CN215073547U - Power device, power supply and electric equipment - Google Patents
Power device, power supply and electric equipment Download PDFInfo
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- CN215073547U CN215073547U CN202023351772.XU CN202023351772U CN215073547U CN 215073547 U CN215073547 U CN 215073547U CN 202023351772 U CN202023351772 U CN 202023351772U CN 215073547 U CN215073547 U CN 215073547U
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Abstract
The embodiment of the utility model relates to the technical field of power supply heat dissipation, in particular to a power device, a power supply and electric equipment, wherein the power device comprises a heat-conducting shell which is provided with an accommodating cavity and an opening communicated with the accommodating cavity; the magnetic element is accommodated in the accommodating cavity, and the heat of the magnetic element is transferred to the heat conducting shell; a power element mounted on an outer surface of the heat conductive case, heat of the power element being transferred to the heat conductive case; the PCB is arranged at the opening and is respectively and electrically connected with the magnetic element and the power element; the heat conducting shell is arranged on the radiator, and the surface, far away from the opening, of the heat conducting shell transmits heat to the radiator, so that the radiator radiates the heat. In this way, the embodiment of the utility model provides a can realize the radiating integration of magnetic element and power component to make power device's volume littleer, the heat dissipation cost is lower.
Description
Technical Field
The embodiment of the utility model provides a relate to power heat dissipation technical field, especially relate to a power device, power and consumer.
Background
In self-cooling or water-cooling switching power supplies and automobile power supplies, a plurality of heating devices such as power elements, transformers, inductors and other magnetic devices are arranged on power devices. These heating elements all need to dispel the heat in order to guarantee the normal use and the increase of service life of components and parts.
However, the utility model discloses an inventor is realizing the utility model discloses an in-process discovery, among the current product design, the components and parts that generate heat often relatively disperse, correspondingly, the components and parts that generate heat that the dispersion was arranged in different positions need design heat radiation structure alone, for example magnetic element, power element install respectively on a plurality of little radiating blocks, consequently cause easily the heat dispersion that power device's heat radiation module is too big and the heat dissipation inequality is brought is not good.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a main technical problem who solves provides a power device, can realize magnetic element and the radiating integration of power element to make power device's volume littleer, the heat dissipation cost is lower.
In order to solve the technical problem, the utility model discloses a technical scheme be: provided is a power device characterized by comprising:
the heat conduction shell is provided with an accommodating cavity and an opening communicated with the accommodating cavity;
the magnetic element is accommodated in the accommodating cavity, and the heat of the magnetic element is transferred to the heat conducting shell;
a power element mounted on an outer surface of the heat conductive case, heat of the power element being transferred to the heat conductive case;
the PCB is arranged at the opening and is respectively and electrically connected with the magnetic element and the power element;
the heat conducting shell is arranged on the radiator, and the surface, far away from the opening, of the heat conducting shell transmits heat to the radiator, so that the radiator radiates the heat.
Optionally, the power device further includes a thermal conductive adhesive filled between the inner surface of the thermal conductive shell and the magnetic element.
Optionally, the power device further comprises a support;
the bracket is mounted on the PCB, and the heat conduction shell is mounted on the bracket.
Optionally, the bracket is disposed around the heat conducting shell, the bracket is provided with a mounting groove, and the power component is partially accommodated in the mounting groove.
Optionally, the power device further includes an insulating heat-conducting medium;
the insulating heat-conducting medium is arranged between the outer surface of the heat-conducting shell and the power element, and the insulating heat-conducting medium is respectively fixed with the heat-conducting shell and the power element.
Optionally, the insulating heat-conducting medium is a ceramic substrate.
Optionally, the power device further comprises a first thermal grease layer and a second thermal grease layer;
the first heat-conducting silicone grease layer is coated on one surface, facing the heat-conducting shell, of the insulating heat-conducting medium, the first heat-conducting silicone grease layer is located between the insulating heat-conducting medium and the heat-conducting shell, the second heat-conducting silicone grease layer is coated on the other surface, facing the power element, of the insulating heat-conducting medium, and the second heat-conducting silicone grease layer is located between the insulating heat-conducting medium and the power element.
Optionally, the power device further includes a fixing plate;
the fixing plate is mounted to the opening of the heat conductive case, and the fixing plate abuts against the magnetic element.
The utility model also provides a power supply embodiment, include as above-mentioned arbitrary embodiment power device.
The utility model also provides an consumer embodiment, including the power that above-mentioned embodiment mentioned.
The embodiment of the utility model provides an in, through all set up magnetic element and power component in on the heat conduction shell, and will the heat conduction shell install in realize on the radiator will the heat that magnetic element and power component produced is unified to be passed through the heat conduction shell dispels the heat, and by the heat conduction shell with heat transfer extremely the radiator reaches the quick radiating effect of heat conduction shell.
Drawings
Fig. 1 is a schematic diagram of a power device assembly provided by an embodiment of the present invention;
fig. 2 is a schematic diagram of a partial explosion of a power device provided by an embodiment of the present invention;
fig. 3 is a schematic view of a heat conducting shell of a power device according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a fixing plate of a power device according to an embodiment of the present invention;
fig. 5 is a schematic view of a bracket of a power device provided by an embodiment of the present invention;
fig. 6 is a schematic diagram of a heat sink of a power device according to an embodiment of the present invention.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like as used herein are for descriptive purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, the power device 1 includes: a heat conductive case 10, a magnetic element 20, a power element 30, a PCB board 40, a bracket 50, and a heat sink 60. The magnetic element 20 is disposed in the heat conductive housing 10, the power element 30 is mounted on one outer surface of the heat conductive housing 10, and the heat sink 60 is mounted on the other surface of the heat conductive housing 10. The PCB board 40 is mounted to the heat conductive case 10 and electrically connected to the magnetic element 20 and the power element 30, respectively. The bracket 50 is mounted to the PCB board 40, and the heat conductive case 10 is mounted to the bracket 50. Wherein the heat conductive case 10 is used for dissipating heat from the magnetic element 20 and the power element and guiding heat generated by the magnetic element 20 and the power element 30 during operation to the heat sink 60, and the bracket 50 is used for fixing the heat conductive case 10 on the PCB 40.
Referring to fig. 3, the heat conductive shell 10 is provided with a receiving cavity 101 and an opening 102 communicating with the receiving cavity 101. The magnetic element 20 is accommodated in the accommodating cavity 101, the heat conducting shell 10 is further provided with a clamping slot 103, and the power element 30 is fixed on the side surface of the heat conducting shell 10 through the clamping slot 103. The number of the card slots 103 is plural, the plural card slots 103 are arranged around the side surface of the heat conducting shell 10, the number of the power elements 30 is plural, the number of the power elements 30 corresponds to the number of the card slots 103, and one power element 30 is fixed on the side surface of the heat conducting shell 10 through one card slot 103. When the magnetic element 20 is accommodated in the accommodating cavity 101, the outer surface of the magnetic element 20 is attached to the inner wall of the accommodating cavity 101, and the magnetic element 20 can transfer heat generated during the operation of the magnetic element 20 to the heat conducting shell 10 by means of heat transfer to dissipate the heat. When the power element 30 is fixed to the heat conducting shell 10 through the card slot 103, the power element 30 abuts against the outer wall of the heat conducting shell 10, and the power element 30 can transfer heat generated when the power element 30 operates to the heat conducting shell 10 by means of heat transfer to complete heat dissipation.
Further, the heat conducting shell 10 is further provided with a plurality of first mounting columns 104, the number of the first mounting columns 104 is multiple, and the plurality of first mounting columns 104 are used for fixing the heat conducting shell 10 on the heat sink 60.
In some embodiments, the heat conductive shell 10 further includes fasteners 105, the number of the fasteners 105 is plural, and the number of the fasteners 105 corresponds to the number of the card slots 103. A fastener 105 is engaged with a slot 103 to fix a power element 30 on the outer surface of the heat conductive shell 10. The fastener 105 can ensure that the power element 30 is tightly attached to the outer surface of the heat conducting shell 10, so as to achieve a good heat transfer effect and ensure the heat dissipation efficiency of the power element 30.
Further, referring to fig. 2 and 4, the heat sink 60 further includes a fixing plate 21, the fixing plate 21 is provided with a fixing hole 211, the heat conducting shell 10 is provided with a fixing post 106, and when the magnetic element 20 is placed in the accommodating cavity 101, the fixing plate 21 can cover the magnetic element 20 in the accommodating cavity 101 through the fixing hole 211 and the fixing post 106.
As for the power component 30, the power component 30 further includes a thermal conductive adhesive (not shown) and an insulating thermal conductive medium 31, the thermal conductive adhesive is filled between the inner surface of the thermal conductive shell 10 and the magnetic component 20, the insulating thermal conductive medium 31 is disposed between the power component 30 and the outer surface of the thermal conductive shell 10, and the insulating thermal conductive medium 31 is fixed to the thermal conductive shell 10 and the power component 30, respectively. The heat-conducting glue is filled in the accommodating cavity 101, so as to fill up a gap between the inner wall of the accommodating cavity 101 and the magnetic element 20, and further enhance the heat dissipation effect of the magnetic element 20 through the heat-conducting shell 10. The insulating heat transfer medium 31 rapidly guides heat generated from the power element 30 to the heat conductive case 10.
Further, the power component 30 further includes a first thermal grease layer (not shown) and a second thermal grease layer (not shown). The fixing plate 21 is attached to the opening 102 of the heat conductive case 10, and the fixing plate 21 abuts against the magnetic element 20. The first thermal grease layer is coated on one surface of the insulating thermal medium 31 facing the thermal conductive shell 10, and is located between the insulating thermal medium 31 and the thermal conductive shell 10, the second thermal grease layer is coated on the other surface of the insulating thermal medium 31 facing the power element 30, and is located between the insulating thermal medium 31 and the power element 30. The first thermal grease layer and the second thermal grease layer enhance the thermal conductivity of the insulating thermal medium 31, so that the insulating thermal medium 31 can better guide the heat generated by the power element 30 to the thermal conductive shell 10 more quickly.
In some embodiments, the fixing plate 21 is made of plastic, and the insulating and heat-conducting medium 31 is a ceramic substrate.
In other embodiments, the fixing plate 21 is made of an epoxy plate, and the insulating and heat-conducting medium 31 may also be a heat-conducting insulating film.
Referring to fig. 5, for the bracket 50, the bracket 50 is mounted on the PCB 40 and the bracket 50 is disposed around the heat conductive case 10. The support 50 is provided with guide ring 501, the quantity of guide ring 501 is a plurality of, and is a plurality of guide ring 501 centers on set up in support 50 sets up, guide ring 501 is used for the support 50 passes through the screw fixation and plays the spacing effect of direction to the screw when on the PCB board 40, prevents that the screw from dropping to other positions.
In some embodiments, the bracket 50 is made of plastic, and the bracket 50 is further provided with a slot 502. When the bracket 50 is mounted and fixed on the PCB 40, one end of the slot 502 close to the bottom of the receiving cavity 101 is used for inserting and fixing one end of the fastener 105, and after the heat conducting shell 10 is mounted on the bracket 50, the other end of the fastener 105 is fastened into the fastening slot 103, so that the heat conducting shell 10 and the bracket 50 are fastened and fixed on the PCB 40. It should be noted that an end of the insertion slot 502 away from the bottom of the receiving cavity 101 is used for inserting the power component 30. In addition, the bracket 50 is further provided with positioning pillars (not shown), and the heat conductive housing 10 is provided with positioning holes (not shown), so that the positioning pillars and the positioning holes cooperate with each other to guide and position the heat conductive housing 10 during the process of fixing the heat conductive housing 10 on the PCB 40 through the bracket 50.
Referring to fig. 6, the heat sink 60 is provided with a position-limiting pillar 601 and a second mounting pillar 602, the position-limiting column 601 is used for guiding and limiting the heat-conducting shell 10 mounted on the PCB 40 when the PCB 40 is mounted on the heat sink 60, the number of the second mounting posts 602 is the same as the number of the first mounting posts 104, and when one end face of the heat-conducting shell 10 away from the PCB 40 abuts against the heat-conducting shell 10, the second mounting posts 602 are in one-to-one correspondence with the first mounting posts 104, wherein the first mounting post 104 is provided with a mounting threaded hole (not shown), the second mounting post 602 is provided with a mounting through hole (not shown), the heat conductive case 10 is screwed to the mounting screw hole by screws through the mounting through-hole to fix the heat conductive case 10 to the heat sink 60.
In some embodiments, an end surface of the heat conductive shell 10 abutting against the heat sink 60 is provided with a heat conductive glue, which enables heat of the heat conductive shell 10 to be quickly transferred to the heat sink 60 and dissipated through the heat sink 60. The radiator 60 has a water cooling function.
In some embodiments, the heat sink 60 is made of aluminum by die casting, so that the heat sink 60 has good heat conduction and heat dissipation performance, and it should be noted that the heat sink 60 may be air-cooled in addition to water-cooled.
The utility model discloses a concrete assembling process as follows: the bracket 50 is fixedly mounted to the PCB 40, the magnetic element 20 is fixed to the receiving cavity 101 of the heat conducting shell 10 by the fixing plate 21, the power element 30 is inserted into the slot 502, the heat conducting medium 31 is attached to the power element 30 and faces a surface of the heat dissipating shell 10, the heat conducting shell 10 is fixed to the bracket 50 under the limit and guide of the power element 30 so that the heat dissipating shell 10 is connected to the PCB, the fastener 105 is fastened to the slot 103 and the slot 502 so that the heat dissipating shell 10 is fastened to the PCB 40, and the heat conducting shell 10 is mounted to the heat sink 60 along the limit post 601 until an end surface of the heat conducting shell 10 away from the PCB abuts against the heat sink 60, and screws are inserted through the mounting holes of the second mounting post 602 and screwed into the mounting screw holes of the first mounting post 104 so that the heat conducting shell 10 and the heat dissipating shell 10 are mounted to the heat dissipating post 60, and screws are inserted into the mounting holes of the second mounting post 602 so that the heat conducting shell 10 and the heat dissipating shell 10 are screwed into the mounting post 104 The device 60 is fixed.
In the embodiment of the present invention, through with magnetic element 20 and power component 30 all set up in on the heat conduction shell 10, and will heat conduction shell 10 install in realize on the radiator 60 will the heat that magnetic element 20 and power component 30 produced is unified to be passed through heat conduction shell 10 dispels the heat, and by heat conduction shell 10 with heat transfer extremely heat conduction shell 10 reaches the quick radiating effect of heat conduction shell 10.
The embodiment of the present invention further provides a power supply, the power supply includes the power device 1 according to any of the above embodiments, the structure and function of the power device 1 please refer to the above embodiments, which is not repeated here.
Besides, the embodiment of the utility model provides a still provide a consumer embodiment, consumer includes above-mentioned power.
It should be noted that the preferred embodiments of the present invention are described in the specification and the drawings, but the present invention can be realized in many different forms, and is not limited to the embodiments described in the specification, and these embodiments are not provided as additional limitations to the present invention, and are provided for the purpose of making the understanding of the disclosure of the present invention more thorough and complete. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A power device, comprising:
the heat conduction shell is provided with an accommodating cavity and an opening communicated with the accommodating cavity;
the magnetic element is accommodated in the accommodating cavity, and the heat of the magnetic element is transferred to the heat conducting shell;
a power element mounted on an outer surface of the heat conductive case, heat of the power element being transferred to the heat conductive case;
the PCB is arranged at the opening and is respectively connected with the magnetic element and the power element;
the heat conducting shell is arranged on the radiator, and the surface, far away from the opening, of the heat conducting shell transmits heat to the radiator, so that the radiator radiates the heat.
2. The power device of claim 1, further comprising a thermally conductive paste filled between the inner surface of the thermally conductive case and the magnetic element.
3. The power device of claim 2, further comprising a support;
the bracket is mounted on the PCB, and the heat conduction shell is mounted on the bracket.
4. The power device of claim 3,
the support encircles the heat conduction shell sets up, the support is provided with the mounting groove, power component part accept in the mounting groove.
5. The power device of claim 1, further comprising an insulating heat transfer medium;
the insulating heat-conducting medium is arranged between the outer surface of the heat-conducting shell and the power element, and the insulating heat-conducting medium is respectively fixed with the heat-conducting shell and the power element.
6. The power device of claim 5, wherein the insulating heat-conducting medium is a ceramic substrate.
7. The power device of claim 5, further comprising a first layer of thermally conductive silicone and a second layer of thermally conductive silicone;
the first heat-conducting silicone grease layer is coated on one surface, facing the heat-conducting shell, of the insulating heat-conducting medium, the first heat-conducting silicone grease layer is located between the insulating heat-conducting medium and the heat-conducting shell, the second heat-conducting silicone grease layer is coated on the other surface, facing the power element, of the insulating heat-conducting medium, and the second heat-conducting silicone grease layer is located between the insulating heat-conducting medium and the power element.
8. The power device of any one of claims 1-7, further comprising a fixing plate mounted to an opening of the thermally conductive shell, the fixing plate abutting the magnetic element.
9. A power supply comprising a power device according to any one of claims 1-7.
10. An electrical consumer, comprising the power supply of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023351772.XU CN215073547U (en) | 2020-12-31 | 2020-12-31 | Power device, power supply and electric equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023351772.XU CN215073547U (en) | 2020-12-31 | 2020-12-31 | Power device, power supply and electric equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073547U true CN215073547U (en) | 2021-12-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023351772.XU Active CN215073547U (en) | 2020-12-31 | 2020-12-31 | Power device, power supply and electric equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073547U (en) |
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2020
- 2020-12-31 CN CN202023351772.XU patent/CN215073547U/en active Active
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