KR102002348B1 - Blackbox auxilary powersupply - Google Patents

Blackbox auxilary powersupply Download PDF

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Publication number
KR102002348B1
KR102002348B1 KR1020170000070A KR20170000070A KR102002348B1 KR 102002348 B1 KR102002348 B1 KR 102002348B1 KR 1020170000070 A KR1020170000070 A KR 1020170000070A KR 20170000070 A KR20170000070 A KR 20170000070A KR 102002348 B1 KR102002348 B1 KR 102002348B1
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South Korea
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heat
via hole
heat dissipation
wall
auxiliary power
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KR1020170000070A
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Korean (ko)
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KR20180079656A (en
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이신범
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지에스피 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

본 발명은 방열재질의 블랙박스 보조전원장치용 방열하우징(10);
방열하우징 내벽에 열전도 가능토록 접속 설치된 방열판(20); 및
충전기보드 일면에 열전도테이프로 방열판을 설치하고, 충전기보드의 다른 면에는 표면 실장형(Surface mountaining type) 표면실장소자(35)들의 실장부위(36) 표면에서 상하로 관통하도록 형성한 다수의 제 1비아홀(31)과, 표면 실장부위(36) 사이의 공간부위(37)표면에도 상하로 관통하도록 형성한 다수의 제 2비아홀(32)을 형성한 블랙박스 보조전원용 충전기보드(30)를 포함하고;
상기, 제 1비아홀(31)은 내벽에 열전도코팅층(33)을 형성하고;
상기, 제 2비아홀(32)은 내벽에 열전도코팅층(34)을 형성한 것을 특징으로 하는 방열효율이 좋은 블랙박스 보조전원장치이다.The present invention relates to a heat dissipation housing (10) for a black box auxiliary power supply of a heat dissipation material;
A heat sink (20) connected to the inner wall of the heat dissipation housing so as to be capable of heat conduction; And
A heat sink is provided on one surface of the charger board and a plurality of first heat sinks are formed on the other surface of the charger board so as to penetrate up and down from the surface of the mounting region 36 of the surface mount type surface mount devices 35 And a black box auxiliary power supply charger board 30 in which a plurality of second via holes 32 are formed so as to penetrate vertically through the surface of the space portion 37 between the via hole 31 and the surface mounting portion 36 ;
The first via hole 31 is formed with a thermally conductive coating layer 33 on the inner wall thereof;
The second via hole 32 is a black box auxiliary power source having a good heat radiation efficiency, wherein a thermal conductive coating layer 34 is formed on the inner wall.

Description

방열효율이 좋은 블랙박스 보조전원장치{Blackbox auxilary powersupply}{Blackbox auxilary powersupply}

본 발명은 방열효율이 좋은 블랙박스 보조전원장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a black box auxiliary power supply having a good thermal efficiency.

일반적으로 방열 기술은 발열이 높은 소자의 상면에 방열체를 결합하여 방열시키는 기술이 알려져 있고, BACKGROUND ART [0002] Generally, in a heat dissipating technology, there is known a technique of radiating heat by bonding a heat dissipating member to an upper surface of a device having a high heat dissipation,

발열되는 기판의 열을 방열하는 기술이 국내특허등록10-1208073호, 국내특허등록10-1134671호, 및 국내특허등록10-0665660호로 알려졌는바, 이는 기판에 다수의 구멍을 뚫어서 통기되도록 하는 방식으로 방열시키는 기술이다.It has been known that heat dissipating heat of a substrate to be heated is disclosed in Korean Patent Registration No. 10-1208073, Korean Patent Registration No. 10-1134671, and Korean Patent Registration No. 10-0665660, in which a plurality of holes are drilled in the substrate It is heat dissipation technology.

그러나 보조전원방치의 충전기보드는 발열량이 많아 기존 방식으로는 방열할 수 없어 별도의 방열팬을 추가 설치하는데, 이 경우 소음의 문제점이 있다.However, since the charger board of the auxiliary power supply can not radiate heat due to a large amount of heat, a separate heat-radiating fan is additionally installed. In this case, there is a problem of noise.

본 발명은 이를 해결하고자 하는 것으로, 본 발명의 목적은 충전기보드에 다수의 비아홀을 형성하고, 충전기보드의 비아홀과 접하는 방열판을 설치하고, 방열판을 외부 하우징과 접하도록 하며, 충전기보드의 비아홀은 표면실장부위의 제1비아홀과, 표면실장소자 사이의 제 2비아홀에서 동시에 방열토록 하여 발열이 높은 전원장치용 소자를 사용하여도 외부공기에 의한 자연냉각을 가능토록 하는 방열효율이 좋은 블랙박스 보조전원장치를 제공하려는 것이다.SUMMARY OF THE INVENTION It is an object of the present invention to provide a charger board in which a plurality of via holes are formed in a charger board, a heat sink for contacting a via hole of a charger board is provided, a heat sink is brought into contact with the external housing, A black box auxiliary power source having a good heat radiation efficiency that allows natural cooling by external air even when using a power source device having a high heat generation so as to simultaneously radiate heat in the first via hole at the mounting site and the second via hole between the surface mount device Device.

본 발명의 다른 목적은 충전기보드에 소자를 표면실장형으로 설치하고, 충전기보드의 표면실장부위에는 제 1비아홀을, 충전기보드의 표면실장부위 사이의 공간에는 추가로 제 2 비아홀을 각각 동시에 형성하고, 충전기보드의 제 1 및 제 2 비아홀과 동시에 접하여 방열효율을 증대시키는 방열판을 설치하여, 방열효율이 좋은 블랙박스 보조전원장치를 제공하려는 것이다.Another object of the present invention is to provide a charger board in which elements are mounted on a surface mount type and a first via hole is formed in a surface mounting portion of a charger board and a second via hole is formed simultaneously in a space between surface mounting portions of a charger board And a heat sink for increasing the heat radiation efficiency by contacting the first and second via holes of the charger board at the same time, thereby providing a black box auxiliary power supply having a good heat radiation efficiency.

이를 위한 본원발명은 방열재질의 방열하우징;To this end, the present invention provides a heat dissipation device comprising: a heat dissipation housing of a heat dissipation material;

방열하우징 내벽에 열전도 가능토록 접속 설치된 방열판; 및A heat sink connected to the inner wall of the heat dissipation housing so as to be capable of heat conduction; And

충전기보드 일면에 열전도테이프로 방열판을 설치하고, 충전기보드 다른면에는 표면실장소자들의 실장부위 표면에서 상하로 관통하도록 형성한 다수의 제 1비아홀과, 표면 실장부위 사이의 공간부위에도 상하로 관통하도록 형성한 다수의 제 2비아홀을 형성한 블랙박스 보조전원용 충전기보드를 포함하는 방열효율이 좋은 블랙박스 보조전원장치를 제공한다.A plurality of first via holes formed on the other surface of the charger board so as to penetrate up and down from the surface of the mounting surface of the surface mounted devices and a plurality of first via holes penetrating up and down in a space portion between the surface mounting portions And a black board auxiliary power supply charger board formed with a plurality of second via holes formed therein.

이상과 같이 본원발명은 충전기보드에 다수의 방열구멍을 형성하고, 충전기보드의 일면은 방열구멍과 접하는 방열판을 설치하고, 방열판은 외부 하우징과 바로 접하도록 하여 외부공기에 의한 자연냉각을 가능토록 한다.As described above, according to the present invention, a plurality of heat dissipation holes are formed in the charger board, and a heat radiating plate is provided on one surface of the charger board in contact with the heat dissipating hole, so that the heat dissipating plate comes into direct contact with the external housing, .

본 발명은 충전기보드에 소자를 표면실장형으로 설치하고, 표면실장부위에는 제 1비아홀을, 표면실장부위 사이의 공간에도 제 2 비아홀을 각각 동시에 형성하고, 충전기보드의 제 1 및 제 2 비아홀과 동시에 접하는 하나의 방열판을 설치하여, 표면실장소자의 열을 제 1 및 제 2비아홀에서 동시에 방열판을 통해 방열시키므로 방열효율을 극대화한다.The present invention is characterized in that a device is mounted on a surface of a charger board in a surface mounting manner, a first via hole is formed in a surface mounting portion and a second via hole is formed in a space between surface mounting portions, A heat radiating plate contacting at the same time is provided so that the heat of the surface mounting element is simultaneously radiated from the first and second via holes through the radiating plate, thereby maximizing the radiating efficiency.

도 1은 본 발명의 보조전원장치 반단면 사시도,
도 2는 본 발명과 블랙박스와의 결합상태를 보이는 블럭도,
도 3은 본 발명의 충전기 보드 사시도,
도 4는 본 발명의 충전기보드에서 소자를 생략한 상태의 평면도,
도 5는 도 4 의 요부 확대도,
도 6은 도 5 의 A-A선 확대 단면도,
도 7은 도 6 의 방열 원리를 나타낸 도면이다.1 is a half sectional perspective view of an auxiliary power unit of the present invention,
FIG. 2 is a block diagram showing a combined state of the present invention and a black box, FIG.
3 is a perspective view of the charger board of the present invention,
4 is a plan view of the charger board according to the present invention,
5 is an enlarged view of the main part of Fig. 4,
FIG. 6 is an enlarged cross-sectional view taken along line AA of FIG. 5,
Fig. 7 is a view showing the heat dissipation principle of Fig. 6. Fig.

이하 본원발명의 실시예를 도면을 참조하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

방열재질(알루미늄, 구리 등)의 방열하우징(10);A heat dissipation housing 10 of a heat dissipation material (aluminum, copper, etc.);

방열하우징 내벽에 열전도 가능토록 접속 설치된 알루미늄 재질의 방열판(20); 및 A heat sink (20) made of aluminum and connected to the inner wall of the heat dissipation housing so as to be thermally conductive; And

충전기보드의 일면에 열전도테이프로 방열판을 설치하고, 충전기보드의 다른 면에는 표면 실장형(Surface mountaining type) 표면실장소자(35)들의 실장부위(36) 표면에서 상하로 관통하도록 형성한 다수의 제 1비아홀(31)과, 표면 실장부위(36) 사이의 인접 공간부위(37) 표면에도 상하로 관통하도록 형성한 다수의 제 2비아홀(32)을 형성한 블랙박스 보조전원용 충전기보드(30)를 포함하여 구성한다.A heat sink is provided on one side of the charger board with a heat conductive tape. On the other side of the charger board, a plurality of devices (not shown) are formed on the surface of the mounting region 36 of the surface mounting type surface mounting devices 35 The black board auxiliary power supply charger board 30 in which a plurality of second via holes 32 formed so as to penetrate up and down are formed on the surface of the adjacent space portion 37 between the first via hole 31 and the surface mounting portion 36 .

상기, 제 1비아홀(31)은 내벽에 열전도코팅층(33)을 형성한다.The first via hole 31 forms a thermally conductive coating layer 33 on the inner wall.

상기, 제 2비아홀(32)은 내벽에 열전도코팅층(34)을 형성한다.The second via hole 32 forms a thermally conductive coating layer 34 on the inner wall.

상기 방열판(20)은 충전기보드(30)의 충전회로(30a) 대응 공간과 접하도록 하는 방열하우징(10) 바닥면이나, 방열 가능한 방열핀의 추가결합구성으로 할 수 있다.The heat radiating plate 20 may be a bottom surface of the heat radiating housing 10 to be in contact with the space corresponding to the charging circuit 30a of the charger board 30 or may be a further combined structure of heat radiating fins.

도 4 내지 7에서 충전회로(30a)를 이루는 트랜지스터, FET, 아이씨칩, 콘덴서 같은 표면실장소자(35)가 실장되는 실장부위(36)에는 제 1비아홀(31)이 다수 상하로 관통되도록 하고, 실장부위(36)가 아닌 인접 공간부위(37)에도 제 2비아홀(32)이 다수 관통되도록 하며, 제 1비아홀(21)의 내벽에는 열전도코팅층(33)이, 제 2비아홀(32)의 내벽에도 역시 열전도코팅층(34)을 이루며, 실장부위(36)는 상기 열전도코팅층(33)과 동일 재질로 연결되도록 도 6과 같이 코팅하여 열전도 효율을 극대화시킨다. 바람직한 열전도코팅층은 구리층을 들 수 있고, 바람직한 코팅층은 수 내지 수십㎛ 두께를 예시할 수 있다.4 through 7, a plurality of first via holes 31 are vertically passed through a mounting region 36 where a surface mount device 35 such as a transistor, an FET, an IC chip, and a capacitor is mounted, A large number of second via holes 32 are formed in the adjacent space portion 37 other than the mounting region 36. A thermal conductive coating layer 33 is formed on the inner wall of the first via hole 21 and a thermal conductive coating layer 33 is formed on the inner wall of the second via hole 32, And the mounting area 36 is coated with the same material as the thermal conductive coating layer 33 as shown in FIG. 6 to maximize heat conduction efficiency. A preferable heat conduction coating layer may be a copper layer, and a preferable coating layer may be a thickness of several to several tens of micrometers.

이와 같이 구성한 본원발명은 도 1 및 도 2 와 같이 블랙박스(3) 구동용 전원을 자동차 운전중에는 차량의 발전 전압을 이용하고, 동시에 운전 중에는 충전단자를 통한 발전 전압이 충전기보드(30)를 통하여 바테리(12)의 전압을 충전시킨다. 운전을 마치고 정차시에는 충전기보드(30)를 통하여 바테리(12) 전원을 블랙박스 (3)로 인가한다. 1 and 2, the power source for driving the black box 3 is driven by the power generation voltage of the vehicle while the vehicle is in operation, and at the same time, the power generation voltage through the charging terminal is supplied through the charger board 30 Thereby charging the voltage of the battery 12. The power source of the battery 12 is applied to the black box 3 through the charger board 30 when the vehicle is stopped.

이와 같이 충전과 방전시 기동하는 충전기보드(30)는 충전회로(30a) 작동시 발생하는 표면실장소자(35)의 발열은 도 6 및 도 7에 보인 열전도패드(38)와 접하는 실장부위(36)에서 받아 제 1비아홀(31) 내벽의 열전도코팅층(33)으로 분산 전달되고, 이는 다시 열전도테이프(39)에서 합하여져 보다 냉각 효율이 높은 방열판(20)을 통하여 순식간에 분산되어 방열 효과를 높여준다. 동시에 방열판(20)은 방열핀 구조를 더하여져 냉각 효율을 극대화시킬 수도 있다.The charger board 30, which is activated during charging and discharging as described above, is configured such that the heat generated by the surface mounting element 35 generated during the operation of the charging circuit 30a is transferred to the mounting region 36 (see FIG. 6 and FIG. 7) And is dispersed and transferred to the thermal conductive coating layer 33 on the inner wall of the first via hole 31. The thermal conductive coating is then mixed again with the thermal conductive tape 39 to be dispersed instantly through the heat sink 20 having a higher cooling efficiency, give. At the same time, the heat dissipating plate 20 may be added with a heat dissipating fin structure to maximize the cooling efficiency.

또한 열전도패드(38)를 통한 발열은 도 7과 같이 제 1비아홀(31)로 에너지가 큰 열이 전달되고 동시에 인접한 제 2비아홀(32)에도 충전기보드(30)를 통하여 동시에 전달되고, 제 2비아홀(32) 내벽의 열전도코팅층(34)을 통하여 방열판(20)으로 추가로 분산되므로 냉각시간을 단축시킨다. 열전도 량과 전달 방향을 화살표 크기와 방향으로 예시하면 도 7과 같이 표기할 수 있다. 이는 제 2비아홀(32)측을 통한 방열은 상대적으로 작아서, 남은 방열 기능을 제 1비아홀(31) 측 열을 흡수하는 것을 의미하며, 이러한 추가 흡수 기능 때문에 방열효율을 향상시킨다.As shown in FIG. 7, the heat generated by the heat conductive pad 38 is transferred to the first via hole 31 through the charger board 30 and simultaneously transmitted to the adjacent second via hole 32, It is further dispersed into the heat sink 20 through the heat conductive coating layer 34 on the inner wall of the via hole 32, thereby shortening the cooling time. The amount of heat conduction and the direction of transmission can be represented by arrows in the size and direction as shown in FIG. This means that the heat dissipation through the second via hole 32 side is relatively small, so that the remaining heat dissipation function is absorbed by the first via hole 31 side, and the heat dissipation efficiency is improved due to this additional absorption function.

아울러 본원발명은 도 1 과 같이 충전기보드(30)에 설치된 방열판(20)은 동시에 방열 기능을 가지는 소재로 만든 블랙박스 보조전원장치를 이루는 방열하우징(10)의 내면에 접하도록 설치하므로, 방열하우징(10) 표면으로 전도되는 열을 방열시켜, 충전기보드(30)의 방열 열은 제 1 및 제 2비아홀(31,32), 방열판(20), 방열하우징(10)을 통하여 자연방열되므로, 안정적으로 발열로 인한 문제를 해결하는 방열효율이 좋은 블랙박스 보조전원장치를 제공한다.1, the heat sink 20 provided on the charger board 30 is installed to contact the inner surface of the heat sink housing 10 constituting a black box auxiliary power source device made of a material having a heat radiation function at the same time, Since the heat dissipated from the surface of the charger board 30 is radiated through the first and second via holes 31 and 32, the heat sink 20 and the heat dissipation housing 10, Which provides a black box auxiliary power supply having a good heat dissipation efficiency for solving the problem caused by heat generation.

1,2;터미날 10;방열하우징 20;방열판 30;충전기보드 31;제 1비아홀 32;제 2비아홀 33,34;열전도코팅층 35;표면실장소자 36;실장부위 37;공간부위 38;열전도패드 39;열전도테이프A thermal conductive coating layer 35 is formed on a surface of a thermally conductive pad 39. The thermally conductive coating layer 35 is formed on the surface of the thermally conductive pad 39, ; Heat conduction tape

Claims (3)

방열재질의 블랙박스 보조전원장치용 방열하우징(10);
방열하우징 내벽에 열전도 가능토록 접속 설치된 방열판(20); 및
충전기보드의 일면에 열전도테이프(39)로 방열판(20)을 설치하고, 충전기보드의 다른 면에는 표면 실장형(Surface mountaining type) 표면실장소자(35)들의 실장부위(36) 표면에서 상하로 관통하도록 형성한 다수의 제 1비아홀(31)과, 표면 실장부위(36) 사이의 공간부위(37)표면에도 상하로 관통하도록 형성한 다수의 제 2비아홀(32)을 형성한 블랙박스 보조전원용 충전기보드(30)를 포함하고;
상기, 제 1비아홀(31)은 내벽에 열전도코팅층(33)을 형성하고;
상기, 제 2비아홀(32)은 내벽에 열전도코팅층(34)을 형성한 것을 특징으로 하는 방열효율이 좋은 블랙박스 보조전원장치.A heat dissipation housing (10) for a black box auxiliary power supply of a heat dissipation material;
A heat sink (20) connected to the inner wall of the heat dissipation housing so as to be capable of heat conduction; And
A heat sink 20 is provided on one surface of the charger board and a heat sink 20 is mounted on the other surface of the charger board so as to penetrate vertically from the surface of the mounting region 36 of the surface mount type surface mount devices 35 And a plurality of second via holes 32 formed so as to penetrate up and down on the surface of the space portion 37 between the surface mounting portion 36 and the black box auxiliary power source charger 31, A board (30);
The first via hole 31 is formed with a thermally conductive coating layer 33 on the inner wall thereof;
Wherein the second via hole (32) has a thermally conductive coating layer (34) formed on an inner wall thereof. 삭제delete 삭제delete
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014588A (en) * 2002-06-04 2004-01-15 O K Print:Kk Wiring board

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Publication number Priority date Publication date Assignee Title
JPH0736468U (en) * 1993-12-06 1995-07-04 株式会社東海理化電機製作所 Heat dissipation structure for electronic components

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014588A (en) * 2002-06-04 2004-01-15 O K Print:Kk Wiring board

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