CN219741019U - Radiator module and equipment cabinet - Google Patents

Abstract

The embodiment of the utility model provides a radiator module and an equipment cabinet, comprising: the heat radiator comprises a radiator main body and at least one micro-channel heat radiation module, wherein the micro-channel heat radiation module comprises a plurality of micro-channel structures; a module mounting area is arranged on the radiator main body; each of the microchannel heat dissipating modules is mounted in a module mounting area on the heat sink body. By means of a thermal design method, the heat area distribution of a main board to be radiated and the temperature resistance of each component are analyzed, the local area of the radiator main body is stripped, the stripped area is called a module installation area, a micro-channel radiating module with a corresponding shape is re-embedded into the radiator main body and fixed in the module installation area, and a complete radiator module is formed by the micro-channel radiating module and the radiator main body.

Description

Radiator module and equipment cabinet

Technical Field

The present utility model relates to the field of heat sinks, and in particular, to a heat sink module and an equipment chassis.

Background

High-power electronic equipment such as a communication base station, a server, power equipment and the like generally have higher requirements on the performance of a radiator.

Compared with the traditional pure metal radiator, the microchannel radiator has stronger temperature equalizing capability and can effectively improve the heat dissipation performance of equipment. However, in the case of a larger size of the heat sink or a complicated heat distribution, the application of the micro-channel heat sink is limited because the larger the size, the more complicated the manufacturing process, the more cost and reliability. Moreover, if the overall microchannel design of the heat sink is not matched with the heat distribution, heat dissipation performance may be less than expected.

Disclosure of Invention

The embodiment of the utility model aims to provide a radiator module and an equipment cabinet so as to achieve the purposes of reducing the radiator cost and improving the reliability of the radiator. The specific technical scheme is as follows:

in a first aspect, an embodiment of the present utility model provides a radiator module including: the heat radiator comprises a radiator main body and at least one micro-channel heat radiation module, wherein the micro-channel heat radiation module comprises a plurality of micro-channel structures; a module mounting area is arranged on the radiator main body; each of the microchannel heat dissipating modules is mounted in a module mounting area on the heat sink body.

Optionally, the heat spreader body includes a first substrate and a plurality of first fins; the first substrate is of a thin plate structure; the first tooth piece is of a thin sheet structure with the same width as the first base plate; each first tooth piece is vertically fixed on the first substrate according to a preset interval; and each first tooth piece and the first base plate are provided with a module installation area with a hollow groove structure.

Optionally, the micro-channel heat dissipation module includes a second substrate and a second tooth sheet; the micro-channel structure is arranged in the second tooth plate; the second substrate is of a thin plate structure; the second tooth piece is of a thin sheet structure with the same width as the second base plate; the plurality of second tooth plates are vertically fixed on the second substrate according to preset intervals.

Optionally, the height of the second tooth plate is higher than the height of the first tooth plate.

Optionally, the second substrate includes a first sheet and a second sheet; the second tooth plate is of a concave-shaped sheet structure with a notch at one side, and the convex structures at two sides of the second tooth plate are respectively fixed on the first sheet and the second sheet according to preset intervals.

Optionally, the second tooth sheet is an L-shaped sheet; the L-shaped sheet comprises a first section and a second section, wherein the first section and the second section are mutually perpendicular; the first section of the L-shaped sheet is arranged along the extending direction of the main board to be cooled, and the second section of the L-shaped sheet is perpendicular to the extending direction of the main board to be cooled.

Optionally, each microchannel heat dissipation module is detachably mounted on the heat sink body.

Optionally, each micro-channel heat dissipation module is welded on the heat dissipation body.

Optionally, the sum of the effective areas of the micro-channel heat dissipation modules is not greater than 50% of the effective area of the heat dissipation body.

In a second aspect, an embodiment of the present utility model provides an equipment chassis, including the radiator module, the motherboard and the chassis cover described in any one of the foregoing embodiments; the case cover is a shell matched with the radiator module, and the radiator module is embedded in the case cover; the main board is arranged on the radiator module and is positioned in the case cover.

Optionally, the main board comprises a low temperature area and a high temperature area; the position of the module installation area in the radiator module corresponds to the high-temperature area of the main board and/or the low-temperature resistant device area of the main board.

Optionally, the radiator module includes a first module mounting area and a second module mounting area; the first module installation area corresponds to the high temperature resistant device area of the main board, and the second module installation area corresponds to the low temperature resistant device area of the main board.

The embodiment of the utility model has the beneficial effects that:

the radiator module provided by the embodiment of the utility model comprises: the heat radiator comprises a radiator main body and at least one micro-channel heat radiation module, wherein the micro-channel heat radiation module comprises a plurality of micro-channel structures; a module mounting area is arranged on the radiator main body; each of the microchannel heat dissipating modules is mounted in a module mounting area on the heat sink body. The micro-channel radiator is modularized to be changed into a micro-channel radiating module, so that the size of the micro-channel radiator can be effectively reduced, the purposes of reducing cost and improving the reliability of quality are achieved, meanwhile, the micro-channel radiating module is installed in a proper module installation area according to the position of a cooling area on a main board, the radiating accuracy is improved, and the radiating performance is further improved.

Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.

FIG. 1 is a schematic diagram of a heat sink body with micro-channels embedded therein;

FIG. 2 is a schematic diagram of a micro-channel heat dissipation module according to an embodiment of the present utility model;

FIG. 3 is a schematic diagram of a device chassis according to an embodiment of the present utility model;

FIG. 4 is a cloud image of a motherboard temperature zone before heat dissipation;

FIG. 5 is a schematic diagram of a first structure of a heat sink module according to an embodiment of the utility model;

FIG. 6a is a schematic diagram of a second structure of a heat sink module according to an embodiment of the utility model;

FIG. 6b is a cloud chart illustrating the cooling effect of the motherboard of FIG. 6 a;

FIG. 6c is a cloud chart illustrating the cooling effect of the motherboard of FIG. 5;

FIG. 7a is a schematic diagram of a third configuration of a radiator module according to an embodiment of the utility model;

FIG. 7b is a cloud chart illustrating the cooling effect of the motherboard of FIG. 7 a;

FIG. 8a is a schematic diagram of a fourth embodiment of a heat sink module;

FIG. 8b is a cloud chart illustrating the cooling effect of the motherboard of FIG. 8 a;

FIG. 9a is a schematic diagram of a fifth configuration of a radiator module according to an embodiment of the utility model;

fig. 9b is a cloud chart of the cooling effect of the motherboard of fig. 9 a.

Reference numerals illustrate:

a radiator module 1, a main board 2, components 21 and a case cover 3;

the heat sink body 11, the first substrate 111, the first teeth 112,

microchannel heat dissipation module 12, microchannel structure 12-1

A second substrate 121, a first thin plate 121a, and a second thin plate 121b;

the second tooth 122, the first supporting leg 122a, the second supporting leg 122b, the connecting section 122c, the first section 122d and the second section 122e;

a module mounting region 13, a first module mounting region 13a, a second module mounting region 13b;

region (1), region (2), region (3), region (4), region (5).

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by the person skilled in the art based on the present utility model are included in the scope of protection of the present utility model.

In the related art, conventional heat sinks are generally made of aluminum alloy, copper alloy, and other materials. The heat conductivity coefficient of the high heat conduction aluminum is about 200W/mK, the heat conductivity coefficient of the high heat conduction copper is about 360W/mK, and the conventional radiator is difficult to meet the heat radiation requirement under the condition that the whole size of the high-power electronic equipment to be radiated is large and local high heat flow exists; however, compared with the conventional radiator, the micro-channel radiator with stronger temperature equalizing capability can greatly increase the manufacturing cost, and if the micro-channel design of the whole radiator is not matched with the heat distribution, the heat dissipation performance is not expected.

In order to solve the problems of the related art, such as failure to meet the heat dissipation requirement and high manufacturing cost, referring to fig. 1 to 6b, the present utility model provides a heat sink module 1, comprising: a radiator body 11 and at least one micro-channel heat dissipation module 12, wherein the micro-channel heat dissipation module 12 comprises a plurality of micro-channel structures 12-1; the radiator body 11 is provided with a module mounting area 13; each microchannel heat sink module 12 is mounted in a module mounting area 13 on the heat sink body 11.

As shown in fig. 1, the radiator body 11 is a conventional radiator, and is generally manufactured by adopting materials such as aluminum alloy, copper alloy and the like through technologies such as die casting, machining and the like, and the cost is low.

As shown in fig. 2, the micro-channel heat dissipation module 12 is a micro-channel heat sink with small volume, wherein the micro-channel heat sink commonly used in the market includes three types of heat-conducting tube type micro-channel heat sinks, expansion plate embedded type micro-channel heat sinks and welding type micro-channel heat sinks, and the micro-channel structure 12-1 with different forms exists on the heat sink by using different materials or processing technologies, and the three types of micro-channel heat sinks are not described in detail in the prior art. The micro-channel structure 12-1 is a physical structure for improving the heat dissipation effect of the heat sink, but the manufacturing cost is greatly increased by using the micro-channel heat sink in a large area due to the complicated process of the micro-channel heat sink.

By means of a thermal design method, the heat area distribution of a main board to be cooled (hereinafter referred to as a main board 2) and the temperature resistance of components of each component are analyzed, a local area of a radiator main body 11 is peeled off, the peeled area is called a module mounting area 13, a micro-channel cooling module 12 with a corresponding shape is re-embedded into the radiator main body 11 and is fixed in the module mounting area 13, and a complete radiator module 1 is formed by the micro-channel cooling module 12 and the radiator main body 11, and the radiator module 1 comprises a high-cooling performance module realized by the micro-channel cooling module 12 and a low-cost module realized by the radiator main body 11, so that the cooling performance is improved regionally and the cost is effectively reduced.

As shown in fig. 3, the equipment chassis includes a main board 2 that needs to dissipate heat through a radiator module 1, and a plurality of components 21 are disposed on the main board 2. As shown in fig. 4, the temperature cloud image of the main board 2 is divided into five areas with different temperatures, namely an area (1), an area (2), an area (3), an area (4) and an area (5), by utilizing the difference of the temperatures of the areas of the main board 2; according to the distribution condition of the components 21, different heat dissipation requirements exist in each region; when there is a high temperature region or a region where low temperature resistant components 21 are distributed (hereinafter referred to as a low temperature resistant device region) on the motherboard 2, it is necessary to improve the heat radiation performance of the radiator module 1 in the high temperature region and the low temperature resistant device region.

As an example, as shown in fig. 4, the area (1) is 117degC (degC is in degrees celsius), the area (2) is 121degC, the area (3) is 113degC, the area (4) is 112-113degC, and the area (5) is 111degC; the area (1) and the area (4) are high-temperature areas of the main board 2, namely, the heat radiation performance of the radiator module 1 in the area (2) and the area (4) needs to be improved; as shown in fig. 5, the positions on the radiator module 1 corresponding to the area (2) and the area (4) are set as module installation areas 13, micro-channel heat dissipation modules 12 are respectively embedded in the two module installation areas 13, and the area (2) and the area (4) are subjected to targeted high-performance heat dissipation, and experiments show that the heat dissipation effect is as shown in fig. 6c, the area (1) is 116degC (degC is in degrees celsius), the area (2) is 117degC, the area (3) is 112degC, the area (4) is 110-111degC, and the area (5) is 113degC; the temperature of the region (2) and the region (4) is effectively reduced.

As another example, as shown in fig. 4, the temperatures of the region (1) and the region (3) are high and the distribution is uneven, which affects the long-term reliability of the component 21. As shown in fig. 6a, the positions on the radiator module 1 corresponding to the area (1) and the area (3) are set as module installation areas 13, micro-channel heat dissipation modules 12 are respectively embedded in the two module installation areas 13, and the area (1) and the area (3) are subjected to targeted high-performance heat dissipation, and experiments show that the heat dissipation effect is as shown in fig. 6b, the area (1) is 113degC (degC is in degrees centigrade), the area (2) is 118-119degC, the area (3) is 111degC, the area (4) is 114-115degC, and the area (5) is 112-113degC; the temperature of the region (1) and the region (3) is effectively reduced.

As yet another example, as shown in fig. 4, the area (1) is a low temperature resistant device area of the motherboard 2, that is, it is required to improve the heat radiation performance of the heat sink module 1 in the area (1); as shown in fig. 8a, the position, corresponding to the area (1), on the radiator module 1 is set as a module mounting area 13, a micro-channel radiating module 12 is embedded in the module mounting area 13, and the area (1) is subjected to targeted high-performance radiation, and experiments show that the radiating effect is as shown in fig. 8b, and the temperature of the area (1) is effectively reduced.

Alternatively, as shown in fig. 1, the heat sink body 11 includes a first base plate 111 and a plurality of first teeth 112; the first substrate 111 has a thin plate structure; the first tooth 112 has a thin sheet structure having the same width as the first substrate 111; each first tooth piece 112 is vertically fixed on the first substrate 111 at a preset interval; as shown in fig. 5 and 6a, each of the first tooth plate 112 and the first base plate 111 is provided with a module mounting region 13 having a hollow structure.

The first substrate 111 is a rectangular plate for fixing the first teeth 112, the first substrate 111 and the first teeth 112 have two long sides and two short sides, and the first teeth 112 are equal in width to the first substrate 111, that is, the first teeth 112 are equal in length to the long sides of the first substrate 111. The radiator main body 11 mainly realizes heat radiation by the first tooth piece 112; the plurality of first teeth 112 are disposed on the first substrate 111 at predetermined intervals in order to improve heat dissipation efficiency and achieve uniform heat dissipation. The tooth sheet is generally made of a metal sheet with smaller specific heat, the heat absorption speed and the heat dissipation speed are both high, and the effect of rapid heat dissipation is achieved through heat transfer. The surface area of the tooth piece is as large as possible, so that air circulation is facilitated, and heat dissipation is accelerated.

The shape of the tooth piece is not limited to the traditional straight teeth, V teeth and the like, and the tooth piece can be designed into inclined teeth, corrugated teeth, radial teeth and the like according to actual heat dissipation requirements.

Optionally, as shown in fig. 2, the micro-channel heat dissipation module 12 includes a second substrate 121 and a second tooth 122; the micro-channel structure 12-1 is disposed within the second tooth 122; the second substrate 121 has a thin plate structure; the second tooth 122 has a thin sheet structure having the same width as the second substrate 121; the plurality of second teeth 122 are vertically fixed on the second substrate 121 at a predetermined interval.

The second substrate 121 is a rectangular plate for fixing the second tooth 122, and the second substrate 121 and the second tooth 122 have two long sides and two short sides, and the second tooth 122 is equal in width to the second substrate 121, that is, the second tooth 122 is equal in length to the long sides of the second substrate 121. The second substrate 121 is used for fixing the second teeth 122, and the radiator body 11 mainly relies on the second teeth 122 to dissipate heat; the plurality of second teeth 122 are disposed on the second substrate 121 at predetermined intervals in order to improve heat dissipation efficiency and achieve uniform heat dissipation.

The research shows that when the size of the flow channel is smaller than 3mm, the gas-liquid two-phase flow and phase change heat transfer rule is different from the conventional size, and the smaller the size of the flow channel is, the more obvious the size effect is, and when the size of the flow channel is smaller than 0.5-1 mm, the convection heat transfer coefficient in the flow channel can be increased by 50% -100%; by providing one or more micro-channel structures 12-1 within the interlayer of the second teeth 122, the efficiency of the second teeth 122 is effectively improved, thereby accelerating heat dissipation.

Optionally, the height of the second teeth 122 is higher than the height of the first teeth 112.

As shown in fig. 7a, the height of the second tooth 122 is higher than that of the first tooth 112, which means that the surface area of the second tooth 122 is larger than that of the first tooth 112, and the larger the surface area of the tooth, the faster the heat dissipation speed, and the heat dissipation performance of the micro-channel heat dissipation module 12 is further improved. As shown in fig. 4 and 7a, the microchannel heat dissipation module 12 is disposed at the position corresponding to the region (1) and the region (2), and the second tooth plate 122 is raised, so that the heat dissipation performance of the region (1) and the region (2) is improved, and the temperature of other regions is not increased. Compared with the scheme of integrally adding the radiator tooth plates in the related art, the scheme of locally adding the second tooth plates 122 to improve the heat radiation performance is more cost-effective. Experiments show that the heat dissipation effect is shown in fig. 7b, the temperature of the area (1) is 102degC (degC is in degrees centigrade), the temperature of the area (2) is 104degC, the temperature of the area (3) is 102degC, the temperature of the area (4) is 105-107degC, the temperature of the area (5) is 106degC, the temperature of the area (1) and the temperature of the area (2) are obviously reduced, and the temperature of the area (3), the temperature of the area (4) and the temperature of the area (5) are reduced.

Alternatively, as shown in fig. 8a, the second substrate 121 includes a first thin plate 121a and a second thin plate 121b; the second teeth 122 has a concave sheet structure with a notch at one side, and the convex structures at two sides of the second teeth 122 are respectively fixed on the first sheet 121a and the second sheet 121b at preset intervals.

The protruding structures at two sides of the second tooth piece 122 are respectively a first supporting leg 122a and a second supporting leg 122b in fig. 8a, and the first supporting leg 122a and the second supporting leg 122b are connected through a connecting section 122 c; when the temperature of the low temperature resistant device region exceeds the temperature resistant limit of the low temperature resistant device and the current temperature of the rest regions has a heating allowance, heat can be transferred from the micro-channel heat dissipation module 12 at the first support leg 122a to the micro-channel heat dissipation module 12 at the second support leg 122b through the micro-channel heat dissipation module 12 at the first support leg 122a, so that heat transfer between the regions is realized.

As shown in fig. 4 and 8a, when the temperature of the area (1) exceeds the temperature tolerance limit of the low temperature resistant device in the area (1), the micro-channel heat dissipation module 12 at the first support leg 122a is arranged in the area (1), the micro-channel heat dissipation module 12 at the second support leg 122b is arranged in the area (5), and heat transfer from the area (1) to the area (5) is realized through the micro-channel heat dissipation module 12 at the connecting section 122c, so that the temperature of the area (1) meets the requirement of the reliability of the low temperature resistant device. Experiments show that the heat dissipation effect is shown in fig. 8b, the temperature of the area (1) is 110degC (degC is in degrees centigrade), the temperature of the area (2) is 120degC, the temperature of the area (3) is 119degC, the temperature of the area (4) is 116-118degC, the temperature of the area (5) is 112-113degC, the temperature of the area (1) is obviously reduced, and the temperature of other areas is increased.

Alternatively, as shown in fig. 3 and 9a, the second tooth 122 is an L-shaped thin sheet; the L-shaped sheet includes a first section 122d and a second section 122e, the first section 122d being perpendicular to the second section 122e; the first sections 122d of the L-shaped thin sheets are disposed along the extending direction of the motherboard 2 to be heat-dissipated, and the second sections 122e of the L-shaped thin sheets are disposed perpendicular to the extending direction of the motherboard 2 to be heat-dissipated.

When the radiator module 1 radiates heat, the heat is transferred along the directions of the first tooth piece 112 and the second tooth piece 122, and when the radiator module 1 is vertically placed along the gravity direction, according to the natural convection principle, the heat flows along the tooth pieces to the top end of the main board 2 to be radiated, so that the temperature of the upper half part of the main board 2 to be radiated is higher. The second tooth piece 122 is arranged into an L-shaped thin sheet, so that heat can be led out to two sides of the main board 2 to be cooled, and the temperature of the upper half part of the main board 2 to be cooled can be effectively controlled.

As shown in fig. 4 and 9a, the radiator module 1 is vertically installed on the motherboard 2, the area (3), the area (4) and the area (5) are located at the bottom of the motherboard 2, the microchannel heat dissipation module 12 is disposed at the positions corresponding to the area (3), the area (4) and the area (5), the first section 122d and the second section 122e of the second tooth piece 122 are mutually perpendicular, and heat flows from the first section 122d located at the bottom of the motherboard 2 to the second section 122e located at two sides of the motherboard 2, and dissipates heat to two sides of the motherboard 2, so that the heat is prevented from flowing upwards through the area (1) and the area (2) due to gravity convection. Experiments show that the heat dissipation effect is shown in fig. 9b, the area (1) is 114degC (degC is in degrees celsius), the area (2) is 117-118degC, the area (3) is 109degC, the area (4) is 108degC, the area (5) is 107degC, and the temperatures of all the areas are obviously reduced.

The mounting mode of the radiator module 1 is not limited to vertical mounting, and mounting in other directions can be adopted according to actual requirements under the condition of process permission.

Alternatively, each microchannel heat module 12 may be detachably mounted on the heat sink body 11.

In the electronic industry, three-proofing refers to mould proofing, moisture proofing and salt mist proofing, and is a protection for three-stage products. When the requirements on the three-proofing or structural strength of the radiator module 1 are low, the micro-channel radiating module 12 can be detachably mounted on the radiator main body 11 by adopting a screw and the like, so that the maintenance cost is saved while the disassembly, the replacement and the maintenance are convenient.

Alternatively, each microchannel heat sink module 12 is welded to the heat sink body 11.

When the requirements on the three-proofing or structural strength of the radiator module 1 are high, the micro-channel radiating module 12 can be welded on the radiator main body 11, and the welding is stable and firm, so that the requirements on the three-proofing and structural strength of the radiator module 1 are ensured.

Optionally, the sum of the effective areas of the micro-channel heat dissipation modules 12 is not more than 50% of the effective area of the heat sink body 11.

The effective area of the micro-channel heat dissipation module 12 is the area where the micro-channel heat dissipation module 12 contacts the motherboard 2, and the effective area of the heat sink body 11 is the area where the heat sink body 11 contacts the motherboard 2.

The larger the proportion of the microchannel heat dissipating module 12 is, the more obvious the effect of improving the heat dissipating performance of the heat sink is. But the sum of the effective areas of the micro-channel heat dissipation modules 12 should be less than 50% of the effective area of the heat sink body 11 in consideration of heat dissipation performance, reliability, and cost.

Referring to fig. 3, another aspect of the embodiment of the present utility model provides an equipment chassis, including the radiator module 1, the motherboard 2, and the chassis cover 3 of any of the above embodiments; the case cover 3 is a shell matched with the radiator module 1, and the radiator module 1 is embedded in the case cover 3; the motherboard 2 is mounted on the radiator module 1 and is located in the chassis cover 3.

The mainboard 2 passes through the inboard of screw installation at radiator module 1, and the radiator module 1 is inlayed through forms such as screw or sticky in case lid 3 with radiator module 1, seals in the inside of case mainboard 2, plays sealed dirt-proof effect. The components 21 on the motherboard 2 are formed by heat-conductive interface materials such as: the heat conducting pad, the heat conducting gel, the heat conducting silicone grease and the like are attached to the radiator module 1; the heat generated by the components 21 and the main board 2 in the working state is dissipated to the surrounding environment through the radiator module 1, so that the heat dissipation of the main board 2 and the components 21 is realized.

Alternatively, as shown in fig. 4 to 9a, the main board 2 includes a low temperature region and a high temperature region; the location of the module mounting region 13 in the radiator module 1 corresponds to the high temperature region of the motherboard 2 and/or the low temperature resistant device region of the motherboard 2.

In order to reduce and equalize the temperature of the motherboard 2, it is generally necessary to reduce the temperature in a high temperature region having a relatively high temperature and a high temperature region having a non-uniform temperature, so that the position of the module mounting region 13 in the radiator module 1 corresponds to the high temperature region of the motherboard 2.

In addition, different components 21 are arranged on each area, wherein the low temperature resistant components are included, the reliability of the low temperature resistant Wen Yuan components in a high temperature environment is greatly reduced, and the low temperature resistant component area needs to be cooled in order to ensure the reliability of the components 21, so that the position of the module mounting area 13 in the radiator module 1 corresponds to the low temperature resistant component area of the main board 2.

Alternatively, as shown in fig. 8a, the radiator module 1 includes a first module mounting area 13a and a second module mounting area 13b; the first module mounting region 13a corresponds in position to a high temperature resistant region of the motherboard 2, and the second module mounting region 13b corresponds to a low temperature resistant device region of the motherboard 2.

The first module mounting region 13a and the second module mounting region 13b are respectively provided in the low temperature resistant device region and the high temperature resistant device region of the motherboard 2, so that heat in the low temperature resistant device region can flow to the high temperature resistant device region. The heat generation amount of the unit area of the high temperature resistant device area is lower than that of the unit area of the low temperature resistant device area, and reverse exchange of heat is avoided.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model are included in the protection scope of the present utility model.

Claims (12)

1. A heat sink module, comprising: the heat radiator comprises a radiator main body and at least one micro-channel heat radiation module, wherein the micro-channel heat radiation module comprises a plurality of micro-channel structures;

a module mounting area is arranged on the radiator main body;

each of the microchannel heat dissipating modules is mounted in a module mounting area on the heat sink body.

2. The heat sink module of claim 1, wherein the heat sink body comprises a first base plate and a plurality of first fins;

the first substrate is of a thin plate structure;

the first tooth piece is of a thin sheet structure with the same width as the first base plate;

each first tooth piece is vertically fixed on the first substrate according to a preset interval;

and each first tooth piece and the first base plate are provided with a module installation area with a hollow groove structure.

3. The heat sink module of claim 2, wherein the microchannel heat sink module comprises a second substrate, a second tooth; the micro-channel structure is arranged in the second tooth plate;

the second substrate is of a thin plate structure;

the second tooth piece is of a thin sheet structure with the same width as the second base plate;

the plurality of second tooth plates are vertically fixed on the second substrate according to preset intervals.

4. A radiator module according to claim 3, wherein the height of the second tooth is higher than the height of the first tooth.

5. The heat sink module of claim 3, wherein the second substrate comprises a first sheet and a second sheet;

the second tooth plate is of a concave-shaped sheet structure with a notch at one side, and the convex structures at two sides of the second tooth plate are respectively fixed on the first sheet and the second sheet according to preset intervals.

6. A radiator module according to claim 3, wherein the second tooth is an L-shaped sheet;

the L-shaped sheet comprises a first section and a second section, wherein the first section and the second section are mutually perpendicular;

the first section of the L-shaped sheet is arranged along the extending direction of the main board to be cooled, and the second section of the L-shaped sheet is perpendicular to the extending direction of the main board to be cooled.

7. The heat sink module of any one of claims 4-6, wherein each of the microchannel heat sink modules is removably mounted to the heat sink body.

8. The heat sink module of any one of claims 4-6, wherein each of the microchannel heat sink modules is welded to the heat sink body.

9. The heat sink module of any one of claims 4-6, wherein the sum of the effective areas of the microchannel heat sink modules is no greater than 50% of the effective area of the heat sink body.

10. An equipment cabinet, which is characterized by comprising the radiator module, a main board and a cabinet cover according to any one of claims 1-9;

the case cover is a shell matched with the radiator module, and the radiator module is embedded in the case cover;

the main board is arranged on the radiator module and is positioned in the case cover.

11. The equipment cabinet of claim 10, wherein the motherboard includes a low temperature zone and a high temperature zone;

the position of the module installation area in the radiator module corresponds to the high-temperature area of the main board and/or the low-temperature resistant device area of the main board.

12. The equipment cabinet of claim 10, wherein the heat sink module comprises a first module mounting area and a second module mounting area;

the first module installation area corresponds to the high temperature resistant device area of the main board, and the second module installation area corresponds to the low temperature resistant device area of the main board.