at least one refrigeration module are respectively connected with an external power supply; the refrigeration module is used for preparing cold energy and reducing the temperature of an external heating device;
the heat dissipation module is used for absorbing heat of the refrigeration module and dissipating the heat.
In one possible embodiment, each of the at least one refrigeration module comprises: a semiconductor refrigerator.
In one possible embodiment, the hot side of the semiconductor refrigerator is fixedly arranged on the first side of the heat dissipation module, and the cold side of the semiconductor refrigerator is provided with an external heating device.
In one possible embodiment, the heat dissipation module includes: a heat sink.
In one possible embodiment, the heat sink is a copper alloy heat sink or an aluminum alloy heat sink.
In one possible embodiment, a heat-conducting medium is arranged between the heat-dissipating module and the at least one cooling module, the heat-conducting medium being used to transfer heat from the cooling module to the heat-dissipating module.
In one possible embodiment, the heat conducting medium comprises a heat conducting silicone grease.
In another aspect, an embodiment of the present utility model further provides a power amplifier, including: the embodiment of the utility model provides the heat radiating device, the power amplifying circuit, the power supply, the detection module, the comparison module and the voltage and current adjusting module; the power amplifying tube in the power amplifying circuit is correspondingly and fixedly arranged on the second face of at least one refrigerating module of the heat radiating device, the first end of the detecting module is connected with the power amplifying circuit, the second end of the detecting module is connected with the first end of the comparing module, the second end of the comparing module is connected with the first end of the voltage and current adjusting module, the second end of the voltage and current adjusting module is connected with the power supply, and the third end of the voltage and current adjusting module is connected with the heat radiating device.
In one possible embodiment, the number of cooling modules in the heat sink is the same as the number of power amplifying tubes in the power amplifying circuit.
In one possible embodiment, the power amplifying circuit and the heat sink are fixedly connected by a fixed connection.
The embodiment of the utility model has the following beneficial effects:
according to the heat dissipation device provided by the embodiment of the utility model, the refrigerating module corresponding to the external heating device with the cooling requirement in the plurality of external heating devices can be refrigerated by correspondingly arranging the refrigerating module for each external heating device, so that the external heating devices arranged on the surface of the external heating device can be dissipated in a targeted manner, the condition that the traditional heat dissipation device only can uniformly dissipate heat of the plurality of external heating devices arranged on the surface of the external heating device is avoided, and the heat of at least one refrigerating module can be effectively absorbed and dissipated by arranging the heat dissipation module, so that good working conditions can be provided for the refrigerating module.
Drawings
FIG. 1 is a schematic diagram of a first structure of a heat dissipating device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of a second structure of a heat dissipating device according to an embodiment of the present utility model;
fig. 3 is a schematic diagram of a first configuration of a power amplifier according to an embodiment of the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
An embodiment of the present utility model provides a heat dissipating device, as shown in fig. 1, including: at least one refrigeration module 110 and a heat dissipation module 120;
the first surface of each refrigeration module 110 in the at least one refrigeration module 110 is fixedly arranged on the first surface of the heat dissipation module 120, an external heating device is arranged on the second surface of each refrigeration module 110 in the at least one refrigeration module 110, and the first input end and the second input end of each refrigeration module 110 in the at least one refrigeration module 110 are respectively connected with an external power supply; the refrigeration module 110 is used for preparing cold energy and reducing the temperature of an external heating device;
the heat dissipation module 120 is used for absorbing heat of the refrigeration module 110 and dissipating the heat.
In practical applications, each of the at least one cooling module 110 may be fixed to the first surface of the heat dissipation module 120 by welding, bonding, or the like, and each of the at least one cooling module 110 may be fixed to an external heat generating device by welding, bonding, or the like. Each refrigeration module 110 can be used for refrigerating by switching on an external power supply, and the prepared cold energy is transferred to an external heating device arranged on the second surface of the refrigeration module, so that the external heating device is cooled, and the external heating device which needs to be cooled can be cooled through the corresponding refrigeration module 110 in the working process of a plurality of external heating modules. Each of the cooling modules 110 generates heat during cooling by switching on an external power source, and the heat dissipation module 120 can absorb and dissipate heat generated by the cooling module 110 fixedly disposed on the first surface thereof. Like this, through correspond setting up a refrigeration module 110 for every heating element, can have the outside heating element cooling of cooling demand in the a plurality of outside heating elements that have the pertinence, avoid traditional heat abstractor can only set up the unified radiating condition of a plurality of outside heating elements on its surface, moreover, can absorb refrigeration module 110's heat and lose effectively through setting up heat dissipation module 120, can provide good operating condition for refrigeration module 110, provide the guarantee for refrigeration module 110's good work.
In one possible embodiment, each refrigeration module 110 of the at least one refrigeration module 110 includes: a semiconductor refrigerator.
In practical application, the semiconductor refrigerator can utilize thermoelectric effect of semiconductor to produce cold energy, and its connected power source is DC power source. The semiconductor refrigerator is connected with an external direct current power supply to reduce the temperature of a cold surface and increase the temperature of a hot surface. The refrigerating speed of the semiconductor refrigerator is related to the voltage and current of the external power source.
In one possible embodiment, the hot side of the semiconductor refrigerator is fixedly disposed on the first side of the heat dissipation module 120, and the cold side of the semiconductor refrigerator is provided with an external heat generating device.
In practical application, the temperature of the hot surface of the semiconductor comes from the heat generated in the refrigerating process, and the hot surface of the semiconductor refrigerator is fixedly arranged on the first surface of the heat dissipation module 120, so that the heat dissipation module 120 is beneficial to absorb the heat of the refrigerating module 110 and dissipate the heat; the temperature of the cold face of the semiconductor is the cold energy obtained by refrigerating the semiconductor, and the cold energy is transmitted to an external heating device arranged on the cold face of the semiconductor, so that the temperature of the external heating device can be effectively reduced.
In one possible implementation, referring to fig. 2, the heat dissipation module 120 includes: and a heat sink 121.
In practical applications, the heat sink 121 may be a fin type heat sink, where the first surface of the heat sink 121 is used for receiving heat from a hot surface of a semiconductor refrigerator fixedly disposed thereon, and conducting the absorbed heat to each portion inside the heat sink, and using a plurality of fins of the heat sink, the heat is dissipated into air through various heat exchange paths on the surface.
In one possible embodiment, the heat sink is a copper alloy heat sink or an aluminum alloy heat sink.
In practical application, the material of the radiating fin generally adopts metal, the heat conductivity of copper alloy and aluminum alloy is higher, and the copper alloy radiating fin or the aluminum alloy radiating fin with higher heat conductivity can be used as the main material of the radiating fin, so that a good radiating effect can be achieved.
In one possible embodiment, a heat transfer medium is disposed between the heat dissipation module 120 and the at least one refrigeration module 110, the heat transfer medium being used to transfer heat of the refrigeration module 110 to the heat dissipation module 120.
In practical application, a heat conducting medium can be respectively arranged between the heat dissipation module 120 and at least one refrigeration module 110, and heat of each refrigeration module 110 can be uniformly and fully transferred to the heat dissipation module 120 through the heat conducting medium, so that the heat dissipation module 120 dissipates heat, and the condition that the heat dissipation effect is not ideal due to overhigh temperature at a certain place is effectively avoided.
In one possible embodiment, the heat conducting medium comprises a heat conducting silicone grease.
In practical application, the main components of the heat-conducting silicone grease are alumina powder, aluminum nitride powder and the like with high heat conductivity. The heat dissipation module 120 is coated with and filled with a heat-conductive silicone grease, which can transfer heat generated in the cooling process of the at least one cooling module 110 to the heat dissipation module 120, and the at least one cooling module 110 is filled with the heat-conductive silicone grease.
Based on the same concept, the embodiment of the present utility model further provides a power amplifier, referring to fig. 3, the power amplifier 200 includes: the heat dissipating device, the power amplifying circuit 210, the power supply 220, the detection module 230, the comparison module 240 and the voltage and current adjustment module 250 provided by the embodiment of the utility model; the power amplifying tube in the power amplifying circuit 210 is correspondingly and fixedly arranged on the second surface of at least one refrigeration module of the heat dissipation device, the first end of the detection module 230 is connected with the power amplifying circuit, the second end of the detection module 230 is connected with the first end of the comparison module 240, the second end of the comparison module 240 is connected with the first end of the voltage and current adjustment module 250, the second end of the voltage and current adjustment module 250 is connected with the power supply 220, and the third end of the voltage and current adjustment module 250 is connected with the heat dissipation device.
In practical applications, each power amplifier in the power amplifier circuit 210 is uniformly and correspondingly fixed to the refrigeration module of the heat dissipation device, and the refrigeration module can be used for refrigeration when the power supply 220 is turned on. The detection module 230 is mainly configured to detect an operating temperature of each power amplifier in the power amplifier circuit 210, send the operating temperature of each power amplifier to the comparison module 240, compare the input operating temperature of each power amplifier with a preset temperature, determine a power amplifier higher than the preset temperature, and adjust a voltage or a current input to a refrigeration module corresponding to the power amplifier by the voltage and current adjustment module 250, so that the refrigeration module starts to refrigerate, so that the refrigeration module corresponding to the power amplifier with a temperature exceeding the preset temperature in the power amplifier circuit 210 starts to refrigerate, and dissipate heat of the power amplifier with a temperature exceeding the preset temperature, thereby realizing targeted heat dissipation of the power amplifier in the power amplifier circuit 210.
In one possible embodiment, the number of cooling modules in the heat sink is the same as the number of power amplifying tubes in the power amplifying circuit.
In practical application, because the power amplification tubes are main heating components in the power amplification circuit, a refrigeration module is correspondingly arranged for each power amplification tube, and refrigeration is carried out on the power amplification tubes needing to be cooled in the working process of the power amplification circuit.
In one possible embodiment, the power amplifying circuit and the heat sink are fixedly connected by a fixed connection.
In practical application, the corresponding positions of the two ends of the corresponding circuit board of the power amplification circuit, which are provided with the mounting holes and the heat dissipation device, are also provided with the mounting holes, the power amplification circuit and the heat dissipation device can be fixed through fixing pieces such as bolts, dislocation between a refrigeration module in the heat dissipation device and a power amplification tube of the corresponding power amplification circuit is avoided, and good guarantee is provided for heat dissipation effect.
In the power amplifier provided by the embodiment of the utility model, the heat dissipation device can pertinently cool the external heating devices with cooling requirements in the plurality of external heating devices, so the power amplifier using the heat dissipation device also has corresponding advantages, and the temperature of each power amplifier tube is independently adjusted by correspondingly arranging one refrigeration module for each power amplifier tube so as to control the working temperature of each power amplifier tube, thereby avoiding the conditions of lower power synthesis efficiency and larger service life difference of each power amplifier tube caused by the influence of the temperature difference on the phase difference.
While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present utility model without departing from the spirit or scope of the embodiments of the utility model. Thus, if such modifications and variations of the embodiments of the present utility model fall within the scope of the claims and the equivalents thereof, the present utility model is also intended to include such modifications and variations.
Claims (9)
1. A heat sink, comprising: at least one refrigeration module and a heat dissipation module;
the first surface of each refrigeration module of the at least one refrigeration module is fixedly arranged on the first surface of the heat dissipation module, an external heating device is arranged on the second surface of each refrigeration module of the at least one refrigeration module, and the first input end and the second input end of each refrigeration module of the at least one refrigeration module are respectively connected with an external power supply; the refrigerating module is used for preparing cold energy and reducing the temperature of the external heating device;
the heat dissipation module is used for absorbing heat of the refrigeration module and dissipating the heat; the heat dissipation module comprises a fin type heat dissipation sheet, wherein the first surface of the fin type heat dissipation sheet is used for receiving heat of the refrigeration module fixedly arranged on the fin type heat dissipation sheet, the absorbed heat is conducted inside, and the heat is dissipated into air by utilizing a plurality of fins.
2. The heat sink of claim 1, wherein each of the at least one refrigeration module comprises: a semiconductor refrigerator.
3. The heat dissipating device of claim 2, wherein the hot side of the semiconductor refrigerator is fixedly disposed on the first side of the heat dissipating module, and the cold side of the semiconductor refrigerator is provided with an external heat generating device.
4. A heat sink according to claim 3, wherein the heat sink is a copper alloy heat sink or an aluminum alloy heat sink.
5. A heat sink according to claim 3, characterized in that a heat-conducting medium is arranged between the heat-dissipating module and at least one cooling module, said heat-conducting medium being used for transferring heat of the cooling module to the heat-dissipating module.
6. The heat sink of claim 5 wherein the thermally conductive medium comprises thermally conductive silicone grease.
7. A power amplifier, comprising: the heat sink, power amplification circuit, power supply, detection module, comparison module, voltage current adjustment module of any one of claims 1-6; the power amplifying tube in the power amplifying circuit is correspondingly and fixedly arranged on the second face of at least one refrigerating module of the radiating device, the first end of the detecting module is connected with the power amplifying circuit, the second end of the detecting module is connected with the first end of the comparing module, the second end of the comparing module is connected with the first end of the voltage and current adjusting module, the second end of the voltage and current adjusting module is connected with the power supply, and the third end of the voltage and current adjusting module is connected with the radiating device.
8. The power amplifier of claim 7, wherein the number of cooling modules in the heat sink is the same as the number of power amplifier tubes in the power amplifier circuit.
9. The power amplifier of claim 7, wherein the power amplifying circuit and the heat sink are fixedly connected by a fixed connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223072352.7U CN219961151U (en) | 2022-11-18 | 2022-11-18 | Heat abstractor and power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223072352.7U CN219961151U (en) | 2022-11-18 | 2022-11-18 | Heat abstractor and power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219961151U true CN219961151U (en) | 2023-11-03 |
Family
ID=88548936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223072352.7U Active CN219961151U (en) | 2022-11-18 | 2022-11-18 | Heat abstractor and power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219961151U (en) |
-
2022
- 2022-11-18 CN CN202223072352.7U patent/CN219961151U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20210153394A1 (en) | Cooling arrangement for electrical components, converter with a cooling arrangement, and aircraft having a converter | |
| CN112748633B (en) | Laser light source and laser projection equipment | |
| US20100218512A1 (en) | Heat exchanger for thermoelectric applications | |
| CN102299614A (en) | Semiconductor-refrigeration-based inverter radiating system | |
| CN112242480A (en) | Thermoelectric refrigeration method for chip-level electronic equipment | |
| CN210015419U (en) | Semiconductor device heat abstractor and data center computer lab | |
| CN113793837A (en) | Self-sensing temperature control system of chip | |
| CN102446877A (en) | Semiconductor cooling device | |
| CN112672605B (en) | Air cooling plate based on TEC refrigeration | |
| CN219961151U (en) | Heat abstractor and power amplifier | |
| JP4391351B2 (en) | Cooling system | |
| CN214199271U (en) | High-performance refrigeration module with simple structure | |
| CN115016622A (en) | Cooling system of mute server | |
| CN210129217U (en) | Refrigerating system capable of monitoring power consumption immediately | |
| CN209402917U (en) | A kind of heat generating components high temperature water flow cooling device | |
| CN112130644A (en) | Optical module heat dissipation equipment and server | |
| CN112713128A (en) | Intelligent controller heat dissipation method and device | |
| KR20040061286A (en) | Hybrid heat exchanger having tec and heat pipe | |
| CN218770826U (en) | Cooling system for internal ring temperature of power supply equipment | |
| CN213340350U (en) | Accurate temperature control structure of high-power chip | |
| CN216873449U (en) | TEC temperature control assembly | |
| CN213066624U (en) | Contact heat exchange type semiconductor refrigeration assembly | |
| CN220755317U (en) | Dual-semiconductor core heat dissipation control module for mobile phone air-cooled radiator | |
| CN209842547U (en) | High-efficiency energy-saving combined radiator | |
| US20230363113A1 (en) | Heat sink with bulk heat isolation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |