CN213340350U - Accurate temperature control structure of high-power chip - Google Patents
Accurate temperature control structure of high-power chip Download PDFInfo
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- CN213340350U CN213340350U CN202022173383.6U CN202022173383U CN213340350U CN 213340350 U CN213340350 U CN 213340350U CN 202022173383 U CN202022173383 U CN 202022173383U CN 213340350 U CN213340350 U CN 213340350U
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- cooling block
- water cooling
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- heat
- temperature control
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- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model aims at providing a temperature control precision is high, small in noise, cooling effect are showing and have the accurate accuse temperature structure of the high-power chip of extensive commonality. The utility model discloses a water pump, heat conduction piece, refrigerator, radiator unit and heat exchanger, the water pump the radiator unit with the heat exchanger leads to pipe and communicates each other, the refrigerator is located the heat conduction piece with between the radiator unit. The utility model discloses be applied to the technical field of chip control by temperature change structure.
Description
Technical Field
The utility model relates to a technical field of chip control by temperature change structure, in particular to accurate accuse temperature structure of high-power chip.
Background
Along with the development of electronic products, the power of a PCB mainboard is higher and higher, the requirement on a chip is higher and higher, and the temperature of the chip is required to be controlled in time in the test process to meet the test requirement. The current commonly used heat dissipation structure is shown in fig. 3, such a design cannot meet the accurate temperature control of a high-power CPU, or the temperature of a chip cannot be accurately controlled under the condition of heat dissipation, and the fan has too much noise and cannot meet the requirements of customers. Although a TEC (semiconductor cooler) is also adopted as a temperature control component in the market to achieve the effect of stabilizing the working temperature of the chip, the TEC is difficult to be matched and applied to some chips with higher requirements on the placement position, and the TEC lacks universality.
Chinese patent publication No. CN210895146U discloses a temperature control assembly for maintaining the working temperature of a chip, wherein the temperature control assembly comprises a chip, a heater, a thermistor, an insulating substrate, and an insulating thermal baffle, the chip is disposed on the insulating thermal baffle, and the heater and the thermistor are adhered to the outside of the same side of the insulating substrate and adhered to the chip through the insulating substrate. In this patent, need decide insulating thermal-insulated plate size, material according to the size of chip, although satisfy and put the higher chip application scene of requirement to the position, its material is extravagant serious to be not suitable for wide use, and because its accuse temperature mode is single, to the big high-power chip of calorific capacity, this scheme is not suitable for and carries out long-time cooling to high-power chip.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that overcome prior art not enough, provide a control by temperature change precision height, small in noise, cooling effect are showing and have the accurate accuse temperature structure of the high-power chip of extensive commonality.
The utility model adopts the technical proposal that: the utility model discloses a water pump, heat conduction piece, refrigerator, radiator unit and heat exchanger, the water pump the radiator unit with the heat exchanger leads to pipe and communicates each other, the refrigerator is located the heat conduction piece with between the radiator unit.
Further, the radiating assembly comprises a first water cooling block, a second water cooling block, a first base and a second base, the first water cooling block is arranged on the first base, the second water cooling block is arranged on the second base, the first water cooling block is matched with the second water cooling block, the first water cooling block is respectively communicated with the second water cooling block and the water pump, and the second water cooling block is communicated with the heat exchanger.
Furthermore, equal-height screws and springs sleeved on the equal-height screws are arranged between the first water cooling block and the first base and between the second water cooling block and the second base.
Furthermore, the first base and the second base are both provided with fixing holes matched with the chip through holes.
Furthermore, the heat exchanger comprises a casing, a plurality of radiating fins arranged on the casing and a plurality of radiating fans which are arranged on the casing and matched with the radiating fins.
Further, the refrigerator adopts a semiconductor refrigerator.
The utility model discloses following beneficial effect has:
the accurate temperature control structure of high-power chip includes water pump, heat conduction piece, refrigerator, radiator unit and heat exchanger, the water pump radiator unit with the heat exchanger leads to pipe intercommunication each other, the refrigerator is located the heat conduction piece with between the radiator unit, the water pump with the water-cooling system is constituteed to the heat exchanger, the utility model discloses an adopt semiconductor refrigerator cooperation water-cooling system, through control the accurate accuse temperature cooling to the chip can be realized to semiconductor refrigerator's electric current size, and the produced heat of semiconductor refrigerator is taken away by water-cooling system, and water-cooling system's noise is very little, generally in 30dB to 45 dB.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic structural view of the heat dissipation assembly;
fig. 3 is a schematic structural diagram of an air-cooled heat dissipation structure for dissipating heat from a high-power chip.
Detailed Description
As shown in fig. 1 and fig. 2, in this embodiment, the present invention includes a water pump 1, a heat conducting block 2, a refrigerator 3, a heat dissipating assembly 4 and a heat exchanger 5, wherein the water pump 1, the heat dissipating assembly 4 and the heat exchanger 5 are communicated with each other through a water pipe 6, and the refrigerator 3 is disposed between the heat conducting block 2 and the heat dissipating assembly 4; the refrigerator 3 employs a semiconductor refrigerator 31.
According to the scheme, the semiconductor refrigerator 31 is adopted to control the temperature of the chip 7, specifically, the heat generated by the chip 7 passes through the heat conducting block 2, the heat conducting block 2 is in contact with the semiconductor refrigerator 31, the refrigerating capacity is controlled by controlling the current of the semiconductor refrigerator 31, so that the temperature of the heat conducting block 2 is controlled, the heat flowing out of the semiconductor refrigerator 31 is cooled by matching the water pump 1 with the heat exchanger 5, namely, the semiconductor refrigerator 31 is matched with a water-cooling heat dissipation system, so that the accurate temperature control of the high-power chip 7 is realized, the temperature control effect is good, and the cooling is rapid.
Preferably, as shown in fig. 1 and fig. 2, the heat dissipation assembly 4 includes a first water cooling block 41, a second water cooling block 42, a first base 43, and a second base 44, the first water cooling block 41 is disposed on the first base 43, the second water cooling block 42 is disposed on the second base 44, the first water cooling block 41 is adapted to the second water cooling block 42, the first water cooling block 41 is respectively communicated with the second water cooling block 42 and the water pump 1, and the second water cooling block 42 is communicated with the heat exchanger 5.
According to the scheme, the circulating cooling liquid flows among the first water cooling block 41, the second water cooling block 42 and the heat exchanger 5 under the action of the water pump 1, so that the heat flowing out of the semiconductor refrigerator 31 is sequentially cooled through the first water cooling block 41, the second water cooling block 42 and the heat exchanger 5, and the temperature control effect of the device on the chip 7 is effectively ensured; in this design, the heat conduction block 2 is mounted at the bottom of the first water cooling block 41.
Preferably, as shown in fig. 2, a constant-height screw 45 and a spring sleeved on the constant-height screw 45 are respectively disposed between the first water-cooling block 41 and the first base 43 and between the second water-cooling block 42 and the second base 44.
As can be seen from the above solution, the equal-height screws 45 and the springs are used to realize independent floating of the first water-cooling block 41 and the second water-cooling block 42 to adapt to the height difference of each chip 7, so as to ensure good contact between the heat-conducting block 2 and the chip 7.
Preferably, as shown in fig. 1 and fig. 2, fixing holes 46 adapted to the through holes of the chip are formed in both the first base 43 and the second base 44.
As can be seen from the above solution, the present device is mounted on the chip 7 by combining the fixing hole 46 and the chip through hole with a bolt, so that the heat conduction block 2 contacts the chip 7, and the heat generated by the chip 7 is conducted out through the heat conduction block 2.
Preferably, as shown in fig. 1, the heat exchanger 5 includes a casing 51, a plurality of cooling fins 52 disposed on the casing 51, and a plurality of cooling fans 53 mounted on the casing 51 and cooperating with the cooling fins 52.
As can be seen from the above solution, the circulating liquid transfers heat to the heat sink 52 with a large surface area, and the heat dissipation fan 53 on the heat sink 52 removes heat from the incoming air.
The utility model discloses specific theory of operation:
since the heat conduction block 2 is in contact with the chip 7, the heat generated from the chip 7 is transferred to the semiconductor cooler 31 via the heat conduction block 2, the semiconductor cooler 31 controls the temperature of the chip 7 by changing the magnitude of the current, the heat brought out by the semiconductor refrigerator 31 is cooled by a water-cooling heat dissipation system, specifically, the circulating liquid is cooled by the water pump 1, circulating between the first water cooling block 41, the second water cooling block 42 and the heat exchanger 5, when the circulating liquid passes through the first water cooling block 41 and the second water cooling block 42, heat is taken away, the circulating liquid flows through the heat exchanger 5 after the temperature of the circulating liquid is raised, the circulating liquid transfers the heat flowing out of the second water cooling block 42 to the radiating fins 52 on the heat exchanger 5, and the radiating fans 53 mounted on the radiating fins 52 take away the heat of the flowing air.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.
Claims (6)
1. The utility model provides an accurate accuse temperature structure of high-power chip which characterized in that: the heat dissipation device comprises a water pump (1), a heat conduction block (2), a refrigerator (3), a heat dissipation assembly (4) and a heat exchanger (5), wherein the water pump (1), the heat dissipation assembly (4) and the heat exchanger (5) are communicated with each other through a water pipe (6), and the refrigerator (3) is arranged between the heat conduction block (2) and the heat dissipation assembly (4).
2. The precise temperature control structure of a high-power chip according to claim 1, characterized in that: the heat dissipation assembly (4) comprises a first water cooling block (41), a second water cooling block (42), a first base (43) and a second base (44), the first water cooling block (41) is arranged on the first base (43), the second water cooling block (42) is arranged on the second base (44), the first water cooling block (41) is matched with the second water cooling block (42), the first water cooling block (41) is respectively communicated with the second water cooling block (42) and the water pump (1), and the second water cooling block (42) is communicated with the heat exchanger (5).
3. The precise temperature control structure of a high-power chip according to claim 2, characterized in that: equal-height screws (45) and springs sleeved on the equal-height screws (45) are arranged between the first water cooling block (41) and the first base (43) and between the second water cooling block (42) and the second base (44).
4. The precise temperature control structure of a high-power chip according to claim 2, characterized in that: and the first base (43) and the second base (44) are respectively provided with a fixing hole (46) matched with the chip through hole.
5. The precise temperature control structure of a high-power chip according to claim 1, characterized in that: the heat exchanger (5) comprises a machine shell (51), a plurality of radiating fins (52) arranged on the machine shell (51) and a plurality of radiating fans (53) which are arranged on the machine shell (51) and matched with the radiating fins (52).
6. The precise temperature control structure of a high-power chip according to claim 1, characterized in that: the refrigerator (3) adopts a semiconductor refrigerator (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022173383.6U CN213340350U (en) | 2020-09-29 | 2020-09-29 | Accurate temperature control structure of high-power chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022173383.6U CN213340350U (en) | 2020-09-29 | 2020-09-29 | Accurate temperature control structure of high-power chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213340350U true CN213340350U (en) | 2021-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022173383.6U Active CN213340350U (en) | 2020-09-29 | 2020-09-29 | Accurate temperature control structure of high-power chip |
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| Country | Link |
|---|---|
| CN (1) | CN213340350U (en) |
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2020
- 2020-09-29 CN CN202022173383.6U patent/CN213340350U/en active Active
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