KR20070063817A - Semiconductor package with heat sink - Google Patents

Abstract

A semiconductor package is provided to reduce the thickness of the package and to improve a heat radiating efficiency by using a heat sink protruded to the outside through a molding layer. A semiconductor package includes a substrate, chip, and a molding layer. The substrate(110) includes a plurality of solder balls at one side. The chip is mounted on the other side of the substrate. The molding layer(130) is formed on the substrate to cover the chip, so that the chip is protected from the outside. The semiconductor package further includes a heat sink. The heat sink(140) is formed on the chip. The heat sink is protruded to the outside through the molding layer.

Description

Semiconductor package with heat sink {Semiconductor package with heat sink}

1 is a cross-sectional view showing a state in which a heat sink is attached to a conventional semiconductor package;

2 is a perspective view illustrating a heat sink attached to a semiconductor package according to an embodiment of the present invention;

3 is a cross-sectional view illustrating a heat sink attached to a semiconductor package along line III-III ′ of FIG. 2;

Figure 4 is a schematic diagram showing the flow of air between the protrusion bar of Figure 2;

<Description of the symbols for the main parts of the drawings>

100 ... semiconductor package with heat sink 110 ... substrate

120 ... chip 130 ... molding layer

140 ... heatsink 141 ... base plate

142 ... protrusion bar

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package, and more particularly, to a semiconductor package provided with a heat sink for dissipating high temperature heat generated during chip driving to the outside.

A semiconductor package is a package that is electrically sealed so that individual dies made by a wafer process can be used as actual electronic components, and is sealed to protect against external shocks. Various semiconductor packages are being developed to meet this.

The power consumption of the semiconductor package increases as various functions and performances increase, while the size of the semiconductor package decreases due to the improvement of integrated technology. Thus, the problem of heat dissipation of high temperature heat generated when driving the chips constituting the semiconductor package increases. I'm going.

The heat sink 20 is coupled to the surface of the semiconductor package 10 as shown in FIG. 1 to properly dissipate heat generated when the chip is driven.

However, the heat sink 20 having such a structure has a problem that its efficiency is lower than that of the direct heat dissipation method because it uses an indirect heat dissipation method for dissipating heat conducted from a chip (not shown) which is a heat source to the molding layer to the outside.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide an improved semiconductor package capable of improving heat dissipation efficiency by a direct heat dissipation method.

The semiconductor package of the present invention for achieving the above object is a substrate on which a solder ball is mounted on one side, a chip mounted on the other side of the substrate, and to cover the chip to protect the chip from the outside on the substrate It includes a molding layer laminated on the, it is preferable that a heat sink protruding to the outside through the molding layer is provided on the chip.

Here, the heat sink preferably includes a base plate in contact with the chip and a plurality of protrusion bars protruding from the base plate to penetrate the molding layer.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view of a semiconductor package in which a heat sink is coupled according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of the semiconductor package in which a heat sink is coupled along the line III-III ′ of FIG. 2.

Referring to the drawings, the semiconductor package 100 to which the heat sink is coupled includes a substrate 110 having a solder ball 150 provided on one side thereof, a chip 120 mounted on the other side of the substrate 110, and the chip ( And a molding layer 130 stacked on the substrate 110 to cover a portion of the heat sink 140 and the chip 120 and the heat sink 140 provided on the 120.

The heat sink 140 is a base plate 141 which is a portion covered by the molding layer 130 and a plurality of spaced apart from each other on one surface of the base plate 141, protruding outside the molding layer 130 Protruding bar 142 is made.

Here, the reason for forming the plurality of protrusion bars 142 on the base plate 141 is not only the reason for enlarging the surface area when absorbing heat from the chip 120 to radiate heat to the outside, the semiconductor package is mounted In order to easily dissipate heat retained in each protruding bar 142 by actively utilizing the flow of internal air as shown in FIG. 4. Here, reference numeral 160 denotes a printed circuit board.

 According to the semiconductor package in which the heat sink 140 having such a structure is coupled, the heat sink 140 is attached to the chip 120 that generates high heat when the semiconductor package is driven, and the heat sink 140 is configured. The plurality of protruding bars 142 penetrate the molding layer 130 to be exposed to the outside, thereby directly absorbing high temperature heat and radiating heat to the outside, and indirectly through the molding layer made of a conventional low conductive material. The heat dissipation efficiency can be improved as compared with the heat dissipation.

As described above, according to the semiconductor package of the present invention, a part of the heat sink is brought into contact with a chip inside the molding layer, thereby reducing the overall thickness and providing an effect of improving heat radiation efficiency by a direct heat radiation method. .

It is to be understood that the invention is not limited to that described above and illustrated in the drawings, and that more modifications and variations are possible within the scope of the following claims.

Claims (2)

A semiconductor package comprising a substrate having solder balls mounted on one side, a chip mounted on the other side of the substrate, and a molding layer stacked on the substrate to cover the chip to protect the chip from outside. And a heat sink protruding to the outside through the molding layer on the chip. The method of claim 1, The heat sink includes a base plate in contact with a chip and a plurality of protrusion bars protruding from the base plate penetrating the molding layer.

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