CN221102066U - Chip structure, power device and electronic equipment - Google Patents

Abstract

The utility model relates to a chip structure, a power device and an electronic device. The chip structure includes a lead frame and a shell, wherein the lead frame is exposed on the top surface of the shell; the power device includes a chip, a PCB board, a heat conducting member and a heat sink, wherein the chip is connected to the PCB board, the heat conducting member is arranged on the chip and fits with the lead frame, and the heat sink is arranged on the heat conducting member. The heat dissipation capacity of the chip is improved, and at the same time, the chip is arranged between the PCB board and the heat conducting member and the exposed lead frame of the chip is connected to the heat conducting member. Compared with the original structure that mainly conducts the heat emitted by the chip through the PCB board, the heat dissipation efficiency of the chip and the heat dissipation capacity of the entire power device are improved, which can ensure that the use performance of the chip and the power device reaches the best and improves its service life, thereby reducing the cost of use; and it will not limit the arrangement and layout of other electronic components, nor will it affect the connection of the PCB board, which can reduce the design difficulty of the entire power device.

Description

Chip structure, power device and electronic equipment

Technical Field

The utility model relates to the technical field of electronic products, in particular to a chip structure, a power device and an electronic device.

Background technique

As one of the most widely used electrical components in the electronics industry, power devices are developing in the direction of high power, high frequency and high integration. Whether they have good heat dissipation performance is a key factor affecting the working performance and service life of power devices.

As shown in Figures 1, 2 and 3, the structures of existing chips and power devices are respectively, wherein the existing chip is generally a structure in which all components of the chip are covered by plastic packaging material, and the heat generated by the internal components is released through the plastic packaging material and external air convection, and the heat dissipation effect is poor; the structure of the existing power device mainly includes a chip, a PCB board, a thermal conductive layer and a heat dissipation layer, wherein the chip is connected to the PCB board, the PCB board is connected to the thermal conductive layer, and the thermal conductive layer is further connected to the heat dissipation layer. The heat released by the chip during operation is mainly conducted through the PCB board, but the thermal conductivity and thermal mass of the PCB are poor, so that the heat generated by the chip cannot be released quickly, resulting in the maximum power capacity of the entire power device cannot reach the optimal state.

Utility Model Content

To this end, the technical problem to be solved by the utility model is to overcome the structure in the prior art that the chip is generally a plastic packaging material that covers all the components of the chip, and the heat generated by the internal components is released through the plastic packaging material and external air convection, resulting in poor heat dissipation effect; the structure of the existing power device mainly includes a chip, a PCB board, a thermal conductive layer and a heat dissipation layer, wherein the chip is connected to the PCB board, the PCB board is connected to the thermal conductive layer, and the thermal conductive layer is further connected to the heat dissipation layer. The heat released by the chip during operation must be conducted through the PCB board, but the thermal conductivity and thermal mass of the PCB are poor, so that the heat generated by the chip cannot be released quickly, resulting in the problem that the maximum power capacity of the entire power device cannot reach the optimal state.

To solve the above technical problems, the utility model provides a chip structure, including a lead frame and a shell, wherein the lead frame is arranged in the shell, and a through groove is opened on the shell to expose one side of the lead frame.

In an embodiment of the utility model, the shape and size of the through slot correspond to the shape and size of the lead frame, the lead frame is embedded in the through slot, and the exposed side of the lead frame is flush with the side of the shell having the through slot.

A power device, comprising a chip structure as described in any one of the above, further comprising:

A PCB board, the chip is connected to the PCB board;

A heat conducting member, the heat conducting member is disposed on the chip and is in contact with the lead frame of the chip exposed outside;

A heat sink is disposed on the heat conducting member.

In an embodiment of the present invention, the heat conducting member is a plate-shaped structure and is made of heat-conducting silicone material.

In one embodiment of the present invention, the heat sink is made of an iron-cobalt-nickel metal sheet, and the heat sink is connected in parallel to the heat conductor and fits tightly with the heat conductor.

In an embodiment of the present invention, the PCB board is a single-layer or multi-layer PCB board.

In an embodiment of the present invention, the housing and the heat conducting member are welded together.

In one embodiment of the present invention, the pins of the chip are connected to the pins or pads on the PCB board.

In one embodiment of the present invention, a shell is further included, wherein the shell encloses the PCB board, the chip, the heat conducting member and the heat dissipating member connected together.

An electronic device comprises a power device as described in any one of the above.

The above technical solution of the utility model has the following advantages compared with the prior art:

The utility model discloses a chip structure, a power device and an electronic device, wherein the chip structure comprises a lead frame and a shell, the lead frame is exposed on the top surface of the shell; the power device comprises a chip, a PCB board, a heat conducting member and a heat sink, the chip is connected to the PCB board, the heat conducting member is arranged on the chip and fits with the lead frame of the chip exposed outside, and the heat sink is arranged on the heat conducting member; compared with the original structure in which the plastic sealing layer completely covers each internal component, the heat dissipation capacity of the chip of the utility model is improved; at the same time, the chip is arranged between the PCB board and the heat conducting member and the lead frame of the chip exposed is directly connected to the heat conducting member and the heat sink, compared with the original structure in which the PCB board is required to conduct the heat dissipated by the chip, the heat dissipation efficiency of the chip and the heat dissipation capacity of the entire power device are improved, the use performance of the chip and the power device can be guaranteed to reach the best and the service life thereof can be increased, and the use cost can be reduced; and the arrangement and layout of other electronic components will not be restricted, and the arrangement of the PCB board will not be affected, so the design difficulty of the entire power device can be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein

FIG1 is a schematic diagram of the structure of an existing chip from a front perspective;

FIG2 is a schematic diagram of the structure of an existing chip from a back side perspective;

FIG3 is a schematic diagram of the structure of an existing power device;

FIG4 is a schematic diagram of the structure of the chip structure of a preferred embodiment of the utility model from a front view;

FIG5 is a schematic structural diagram of a chip structure from a back side view according to a preferred embodiment of the present invention;

FIG6 is a schematic diagram of the structure of a power device according to a preferred embodiment of the present utility model.

Explanation of the reference numerals in the specification: 1. chip; 11. lead frame; 12. housing; 2. PCB board; 3. heat conducting element; 4. heat dissipating element.

Detailed ways

The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

Embodiment 1

4 and 5 , a chip structure of the present invention includes a lead frame 11 and a housing 12 . The lead frame 11 is disposed in the housing 12 , and a through groove is formed on the housing 12 to expose one side of the lead frame 11 to the outside.

Specifically, the lead frame 11 of the chip 1 is directly exposed on the top of the housing 12 , which is beneficial to the heat dissipation inside the chip 1 .

Furthermore, the shape and size of the through slot correspond to the shape and size of the lead frame 11, the lead frame 11 is embedded in the through slot, and the exposed side of the lead frame 11 is flush with the side of the housing 12 with the through slot. The lead frame 11 matching the shape and size of the through slot of the housing 12 can be tightly combined with the housing 12 and seal the space inside the housing 12; at the same time, the lead frame 11 flush with one side of the housing 12 is conducive to the connection between the chip 1 and the heat conductor 3, etc., and the lead frame 11 can be tightly fitted with the heat conductor 3 by simply connecting the housing 12 and the heat conductor 3 together, ensuring timely and effective heat dissipation of the chip 1.

Embodiment 2

As shown in FIG. 6 , the utility model further discloses a power device, including the chip 1 of the first embodiment, and further including:

PCB board 2, chip 1 is connected to PCB board 2;

The heat conducting member 3 is disposed on the chip 1 and is attached to the lead frame 11 of the chip 1 that is exposed outside;

The heat sink 4 is disposed on the heat conducting member 3 .

Specifically, the chip 1 of the power device of the present invention is located between the PCB board 2 and the heat conductor 3, the pins of the chip 1 are connected to the pins of the PCB board 2, the exposed lead frame 11 of the chip 1 is directly connected to and tightly fits the heat conductor 3, and the heat conductor 3 is connected to the heat sink 4.

It can be imagined that the structure in which the lead frame 11 of the chip 1 is exposed can improve the heat dissipation capacity of the chip 1 compared to the original structure in which the plastic packaging layer completely covers the internal components; at the same time, the chip 1 is arranged between the PCB board 2 and the heat conductor 3 and the exposed lead frame 11 of the chip 1 is directly connected to the heat conductor 3 and the heat sink 4. Compared with the original structure in which the PCB board 2 is required to conduct the heat dissipated by the chip 1, the heat dissipation efficiency of the chip 1 and the heat dissipation capacity of the entire power device are improved, which can ensure that the performance of the chip 1 and the power device is optimal and increase its service life, thereby reducing the cost of use.

At the same time, it can be imagined that in order to ensure heat dissipation, the existing power devices generally have multiple heat dissipation holes on the PCB board 2. The opening of the heat dissipation holes needs to take into account factors such as the position, size and arrangement of the holes to ensure that the heat dissipation holes can have a positive impact on heat dissipation, which will increase the difficulty of the entire power device design, and the heat dissipation holes will occupy the available space on the PCB board 2, thereby limiting the arrangement and layout of other electronic components, and will cause some restrictions on the setting and connection of the PCB board 2. The power device of the utility model improves its heat dissipation performance by improving the structure of the chip 1, and changes the position of the chip 1 in the entire power device structure, so that the heat dissipation of the chip 1 no longer mainly depends on the PCB board 2, but is directly dissipated by the exposed lead frame 11 of the chip 1 directly contacting the heat conductor 3 and the heat sink 4. Without increasing the difficulty of design and production, the heat dissipation performance of the power device is effectively improved, which is suitable for practical use.

Furthermore, the heat conducting member 3 is a plate-shaped structure and is made of heat-conducting silicone. The heat-conducting silicone has excellent thermal conductivity, can more effectively transfer heat and reduce temperature, and improve heat dissipation efficiency; at the same time, the heat-conducting silicone can still maintain stable performance at high temperatures, will not decompose or fail, has good aging resistance and long service life, and can maintain its heat dissipation performance for a long time, thereby improving the stability and reliability of the entire structure.

Furthermore, the heat sink 4 is made of an iron-cobalt-nickel metal sheet, and the heat sink 4 is connected in parallel to the heat conductor 3 and fits tightly with the heat conductor 3 .

Furthermore, the PCB board 2 is a single-layer or multi-layer PCB board. Specifically, in the original power device structure, the two ends of the PCB board 2 are respectively connected to the chip 1 and the heat conductor 3; while in the power device of the utility model, one side of the PCB board 2 is connected to the chip 1, and the other side is empty and can be used to place other electronic components.

Furthermore, the housing 12 is welded to the heat conducting member 3. Specifically, the housing 12 is welded to the heat conducting member 3 on one side where the lead frame 11 is exposed, so that the lead frame 11 and the heat conducting member 3 are closely attached and the lead frame 11 can be isolated from the outside.

Furthermore, the pins of the chip 1 are connected to the pins or pads on the PCB board 2 .

Furthermore, it also includes a shell, which encloses the PCB board 2, the chip 1, the heat conducting member 3 and the heat dissipating member 4 connected together.

Embodiment 3

The utility model also discloses an electronic device, comprising the power device of the second embodiment. The structure of the power device of the utility model can be applied to a variety of electronic devices to ensure the stable operation of the electronic devices.

Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims (10)

1. A chip structure, comprising a lead frame and a housing, wherein the lead frame is arranged in the housing, and a through groove is provided on the housing to expose one side of the lead frame. 2. The chip structure according to claim 1 is characterized in that: the shape and size of the through groove correspond to the shape and size of the lead frame, the lead frame is embedded in the through groove, and the exposed side of the lead frame is flush with the side of the shell having the through groove. 3. A power device, comprising the chip according to any one of claims 1 to 2, characterized in that: it also includes: A PCB board, the chip is connected to the PCB board; A heat conducting member, the heat conducting member is disposed on the chip and is in contact with the lead frame of the chip exposed outside; A heat sink is disposed on the heat conducting member. 4. The power device according to claim 3, wherein the heat conducting member is a plate-shaped structure and is made of heat-conducting silicone. 5 . The power device according to claim 4 , wherein the heat sink is made of an iron-cobalt-nickel metal sheet, and the heat sink is connected in parallel to the heat conductor and fits tightly with the heat conductor. 6. The power device according to claim 3, characterized in that the PCB board is a single-layer or multi-layer PCB board. 7 . The power device according to claim 3 , wherein the housing and the heat conducting member are welded together. 8. The power device according to claim 3, wherein the pins of the chip are connected to the pins or pads on the PCB board. 9 . The power device according to claim 3 , further comprising a housing, wherein the housing encloses the PCB board, the chip, the heat conducting member and the heat dissipating member connected together. 10. An electronic device, characterized in that it comprises the power device according to any one of claims 3 to 9.