CN220254965U - Heat radiation structure for circuit module and electronic equipment - Google Patents
Heat radiation structure for circuit module and electronic equipment Download PDFInfo
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- CN220254965U CN220254965U CN202321593481.2U CN202321593481U CN220254965U CN 220254965 U CN220254965 U CN 220254965U CN 202321593481 U CN202321593481 U CN 202321593481U CN 220254965 U CN220254965 U CN 220254965U
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- heat
- heat dissipation
- electronic device
- circuit board
- housing
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- 230000005855 radiation Effects 0.000 title description 11
- 230000017525 heat dissipation Effects 0.000 claims abstract description 70
- 239000003292 glue Substances 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
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- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011499 joint compound Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Abstract
A heat dissipation structure for a circuit module, comprising: a housing; a circuit board mounted within the housing; an electronic device; the electronic device is mounted on the circuit board; a heat dissipation pad; the heat dissipation pad is arranged on the circuit board at one side of the electronic device; a heat sink; the heat dissipation piece is arranged on the heat dissipation bonding pad and the electronic device; and the heat conducting glue is arranged in the shell and wraps all the parts. The heat generated by the electronic device can be conducted out by arranging a heat dissipation pad beside the electronic device and additionally arranging a heat dissipation piece. The heat dissipation area is further increased through the package of heat-conducting glue to the lateral surface of heat-conducting glue meets with the shell, finally through the layer upon layer transmission to heat, heat conduction to the shell on, has increased final heat dissipation area, has not only guaranteed radiating efficiency, does not need extra energy consumption and heat production moreover, has reduced entire system's complexity, and life is permanent, maintains portably.
Description
Technical Field
The present disclosure relates to heat dissipation structures for circuits, and particularly to a heat dissipation structure for a circuit module and an electronic device.
Background
The module circuits such as the converter or the driver realize the assembly of the PC B light plate, the patch element, the plug-in element and the magnetic core, which is called as the PC B A for short. The components on the current medium and high power circuit module are mostly from different manufacturers, the components are very different in related factors such as processing technology and precision errors, so that the temperature of the same schematic diagram is ultrahigh when components of different manufacturers are used, and the products cannot pass a series of screening tests. At present, the traditional heat dissipation structure adopts an air cooling and liquid cooling mode; as disclosed in the chinese patent application No. 2 0 2 0 2 0 5 7 0 8 0 2.7, a heat dissipation structure for an inverter is disclosed, in which the power devices are uniformly disposed on top of the cooling flow channel, so that most of the heat generated by the power devices is taken away in the process of flowing through the cooling flow channel, thereby improving the heat dissipation performance of the entire inverter. The utility model patent of China as 2 0 2 0 2 0 2 0 3 5 9 7.0 discloses a heat radiation structure suitable for a digital D C-D C conversion device, wherein the heat radiation structure comprises a motor, a rotating shaft, a first bevel gear, a second bevel gear and fan blades, the heat radiation mechanisms are arranged on two sides of a device main body, heat radiation net openings are formed on two sides of the device main body, when the device main body is used, the heat radiation mechanisms can be started to open the heat radiation net openings for heat radiation, the heat radiation effect is guaranteed to be good, and heat aggregation is avoided. All the above mechanisms need to be provided with additional power to drive the heat dissipation structure, so that the complexity of the system and the later use and maintenance cost are increased.
Disclosure of Invention
The application provides a heat radiation structure for circuit module for simplify heat radiation structure and system structure when realizing the circuit heat dissipation, the later stage of also being convenient for use and maintain when reduce cost.
In order to achieve the above purpose, the technical scheme adopted by the application is as follows:
a heat dissipation structure for a circuit module, comprising:
a housing;
a circuit board mounted within the housing;
an electronic device; the electronic device is mounted on the circuit board;
a heat dissipation pad; the heat dissipation pad is arranged on the circuit board at one side of the electronic device;
a heat sink; the heat dissipation piece is arranged on the heat dissipation bonding pad and the electronic device;
and the heat conducting glue is arranged in the shell and wraps all the parts.
Furthermore, gaps among the electronic devices and between the electronic devices and the circuit board are filled with the gap filler.
Furthermore, the caulking agent adopts non-adhesive heat conduction caulking agent.
Further, the heat dissipation piece is adhered to the heat dissipation bonding pad and the electronic device through heat conduction glue.
Further, the heat dissipation piece is made of aluminum nitride, boron nitride or diamond.
Further, the circuit board adopts a PCB.
Further, the shell is a metal shell.
Further, the outer side surface of the heat-conducting glue is connected with the shell.
Further, a gap is arranged between the circuit board and the shell; and a heat-conducting adhesive is arranged in the gap.
An electronic device comprising a heat dissipating structure as described above.
A heat dissipation structure for a circuit module, comprising: a housing; a circuit board mounted within the housing; an electronic device; the electronic device is mounted on the circuit board; a heat dissipation pad; the heat dissipation pad is arranged on the circuit board at one side of the electronic device; a heat sink; the heat dissipation piece is arranged on the heat dissipation bonding pad and the electronic device; and the heat conducting glue is arranged in the shell and wraps all the parts. The heat generated by the electronic device can be conducted out by arranging a heat dissipation pad beside the electronic device and additionally arranging a heat dissipation piece. Then, the heat radiating area is further increased through the package of heat conducting glue to the lateral surface of heat conducting glue meets with the shell, finally through layer upon layer transmission, the heat conduction to the shell to the heat, has increased final heat radiating area, and traditional heat dissipation mode is relatively done, does not have the foreign object to block with the shell heat dissipation, has not only guaranteed radiating efficiency, does not need extra energy consumption and heat production moreover, has reduced entire system's complexity, long service life, and it is simple and convenient to maintain.
Drawings
Fig. 1 is a schematic diagram of a heat dissipation structure for a circuit module.
Reference numerals illustrate: the heat-conducting adhesive 1, the shell 2, the heat dissipation piece 3, the glue 4, the heat dissipation bonding pad 5, the circuit board 6, the support 7, the electronic device 8 and the joint compound 9.
Detailed Description
Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present disclosure will become readily apparent to those skilled in the art from the following disclosure, which describes embodiments of the present disclosure by way of specific examples. It will be apparent that the described embodiments are merely some, but not all embodiments of the present disclosure. The disclosure may be embodied or practiced in other different specific embodiments, and details within the subject specification may be modified or changed from various points of view and applications without departing from the spirit of the disclosure. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, based on the embodiments in this disclosure are intended to be within the scope of this disclosure.
Example 1
In some products, users require to use components of specified suppliers, and when the medium-high power products continuously work, the heat generated by the high-power components on the PCB is extremely high, so that the components with relatively low peripheral temperature resistance can not be timely dispersed, and the related screening test can not be passed. Therefore, better solutions to the heat dissipation requirements of medium and high power products are urgently needed. The existing heat dissipation mode is to dissipate heat in a wind-heat or liquid-cooling mode, and additional power is required to drive a heat dissipation structure, so that the complexity of the system and the later use and maintenance cost are increased.
Fig. 1 is a schematic structural diagram of a heat dissipation structure for a circuit module according to the present application, including:
a housing 2;
a circuit board 6, the circuit board 6 being mounted within the housing 2;
an electronic device 8; the electronic device 8 is mounted on the circuit board 6; the electronic device 8 comprises a high-power plastic package device;
a heat dissipation pad 5; the heat dissipation pad 5 is arranged on the circuit board 6 at one side of the electronic device 8; when designing a layout of a medium-high power product, reserving a heat dissipation pad 5 with a specified specification beside a high-power plastic package device;
a heat sink 3; the heat sink 3 is mounted on the heat dissipation pad 5 and the electronic device 8;
the heat-conducting glue 1, the heat-conducting glue 1 is arranged in the shell 2 and wraps all parts.
In practice, the gaps between the electronic components 8 and the circuit board 6 are filled with a gap filler 9.
In a specific implementation, the underfill 9 is an adhesive-free heat conductive underfill 9, and is generally an adhesive-free underfill 9 with a high heat conductivity coefficient.
In a specific implementation, the heat dissipation element 3 is adhered to the heat dissipation pad 5 and the electronic device 8 by using a heat conduction glue 4 (typically, a glue 4 with high adhesion and high heat conduction), so as to ensure heat transfer efficiency between the heat dissipation pad 5 and the electronic device 8 and the heat dissipation element 3.
In specific implementation, the heat dissipation member 3 is made of a heat dissipation material with high thermal conductivity and high insulation performance, such as aluminum nitride, boron nitride or diamond, so as to accelerate heat transfer.
In a specific implementation, the circuit board 6 is a PCB board.
In specific implementation, the shell 2 is a metal shell 2, so that heat transfer and heat dissipation are facilitated.
In a specific implementation, the outer side surface of the heat-conducting glue 1 is connected with the housing 2, so as to transfer heat to the housing 2.
In a specific implementation, the circuit board 6 is mounted at the bottom of the housing 2 through a support 7, so that a gap is formed between the circuit board 6 and the housing 2; and a heat-conducting adhesive 1 is arranged in the gap. The heat-conducting glue 1 not only wraps the electronic device 8, but also wraps the electronic device together with the whole circuit board 6, and meanwhile, the heat-conducting glue 1 is connected with the shells 2 on two sides and the shells 2 on the bottom surface, so that the contact area between the heat-conducting glue 1 and the shells 2 is increased, the heat dissipation area is further increased, and the heat dissipation efficiency is accelerated.
The high-adhesion and high-heat-conductivity glue 4 is used for respectively adhering and curing heat dissipation materials (aluminum nitride, boron nitride and diamond) with high heat conductivity and high insulating property with the surfaces of a heat dissipation bonding pad 5 and a high-power plastic package device on a PCB, gaps of a high-power device area and a peripheral area on the PCB are filled with a gap filler 9 with high heat conductivity without adhesion, and after a product assembled by the high-power PCBA is put into the shell 2, the heat-conductivity glue 1 is filled. The heat is transferred layer by layer and conducted onto the shell 2, so that the final heat radiating area is increased, compared with a traditional heat radiating mode, no foreign object is blocked by utilizing the shell 2 to radiate heat, the heat radiating efficiency is guaranteed, the extra energy consumption and heat generation are avoided, the complexity of the whole system is reduced, the service life is long, and the maintenance is simple and convenient.
Example two
An electronic device comprising a heat dissipating structure as described above.
A heat dissipation structure for a circuit module, comprising: a housing; a circuit board mounted within the housing; an electronic device; the electronic device is mounted on the circuit board; a heat dissipation pad; the heat dissipation pad is arranged on the circuit board at one side of the electronic device; a heat sink; the heat dissipation piece is arranged on the heat dissipation bonding pad and the electronic device; and the heat conducting glue is arranged in the shell and wraps all the parts. The heat generated by the electronic device can be conducted out by arranging a heat dissipation pad beside the electronic device and additionally arranging a heat dissipation piece. Then, the heat radiating area is further increased through the package of heat conducting glue to the lateral surface of heat conducting glue meets with the shell, finally through layer upon layer transmission, the heat conduction to the shell to the heat, has increased final heat radiating area, and traditional heat dissipation mode is relatively done, does not have the foreign object to block with the shell heat dissipation, has not only guaranteed radiating efficiency, does not need extra energy consumption and heat production moreover, has reduced entire system's complexity, long service life, and it is simple and convenient to maintain.
In the description of the present utility model, it should be understood that the terms "middle," "length," "upper," "lower," "front," "rear," "vertical," "horizontal," "inner," "outer," "radial," "circumferential," and the like indicate an orientation or a positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model.
In the present utility model, unless expressly stated or limited otherwise, a first feature "on" a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. The meaning of "a plurality of" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
The above description is for the purpose of illustrating the embodiments of the present utility model and is not to be construed as limiting the utility model, but is intended to cover all modifications, equivalents, improvements and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. A heat dissipation structure for a circuit module, comprising:
a housing;
a circuit board mounted within the housing;
an electronic device; the electronic device is mounted on the circuit board;
a heat dissipation pad; the heat dissipation pad is arranged on the circuit board at one side of the electronic device;
a heat sink; the heat dissipation piece is arranged on the heat dissipation bonding pad and the electronic device;
and the heat conducting glue is arranged in the shell and wraps all the parts.
2. The heat dissipating structure of claim 1, wherein gaps between said electronic devices and said circuit board are filled with an underfill.
3. The heat dissipating structure of claim 2, wherein said underfill is a non-adhesive thermally conductive underfill.
4. The heat dissipating structure of claim 1, wherein the heat dissipating member is bonded to the heat dissipating pad and the electronic device by a thermally conductive glue.
5. The heat dissipating structure of claim 4, wherein said heat dissipating member is aluminum nitride, boron nitride or diamond.
6. The heat dissipating structure of claim 1, wherein said circuit board is a PCB board.
7. The heat dissipating structure of claim 1, wherein said housing is a metal housing.
8. The heat dissipating structure of claim 7, wherein an outer side of said heat conductive gel is coupled to said housing.
9. The heat dissipating structure of claim 7, wherein a gap is provided between said circuit board and said housing; and a heat-conducting adhesive is arranged in the gap.
10. An electronic device comprising the heat dissipation structure as recited in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321593481.2U CN220254965U (en) | 2023-06-20 | 2023-06-20 | Heat radiation structure for circuit module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321593481.2U CN220254965U (en) | 2023-06-20 | 2023-06-20 | Heat radiation structure for circuit module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220254965U true CN220254965U (en) | 2023-12-26 |
Family
ID=89229477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321593481.2U Active CN220254965U (en) | 2023-06-20 | 2023-06-20 | Heat radiation structure for circuit module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220254965U (en) |
-
2023
- 2023-06-20 CN CN202321593481.2U patent/CN220254965U/en active Active
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| GR01 | Patent grant |