CN216873449U - TEC temperature control assembly - Google Patents
TEC temperature control assembly Download PDFInfo
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- CN216873449U CN216873449U CN202123398606.XU CN202123398606U CN216873449U CN 216873449 U CN216873449 U CN 216873449U CN 202123398606 U CN202123398606 U CN 202123398606U CN 216873449 U CN216873449 U CN 216873449U
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- radiator
- heat
- temperature control
- control assembly
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Abstract
The utility model aims to provide the TEC temperature control component which is high in heat dissipation efficiency and can actively raise and lower the temperature. The thermoelectric module comprises a substrate, a heat-conducting plate, a TEC, a radiator, a power supply and a controller, wherein the substrate is provided with a through hole, one surface of the heat-conducting plate is attached to the front surface of the substrate and covers the through hole, the other surface of the heat-conducting plate is attached to the refrigerating end of the TEC, the heating end of the TEC is attached to the bottom surface of the radiator, the radiating end of the radiator is provided with a radiating fan, and the power supply, the TEC and the radiating fan are electrically connected with the controller. The utility model is applied to the technical field of semiconductor thermoelectricity.
Description
Technical Field
The utility model is applied to the technical field of semiconductor thermoelectricity, and particularly relates to a TEC temperature control assembly.
Background
The temperature control mode that IC chip components and parts temperature control assembly on traditional PCB integrated circuit board adopted does: air cooling or water cooling, wherein the air cooling is realized by blowing air through a fan to accelerate the air flow of the radiating fins so as to accelerate heat exchange and reduce the temperature of the device; the water cooling is to arrange a pipeline in the device, circulating cooling water is introduced into the pipeline, the cooling water flows through a heat dissipation part to take away heat, and the cooling water absorbing the heat flows onto a condenser of a main heat radiator through the pipeline to perform heat dissipation and cooling.
At present, the two temperature control modes have low heat dissipation efficiency, can only dissipate heat and cannot actively heat, wherein the water cooling mode has certain potential safety hazard, and if water leaks, components can be burnt out or other more serious results can be caused.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide the TEC temperature control assembly which has high heat dissipation efficiency and can actively raise and lower the temperature.
The technical scheme adopted by the utility model is as follows: the thermoelectric module comprises a substrate, a heat-conducting plate, a TEC, a radiator, a power supply and a controller, wherein the substrate is provided with a through hole, one surface of the heat-conducting plate is attached to the front surface of the substrate and covers the through hole, the other surface of the heat-conducting plate is attached to the refrigerating end of the TEC, the heating end of the TEC is attached to the bottom surface of the radiator, the radiating end of the radiator is provided with a radiating fan, and the power supply, the TEC and the radiating fan are electrically connected with the controller.
Further, the TEC temperature control assembly further comprises a temperature sensor, and the temperature sensor is electrically connected with the controller.
Further, heat-conducting silicone grease is filled between the TEC and the heat conducting plate and between the TEC and the radiator.
Further, the substrate, the heat conducting plate, the TEC and the radiator are fastened through screws, the radiating fan is fixed on the radiator through screws, and the substrate is further provided with mounting holes.
Further, the heat-conducting plate is an aluminum plate.
Further, the substrate is made of FR4 material.
Further, the radiator is a copper radiator or an aluminum radiator.
The utility model has the beneficial effects that: the base plate is used for installing and fixing the heat conducting plate, the TEC and the radiator, when the temperature control device is used, the back face of the base plate is fixed on the PCB through the mounting hole, the heat conducting plate is in contact with a temperature control target, the TEC is electrified to generate temperature difference, namely, the TEC is cooled and heated at the same time, the cooling end is used for heating and cooling the target through the heat conducting plate, the heating end is used for radiating through the radiator and the fan, high radiating efficiency is achieved, the temperature sensor monitors the target temperature in real time, and the controller controls the current size and direction of the TEC and the rotating speed of the fan, so that accurate temperature control of the target is achieved.
Drawings
FIG. 1 is a schematic diagram of a first perspective of the present invention;
FIG. 2 is a schematic diagram of a second perspective of the present invention;
fig. 3 is a circuit schematic of the present invention.
Detailed Description
As shown in fig. 1 to 3, in this embodiment, the present invention includes a substrate 1, a heat conducting plate 2, a TEC3, a heat sink 4, a power supply 5, and a controller 6, where a through hole is formed in the substrate 1, one surface of the heat conducting plate 2 is attached to the front surface of the substrate 1 and covers the through hole, the other surface of the heat conducting plate 2 is attached to a cooling end of the TEC3, a heating end of the TEC3 is attached to the bottom surface of the heat sink 4, a heat dissipating end of the heat sink 4 is provided with a heat dissipating fan 7, and the power supply 5, the TEC3, and the heat dissipating fan 7 are electrically connected to the controller 6.
In this embodiment, the TEC temperature control assembly further includes a temperature sensor 8, and the temperature sensor 8 is electrically connected to the controller 6.
In this embodiment, a heat conductive silicone grease is filled between the TEC3 and the heat conductive plate 2 and the heat sink 4.
In this embodiment, the substrate 1, the heat conducting plate 2, the TEC3, and the heat sink 4 are fastened by screws, the heat dissipating fan 7 is fixed on the heat sink 4 by screws, and the substrate 1 is further provided with a mounting hole 9.
In the present embodiment, the heat conductive plate 2 is an aluminum plate.
In the present embodiment, the substrate 1 is made of FR4 material.
In this embodiment, the heat sink 4 is a copper heat sink or an aluminum heat sink.
While the embodiments of the utility model have been described in terms of practical embodiments, they are not to be construed as limiting the meaning of the utility model, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.
Claims (7)
1. A TEC temperature control assembly is characterized in that: including base plate (1), heat-conducting plate (2), TEC (3), radiator (4), power (5) and controller (6), be provided with the through-hole on base plate (1), the one side of heat-conducting plate (2) with base plate (1) openly laminates and covers the through-hole, the another side of heat-conducting plate (2) with the refrigeration end laminating of TEC (3), the system hot side of TEC (3) with the bottom surface laminating of radiator (4), the heat dissipation end of radiator (4) is provided with radiator fan (7), power (5), TEC (3) and radiator fan (7) all with controller (6) electric connection.
2. The TEC temperature control assembly of claim 1, wherein: the TEC temperature control assembly further comprises a temperature sensor (8), and the temperature sensor (8) is electrically connected with the controller (6).
3. The TEC temperature control assembly of claim 1, wherein: and heat-conducting silicone grease is filled between the TEC (3) and the heat-conducting plate (2) and between the TEC and the radiator (4).
4. The TEC temperature control assembly of claim 1, wherein: the base plate (1), the heat conducting plate (2), the TEC (3) and the radiator (4) are fastened through screws, the radiating fan (7) is fixed on the radiator (4) through screws, and the base plate (1) is further provided with a mounting hole (9).
5. The TEC temperature control assembly of claim 1, wherein: the heat conducting plate (2) is an aluminum plate.
6. The TEC temperature control assembly of claim 1, wherein: the substrate (1) is made of FR4 material.
7. The TEC temperature control assembly of claim 1, wherein: the radiator (4) is a copper radiator or an aluminum radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123398606.XU CN216873449U (en) | 2021-12-31 | 2021-12-31 | TEC temperature control assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123398606.XU CN216873449U (en) | 2021-12-31 | 2021-12-31 | TEC temperature control assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216873449U true CN216873449U (en) | 2022-07-01 |
Family
ID=82149068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123398606.XU Active CN216873449U (en) | 2021-12-31 | 2021-12-31 | TEC temperature control assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216873449U (en) |
-
2021
- 2021-12-31 CN CN202123398606.XU patent/CN216873449U/en active Active
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