CN217689993U - Power supply device and computing equipment with same - Google Patents

Abstract

The present disclosure provides a power supply device and a computing apparatus having the same. The power supply device includes: the power supply assembly comprises a first side, a second side opposite to the first side and a plurality of components positioned on the first side; a first heat sink comprising a base and a plurality of fins on a first side of the base, a second side of the base facing the first side of the power supply component, the base being thermally coupled to each of the plurality of components; a second heat sink comprising a heat slug facing a second side of the power supply component, the heat slug thermally coupled to at least one of the plurality of components. According to the present disclosure, both sides of the power supply assembly are cooled, so that the cooling efficiency is improved, stable and reliable operation of the power supply device is ensured, and stable and reliable operation of the computing equipment comprising the power supply device is further ensured.

Description

Power supply device and computing equipment with same

Technical Field

The present disclosure relates to a power supply device and a computing apparatus having the power supply device.

Background

With the development of automatic driving technology, automatic driving vehicles have been applied in the fields of logistics freight, passenger carrying and the like. When the autonomous vehicle is running, external road information is generally sensed by a sensor of the autonomous vehicle, such as a radar, a camera, and the like. And then, the automatic driving computing equipment (such as a server) and the like perform calculation to complete the decision and planning of the driving of the automatic driving vehicle, and finally, the automatic driving vehicle is controlled to drive according to the corresponding decision and planning.

In order to ensure safe driving of the vehicle, the power supply of the autonomous computing device needs to be stable and reliable. The power supply device of the automatic driving computing equipment can generate a large amount of heat in the running process of the computing equipment, and if the heat dissipation of the power supply device is not timely, the power supply device can break down, so that the computing equipment can not work stably and reliably, and the running safety of a vehicle is influenced.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides a power supply device and a computing apparatus having the same, which can effectively dissipate heat and ensure stable and reliable operation of the power supply device.

One aspect of the present disclosure provides a power supply device, including:

the power supply assembly comprises a first side, a second side opposite to the first side and a plurality of components positioned on the first side;

a first heat sink comprising a base and a plurality of fins on a first side of the base, a second side of the base facing the first side of the power supply component, the base being thermally coupled to each of the plurality of components;

a second heat sink comprising a heat slug facing a second side of the power supply component, the heat slug thermally coupled to at least one of the plurality of components.

Another aspect of the present disclosure provides a computing device including the power supply apparatus of the present disclosure.

According to the present disclosure, both sides of the power supply assembly are radiated by the first and second radiators, thereby improving the heat radiation efficiency, ensuring stable and reliable operation of the power supply device, and further ensuring stable and reliable operation of a computing device (e.g., an autopilot computing device) including the power supply device.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the embodiments and, together with the description, serve to explain the exemplary implementations of the embodiments. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without undue inventive faculty.

Fig. 1 is an exploded view of a power supply apparatus according to an example embodiment of the present disclosure;

FIG. 2A is a stage of installation of the power supply apparatus of FIG. 1;

FIG. 2B is an enlarged view of a portion of FIG. 2A;

FIG. 3 is another stage of installation of the power supply apparatus of FIG. 1;

FIG. 4 is a further stage of installation of the power supply apparatus of FIG. 1;

FIG. 5 is a schematic structural diagram of the power supply apparatus shown in FIG. 1;

fig. 6 is an exploded view of a power supply apparatus according to another example embodiment of the present disclosure.

FIGS. 7-11 are different stages of installation of the power supply apparatus of FIG. 6;

fig. 12 is a schematic structural view of the power supply device shown in fig. 6.

Detailed Description

To make the objects, technical solutions and advantages of the present disclosure clearer, the present disclosure will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present disclosure, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

In the present disclosure, the term "plurality" means two or more, unless otherwise specified. In this disclosure, the term "and/or" describes an associative relationship of associated objects, covering any and all possible combinations of the listed objects. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.

In the present disclosure, unless otherwise specified, the terms "first", "second", and the like are used for distinguishing similar objects, and are not intended to limit positional relationships, timing relationships, or importance relationships thereof. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the disclosure described herein are capable of operation in other orientations than those illustrated or otherwise described herein.

Fig. 1 is an exploded view of a power supply device 100 according to an example embodiment of the present disclosure. Fig. 5 is a schematic structural diagram of the power supply device 100. In fig. 5, the same elements as those in fig. 1 are denoted by the same reference numerals. As shown in fig. 1, and with reference to fig. 5, power supply device 100 includes a heat sink 120, a power supply component 140, and a heat sink 160. The power supply apparatus 100 may be a power supply apparatus in a computing device, such as a computing device in an autonomous vehicle.

The heat sink 120 includes a heat slug 125. The heat sink 160 includes a base 161 and a plurality of fins 163 on one side of the base 161 (i.e., a first side of the base 161), and the other side of the base 161 (i.e., a second side of the base 161) faces the power module 140. The power module 140 is sandwiched between the heat sink 120 and the heat sink 160 such that the base 161 of the heat sink 160 faces one side of the power module 140 (i.e., a first side of the power module 140) and the heat slug 125 of the heat sink 120 faces the other side of the power module 140 (i.e., a second side of the power module 140, which is opposite the first side of the power module 140).

The power module 140 includes a plurality of components 143, 147 on a first side thereof. The component 143 may be, for example, a power supply module. The power module may step up or down the voltage of an external power source (e.g., utility power or a generator) and provide the stepped up or down voltage to various powered components of the computing device. The component 147 may be an inductive element, for example.

The components 143, 147 generate a large amount of heat during operation (these components are also referred to as heating elements), and the heat cannot be dissipated in time, which may cause the temperature of the heating elements to be too high, and the too high temperature may cause the heating elements to operate unstably or to malfunction. Different heating elements generate different amounts of heat during operation, and some heating elements (e.g., the component 143) generate significantly more heat than other heating elements (e.g., the component 147). Therefore, it is necessary to ensure that all the heating elements having different heating values can be efficiently radiated.

According to the power module, the radiator 120 and the radiator 160 are respectively arranged on the two sides of the power module 140, so that the components 143 and 147 can be efficiently radiated, and the stable operation of the components 143 and 147 is ensured. The heat sink 160 may be thermally coupled to each of the components 143, 147 at the first side of the power module to dissipate heat from the components 143, 147. The heat sink 120 may be thermally coupled to one of the components 143, 147 (e.g., the power module) on the second side of the power module to additionally dissipate heat generated by the one of the components 143, 147. Therefore, the heating elements with different heating values can be effectively radiated.

With continued reference to fig. 1, the power supply component 140 includes a board 141, which board 141 may be, for example, a printed circuit board having a first side and a second side opposite the first side. The plate 141 may have a flat surface at the first side and the second side. The components 143, 147 are located on a first side of the board 141. The number of components 143 (i.e., power modules) may be multiple and each may include a base that passes through the board 141, and the heat slug 125 of the heat sink 120 may be thermally coupled to the base of each power module. Alternatively, instead of the power module base penetrating the board 141, a portion of the board 141 for mounting the power module (also referred to as a power module mounting region) has a heat conducting function, and heat can be conducted from the power module on the first side of the board 141 to the heat radiation block 125 on the second side of the board 141 thermally coupled to the mounting region.

In addition to the components 143, 147 (i.e., heat generating elements), the power module 140 may include one or more additional components 145 on the first side of the board 141. The component 145 may be, for example, a capacitive element. These components, which do not generate heat or generate only little heat during operation, do not require heat sinks to dissipate heat as do heat-generating components. The components 143, 145, 147 may have different heights, e.g., some or all of the component 145 may have a higher height than the components 143, 147.

The heat sink 160 may be made of a thermally conductive material, such as copper, aluminum alloy, or other suitable thermally conductive metal. The base 161 of the heat sink 160 may have a plate shape having a first side and a second side opposite to the first side. The base 161 may have a flat surface on the second side when the components 143, 147 of the power module 140 have the same or substantially the same height. When the power supply apparatus 100 is a power supply apparatus in a computing device of an autonomous vehicle, the computing device is expected to occupy as small a space as possible due to a limited space in the vehicle, and thus the power supply apparatus needs to be compactly arranged. For compactness of the power supply device, the surface of the base 161 (i.e., the surface of the second side of the base 161, the same below) may have an area smaller than that of the surface of the board 141 (i.e., the surface of the first side or the second side of the board 141, the same below).

When the components 143, 147 of the power module 140 are of different heights, the base 161 may have a surface shape on the second side that varies according to the height of the components 143, 147 to thermally couple with the components.

The fins 163 of the heat sink 160 may be thin rectangular parallelepipeds. The fins 163 are arranged parallel to each other and extend vertically upward from the base 161. The adjacent two fins 163 have a channel therebetween for air flow. The air may flow substantially along the channel extension.

As described above, some or all of the components 145 have a higher height than the components 143, 147, the heat spreader 160 may include openings 165, and some or all of the components 145 may be at least partially located in the openings.

The heat sink 120 may be made of a thermally conductive material, such as copper, aluminum alloy, or other suitable thermally conductive metal. The heat slug 125 of the heat sink 120 may have a rectangular parallelepiped shape. The base of the component 143 (i.e., the power module) passes through the board 141 and the heat slug 125, which is located on the second side of the board 141, is thermally coupled to the base of the power module, thereby conducting the heat generated by the power module.

In some embodiments, the heat sink 120 includes a base 121 and a plurality of fins 123 on the base 121 in addition to the heat slug 125. The base 121 of the heat sink 120 may have a plate shape having a first side and a second side opposite to the first side, and the base 121 may have a flat surface at the second side. As described above, when the power supply apparatus 100 is a power supply apparatus in a computing device of an autonomous vehicle, it is desirable that the computing device occupy as small a space as possible, and thus the power supply apparatus needs to be compactly arranged. For compactness of the power supply device, the area of the surface of the susceptor 121 (i.e., the surface of the second side of the susceptor 121, the same applies hereinafter) may be smaller than the area of the surface of the plate 141.

A first surface of the heat dissipation block 125 faces the power supply assembly 140 and a second surface opposite the first surface faces a first side of the base 121. The heat dissipation block 125 is thermally coupled to the power module 140 (or to a power module of the power module 140) via a first surface, and is thermally coupled to the base 121 via a second surface.

The fins 123 of the heat sink 120 may be thin rectangular parallelepipeds. The fins 123 are arranged parallel to each other and extend vertically upward from the base 121. In some embodiments, fins 123 of heat sink 120 are parallel to fins 163 of heat sink 160.

The heat slug 125 and the fins 123 may be located on the same side of the base 121 (i.e., the first side of the base 121), and the height of the fins 123 is lower than the height of the heat slug 125, so that a certain space is provided between the fins 123 and the power module 140 to facilitate the flow of air, and the flowing air can effectively remove heat from the fins 123.

In some embodiments, the fins 123 may be divided into two groups, one on each side of the heat dissipation block 125, each group including a plurality of fins. Adjacent two fins of each set of fins 123 have a channel therebetween for air flow. The air may flow substantially in the direction of extension of the channel. The channels of the heat spreader 120 are parallel to the direction of extension of the channels of the heat spreader 160.

The heat slug 125 of the heat sink 120 and the base of the component 143 (i.e., the power module) may be in direct contact for thermal coupling, and likewise, the base 161 of the heat sink 160 and the components 143, 147 (i.e., the heat generating elements) may be in direct contact for thermal coupling.

In some embodiments, a thermally conductive connection layer is disposed between the heat slug 125 and the base of the component 143 (i.e., the power module) and between the base 161 of the heat sink 160 and the components 143, 147 (i.e., the heat generating elements), so that the thermal coupling between the heat slug 125 and the base of the power module and the thermal coupling between the base 161 and the heat generating elements are achieved through the thermally conductive connection layer. This can enhance the heat transfer efficiency between the heat dissipation block 125 and the base of the power module and between the base 161 and the heat generating element. The heat-conducting connecting layer can be a solder layer, a heat-conducting paste layer or a heat-conducting glue layer. The heat conductive paste may be heat conductive silicone grease, and the heat conductive adhesive may be, for example, heat conductive silicone gel.

When the power supply apparatus 100 is a power supply apparatus in a computing device of an autonomous vehicle, since the vehicle may generate a large amount of vibration during traveling, it is necessary that the power supply apparatus in the computing device be firmly fixed. Thus, in some embodiments, power supply apparatus 100 may further include a support assembly 110, and heat sink 120, power supply assembly 140, and heat sink 160 may be secured to support assembly 110, and support assembly 110 may be secured to, for example, a housing of a computing device. The support assembly 110 is provided with a heat sink 120, a power module 140 and a heat sink 160 in this order, i.e. the heat sink 120 is located between the support assembly 110 and the power module 140, and the power module 140 is located between the heat sink 120 and the heat sink 160.

As shown in fig. 1, support assembly 110 includes a plate 113 and a stud 115 on plate 113. The plate 113 may be made of a metal material, for example, may be formed of aluminum, an aluminum alloy, or other suitable metal. The plate 113 includes screw holes. The stud 115 also has a threaded hole therein. The heat sink 120 may be secured to the support assembly 110 using screws 131 that pass through holes 127 in the heat sink 120 and are tightened into threaded holes in the plate 113. Some of the studs 115 pass through holes 127 of the heat sink 120 and some of the studs 115 are located at the periphery of the heat sink 120. The plate 141 of the power module 140 also has holes through which screws 151 may be passed through the holes of the plate 141 and tightened into threaded holes in some of the studs 115 to secure the power module 140 to the support assembly 110. One end of the stud 153 is screwed with the screw holes of other studs 115, and the other end of the stud 153 is provided with a screw hole. Heat sink 160 is secured to support assembly 110 by screws 171 through holes 167 of heat sink 160 and threaded into threaded holes of studs 153.

The following describes an installation process of the power supply device 100 with reference to fig. 2A, 3 to 5. Fig. 2A is an installation stage of a power supply apparatus according to an example embodiment of the present disclosure, and fig. 2B is an enlarged view of a portion circled by block a of fig. 2A. Fig. 3 is another stage of installation of a power supply apparatus according to an example embodiment of the present disclosure, and fig. 4 is yet another stage of installation of a power supply apparatus according to an example embodiment of the present disclosure. It should be noted that the same elements in fig. 2 to 5 as those in fig. 1 are denoted by the same reference numerals.

As shown in fig. 2A in conjunction with fig. 2B, the heat sink 120 may be secured to the support assembly 110 using screws 131 threaded through holes 127 in the heat sink 120 and into threaded holes in the plate 113. Some of the studs 115 pass through holes 127 of the heat sink 120 and some of the studs 115 are located at the periphery of the heat sink 120. Meanwhile, a thermally conductive bonding layer, such as thermally conductive silicone grease, is applied to the surface of the heat slug 125 that leaks out (i.e., the first surface of the heat slug 125).

The power module 140 may then be secured to the support assembly 110 using screws 151 threaded through holes in the plate 141 and tightened into threaded holes in some of the studs 115, as shown in figure 3.

Subsequently, as shown in fig. 4, one end of the stud 153 is screwed with a screw hole of another stud 115, and the other end of the stud 153 has a screw hole. At the same time, a thermally conductive bonding layer, such as a thermally conductive silicone grease, is applied to the exposed surfaces of components 143, 147 (i.e., the heat generating elements).

Then, the heat sink 160 is fixed to the support member 110 by screwing the screws 171 (see fig. 1) through the holes 167 of the heat sink 160 to the screw holes of the studs 153 (see fig. 1 and 4), resulting in the final power supply device 100 shown in fig. 5.

Fig. 6 is an exploded view of a power supply apparatus 600 according to another example embodiment of the present disclosure. Fig. 12 is a schematic configuration diagram of the power supply device 600. In fig. 12, the same elements as those in fig. 6 are denoted by the same reference numerals. As shown in fig. 6, and with reference to fig. 12, power supply device 600 includes a heat sink 620, a power supply assembly 640, and a heat sink 660. Power supply apparatus 600 may be a power supply apparatus in a computing device, such as a computing device in an autonomous vehicle.

The heat sink 620 includes a heat slug 625. The heat sink 660 includes a base 661 and a plurality of fins 663 positioned at one side of the base 661 (i.e., a first side of the base 661), the other side of the base 661 (i.e., a second side of the base 661) facing the power supply assembly 640. The power component 640 is sandwiched between the heat sink 620 and the heat sink 660 such that the base 661 of the heat sink 660 faces one side of the power component 640 (i.e., a first side of the power component 640) and the heat slug 625 of the heat sink 620 faces the other side of the power component 640 (i.e., a second side of the power component 640, the side opposite the first side of the power component 640).

The power assembly 640 includes a plurality of components 643, 647 on a first side thereof. The component 643 may be, for example, a power supply module. The power module may step up or down the voltage of an external power source (e.g., utility or generator) and provide the stepped up or down voltage to various powered components of the computing device. The component 647 may be an inductive element, for example.

The components 643, 647 generate a large amount of heat during operation (these components are also referred to as heating elements), and the heat cannot be dissipated in time, which may cause the temperature of the heating elements to be too high, and the too high temperature may cause the heating elements to operate unstably or to malfunction. Different heat generating elements generate different amounts of heat during operation, and some heat generating elements (e.g., the component 643) generate significantly more heat than other heat generating elements (e.g., the component 647). Therefore, it is necessary to ensure that all the heating elements having different heating values can be effectively radiated.

According to the power supply assembly 640, the heat radiators 620 and 660 are arranged on the two sides of the power supply assembly 640 respectively, so that the components 643 and 647 can be efficiently radiated, and stable operation of the components 643 and 647 is guaranteed. The heat sink 660 may be thermally coupled to each of the components 643, 647 at a first side of the power supply assembly to dissipate heat from the components 643, 647. The heat sink 620 may be thermally coupled to a component with a larger heat generation amount (e.g., the power module) of the components 643, 647 at the second side of the power module, thereby additionally dissipating heat from the component with the larger heat generation amount. Therefore, the heating elements with different heating values can be effectively radiated.

With continued reference to fig. 6, the power supply assembly 640 includes a board 641, which board 641 may be, for example, a printed circuit board having a first side and a second side opposite the first side. The plate 641 may have a flat surface at the first and second sides. Components 643,647 are located on a first side of plate 641. The number of components 643 (i.e., power modules) may be one or more, each including a base, the base passing through the board 641, and the heat slug 625 of the heat sink 620 may be thermally coupled with the base of each power module. Or instead of the power module base penetrating through the board 641, a portion of the board 641 where the power module is mounted (also referred to as a power module mounting area) has a heat-conducting function, and can conduct heat from the power module on the first side of the board 641 to a heat-dissipating block 625 on the second side of the board 641, which is thermally coupled to the mounting area.

In addition to components 643, 647 (i.e., heat generating elements), power supply assembly 640 may include one or more additional components 645 located on a first side of board 641. Component 645 may be, for example, a capacitive element. These components, which do not generate heat or generate only little heat during operation, do not require heat sinks to dissipate heat as do heat-generating components. Components 643, 645, 647 may have different heights, e.g., some or all of component 645 may have a higher height than components 643, 647.

Heat sink 660 may be made of a thermally conductive material, such as copper, aluminum alloy, or other suitable thermally conductive metal. The base 661 of the heat sink 660 may have a plate shape having a first side and a second side opposite to the first side. When the components 643, 647 of the power module 640 have the same or substantially the same height, the base 661 can have a flat surface on a second side. When the power supply apparatus 600 is a power supply apparatus in a computing device of an autonomous vehicle, it is desirable that the computing device occupy as little space as possible due to limited space in the vehicle, and thus the power supply apparatus needs to be compactly arranged. For compactness of the power supply device, the surface of the base 661 (i.e., the surface of the second side of the base 661, the same below) may have an area smaller than that of the surface of the board 641 (i.e., the surface of the first side or the second side of the board 641, the same below).

When the heights of the components 643, 647 of the power module 640 are different, the base 661 may have a surface shape that varies according to the heights of the components 643, 647 to thermally couple with the components.

The fins 663 of the heat sink 660 may be thin rectangular parallelepiped. The fins 663 are arranged parallel to each other and extend vertically upward from the base 661. The two adjacent fins 663 have a channel therebetween for air flow. The air may flow substantially along the channel extension.

As described above, some or all of components 645 may have a higher height than components 643, 647, heat sink 660 may include one or more openings 665, and some or all of components 645 may be at least partially located in the openings.

The heat sink 620 may be made of a thermally conductive material, such as copper, aluminum alloy, or other suitable thermally conductive metal. The heat slug 625 of the heat sink 620 may have a rectangular parallelepiped, square, or other shape. The base of the component 643 (i.e., the power module) passes through the board 641, and the heat slug 625 on the second side of the board 641 is thermally coupled to the base of the power module, thereby conducting the heat generated by the power module.

In some embodiments, in addition to the heat slug 625, the heat sink 620 includes a base 621 and a plurality of fins 623 (see fig. 7) on the base 621. The base 621 of the heat sink 620 may have a plate shape having a first side and a second side opposite to the first side, and the base 621 may have a flat surface on the first side. The heat slug 625 may be secured to the base 621, for example, by screws 632 passing through holes 627 (see fig. 11) in the base 621 and fins 623 and tightening into threaded holes in the heat slug 625 to secure the heat slug 625 to the base 621. The heat slug 625 and the fins may be located on different sides of the base 621. The heat slug 625 is located on a first side of the base 621 and the fins are located on a second side of the base 621. As described above, when the power supply apparatus 600 is a power supply apparatus in a computing device of an autonomous vehicle, it is desirable that the computing device occupy as small a space as possible, and thus the power supply apparatus needs to be compactly arranged. For compactness of the power supply device, the surface of the base 621 (i.e., the surface of the first side of the base 621, the same applies hereinafter) may have an area smaller than that of the surface of the board 641.

A first surface of the heat slug 625 faces the power supply assembly 640 and a second surface opposite the first surface faces a first side of the base 621. The heat sink 625 is thermally coupled to the power module 640 (or to the power module of the power module 640) via a first surface, and may be thermally coupled to the base 621 via a second surface.

The fins 623 (see fig. 7) of the heat sink 620 may be thin cuboids. The fins 623 are arranged parallel to each other and extend perpendicularly outwardly from the base 621. In some embodiments, the fins 623 of the heat spreader 620 are parallel to the fins 663 of the heat spreader 660. Between two adjacent fins 623 are channels for air flow. The air may flow substantially in the direction of the extension of the channel. In some embodiments, the channels of heat spreader 620 are parallel to the direction of extension of the channels of heat spreader 660.

The heat slug 625 of the heat sink 620 may be in direct contact with the base of the component 643 (i.e., the power module) to achieve thermal coupling, and likewise, the base 661 of the heat sink 660 may be in direct contact with the components 643, 647 (i.e., the heat generating elements) to achieve thermal coupling.

In some embodiments, a heat conducting connection layer is disposed between the heat dissipation block 625 and the base of the component 643 (i.e., power module) and between the base 661 of the heat sink 660 and the components 643 and 647 (i.e., heat generating elements), so that the heat coupling between the heat dissipation block 625 and the base of the power module and the heat coupling between the base 661 and the heat generating elements are achieved through the heat conducting connection layer. This can enhance the heat transfer efficiency between the heat slug 625 and the base of the power module and between the base 661 and the heat generating element. The heat-conducting connecting layer can be a solder layer, a heat-conducting paste layer or a heat-conducting glue layer. The thermal grease may be thermal silicone grease, and the thermal adhesive may be thermal silicone gel, for example.

When the power supply apparatus 600 is a power supply apparatus in a computing device of an autonomous vehicle, since the vehicle may generate a large amount of vibration during traveling, it is necessary that the power supply apparatus in the computing device be firmly fixed. Thus, in some embodiments, the power supply apparatus 600 may further include a support component 610, the heat sink 620, the power supply component 640, and the heat sink 660 may be secured to the support component 610, and the support component 610 may be secured to, for example, a housing of a computing device.

As shown in fig. 6, the support member 610 includes a plate 613 and a stud 615 on the plate 613, the stud 615 having a threaded hole. Plate 613 also has hole 612 and opening 617. The plate 613 may be made of a metal material, for example, may be formed of aluminum, an aluminum alloy, or other suitable metal. The base 621 of the heat sink 620 has screw holes. The heat sink 620 may be secured to the support assembly 610 using screws 631 threaded through holes 612 of the plate 613 and into threaded holes of the base 621, at which time the heat slug 625 may be passed through the opening 617 of the plate 613. Plate 641 of power assembly 640 also has holes through which one end of stud 653 may be passed to screw holes in stud 615 to secure power assembly 640 to support assembly 610. The stud 653 has a threaded bore at the other end. Heat sink 660 is secured to support assembly 610 using screws 671 threaded through holes 667 of heat sink 660 to threaded holes of studs 653.

In some embodiments, as shown in fig. 6, the power device 600 may further include a thermal insulation pad 681, and the thermal insulation pad 681 may be positioned between the plate 613 of the support assembly 610 and the base 621 of the heat sink 620, i.e., to thermally isolate the base 621 from the plate 613, for preventing the base 621 from conducting heat to the plate 613. The insulating mat 681 has an opening 683, which can be the same size and shape as the opening 617 of the plate 613 for passing through the heat slug 625. In some embodiments, the power supply arrangement 600 may further include an insulating pad 682 for electrically insulating the plate 613 of the support assembly 610 from the power supply assembly 640. Insulating pad 682 has an opening 684, which may be the same size and shape as opening 617 of plate 613 for passing through heat slug 625.

The installation process of the power supply apparatus 600 is described below with reference to fig. 7 to 12. Fig. 7-11 are various stages of installation of a power supply apparatus according to an example embodiment of the present disclosure. It should be noted that the same elements as those in fig. 1 in fig. 7 to 12 are denoted by the same reference numerals.

As shown in FIG. 7, in conjunction with FIG. 6, the heat slug 625 is placed on the base 621 and the thermal pad 681 is placed on the base 621 with the heat slug 625 passing through the opening 683 of the thermal pad 681.

As shown in fig. 8, in conjunction with fig. 6, a heat sink 620 may be secured to the support assembly 610 by screws 631 passing through holes 612 of the plate 613 and tightening into threaded holes of the base 621, at which point the heat slug 625 passes through the opening 617 of the plate 613. A thermally conductive bonding layer, such as a thermally conductive silicone grease, is applied to the surface where the heat slug 625 has escaped (i.e., the first surface of the heat slug 625).

As shown in fig. 9, and in conjunction with fig. 6, an insulating pad 682 is placed over plate 613 and heat slug 625 is passed through an opening 684 of insulating pad 682.

As shown in fig. 10, in conjunction with fig. 6, power assembly 640 may be secured to support assembly 610 using a threaded stud 653 that is threaded at one end through a hole in plate 641 of power assembly 640 and into a threaded hole in stud 615 on plate 613. Meanwhile, a heat conductive connection layer, such as a heat conductive silicone grease, is applied to the surface of the components 643 and 647 (i.e., the heat generating elements) that leaks out.

As shown in fig. 11, in conjunction with fig. 6, the heat slug 625 is secured to the base 621 using screws 632 threaded through holes 627 in the base 621 and fins 623 and tightened into the threaded holes of the heat slug 625.

Screws 671 are then used to pass through holes 667 of heat sink 660 and tighten into the threaded holes of studs 653, thereby securing heat sink 660 to support assembly 610. The final power supply device 600 shown in fig. 12 is obtained.

The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the disclosure and its practical applications, to thereby enable others skilled in the art to best utilize the disclosure and various described embodiments with various modifications as are suited to the particular use contemplated.

Claims (15)

1. A power supply device, comprising:

the power supply assembly comprises a first side, a second side opposite to the first side and a plurality of components positioned on the first side;

a first heat sink comprising a base and a plurality of fins on a first side of the base, a second side of the base facing the first side of the power supply component, the base being thermally coupled to each of the plurality of components;

a second heat sink comprising a heat slug facing a second side of the power supply component, the heat slug thermally coupled to at least one of the plurality of components.

2. The power supply apparatus according to claim 1,

the power supply assembly also includes a board including a first side and a second side opposite the first side, the plurality of components being located on the first side, at least one of the plurality of components being a power supply module.

3. The power supply apparatus according to claim 2,

the power module includes a base that passes through the plate,

the heat slug is located on the second side of the board and thermally coupled to the base.

4. The power supply device according to claim 3,

the base of first radiator with all have the heat conduction articulamentum between a plurality of components and parts and the radiating block with between power module's base.

5. The power supply device according to claim 2,

the power module further includes an additional plurality of components located on the first side of the board, the first heat sink including an opening, the additional plurality of components being located at least partially in the opening.

6. The power supply device according to claim 2, wherein the board is a printed circuit board.

7. The power supply device according to claim 1,

the second heat radiator also comprises a base and a plurality of fins, wherein the base comprises a first side and a second side opposite to the first side, the heat radiating block and the fins are both positioned on the first side of the base, and the height of the heat radiating block is higher than that of the fins.

8. The power supply device according to claim 7, further comprising:

a support assembly to which the power module, the first heat sink and the second heat sink are fixed,

the support assembly includes a plate having a surface area greater than a surface area of the first and second heat sink bases.

9. The power supply device according to claim 1, further comprising:

and the power supply assembly, the first radiator and the second radiator are all fixed on the support assembly, and the second radiator is positioned between the support assembly and the power supply assembly.

10. The power supply apparatus according to claim 1,

the second heat sink further comprises a base and a plurality of fins, the base comprises a first side and a second side opposite to the first side, the heat dissipation block is located on the first side of the base, and the fins are located on the second side of the base.

11. The power supply device according to claim 10, further comprising:

a support assembly comprising a plate including a first side and a second side opposite the first side,

the power supply assembly is located on a first side of the board and the base of the second heat sink is located on a second side of the board.

12. The power supply device according to claim 11,

the plate includes an opening through which the heat slug passes.

13. The power supply device according to claim 11, further comprising:

an insulating mat between the plate and the base of the second heat sink, an

An insulating pad between the plate and the power supply component.

14. The power supply device according to claim 7 or 10,

the first and second heat sinks each include channels between the fins, the channels of the first and second heat sinks being parallel to each other.

15. A computing device comprising the power supply apparatus of any one of claims 1-14.

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