CN221102066U - Chip structure, power device and electronic equipment - Google Patents
Chip structure, power device and electronic equipment Download PDFInfo
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- CN221102066U CN221102066U CN202322532295.4U CN202322532295U CN221102066U CN 221102066 U CN221102066 U CN 221102066U CN 202322532295 U CN202322532295 U CN 202322532295U CN 221102066 U CN221102066 U CN 221102066U
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- chip
- power device
- heat
- lead frame
- piece
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 239000010410 layer Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 11
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a chip structure, a power device and electronic equipment, wherein the chip structure comprises a lead frame and a shell, and the lead frame is exposed out of the top surface of the shell; the power device comprises a chip, a PCB, a heat conducting piece and a heat radiating piece, wherein the chip is connected to the PCB, the heat conducting piece is arranged on the chip and is attached to the lead frame, and the heat radiating piece is arranged on the heat conducting piece. The heat dissipation capacity of the chip is improved, the chip is arranged between the PCB and the heat conducting piece, and the exposed lead frame of the chip is connected with the heat conducting piece; and the arrangement and layout of other electronic elements are not limited, the connection of the PCB is not influenced, and the design difficulty of the whole power device can be reduced.
Description
Technical Field
The present utility model relates to the field of electronic products, and in particular, to a chip structure, a power device, and an electronic device.
Background
As one of the most widely used electrical components in the electronics industry, power devices are being developed in the directions of increasing power, increasing frequency and increasing integration, and whether or not they have good heat dissipation properties is a key factor affecting the working performance and service life of the power devices.
As shown in fig. 1, fig. 2 and fig. 3, the structures of the conventional chip and the power device are respectively shown, wherein the conventional chip is generally a structure in which all elements of the chip are covered by plastic packaging material, and heat generated by internal elements is released through the plastic packaging material and through external air convection, so that the heat dissipation effect is poor; the structure of the existing power device mainly comprises a chip, a PCB, a heat conducting layer and a heat radiating layer, wherein the chip is connected to the PCB, the PCB is connected with the heat conducting layer, the heat conducting layer is connected with the heat radiating layer again, heat released by the chip in the running process is mainly conducted through the PCB, but the heat conductivity and the thermal mass of the PCB are poor, so that the heat generated by the chip cannot be released rapidly, and the maximum power capacity of the whole power device cannot reach an optimal state.
Disclosure of utility model
Therefore, the technical problem to be solved by the utility model is to overcome the defect that the chip in the prior art is generally a structure in which all elements of the chip are covered by plastic packaging materials, and heat generated by internal elements is released through the plastic packaging materials and through external air convection, so that the heat dissipation effect is poor; the structure of the existing power device mainly comprises a chip, a PCB, a heat conducting layer and a heat radiating layer, wherein the chip is connected to the PCB, the PCB is connected with the heat conducting layer, the heat conducting layer is connected with the heat radiating layer again, heat released by the chip in the running process is conducted through the PCB, but the heat conductivity and the thermal mass of the PCB are poor, so that the heat generated by the chip cannot be released rapidly, and the maximum power capacity of the whole power device cannot reach the optimal state.
In order to solve the technical problems, the utility model provides a chip structure, which comprises a lead frame and a shell, wherein the lead frame is arranged in the shell, and a through groove which enables one surface of the lead frame to be exposed outside is formed in the shell.
In one embodiment of the present utility model, the shape and the size of the through groove correspond to those of the lead frame, the lead frame is embedded in the through groove, and the exposed surface of the lead frame is flush with the surface of the shell provided with the through groove.
A power device comprising a chip structure as claimed in any one of the preceding claims, further comprising,
The chip is connected to the PCB;
The heat conduction piece is arranged on the chip and is attached to the lead frame exposed outside the chip;
the heat dissipation piece is arranged on the heat conduction piece.
In one embodiment of the present utility model, the heat conducting member is a plate structure and is made of a heat conducting silica gel material.
In one embodiment of the utility model, the heat dissipation element is made of iron-cobalt-nickel metal sheets, and the heat dissipation element is connected to the heat conduction element in parallel and closely attached to the heat conduction element.
In one embodiment of the utility model, the PCB board is a single-layer or multi-layer PCB board.
In one embodiment of the utility model, the housing is welded to the thermally conductive member.
In one embodiment of the utility model, the pins of the chip are connected with pins or pads on the PCB.
In one embodiment of the present utility model, the heat dissipation device further comprises a housing, wherein the housing encloses the PCB board, the chip, the heat conduction member and the heat dissipation member connected together.
An electronic device comprising a power device as claimed in any one of the preceding claims.
Compared with the prior art, the technical scheme of the utility model has the following advantages:
The utility model relates to a chip structure, a power device and electronic equipment, wherein the chip structure comprises a lead frame and a shell, and the lead frame is exposed out of the top surface of the shell; the power device comprises a chip, a PCB, a heat conducting piece and a heat radiating piece, wherein the chip is connected to the PCB, the heat conducting piece is arranged on the chip and is attached to a lead frame exposed out of the chip, and the heat radiating piece is arranged on the heat conducting piece; compared with the structure that the original plastic sealing layer completely covers all the elements inside, the heat dissipation capacity of the chip is improved; meanwhile, the chip is arranged between the PCB and the heat conducting piece, and the exposed lead frame of the chip is directly connected with the heat conducting piece and the heat radiating piece, so that compared with the original structure requiring the PCB to conduct heat emitted by the chip, the heat radiating efficiency of the chip and the heat radiating capacity of the whole power device are improved, the optimal use performance of the chip and the power device can be ensured, the service life of the chip and the power device can be prolonged, and the use cost is reduced; and the arrangement and layout of other electronic elements are not limited, the arrangement of the PCB is not influenced, and the design difficulty of the whole power device can be reduced.
Drawings
In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings, in which
FIG. 1 is a schematic diagram of a front view of a conventional chip;
FIG. 2 is a schematic diagram of a back view of a conventional chip;
fig. 3 is a schematic structural diagram of a conventional power device;
FIG. 4 is a schematic diagram of the structure of the chip structure of the preferred embodiment of the present utility model from the front view;
FIG. 5 is a schematic diagram of the structure of the back view of the chip structure according to the preferred embodiment of the present utility model;
Fig. 6 is a schematic structural diagram of a power device according to a preferred embodiment of the present utility model.
Description of the specification reference numerals: 1. a chip; 11. a lead frame; 12. a housing; 2. a PCB board; 3. a heat conductive member; 4. and a heat sink.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the utility model and practice it.
Example 1
Referring to fig. 4 and 5, a chip structure of the present utility model includes a lead frame 11 and a housing 12, wherein the lead frame 11 is disposed in the housing 12, and a through slot exposing one surface of the lead frame 11 is formed in the housing 12.
Specifically, the lead frame 11 of the chip 1 is directly exposed at the top of the housing 12, which is beneficial to heat dissipation inside the chip 1.
Further, the shape and size of the through groove correspond to those of the lead frame 11, the lead frame 11 is embedded in the through groove, and the exposed surface of the lead frame 11 is flush with the surface of the shell 12 provided with the through groove. The lead frame 11 matched with the shape and the size of the through groove of the shell 12 can be tightly combined with the shell 12 and seal the space inside the shell 12; meanwhile, the lead frame 11 flush with one surface of the shell 12 is beneficial to the connection of the chip 1 and the heat conducting piece 3, and the lead frame 11 and the heat conducting piece 3 can be tightly attached only by connecting the shell 12 and the heat conducting piece 3 together, so that the chip 1 can dissipate heat effectively in time.
Example two
Referring to fig. 6, the present utility model also discloses a power device, including a chip 1 as in the first embodiment, and further including,
The chip 1 is connected to the PCB 2;
The heat conduction piece 3 is arranged on the chip 1 and is attached to the lead frame 11 exposed outside the chip 1;
And the heat dissipation piece 4 is arranged on the heat conduction piece 3.
Specifically, a chip 1 of the power device is positioned between a PCB 2 and a heat conducting piece 3, pins of the chip 1 are connected with pins of the PCB 2, a lead frame 11 exposed by the chip 1 is directly connected with and closely attached to the heat conducting piece 3, and the heat conducting piece 3 is connected with a heat radiating piece 4.
It is conceivable that the bare structure of the lead frame 11 of the chip 1 can improve the heat dissipation capability of the chip 1 compared with the structure that the original plastic sealing layer completely covers the internal components; meanwhile, the chip 1 is arranged between the PCB 2 and the heat conducting piece 3, and the exposed lead frame 11 of the chip 1 is directly connected with the heat conducting piece 3 and the heat radiating piece 4, so that compared with the original structure that the PCB 2 conducts heat emitted by the chip 1, the heat radiating efficiency of the chip 1 and the heat radiating capacity of the whole power device are improved, the best use performance of the chip 1 and the power device can be ensured, the service life of the chip 1 and the power device can be prolonged, and the use cost is reduced.
Meanwhile, it is conceivable that in order to ensure heat dissipation, the original power device generally has a plurality of heat dissipation holes formed on the PCB 2, and the heat dissipation holes are formed by taking into consideration the position, size, arrangement and other factors of the holes, so as to ensure that the heat dissipation holes can have positive influence on heat dissipation, thus increasing the design difficulty of the whole power device, and the heat dissipation holes occupy the available space on the PCB 2, thereby limiting the arrangement and layout of other electronic components and causing some limitations on the arrangement and connection of the PCB 2. The power device of the utility model improves the heat dissipation performance of the chip 1 by improving the structure of the chip 1 and changes the position of the chip 1 in the whole power device structure, so that the heat dissipation of the chip 1 does not depend on the PCB 2, but directly contacts the heat conduction member 3 and the heat dissipation member 4 through the exposed lead frame 11 of the chip 1 for heat dissipation, and the heat dissipation performance of the power device is effectively improved under the condition of not increasing the difficulty of design and production, and the power device is suitable for practical use.
Further, the heat conducting member 3 is of a plate-like structure and is made of a heat conducting silica gel material. The heat-conducting silica gel has excellent heat conducting performance, can transfer heat more effectively, reduce temperature and improve heat dissipation efficiency; meanwhile, the heat-conducting silica gel can still keep stable performance at high temperature, can not be decomposed or failed, has good ageing resistance and long service life, and can keep heat dissipation performance for a long time, so that the stability and reliability of the whole structure are improved.
Further, the heat dissipation element 4 is made of iron-cobalt-nickel metal sheets, and the heat dissipation element 4 is connected to the heat conduction element 3 in parallel and is tightly attached to the heat conduction element 3.
Further, the PCB 2 is a single-layer or multi-layer PCB. Specifically, in the original power device structure, two ends of a PCB (printed Circuit Board) 2 are respectively connected with a chip 1 and a heat conducting piece 3; in the power device, one surface of the PCB 2 is connected with the chip 1, and the other surface is free, so that the power device can be used for placing other electronic elements.
Further, the housing 12 is welded to the heat conductive member 3. Specifically, the surface of the casing 12, on which the lead frame 11 is exposed, is welded to the heat conductive member 3, so that the lead frame 11 is closely attached to the heat conductive member 3, and the lead frame 11 can be isolated from the outside.
Further, the pins of the chip 1 are connected with pins or pads on the PCB board 2.
Further, the PCB board comprises a shell, wherein the shell is used for coating the PCB board 2, the chip 1, the heat conducting piece 3 and the heat radiating piece 4 which are connected together.
Example III
The utility model also discloses electronic equipment comprising the power device as in the second embodiment. The structure of the power device can be applied to various electronic equipment to ensure the stable operation of the electronic equipment.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present utility model will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the utility model.
Claims (10)
1. A chip architecture, includes lead frame and casing, its characterized in that: the lead frame is arranged in the shell, and a through groove which enables one surface of the lead frame to be exposed outside is formed in the shell.
2. The chip structure of claim 1, wherein: the shape and the size of the through groove correspond to those of the lead frame, the lead frame is embedded in the through groove, and one exposed surface of the lead frame is flush with one surface of the shell provided with the through groove.
3. A power device comprising a chip as claimed in any one of claims 1-2, characterized in that: also included is a method of manufacturing a semiconductor device,
The chip is connected to the PCB;
The heat conduction piece is arranged on the chip and is attached to the lead frame exposed outside the chip;
the heat dissipation piece is arranged on the heat conduction piece.
4. A power device according to claim 3, characterized in that: the heat conduction piece is of a plate-shaped structure and is made of heat conduction silica gel.
5. The power device of claim 4, wherein: the heat dissipation piece adopts iron cobalt nickel sheetmetal, the heat dissipation piece parallel connection in on the heat conduction piece and with the heat conduction piece closely laminates.
6. A power device according to claim 3, characterized in that: the PCB board adopts a single-layer or multi-layer PCB board.
7. A power device according to claim 3, characterized in that: the shell and the heat conducting piece are welded together.
8. A power device according to claim 3, characterized in that: and the pins of the chip are connected with pins or bonding pads on the PCB.
9. A power device according to claim 3, characterized in that: the PCB board, the chip, the heat conducting piece and the heat radiating piece are connected together through the connecting piece.
10. An electronic device, characterized in that: a power device comprising any of claims 3-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322532295.4U CN221102066U (en) | 2023-09-18 | 2023-09-18 | Chip structure, power device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322532295.4U CN221102066U (en) | 2023-09-18 | 2023-09-18 | Chip structure, power device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221102066U true CN221102066U (en) | 2024-06-07 |
Family
ID=91318629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322532295.4U Active CN221102066U (en) | 2023-09-18 | 2023-09-18 | Chip structure, power device and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221102066U (en) |
-
2023
- 2023-09-18 CN CN202322532295.4U patent/CN221102066U/en active Active
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