CN114842749B - Display module and display device - Google Patents
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- CN114842749B CN114842749B CN202210467981.5A CN202210467981A CN114842749B CN 114842749 B CN114842749 B CN 114842749B CN 202210467981 A CN202210467981 A CN 202210467981A CN 114842749 B CN114842749 B CN 114842749B
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- 230000008859 change Effects 0.000 claims description 5
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- 238000004806 packaging method and process Methods 0.000 abstract description 10
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- 125000006850 spacer group Chemical group 0.000 description 6
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- 238000010008 shearing Methods 0.000 description 5
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- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 238000009833 condensation Methods 0.000 description 1
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- 229910052802 copper Inorganic materials 0.000 description 1
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- 239000000945 filler Substances 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The embodiment of the application provides a display module and a display device. The display module includes: the display panel comprises a transparent cover plate, a display panel and a heat conduction assembly; the transparent cover plate is attached to the first surface of the display panel, the heat conduction assembly is attached to the second surface of the display panel, the first surface is the surface of the display panel, and the second surface is the surface opposite to the first surface; the surface that transparent apron and display panel contacted is provided with the connection base, and connection base and heat conduction subassembly are connected to make the display panel attached between transparent apron and heat conduction subassembly. Therefore, the problem that the packaging layer of the display module is invalid under special working conditions can be solved, the service life of the display module is prolonged, the display module can cope with complex working condition use environments, and the use range of the display module is not limited.
Description
Technical Field
The application relates to the technical field of vehicle-mounted display, in particular to a display module and a display device.
Background
With the development of technology, display devices for operation or entertainment of operators, such as on-board displays on vehicles and on-board displays on numerical control machines, are equipped on many machines or devices. The display device generally includes a display module including a glass cover plate and a display panel including a package layer, an organic light emitting layer, and a substrate. The organic light emitting layer is disposed between the substrate and the encapsulation layer. Wherein, the packaging layer is usually a mixed structure layer of silicon nitride, an organic layer and silicon nitride.
However, under the condition that the display device is applied to a machine or a device with complex application scenes such as a vehicle or a numerical control machine tool, when the display device is used under the working condition of high temperature or strong vibration, the strength of the packaging layer is low, and the packaging layer of the display panel is very easy to fail under the action of tensile force or shearing external force, so that the service life of the display module is shortened, the use requirement of the display module under the special working condition cannot be met, and the use range of the display device is further limited.
Disclosure of Invention
The embodiment of the application provides a display module and a display device, which are used for solving the problem that a packaging layer of a display panel in the related art fails under the action of tensile force or shearing external force.
In order to solve the technical problems, the application is realized as follows:
in a first aspect, an embodiment of the present application provides a display module, including: the display panel comprises a transparent cover plate, a display panel and a heat conduction assembly;
the transparent cover plate is attached to the first surface of the display panel, the heat conduction assembly is attached to the second surface of the display panel, the first surface is the surface where the display surface of the display panel is located, and the second surface is the surface opposite to the first surface;
the transparent cover plate is provided with a connecting base on the surface contacted with the display panel, and the connecting base is connected with the heat conduction component so that the display panel is attached between the transparent cover plate and the heat conduction component.
Optionally, the heat conduction assembly comprises a flexible heat conduction gasket and a heat dissipation module;
the heat dissipation module comprises a top surface, a bottom surface opposite to the top surface and a side surface intersecting with the bottom surface;
the flexible heat conduction gasket is attached between the second surface of the display panel and the top surface of the heat dissipation module, and the top surface of the heat dissipation module is connected with the connecting base, so that the display panel is pressed between the flexible heat conduction gasket and the transparent cover plate.
Optionally, the display module further comprises a flip chip film and a circuit board;
the display panel is electrically connected with the circuit board through the flip chip film, and the circuit board is fixed on the side face of the heat dissipation module.
Optionally, a fixing table is provided on a side surface of the heat dissipation module, and the circuit board is fixed on the fixing table.
Optionally, the corner of the surface where the transparent cover plate and the display panel are contacted is provided with a connecting base;
the end parts of the two side surfaces of the heat radiation module are provided with connecting bosses, the connecting bosses are detachably connected with the connecting base, and the circuit board is fixed between the two connecting bosses of the side surfaces of the heat radiation module.
Optionally, the connection base and the connection boss are detachably connected through threads or buckles.
Optionally, the heat dissipation module includes a plurality of heat conduction through grooves;
the heat conduction through groove penetrates from the top surface of the heat dissipation module to the bottom surface of the heat dissipation module.
Optionally, the distance between two adjacent heat conducting through grooves is equal.
Optionally, at least one of a fan radiator, a water-cooled radiator, a heat pipe radiator or a phase change radiator is further arranged in the heat dissipation module.
In a second aspect, an embodiment of the present application provides a display device, where the display device includes the display module set according to any one of the embodiments.
In the embodiment of the application, since the transparent cover plate is attached to the first surface of the display panel, and the heat conducting component is attached to the second surface of the display panel, the display panel is located between the transparent cover plate and the heat conducting component. The transparent cover plate is connected with the heat conduction assembly, so that the display panel is fixedly pressed between the heat conduction assemblies of the display panel, heat generated by the display panel can be dissipated through the heat conduction assemblies on one hand, the force conduction path of the display panel is changed on the other hand, the display module is prevented from being stretched under special working conditions, the problem that the packaging layer of the display module fails under the special working conditions is solved, the service life of the display module is prolonged, the display module can deal with complex working condition use environments, and the use range of the display module is not limited.
Drawings
Fig. 1 shows one of schematic structural diagrams of a display module provided in an embodiment of the present application;
fig. 2 is a schematic diagram of an exploded structure of a display module according to an embodiment of the present disclosure;
fig. 3 is an assembly schematic diagram of a display module according to an embodiment of the present application;
FIG. 4 is a schematic view of an assembly of a transparent cover plate and a flexible thermally conductive gasket according to an embodiment of the present application;
fig. 5 shows a second schematic structural diagram of a display module according to an embodiment of the present application.
Reference numerals:
10: a transparent cover plate; 20: a display panel; 30: a heat conducting component; 40: a flip chip film; 50: a circuit board; 101: the base is connected; 301: a flexible thermally conductive gasket; 302: a heat dissipation module; 3021: a connecting boss; 3022: and a heat conduction through groove.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
The embodiment of the application provides a display module, fig. 1 is a schematic structural diagram of the display module provided by the embodiment of the application, fig. 2 is a schematic explosion structural diagram of the display module provided by the embodiment of the application, fig. 3 shows an assembly schematic diagram of the display module provided by the embodiment of the application, as shown in fig. 1, fig. 2 and fig. 3, and the display module includes: a transparent cover plate 10, a display panel 20, and a heat conductive member 30; the transparent cover plate 10 is attached to a first surface of the display panel 20, and the heat conducting component 30 is attached to a second surface of the display panel 20, wherein the first surface is a surface of the display panel 20 where the display surface is located, and the second surface is a surface opposite to the first surface; a connection base 101 is provided on a surface of the transparent cover plate 10 in contact with the display panel 20, and the connection base 101 is connected with the heat conductive member 30 so that the display panel 20 is attached between the transparent cover plate 10 and the heat conductive member 30.
The display panel 20 may include an encapsulation layer, an organic light emitting layer, and a substrate, among others. The organic light emitting layer is disposed between the substrate and the encapsulation layer. The packaging layer is a mixed structure layer of silicon nitride, an organic layer and silicon nitride, so that the structure of the packaging layer is easy to fail under the action of external tensile force or shearing force.
Based on this, in order to avoid the failure of the package layer of the display panel 20 and the failure of the organic light emitting layer of the display panel 20, the service life of the display module is reduced. In the embodiment of the present application, the transparent cover plate 10 is attached to the first surface of the display panel 20, and the heat conductive member 30 is attached to the second surface of the display panel 20. The first surface is a surface of the display panel 20 where the display surface is located, that is, the first surface is a plane of the surface of the touch layer of the display panel 20, and the second surface is a surface opposite to the first surface of the display panel 20, that is, the second surface is a plane of the surface of the back plate of the display panel 20.
Because be provided with on the surface that transparent apron 10 and display panel 20 contacted and connect base 101, connect base 101 and heat conduction subassembly 30 to make display panel 20 attach between transparent apron 10 and heat conduction subassembly 30, on the one hand can guarantee that the heat that display panel 20 produced can dispel the heat through heat conduction subassembly 30, on the other hand can be fixed transparent apron 10 and display panel 20 through heat conduction subassembly 30, and then prevent that display panel 20 from receiving the tensile effect.
It should be noted that, the connection base 101 and the heat conducting component 30 may be fixed by any connection method such as a bolt, a buckle, or welding, which is not limited in the embodiment of the present application. When the connection base 101 and the heat conduction assembly are detachably connected through bolts or buckles, the transparent cover plate 10 and the heat conduction assembly 30 are more conveniently separated when the heat conduction assembly 30 is damaged or repair and maintenance are needed.
In addition, it should be noted that, the glass cover plate and the display panel 20 provided in the embodiments of the present application may be a planar structure, or may be a flexible structure, and the flexible structure may include flexible shapes such as a two-sided bending type, an S-type, a C-type, and the like, which is not limited in the embodiments of the present application.
As can be seen from the above-described embodiments, in the present embodiment, since the transparent cover plate 10 is attached on the first surface of the display panel 20 and the heat conductive member 30 is attached on the second surface of the display panel 20, the display panel 20 is positioned between the transparent cover plate 10 and the heat conductive member 30. And because the surface that transparent apron 10 and display panel 20 contacted is provided with connection base 101, connection base 101 and heat conduction subassembly 30 are connected, consequently, make display panel 20 by fixed compress tightly between the heat conduction subassembly 30 of display panel 20, on the one hand can dispel the heat through heat conduction subassembly 30 with the heat that display panel 20 produced, on the other hand make the power conduction route of display panel 20 change, can avoid under special operating mode display module assembly receive stretching action, and then the problem that the encapsulation layer that the display module assembly caused under special operating mode is inefficacy has been solved, the life of display module assembly has been prolonged, and make the display module assembly can deal with the operating mode service environment of comparatively complicacy, make the application range of display module assembly not limited.
In order to further reduce the stretching effect of the display module under the special working condition and further improve the heat dissipation effect of the heat conduction assembly 30, in the embodiment of the present application, as shown in fig. 3 and fig. 4, the heat conduction assembly 30 includes a flexible heat conduction pad 301 and a heat dissipation module 302; the heat dissipation module 302 includes a top surface, a bottom surface opposite the top surface, and a side surface intersecting the bottom surface; the flexible heat conductive pad 301 is attached between the second surface of the display panel 20 and the top surface of the heat dissipation module 302, and the top surface of the heat dissipation module 302 is connected to the connection base 101, so that the display panel 20 is pressed between the flexible heat conductive pad 301 and the transparent cover plate 10.
It should be noted that the flexible heat-conducting pad may be a material that can be deformed to a certain extent, such as a flexible graphite heat-conducting sheet, a flexible silicon sheet, or a heat-conducting foam, and can conduct heat. The heat dissipation module 302 is a cuboid-shaped heat conduction member, the heat dissipation module 302 includes a top surface, a bottom surface opposite to the top surface, and a side surface intersecting with the bottom surface, and the top surface of the heat dissipation module 302 is in contact with the flexible heat conduction pad 301. The heat dissipation module 302 may be a metal heat conductive material, such as silver, copper, iron, aluminum, or a non-metal heat conductive material, such as rubber, graphite, which is not limited in this embodiment. Because the heat conduction gasket is attached between the second surface of the display panel 20 and the top surface of the heat dissipation module 302, the top surface of the heat dissipation module 302 is connected with the connection base 101, so that the flexible heat conduction gasket 301 is located between the display panel 20 and the heat dissipation module 302, and the flexible heat conduction gasket 301 is extruded when the heat dissipation module 302 is connected with the transparent cover plate 10, the flexible heat conduction gasket 301 deforms towards the display panel 20 or towards the heat dissipation module, and then the transparent cover plate 10, the display panel 20 and the flexible heat conduction gasket form an integral structure, so that the force is closed, and the display panel 20 cannot be influenced by gravity of other structures to generate shearing action, so that the packaging layer fails. Meanwhile, under the buffer action of the flexible heat conducting gasket, the display panel 20 can be effectively prevented from being stretched.
In addition, under the action of the flexible heat-conducting gasket, no gap exists between the display panel 20 and the heat-radiating module 302, so that the thermal resistance of the display panel 20 is reduced, and heat generated by the display panel 20 can be radiated through the flexible heat-conducting gasket and the heat-radiating module 302.
In addition, in some embodiments, the display module further includes a flip-chip film 40 and a circuit board 50, the display panel 20 is electrically connected to the circuit board 50 through the flip-chip film 40, and the circuit board 50 is fixed on a side surface of the heat dissipation module 302.
The flip chip film 40 is a die pad for fixing the integrated circuit on the substrate of the display panel 20 to the circuit board 50. In this way, after the display panel 20 is electrically connected to the circuit board 50 through the flip chip film 40, the circuit board 50 is disposed on the side surface of the heat dissipation module, on one hand, the heat generated by the circuit board 50 can be conducted out through the heat dissipation module, so that the heat generated by the circuit board 50 is prevented from generating a heat source effect on the display panel 20, and further the service life of the display panel 20 is prolonged. On the other hand, the circuit board 50 can be supported by the heat dissipation module 302, so that the weight of the circuit board 50 is borne by the heat dissipation module 302, and further, the effect of the circuit board 50 on the display panel 20 can be avoided, and the structural integrity of the display panel 20 is further effectively ensured.
Optionally, a fixing stand is provided on a side surface of the heat dissipation module 302, and the circuit board 50 is fixed on the fixing stand. Thus, the circuit board 50 is fixed by the fixing table, and meanwhile, a certain limit can be formed on the circuit board 50 by the fixing table, so that the circuit board 50 is prevented from being shifted. It should be noted that, the circuit board 50 may be disposed on the fixing table through the heat-conducting adhesive, the heat-conducting adhesive may be silica gel formed by mixing polymer materials such as an organic silica gel as a main body, and a filler and a heat-conducting material, so that the heat-conducting adhesive has better heat conduction and electrical insulation properties, and thus, the heat-conducting path of the circuit board 50 may be perfected while the circuit board 50 is fixed, and heat dissipation of the circuit board 50 through the heat dissipation module 302 is more facilitated.
Specifically, a connection base 101 is disposed at a corner of the surface where the transparent cover plate 10 and the display panel 20 contact; the ends of both sides of the heat dissipation module 302 are provided with connection bosses 3021, the connection bosses 3021 are detachably connected to the connection base 101, and the circuit board 50 is fixed between the two connection bosses 3021 of the sides of the heat dissipation module 302.
It should be noted that, taking the transparent cover plate 10 as a square cover plate and the heat dissipation module 302 as a square block structure as an example, four corners of the surface where the transparent cover plate 10 and the display panel 20 contact each other are provided with a connection base 101, and two end portions of two side surfaces of the heat dissipation module 302 are provided with a connection boss 3021. The connection base 101 protrudes from the contact surface of the transparent cover plate 10 and the display panel 20, and the connection boss 3021 protrudes from the side surface of the heat dissipation module 302. In this way, when the cover glass is connected with the heat dissipation module 302, the connection between the display panel 20 and the heat dissipation module 302 cannot be affected due to the arrangement of the connection base 101, meanwhile, the circuit board 50 can be fixed between two connection bosses 3021 on the side surface of the heat dissipation module 302, and then the two connection bosses 3021 arranged on the same side surface form a limiting effect on the circuit board 50, so that the circuit board 50 is prevented from being shifted, meanwhile, a certain protection can be formed on the circuit board 50 through the connection bosses 3021, and the heat dissipation path of the circuit board 50 can be increased through the two connection bosses 3021, so that the heat dissipation of the circuit board 50 is accelerated, and the service life of the circuit board 50 is prolonged.
Furthermore, in some embodiments, the connection base 101 and the connection boss 3021 are detachably connected by threads or snaps. Specifically, in the case of detachable connection between the connection base 101 and the connection boss 3021 through threads, a threaded connection hole may be formed in the connection boss 3021, a screw is disposed at an end portion of the connection base 101, and detachable connection between the connection base 101 and the connection boss 3021 is achieved through connection between the screw and the threaded connection hole. Under the condition that the connection base 101 and the connection boss 3021 are detachably connected through a buckle, a clamping hole can be formed in the connection boss 3021, a clamping head is arranged at the end part on the connection base 101, and the connection base 101 and the connection boss 3021 are detachably connected through the clamping of the clamping head and the clamping groove. In this way, whether the connection base 101 and the connection boss 3021 are detachably connected through threads, or the connection base 101 and the connection boss 3021 are detachably connected through a buckle, the heat dissipation module 302 and the transparent cover plate 10 can be detachably connected, and when the heat dissipation module 302 is damaged or needs to be repaired and maintained, the transparent cover plate 10 and the heat dissipation module 302 are more conveniently separated.
In addition, to further enhance the heat dissipation capability of the heat conduction assembly 30, in the embodiment of the present application, the heat dissipation module 302 includes a plurality of heat conduction through grooves 3022; the heat conducting through groove 3022 penetrates from the top surface of the heat dissipating module 302 to the bottom surface of the heat dissipating module 302.
It should be noted that, since the heat conducting through groove 3022 penetrates from the top surface of the heat dissipating module 302 to the bottom surface of the heat dissipating module 302, the heat transferred from the display panel 20 to the flexible heat conducting pad can be transferred through the heat conducting through groove 3022, which is more beneficial to the rapid transfer of the heat of the display panel 20, and further enhances the heat dissipating effect of the heat dissipating module 302.
Optionally, the spacing between two adjacent heat conducting through grooves 3022 is equal. In this way, the heat dissipation capacity of each part of the heat dissipation module 302 is the same, which is more beneficial to ensuring uniform heat dissipation of the display panel 20 and avoiding damage to the display panel 20 caused by uneven local heat dissipation of the display panel 20.
In some embodiments, at least one of a fan radiator, a water cooled radiator, a heat pipe radiator, or a phase change radiator is also provided in the heat dissipating module 302. For example, in the case that a fan radiator is disposed in the heat dissipation module 302, a mounting hole may be formed in the heat dissipation module 302, and a fan is installed in the mounting hole, and the fan may be driven to rotate by disposing a driving component in the heat dissipation module 302, so that heat is transferred, and thus a heat dissipation effect is achieved. In the case that the heat dissipation module is a water-cooled heat sink, an installation groove can be formed in the heat dissipation module 302, so that the heat dissipation tube is installed in the installation groove, and heat dissipation is performed by using the circulation of cooling liquid in the heat dissipation tube, so that the heat absorption effect is achieved. In the case that the heat-pipe radiator is disposed in the heat-dissipating module 302, an installation groove may be formed in the heat-dissipating module 302, so that the heat-dissipating module 302 is installed in the installation groove, and when the heat-pipe radiator is running, heat can be continuously absorbed in the process of continuous evaporation and condensation, so as to achieve the heat-dissipating effect.
It should be noted that, one of a fan radiator, a water-cooled radiator, a heat pipe radiator or a phase-change radiator may be disposed in the heat dissipation module 302, for example, a fan radiator may be disposed in the heat dissipation module 302, and a plurality of fan radiators, water-cooled radiators, heat pipe radiators or phase-change radiators may also be disposed in the heat dissipation module 302, for example, a fan radiator and a heat pipe radiator are disposed in the heat dissipation module 302 at the same time, and the type and number of the heat radiators disposed in the heat dissipation module 302 are determined according to the application scenario of the display module and the heat dissipation requirement of the display module.
As can be seen from the above-described embodiments, in the present embodiment, since the transparent cover plate 10 is attached on the first surface of the display panel 20 and the heat conductive member 30 is attached on the second surface of the display panel 20, the display panel 20 is positioned between the transparent cover plate 10 and the heat conductive member 30. And because the surface that transparent apron 10 and display panel 20 contacted is provided with connection base 101, connection base 101 and heat conduction subassembly 30 are connected, consequently make display panel 20 by fixed compress tightly between the heat conduction subassembly 30 of display panel 20, on the one hand can dispel the heat through heat conduction subassembly 30 with the heat that display panel 20 produced, on the other hand makes the power conduction route of display panel 20 change, can avoid under special operating mode that the display module receives the stretching effect, and then solved the problem that the encapsulation layer inefficacy that the display module caused under special operating mode, prolonged the life of display module.
In addition, the heat conducting assembly 30 includes a flexible heat conducting spacer 301 and a heat dissipating module 302, the heat conducting spacer is attached between the second surface of the display panel 20 and the top surface of the heat dissipating module 302, and the top surface of the heat dissipating module 302 is connected with the connection base 101, so that the flexible heat conducting spacer is located between the display panel 20 and the heat dissipating module 302 due to the fact that the heat conducting spacer is attached between the second surface of the display panel 20 and the top surface of the heat dissipating module 302, and when the heat dissipating module 302 and the transparent cover plate 10 are connected, the flexible heat conducting spacer 301 is extruded to deform towards the display panel 20 or towards the heat dissipating module 302, and then the transparent cover plate 10, the display panel 20 and the flexible heat conducting spacer form an integral structure, so that the force is closed and circulated, and the display panel 20 is not affected by gravity of other structures to generate shearing action, so that the packaging layer is invalid. Meanwhile, under the buffering action of the flexible heat conductive pad 301, the display panel 20 can be effectively prevented from being subjected to the stretching action.
In a second aspect, an embodiment of the present application further provides a display device, where the display device includes the display module of any one of the embodiments. It should be noted that the display device may be a vehicle-mounted display of a vehicle, a display practical in a numerical control machine tool, or a display on another machine or device, which is not limited in the embodiment of the present application. Meanwhile, under the condition that the display device comprises the display module of any embodiment, the heat dissipation capacity of the display device can be enhanced, the stretching bearing capacity of the display device can be increased, the use environment of complex working conditions can be dealt with, and the application scene limited range of the display device is reduced.
It should be noted that, in the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described as different from other embodiments, and identical and similar parts between the embodiments are all enough to be referred to each other.
While alternative embodiments to the embodiments of the present application have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following appended claims be interpreted as including alternative embodiments and all such alterations and modifications as fall within the scope of the embodiments of the present application.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or terminal. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude that an additional identical element is present in an article or terminal device comprising the element.
While the foregoing has been described in some detail by way of illustration of the principles and embodiments of the present application, and in accordance with the principles and implementations of the present application, those of ordinary skill in the art will readily recognize that there could be variations to the principles and implementations of the present application and, therefore, should not be construed as limited to the embodiments set forth herein.
Claims (8)
1. A display module, characterized in that the display module comprises: the display panel comprises a transparent cover plate, a display panel and a heat conduction assembly;
the transparent cover plate is attached to the first surface of the display panel, the heat conduction assembly is attached to the second surface of the display panel, the first surface is the surface where the display surface of the display panel is located, and the second surface is the surface opposite to the first surface;
the transparent cover plate is provided with a connecting base on the surface contacted with the display panel, and the connecting base is connected with the heat conduction component so that the display panel is attached between the transparent cover plate and the heat conduction component.
The heat conduction assembly comprises a flexible heat conduction gasket and a heat dissipation module;
the heat dissipation module comprises a top surface, a bottom surface opposite to the top surface and a side surface intersecting with the bottom surface;
the flexible heat conduction gasket is attached between the second surface of the display panel and the top surface of the heat dissipation module, and the top surface of the heat dissipation module is connected with the connecting base so that the display panel is pressed between the flexible heat conduction gasket and the transparent cover plate;
the display module further comprises a flip chip film and a circuit board;
the display panel is electrically connected with the circuit board through the flip chip film, and the circuit board is fixed on the side face of the heat dissipation module.
2. The display module of claim 1, wherein a fixing table is provided on a side surface of the heat dissipation module, and the circuit board is fixed on the fixing table.
3. The display module according to claim 2, wherein the corner of the surface of the transparent cover plate contacting the display panel is provided with a connection base;
the end parts of the two side surfaces of the heat radiation module are provided with connecting bosses, the connecting bosses are detachably connected with the connecting base, and the circuit board is fixed between the two connecting bosses of the side surfaces of the heat radiation module.
4. A display module according to claim 3, wherein the connection base and the connection boss are detachably connected by screw threads or a snap.
5. The display module of claim 1, wherein the heat dissipation module comprises a plurality of thermally conductive channels;
the heat conduction through groove penetrates from the top surface of the heat dissipation module to the bottom surface of the heat dissipation module.
6. The display module of claim 5, wherein the spacing between two adjacent thermally conductive vias is equal.
7. The display module of claim 1, wherein at least one of a fan radiator, a water-cooled radiator, a heat pipe radiator, or a phase change radiator is further provided in the heat dissipation module.
8. A display device, characterized in that the display device comprises a display device according to any one of claims 1-7.
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| CN202210467981.5A CN114842749B (en) | 2022-04-29 | 2022-04-29 | Display module and display device |
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| CN202210467981.5A CN114842749B (en) | 2022-04-29 | 2022-04-29 | Display module and display device |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017080150A1 (en) * | 2015-11-13 | 2017-05-18 | 乐视控股（北京）有限公司 | Liquid crystal module and display device |
| CN113923958A (en) * | 2021-10-19 | 2022-01-11 | 京东方科技集团股份有限公司 | Display module and display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7508673B2 (en) * | 2004-03-04 | 2009-03-24 | Samsung Sdi Co., Ltd. | Heat dissipating apparatus for plasma display device |
| CN105676502B (en) * | 2016-04-13 | 2019-11-29 | 京东方科技集团股份有限公司 | A kind of display module and display equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017080150A1 (en) * | 2015-11-13 | 2017-05-18 | 乐视控股（北京）有限公司 | Liquid crystal module and display device |
| CN113923958A (en) * | 2021-10-19 | 2022-01-11 | 京东方科技集团股份有限公司 | Display module and display device |
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