CN111442419A - Electrical apparatus box structure and air condensing units - Google Patents
Electrical apparatus box structure and air condensing units Download PDFInfo
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- CN111442419A CN111442419A CN202010393228.7A CN202010393228A CN111442419A CN 111442419 A CN111442419 A CN 111442419A CN 202010393228 A CN202010393228 A CN 202010393228A CN 111442419 A CN111442419 A CN 111442419A
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- heat dissipation
- plate
- attached
- electrical box
- circuit board
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/22—Arrangement or mounting thereof
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention is suitable for the technical field of electrical appliance parts, and provides an electrical appliance box structure and an air conditioner outdoor unit, which comprise: the first electric appliance box comprises a first electric appliance box main body, a second electric appliance box main body and a first electric appliance box cover, wherein the first electric appliance box main body comprises a first bottom plate and a first box cover; a first component board comprising: the first component board is arranged in the electric appliance box main body; the heat dissipation assembly at least comprises a heat dissipation plate, and one surface of the heat dissipation plate is attached to the first bottom plate; at least a part of first components on the first circuit board are attached to the first bottom plate or the heat dissipation plate through solid media. According to the embodiment of the invention, the heat generated by the part of components is conducted on the heat dissipation plate through the solid medium, and the traditional air heat conduction mode is replaced by the solid heat conduction mode, so that the heat exchange efficiency is greatly improved, and the heat dissipation effect of the part of components is further improved.
Description
Technical Field
The invention belongs to the technical field of electric appliance parts, and particularly relates to an electric appliance box structure and an air conditioner outdoor unit.
Background
At present, because electronic components in the electric appliance box are high in integration degree and generate larger heat, the effect of air cooling heat dissipation of the electronic components is unsatisfactory.
In order to solve the problem of poor air-cooling heat dissipation effect, the electronic components in the electrical box are cooled by utilizing a solid heat conduction mode so as to improve the heat dissipation effect of the electronic components. For example, patent CN108151187A published in 2018, 6, month and 12 is an electrical box structure with a refrigerant heat dissipation mechanism, in which a refrigerant heat sink is attached to the outside of an electrical box assembly, and a power module is connected to the electrical box through a heat conduction gasket, so as to establish a solid heat conduction channel, thereby increasing the heat dissipation effect of electronic components in the electrical box structure.
Although, the poor problem of forced air cooling radiating effect has been solved to electrical apparatus box structure among the prior art, however, the contact (direct contact or indirect contact) area undersize between electronic components in the electrical apparatus box structure and the heating panel, the heat that its produced can only carry out the heat dissipation on conducting to the heating panel through the mode of air heat conduction, and because the hot-air can come up the dispersion, consequently, can have the heat of most production can't conduct to dispel the heat on the heating panel to still can lead to electronic components's radiating effect poor.
Disclosure of Invention
The embodiment of the invention provides an electrical box structure, and aims to solve the problem that an electronic component in the existing electrical box structure is poor in heat dissipation effect.
The embodiment of the present invention is achieved as described above, and provides an electric appliance box structure, including:
the first electric appliance box comprises a first electric appliance box main body, a second electric appliance box main body and a first electric appliance box cover, wherein the first electric appliance box main body comprises a first bottom plate and a first box cover;
a first component board comprising: the first component board is arranged in the electric appliance box main body;
the heat dissipation assembly at least comprises a heat dissipation plate, and one surface of the heat dissipation plate is attached to the first bottom plate;
at least a part of first components on the first circuit board are attached to the first bottom plate or the heat dissipation plate through solid media.
Furthermore, at least a part of the first components attached to the first circuit board on the first bottom plate or the heat dissipation plate through the solid-state medium are non-flat components, wherein the solid-state medium for attaching the non-flat components to the first bottom plate or the heat dissipation plate is potting adhesive, and the potting adhesive encapsulates the bottom area of the non-flat components on the first bottom plate or the heat dissipation plate.
Still further, at least a portion of the first component attached to the first circuit board on the first base plate or the heat spreader via the solid medium includes at least one of an inductor, a capacitor, a diode, a transistor, an insulator gate bipolar transistor, a field effect transistor, and a rectifier bridge.
Furthermore, the heat dissipation assembly further comprises a refrigerant pipe penetrating through the heat dissipation plate.
Furthermore, the heat dissipation plate is an aluminum plate, and at least a part of the flat first components on the first circuit board is attached to the aluminum plate through the solid medium.
Furthermore, the electrical box structure further comprises a second electrical box main body and a second component board arranged in the second electrical box main body, the second electrical box main body comprises a second bottom board and a second box cover, the second component board comprises a second circuit board and a plurality of second components arranged on the second circuit board, and the second bottom board is attached to the heat dissipation board;
at least a part of the second component on the second circuit board is attached to the second bottom plate or the heat dissipation plate through a solid medium.
Furthermore, the first bottom plate and the second bottom plate are the same bottom plate, at least one part of first components on the first circuit board attached through the solid medium is attached to the first bottom plate, and at least one part of second components on the second circuit board attached through the solid medium is attached to the heat dissipation plate.
Still further, the surface of the first bottom plate or/and the second bottom plate of the second electrical box main body is coated with heat conductive silicone grease.
Furthermore, the electrical box structure further comprises at least two second electrical box main bodies and a second component board arranged inside the second electrical box main bodies, wherein each second electrical box main body comprises a second bottom plate and a second box cover, each second component board comprises a second circuit board and a plurality of second components arranged on the second circuit board, and at least one part of the second components on the second circuit board are attached to the first surface of the second bottom plate through solid media;
at least a part of first components on the first circuit board attached through the solid media are attached to the first surface of the first base plate, the second surface of the first base plate and the second surface of the second base plate are both attached to the heat dissipation plate, the second surface of the first base plate is outside the first electrical box main body, and the second surface of the second base plate is outside the second electrical box main body.
The embodiment of the invention also provides an air conditioner outdoor unit, and the electric box structure in the air conditioner outdoor unit is the electric box structure.
Compared with the prior art, the electric box structure provided by the embodiment of the invention has the advantages that the heat dissipation plate is arranged on the first bottom plate in an attaching mode, at least one part of the first components on the first circuit board is attached to the first bottom plate or the heat dissipation plate through the solid medium, so that heat generated by the part of the components is dissipated through the heat dissipation plate conducted by the solid medium and then through the heat dissipation plate, the traditional air heat conduction mode is replaced by the solid heat conduction mode, the heat exchange efficiency is greatly improved, and the heat dissipation effect of the part of the components is further improved.
Drawings
Fig. 1 is a schematic structural diagram of a first type of electrical box structure provided in an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a second type of electrical box structure provided in the embodiment of the present invention.
Fig. 3 is a schematic diagram of a heat dissipation plate in an electrical box structure according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a third type of electrical box structure according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of a fourth type of structure of an electrical box structure according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a fifth type of electrical box structure provided in the embodiment of the present invention.
Wherein, 1, a first bottom plate; 2. a heat dissipation plate; 3. a refrigerant pipe; 4. a first circuit board; 5. a first box cover; 6. a first component; 7. a solid-state medium; 8. a second base plate; 9. a second circuit board; 10. a second component; 11. a second box cover; 12. first electrical apparatus box main part, 13, second electrical apparatus box main part.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example one
The present embodiment provides an electrical box structure, as shown in fig. 1, including:
the first electrical box main body 12, the first electrical box main body 12 includes a first bottom plate 1 and a first box cover 5.
A first component board comprising: the first circuit board 4 and set up a plurality of first components 6 on first circuit board 4, the first components board sets up inside the electrical apparatus box main part.
The heat dissipation assembly at least comprises a heat dissipation plate 2, and one surface of the heat dissipation plate 2 is attached to the first base plate 1.
At least a part of the first components 6 on the first circuit board 4 are attached to the first base plate 1 or the heat dissipation plate 2 through the solid medium 7.
Specifically, the first box cover 5 and the first bottom plate 1 are fixed by screws (or bonding), and the arrangement mode of the first box cover and the bottom plate is preferably a fully closed state so as to prevent water, dust, insects and the like. Of course, the first cover 5 or the first base plate 1 may be set to be in a semi-closed state according to actual requirements, for example, heat dissipation holes are formed in the first cover.
Specifically, the circuit board is also called as a circuit board, a PCB board, etc., the first component 6 includes a resistor, a capacitor, various transistors (such as a diode, a triode, a field effect transistor, etc.), a chip, etc., and the number and the kind of the first component 6 inside the different electrical box structures are also different.
Specifically, the heat dissipation plate 2 is a plate-like structure made of aluminum (aluminum alloy, bronze, brass, and the like) so as to dissipate heat for the first component 6 in the structure of the electric box by its heat absorption performance and heat conduction performance.
Specifically, the solid medium 7 can be selected from a heat conducting adhesive, a potting adhesive, a heat conducting rubber and other solid media 7 with heat conducting performance, if the solid medium 7 of glue is selected, the first component 6 is attached to the first base plate 1 or the heat dissipation plate 2 in a potting mode, if the solid medium 7 of glue is selected, the first component 6 can be attached to the heat conducting rubber in a pasting mode firstly, and then the heat conducting rubber is attached to the first base plate 1 or the heat dissipation plate 2, so that indirect attachment with the first base plate 1 or the heat dissipation plate 2 is realized.
Specifically, as shown in fig. 2, when the heat dissipation plate 2 is disposed on the outer side of the first base plate 1, the first component 6 on the first circuit board 4 attached by the solid medium 7 is attached to the first base plate 1, and at this time, the first component 6 on the first circuit board 4 is in indirect contact with the heat dissipation plate 2; as shown in fig. 1, when the heat dissipation plate 2 is disposed on the inner side surface of the first base plate 1, the first component 6 on the first circuit board 4 attached via the solid medium 7 is attached to the heat dissipation plate 2, at this time, the first component 6 on the first circuit board 4 is in direct contact with the heat dissipation plate 2, and the heat dissipation plate 2 can reduce the air temperature in the main body of the electrical box, thereby enhancing the heat convection effect of the air in the main body of the electrical box.
The electrical apparatus box structure of this embodiment sets up on first bottom plate 1 through laminating heating panel 2 to with at least partly first component 6 on first circuit board 4 through solid-state medium 7 attached on first bottom plate 1 or heating panel 2, thereby make the heat that this part components and parts produced through solid-state medium conduction on heating panel 2, rethread heating panel 2 dispels the heat, traditional air heat conduction mode has been replaced to the mode of solid heat conduction, great improvement heat exchange efficiency, and then promoted the radiating effect of this part components and parts.
In order to better dissipate heat of the first component 6 in the electrical box structure, the first component 6 on the first circuit board 4 may be attached to the first base board 1 or the heat dissipation board 2 through the solid medium 7.
As an alternative embodiment of the present invention, as shown in fig. 1, at least a portion of the first component 6 attached to the first circuit board 4 on the first base board 1 or the heat dissipation plate 2 through the solid medium 7 is an unpalatable component, wherein the solid medium 7 for attaching the unpalatable component to the first base board 1 or the heat dissipation plate 2 is a potting adhesive, and the potting adhesive encapsulates a bottom region of the unpalatable component on the first base board 1 or the heat dissipation plate 2.
Of course, as shown in fig. 3, the first component 6 attached to the first substrate 1 or the heat sink via the solid medium 7 is not limited to the non-flat component, and other types of first components 6 may be attached to the first substrate 1 or the heat sink via the solid medium 7.
Specifically, the non-flat components include inductors, capacitors, and the like, which is only an example of the structure of the electrical box. The flat first component 6 in the electrical box structure can also be attached to the first base plate 1 or the heat dissipation plate 2 through the solid medium 7, such as a diode, a triode, a field effect transistor, a rectifier bridge and the like, so as to improve the heat dissipation effect of the components.
By way of example, the inductance is the iron core of annular column nature, the winding copper line outside, if directly be connected it with first circuit board 4 through the wire, set up first circuit board 4 on the bottom plate again, at this moment, the inductance is owing to the area undersize with 2 indirect contacts of heating panel, consequently, can only conduct the heat that produces to heating panel 2 through the mode of air heat conduction during the heat dissipation, and because hot-air can float the dispersion, can have on the heat unable conduction of most productions to heating panel 2, heating panel 2 can be limited for the heat that the inductance gived like this. As shown in fig. 2, but now the inductor is attached to the first base plate 1 or the heat dissipation plate 2 through the solid medium 7, most of the heat of the inductor can be directly conducted to the heat dissipation plate 2 through solid heat conduction, so as to improve the heat dissipation effect of the inductor.
Due to the fact that the shape of the non-flat component is irregular, the first component 6 is attached to the first base plate 1 or the heat dissipation plate 2 through the solid medium 7, the contact area of the first component 6 and the heat dissipation plate 2 can be increased better, heat dissipation of the first component 6 is further achieved, the heat dissipation effect of the first component 6 is improved, and the situation that the first component 6 is poor in heat dissipation effect and causes faults due to the fact that the contact area of the first component 6 and the first base plate 1 or the heat dissipation plate 2 is too small due to the irregular shape is avoided.
As shown in fig. 1, the non-flat component encapsulates the bottom region on the first bottom plate 1 and the heat dissipation plate 2 in an encapsulating manner, so that the contact area between the non-flat component and the heat dissipation plate 2 can be further increased to improve the heat dissipation effect.
As another alternative embodiment of the present invention, as shown in fig. 3, the heat dissipation assembly further includes a refrigerant pipe 3 penetrating the heat dissipation plate 2.
Specifically, the two ends of the refrigerant pipe 3 are also provided with interfaces, so that refrigerants (water, brine, chlorofluorocarbon and the like) can be circularly injected into the refrigerant pipe 3, and the heat dissipation effect of the heat dissipation assembly is improved.
Preferably, this refrigerant pipe 3 is the copper pipe, because the copper pipe has good heat conductivility, consequently, chooses for use the copper pipe and can promote the heat conduction effect of refrigerant pipe 3 to further promote radiating component's radiating effect. Of course, the tube body with heat conductivity such as an aluminum tube and an iron tube can be selected according to actual requirements.
As another alternative embodiment of the present invention, as shown in fig. 3, the heat dissipation plate 2 is specifically an aluminum plate, and at least a part of the flat first component 6 on the first circuit board 4 is attached to the aluminum plate through a solid medium 7.
At this moment, the heat dissipation assembly is arranged inside the first electrical box, the flat first components 6 in the first circuit board 4 are attached to the aluminum plate through the solid media 7, and certainly, the flat first components 6 are not limited, and the first components 6 of other types can also be attached to the aluminum plate through the solid media 7.
Because the first component 6 volume of platykurtic is less, consequently, this kind of first component 6 is convenient for directly attach on aluminum plate, and passes through solid-state medium 7 with this kind of first component 6 and attach on aluminum plate, can be better dispel the heat to this kind of first component 6 to promote the radiating effect.
As another alternative embodiment of the present invention, as shown in fig. 4, the electrical box structure further includes a second electrical box main body 13 and a second component board disposed inside the second electrical box main body 13, the second electrical box main body 13 includes a second base board 8 and a second box cover 11, the second component board includes a second circuit board 9 and a plurality of second components 10 disposed on the second circuit board 9, and the second base board 8 is attached to the heat dissipation plate 2;
wherein at least a part of the second component 10 on the second circuit board 9 is attached to the second base plate 8 or the heat sink plate 2 via the solid medium 7.
Through attaching second bottom plate 8 on heating panel 2, alright dispel the heat for two electrical apparatus box main parts through a heating panel 2 to under the prerequisite of guaranteeing to carry out the heat dissipation to two electrical apparatus box main parts, reduce heating panel 2's material cost.
In order to better dissipate the heat of the second component 10 in the second electrical box main body 13, the second component 10 on the second circuit board 9 may be attached to the second base plate 8 or the heat dissipation plate 2 through the solid medium 7.
In this embodiment, as shown in fig. 4, the first base plate 1 and the second base plate 8 are respectively disposed on two sides of the heat dissipation plate 2, in this case, since the heat dissipation plate 2 is disposed on the outer sides of the first base plate 1 and the second base plate 8, at least a part of the first component 6 on the first circuit board 4 can only be attached to the first base plate 1 through the solid medium 7, and at least a part of the second component 10 on the second circuit board 9 can only be attached to the second base plate 8 through the solid medium 7.
Preferably, as shown in fig. 4, the space between the first base plate 1 and the second base plate 8 is filled with a heat conductive silicone grease, so that heat generated by the first component 6 attached to the first base plate 1 and the second component 10 attached to the second base plate 8 can be better indirectly conducted to the heat dissipation plate 2 through the heat conductive silicone grease, and thus the heat dissipation effect on the first component 6 and the second component 10 can be improved.
Under the prerequisite of guaranteeing the radiating effect, in order to reduce the bottom plate material in first electrical apparatus box main part 12 and the second electrical apparatus box main part 13, first bottom plate 1 and second bottom plate 8 are same bottom plate, and second bottom plate 8 also is first bottom plate 1 promptly, and at this moment, heating panel 2 has two kinds of arrangement modes, and first kind of arrangement mode is the inside bottom plate face of heating panel 2 setting in first electrical apparatus box main part 12, and second kind of arrangement mode is the inside bottom plate face of heating panel 2 setting in second electrical apparatus box main part 13.
When the heat dissipation plate 2 is disposed on the bottom plate surface inside the first electrical box main body 12, at least a part of the first components 6 on the first circuit board 4 is attached to the heat dissipation plate 2, and at least a part of the second components 10 on the second circuit board 9 is attached to the first bottom plate 1.
As shown in fig. 5, when the heat dissipation plate 2 is disposed on the bottom plate surface inside the second electrical box main body 13, at least a part of the first component 6 on the first circuit board 4 is attached to the first bottom plate 1, and at least a part of the second component 10 on the second circuit board 9 is attached to the heat dissipation plate 2.
As another alternative embodiment of the present invention, the surface of the first base plate 1 or/and the second base plate 8 of the second electrical box main body 13 is coated with heat conductive silicone grease.
When the heat dissipation plate 2 is disposed on the outer side of the first base plate 1, a heat conductive silicone grease is coated on the surface of the first base plate 1.
When the heat dissipation plate 2 is disposed on the outer side of the second base plate 8, a heat conductive silicone grease is coated on the surface of the second base plate 8.
When the first substrate 1 and the second substrate 8 are the same substrate, a heat conductive silicone grease is coated on the substrate.
Of course, in order to save material costs for the heat conducting silicone grease, the heat conducting silicone grease may be applied only on one side or both sides of the portion of the first base plate 1 to which the first component 6 is attached via the solid medium 7, and correspondingly, only on one side or both sides of the portion of the second base plate 8 to which the second component 10 is attached via the solid medium 7.
By coating the heat-conducting silicone grease on the first bottom plate 1 or/and the second bottom plate 8, the heat-conducting performance of the first bottom plate 1 and the second bottom plate 8 can be improved, so that the heat can be better dissipated for the first component 6 attached to the first bottom plate 1 and the second component 10 attached to the second bottom plate 8.
Example two
As another alternative embodiment of the present invention, as shown in fig. 6, the electrical box structure further includes at least two second electrical box main bodies 13 and a second component board disposed inside the second electrical box main body 13, the second electrical box main body 13 includes a second bottom board 8 and a second box cover 11, the second component board includes a second circuit board 9 and a plurality of second components 10 disposed on the second circuit board 9, at least a portion of the second components 10 on the second circuit board 9 is attached to the first surface of the second bottom board 8 through a solid medium 7;
at least a part of the first components 6 on the first circuit board 4 attached by the solid medium 7 are attached to the first surface of the first base plate 1, the second surface of the first base plate 1 and the second surface of the second base plate 8 are both attached to the heat dissipation plate 2, the second surface of the first base plate 1 is outside the first electrical box main body 12, and the second surface of the second base plate 8 is outside the second electrical box main body 13.
Preferably, the first and second base plates 1 and 8 are coated with heat conductive silicone grease to enhance the heat conductive effect. In order to save the material cost of the heat-conducting silicone grease, the heat-conducting silicone grease can be coated only on the second surface of the first base plate 1 and the second surface of the second base plate 8, so that the coating area of the heat-conducting silicone grease is reduced on the premise of improving the heat-conducting effect.
This embodiment is through restricting attached first face at first bottom plate 1 through at least partly first component 6 on the first circuit board 4 that will pass through solid-state medium 7 is attached to with attached first face at second bottom plate 8 through at least partly second component 10 on the second circuit board 9 that passes through solid-state medium 7, and all laminate the setting on heating panel 2 with the second face of first bottom plate 1 and the second face of second bottom plate 8, thereby realized that a heating panel 2 dispels the heat for a plurality of electrical apparatus box main parts, under the prerequisite that can dispel the heat with guaranteeing a plurality of electrical apparatus box main parts, reduce the material cost of heating panel 2.
The number of the second electrical box main bodies 13 of the electrical box structure in this embodiment is two, three, four, five, and the like. The structure of the heat dissipation plate 2 is set according to the number of the second electrical box main bodies 13, as shown in fig. 6, if the number of the second electrical box main bodies 13 is two, which is equivalent to three electrical box main bodies, at this time, it is an optimal solution to set the heat dissipation plate 2 to be a triangular prism structure. Of course, the heat dissipation plate 2 may be a rectangular parallelepiped, a pentagonal prism, or the like according to actual requirements.
EXAMPLE III
The embodiment provides an air conditioner outdoor unit, and an electrical box structure in the air conditioner outdoor unit is as in the first embodiment or the second embodiment.
If the electric appliance box structure in the air conditioner outdoor unit is selected from the electric appliance box structure in the first embodiment, the heat dissipation effect of the electric appliance box structure in the air conditioner outdoor unit can be improved, and if the electric appliance box structure is composed of two electric appliance box main bodies, only one bottom plate can be selected, so that the material cost of one bottom plate can be reduced.
If the electrical box structure in the second embodiment is selected as the electrical box structure in the outdoor unit of the air conditioner, the heat dissipation plate 2 can be used for dissipating heat of a plurality of electrical box main bodies, so that the material cost of the heat dissipation plate 2 is reduced on the premise that the plurality of electrical box main bodies can dissipate heat.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. An electrical box structure, comprising:
the first electric appliance box main body comprises a first bottom plate and a first box cover;
a first component board comprising: the first component board is arranged in the electric appliance box main body;
the heat dissipation assembly at least comprises a heat dissipation plate, and one surface of the heat dissipation plate is attached to the first bottom plate;
at least a part of first components on the first circuit board are attached to the first bottom plate or the heat dissipation plate through solid media.
2. The electrical box structure of claim 1, wherein at least a portion of the first components on the first circuit board attached to the first base plate or the heat dissipation plate via the solid-state medium are non-flat components, wherein the solid-state medium for attaching the non-flat components to the first base plate or the heat dissipation plate is a potting adhesive, and the potting adhesive encapsulates a bottom region of the non-flat components on the first base plate or the heat dissipation plate.
3. The electrical enclosure of claim 1, wherein at least a portion of the first components on the first circuit board attached to the first base plate or the heat spreader plate via the solid state media include at least one of an inductor, a capacitor, a diode, a transistor, a field effect transistor, and a rectifier bridge.
4. The electrical box structure of claim 1, wherein the heat sink assembly further comprises a coolant tube disposed through the heat sink plate.
5. The electrical box structure of claim 1, wherein the heat dissipation plate is an aluminum plate, and at least a portion of the flat first component on the first circuit board is attached to the aluminum plate via the solid medium.
6. The electrical box structure according to any one of claims 1 to 4, wherein the electrical box structure further comprises a second electrical box main body and a second component board arranged inside the second electrical box main body, the second electrical box main body comprises a second bottom board and a second box cover, the second component board comprises a second circuit board and a plurality of second components arranged on the second circuit board, and the second bottom board is arranged on the heat dissipation board in an attaching manner;
at least a part of the second component on the second circuit board is attached to the second bottom plate or the heat dissipation plate through a solid medium.
7. The electrical box structure of claim 6, wherein the first base plate and the second base plate are the same base plate, wherein at least a portion of the first components on the first circuit board attached by the solid medium are attached to the first base plate, and at least a portion of the second components on the second circuit board attached by the solid medium are attached to the heat dissipation plate.
8. The electrical box structure of claim 6, wherein a surface of the first base plate or/and the second base plate is coated with a thermally conductive silicone grease.
9. The electrical box structure according to claim 1, wherein the electrical box structure further comprises at least two second electrical box bodies and a second component board disposed inside the second electrical box bodies, the second electrical box bodies comprise a second bottom board and a second box cover, the second component board comprises a second circuit board and a plurality of second components disposed on the second circuit board, and at least a part of the second components on the second circuit board are attached to the first surface of the second bottom board through the solid medium;
at least a part of first components on the first circuit board attached through the solid media are attached to the first surface of the first base plate, the second surface of the first base plate and the second surface of the second base plate are both attached to the heat dissipation plate, the second surface of the first base plate is outside the first electrical box main body, and the second surface of the second base plate is outside the second electrical box main body.
10. An outdoor unit of an air conditioner, wherein an electric appliance box in the outdoor unit of the air conditioner is the electric appliance box structure of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010393228.7A CN111442419A (en) | 2020-05-11 | 2020-05-11 | Electrical apparatus box structure and air condensing units |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010393228.7A CN111442419A (en) | 2020-05-11 | 2020-05-11 | Electrical apparatus box structure and air condensing units |
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| CN111442419A true CN111442419A (en) | 2020-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010393228.7A Pending CN111442419A (en) | 2020-05-11 | 2020-05-11 | Electrical apparatus box structure and air condensing units |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127008A1 (en) * | 2020-12-17 | 2022-06-23 | 广东美的制冷设备有限公司 | Device for controlling air conditioner, and air conditioner |
-
2020
- 2020-05-11 CN CN202010393228.7A patent/CN111442419A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127008A1 (en) * | 2020-12-17 | 2022-06-23 | 广东美的制冷设备有限公司 | Device for controlling air conditioner, and air conditioner |
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