CN220965252U

CN220965252U - PCB and electronic equipment

Info

Publication number: CN220965252U
Application number: CN202322364519.5U
Authority: CN
Inventors: 姜文熙
Original assignee: Shanghai Silang Wanwei Computing Technology Co ltd
Current assignee: Shanghai Silang Wanwei Computing Technology Co ltd
Priority date: 2023-08-31
Filing date: 2023-08-31
Publication date: 2024-05-14
Anticipated expiration: 2033-08-31

Abstract

The utility model belongs to the technical field of electronic circuit boards, and discloses a PCB and electronic equipment. The PCB comprises a PCB body and a radiator, wherein the PCB body comprises a substrate layer, and at least one of the upper surface and the lower surface of the substrate layer is provided with a wiring layer which is used for mounting electronic elements; the radiator is platy, is provided with the liquid cooling runner in the radiator inside, and the liquid cooling runner is provided with the drive pump that drives refrigerant flow, and the heat dissipation layer of radiator presss from both sides and locates between base plate layer and the wiring layer, and the radiating end of radiator is used for being connected with heat exchanger heat transfer. The PCB can accurately radiate heat from the inside to the PCB and the electronic element, so that the occupied space of the radiating device is reduced, and the radiating efficiency is improved.

Description

PCB and electronic equipment

Technical Field

The utility model relates to the technical field of electronic circuit boards, in particular to a PCB and electronic equipment.

Background

The PCB board, i.e. the printed circuit board (Printed Circuit Board), also called a printed circuit board, is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of the electronic components. The printed circuit board consists of an insulating base plate, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating base plate. The wiring device can replace complex wiring, realizes electric connection among elements in a circuit, simplifies assembly and welding work of electronic products, reduces wiring workload in a traditional mode, and greatly lightens labor intensity of workers; and the whole volume is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved.

The current PCB is developing towards multi-layer and high-density, and electronic components borne by a single PCB are increasing, and the heat productivity is increased due to the increase of the electronic components, so that the heat dissipation requirement on the PCB is also higher. Most of the existing PCB dissipates heat, such as an air cooling or water cooling system, but the external heat dissipating device occupies large space, and cannot dissipate heat accurately to the heating device, so that the heat dissipating efficiency is low.

Therefore, it is needed to provide a novel PCB board, so as to solve the above technical problems in the prior art.

Disclosure of utility model

The utility model aims to provide a PCB which can accurately radiate heat from the inside to the PCB and electronic elements, reduces the occupied space of a radiating device and improves the radiating efficiency.

To achieve the purpose, the utility model adopts the following technical scheme:

The PCB comprises a PCB body and a radiator, wherein the PCB body comprises a substrate layer, at least one of the upper surface and the lower surface of the substrate layer is provided with a wiring layer, and the wiring layer is used for mounting electronic elements; the radiator is plate-shaped, a liquid cooling runner is arranged in the radiator, a driving pump for driving a refrigerant to flow is arranged in the liquid cooling runner, a heat dissipation layer of the radiator is clamped between the substrate layer and the wiring layer, and a heat dissipation end of the radiator is in heat exchange connection with the heat exchanger.

Optionally, the heat dissipation layer includes an evaporator, and the evaporator is used for exchanging heat with the electronic component so as to make the liquid refrigerant absorb heat to be in a gaseous state.

Optionally, an annular liquid cooling runner is arranged in the heat dissipation layer, and the annular liquid cooling runner is communicated with the evaporator.

Optionally, the heat dissipation end includes a condenser, and the condenser is connected with the heat exchanger in a heat exchange manner, so that the gaseous refrigerant dissipates heat into a liquid state.

Optionally, the condenser comprises a serpentine elbow provided with a liquid cooling flow passage.

Optionally, the liquid cooling flow channel of the heat dissipation layer flowing to the heat dissipation end is a gas pipeline, the liquid cooling flow channel of the heat dissipation end flowing to the heat dissipation layer is a liquid pipeline, the liquid pipeline is provided with the driving pump, and a capillary flow channel is arranged inside the liquid pipeline.

Optionally, an insulating layer is sandwiched between the wiring layer and the heat dissipation layer.

Optionally, the insulating layer is any one of an insulating board, an insulating sticker, and an insulating film.

Optionally, the heat exchanger is any one of a liquid-cooled plate heat exchanger, a single-phase submerged heat exchanger and a phase-change submerged heat exchanger.

Another object of the present utility model is to provide an electronic device, which includes a heat exchanger and a PCB board according to any of the above schemes, wherein the heat dissipation end is connected with the heat exchanger by heat exchange. When the PCB is used, the electronic device can accurately radiate heat of the PCB and the electronic element of the PCB, the radiating efficiency is higher, the occupied space is smaller, the volume of the electronic device can be reduced, and the service life of the electronic device is prolonged.

The beneficial effects are that:

According to the PCB, the heat dissipation layer of the radiator is arranged between the substrate layer and the wiring layer of the PCB body, the heat dissipation layer is used for absorbing heat generated by the electronic element connected with the wiring layer, the electronic element is directly dissipated, the driving pump drives the refrigerant absorbed by the heat dissipation layer to the heat dissipation end, the heat exchanger of the heat dissipation end is used for cooling the refrigerant, and therefore a loop of a liquid cooling flow channel is formed, and the electronic element and the PCB body are cooled. This PCB board directly brings out the heat that electronic component produced through the heat dissipation layer of inside, carries out accurate heat dissipation to electronic component, and radiating efficiency is higher to heat dissipation layer and base plate layer and the direct range upon range of setting of routing layer, make radiator and PCB board body become whole, under the circumstances that does not influence routing layer and heat dissipation of radiator, make the PCB board thinner, reduced the occupied space of PCB board and required heat radiation structure.

Drawings

FIG. 1 is a schematic diagram of an electronic device provided in an embodiment of the present utility model;

fig. 2 is an exploded schematic view of a PCB board according to an embodiment of the present utility model.

In the figure:

10. An electronic component; 20. a server housing; 100. a PCB body; 110. a wiring layer; 120. a substrate layer; 130. an insulating layer; 200. a heat sink; 210. driving a pump; 220. a heat dissipation layer; 230. a heat dissipating end; 240. a liquid line; 250. a gas line; 300. a heat exchanger.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

Referring to fig. 1 and 2, in the present embodiment, the PCB board includes a PCB board body 100 and a heat sink 200, the PCB board body 100 includes a substrate layer 120, at least one of an upper surface and a lower surface of the substrate layer 120 is provided with a routing layer 110, and the routing layer 110 is used for mounting the electronic component 10; the heat sink 200 has a plate shape, a liquid cooling flow channel is provided in the heat sink 200, a driving pump 210 for driving a refrigerant to flow is provided in the liquid cooling flow channel, a heat dissipation layer 220 of the heat sink 200 is interposed between the substrate layer 120 and the wiring layer 110, and a heat dissipation end 230 of the heat sink 200 is connected to the heat exchanger 300 by heat exchange.

In the PCB board of the present embodiment, the heat dissipation layer 220 of the heat sink 200 is disposed between the substrate layer 120 and the trace layer 110 of the PCB board body 100, the heat dissipation layer 220 is used to absorb the heat generated by the electronic component 10 connected to the trace layer 110, directly dissipate the heat of the electronic component 10, the driving pump 210 drives the refrigerant after the heat absorption of the heat dissipation layer 220 to the heat dissipation end 230, and the heat exchanger 300 of the heat dissipation end 230 is used to cool the refrigerant, thereby forming a loop of a liquid cooling flow channel, and cooling the electronic component 10 and the PCB board body 100. The heat generated by the electronic element 10 is directly taken out by the PCB through the internal heat dissipation layer 220, the electronic element 10 is precisely dissipated, the heat dissipation efficiency is higher, the heat dissipation layer 220, the substrate layer 120 and the routing layer 110 are directly stacked, the heat sink 200 and the PCB body 100 are integrated, the PCB is thinner under the condition that the routing of the routing layer 110 and the heat dissipation of the heat sink 200 are not affected, and the occupied space of the PCB and the required heat dissipation structure is reduced.

As shown in fig. 1, this embodiment further provides an electronic device, which includes a heat exchanger 300 and a PCB board according to any one of the above schemes, where the heat dissipation end 230 is connected to the heat exchanger 300 by heat exchange. When the electronic equipment is used, the PCB and the electronic element 10 of the PCB can be accurately cooled, the cooling efficiency is higher, the occupied space is smaller, the volume of the electronic equipment can be reduced, and the service life of the electronic equipment is prolonged. In this embodiment, the electronic device is a server, the PCB is a server motherboard, the electronic component 10 is a chip, a capacitor or a resistor, and the PCB is mounted inside the server casing 20; when the PCB is actually applied to the server, the number of the main boards in the server is more in the same space, the heat productivity is larger, the PCB can strengthen the cooling circulation and increase the temperature difference between the main boards and the environment, the natural cooling effect is better, the waste heat recovery utilization rate of the main boards is higher, and the energy conservation and emission reduction trend is met.

Further, the heat exchanger 300 is any one of a liquid-cooled plate heat exchanger, a single-phase submerged heat exchanger, and a phase-change submerged heat exchanger. Those skilled in the art may select the specific form of the heat exchanger 300 according to the usage environment and heat dissipation requirements, and will not be described herein.

As shown in fig. 2, the PCB board in the present embodiment is a single-layer PCB board, that is, the trace layer 110 is only provided with one layer, and the heat dissipation layer 220 is disposed between the trace layer 110 and the substrate layer 120; when the PCB board is a double-layer PCB board, it has an upper and a lower wiring layers 110, a heat dissipation layer 220 may be disposed between one of the wiring layers 110 and the substrate layer 120, and two heat dissipation layers 220 may be disposed between the two wiring layers 110 and the middle substrate layer 120, and a specific configuration may be determined by one skilled in the art according to the usage scenario of the PCB board, which is not limited herein.

The plate-shaped radiator 200 is laminated inside the PCB, the thickness of the radiator 200 can be reduced to 1mm during actual production, the shape of the radiating layer 220 can be changed and locally avoided according to the distribution condition of the actual PCB and the heat source, and meanwhile, the radiating layer 220 is placed at the lower end of the wiring layer 110, so that the arrangement of the structures such as wiring, punching, grounding and insulation of the wiring layer 110 is not affected. And the heat dissipation layer 220 of the heat sink 200 can cover all the electronic components 10 which generate heat, the layout requirement on the electronic components 10 is not high, direct installation is not needed between the electronic components 10 and the heat sink 200, the assembly and design modes are simpler, the complex structural design is not needed when multiple heat sources simultaneously need to dissipate heat like the traditional heat sink 200, and the time cost and the component cost of installation are saved.

With continued reference to fig. 2, optionally, the heat dissipation layer 220 includes an evaporator for exchanging heat with the electronic component 10 to absorb the liquid refrigerant into a gaseous state. Further, the heat dissipating end 230 includes a condenser, which is in heat exchange connection with the heat exchanger 300 to dissipate the gaseous refrigerant into a liquid state. The type of refrigerant in the present embodiment is not particularly limited herein. Heat is generated from the electronic component 10 and then transferred to the PCB board, and is transferred to the evaporator through heat conduction of the wiring layer 110, and the refrigerant in the liquid cooling flow channel absorbs heat and rapidly evaporates to form a gaseous refrigerant, and the heat is brought into the condenser; the condenser and the heat exchanger 300 are attached to each other, the gas is rapidly condensed in the condenser and transfers heat to the heat exchanger 300, and the condensed liquid enters the evaporator again by the driving force of the driving pump 210, thereby forming a closed heat dissipation cycle and cooling the electronic component 10.

Optionally, an annular liquid cooling channel is disposed in the heat dissipation layer 220, and the annular liquid cooling channel is disposed in communication with the evaporator and exchanges heat. The annular liquid cooling flow passage can increase the contact area with the electronic component 10 and the evaporator, and further improve the heat radiation efficiency.

Preferably, the condenser comprises a serpentine elbow provided with a liquid cooling flow passage. The serpentine pipe can increase the contact area with the heat exchanger 300 and prolong the flowing time of the refrigerant in the heat exchanger 300, so that the refrigerant is completely cooled by the heat exchanger 300, and further the heat dissipation effect of the heat sink 200 on the PCB board body 100 is improved.

Referring to fig. 2, the liquid cooling channel of the heat dissipation layer 220 flowing to the heat dissipation end 230 is a gas pipeline 250, the liquid cooling channel of the heat dissipation end 230 flowing to the heat dissipation layer 220 is a liquid pipeline 240, the liquid pipeline 240 is provided with the driving pump 210, and a capillary channel is provided inside the liquid pipeline 240. In the process of flowing the liquid refrigerant from the heat dissipation end 230 to the heat dissipation layer 220, not only the driving function of the driving pump 210 is provided, but also the capillary force of the capillary flow channel in the liquid pipeline 240 can be utilized to drive the liquid refrigerant to flow into the heat dissipation layer 220, so that the smooth flow of the refrigerant is ensured.

Optionally, an insulating layer 130 is sandwiched between the trace layer 110 and the heat dissipation layer 220. In this embodiment, the insulating layer 130 is provided with multiple layers, so as to ensure the insulating effect between the heat dissipation layer 220 and the routing layer 110, and ensure the reliability of the PCB board.

Further, the insulating layer 130 is any one of an insulating sheet, an insulating sticker, and an insulating film. In this embodiment, the insulating layer 130 is an insulating PP (polypropylene) layer, and may specifically be any one of copper-clad plate insulating materials such as FR-1, FR-4, SIC, CEM-1, etc.; the thermoplastic synthetic resin is a colorless semitransparent thermoplastic light general plastic with excellent performance, chemical resistance, heat resistance, electrical insulation, high strength mechanical property and good high wear resistance processing property.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims

PCB board, its characterized in that includes:

The PCB comprises a PCB body (100), wherein the PCB body (100) comprises a substrate layer (120), at least one of the upper surface and the lower surface of the substrate layer (120) is provided with a wiring layer (110), and the wiring layer (110) is used for mounting an electronic element (10);

radiator (200), radiator (200) are platy, radiator (200) inside is provided with the liquid cooling runner, the liquid cooling runner is provided with drive pump (210) that drive refrigerant flows, heat dissipation layer (220) of radiator (200) press from both sides locates between base plate layer (120) and walk line layer (110), heat dissipation end (230) of radiator (200) are used for being connected with heat exchanger (300) heat transfer.
2. The PCB board of claim 1, wherein the heat sink layer (220) comprises an evaporator for exchanging heat with the electronic component (10) to absorb heat of a liquid refrigerant into a gaseous state.
3. The PCB of claim 2, wherein an annular liquid cooling channel is provided in the heat dissipation layer (220), and the annular liquid cooling channel is disposed in communication with the evaporator.
4. The PCB board of claim 2, wherein the heat dissipating end (230) comprises a condenser in heat exchanging connection with the heat exchanger (300) to dissipate the gaseous refrigerant into a liquid state.
5. The PCB panel of claim 4, wherein the condenser comprises a serpentine elbow provided with a liquid cooled runner.
6. The PCB of claim 2, wherein the liquid cooling channel of the heat dissipation layer (220) flowing to the heat dissipation end (230) is a gas channel (250), the liquid cooling channel of the heat dissipation end (230) flowing to the heat dissipation layer (220) is a liquid channel (240), the liquid channel (240) is provided with the driving pump (210), and a capillary channel is provided inside the liquid channel (240).
7. The PCB of claim 1, wherein an insulating layer (130) is sandwiched between the trace layer (110) and the heat sink layer (220).
8. The PCB of claim 7, wherein the insulating layer (130) is a copper clad laminate insulating PP layer.
9. The PCB board according to any one of claims 1-8, wherein the heat exchanger (300) is any one of a liquid cooled plate heat exchanger, a single phase submerged heat exchanger and a phase change submerged heat exchanger.
10. Electronic device, characterized in that it comprises a heat exchanger (300) and a PCB board according to any of claims 1-9, said heat dissipating end (230) being in heat exchanging connection with said heat exchanger (300).