CN216905440U

CN216905440U - Printed circuit board and display device

Info

Publication number: CN216905440U
Application number: CN202220338506.3U
Authority: CN
Inventors: 樊涛; 康报虹
Original assignee: HKC Co Ltd; Mianyang HKC Optoelectronics Technology Co Ltd
Current assignee: HKC Co Ltd; Mianyang HKC Optoelectronics Technology Co Ltd
Priority date: 2022-02-15
Filing date: 2022-02-15
Publication date: 2022-07-05
Anticipated expiration: 2032-02-15

Abstract

The application discloses a printed circuit board and a display device, wherein the printed circuit board comprises a printed circuit board body and a plurality of components, the components are arranged on the printed circuit board body, a bonding pad is arranged on the surface, in contact with the printed circuit board body, of each component, and the components are fixed on the printed circuit board body through the bonding pads; the printed circuit board comprises a printed circuit board body, a bonding pad and a heat dissipation structure, wherein the position of the printed circuit board body at least corresponding to one bonding pad is provided with the heat dissipation structure, and the heat dissipation structure comprises at least one heat dissipation through hole penetrating through the printed circuit board body and a heat conduction layer arranged on the hole wall of the heat dissipation through hole. This application is through above mode, dispels the heat through heat dissipation through-hole and heat-conducting layer with the heat that components and parts produced, improves the heat-sinking capability of components and parts, avoids components and parts to damage, and then improves printed circuit board's drivability and life.

Description

Printed circuit board and display device

Technical Field

The application relates to the technical field of display, in particular to a printed circuit board and a display device.

Background

With the rapid development of display technologies, the requirements of consumers on display devices are also increasing, wherein large-size display devices are increasingly popular with users due to the advantages of large size and wide viewing angle, and the demand of the large-size display devices is gradually increasing. However, the increase in size of the display device means that components, such as the driving chip, need to provide a larger driving force, and accordingly, the larger the driving force, the higher the heat generation of the components is accompanied.

Generally, the driving performance and the service life of the components are related to the temperature of the components, the higher the temperature of the components is, the more the driving performance and the service life of the components are affected, and the overhigh temperature of the components can affect the electrical performance of the components, for example, a series of problems such as abnormal driving or component damage caused by overhigh temperature of a peripheral structure can be caused, so that the problem that how to improve the heat dissipation capacity of the components of the display equipment with gradually rising size becomes urgent needs to be solved.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a printed circuit board and display device dispels the heat through heat dissipation through-hole and heat-conducting layer with the heat that components and parts produced, improves the heat-sinking capability of components and parts, and then improves printed circuit board's driveability and life.

The application discloses printed circuit board includes: the printed circuit board comprises a printed circuit board body and a plurality of components, wherein the components are arranged on the printed circuit board body, a bonding pad is arranged on the surface, in contact with the printed circuit board body, of each component, and the components are fixed on the printed circuit board body through the bonding pads; the printed circuit board comprises a printed circuit board body, a bonding pad and a heat dissipation structure, wherein the position of the printed circuit board body at least corresponding to one bonding pad is provided with the heat dissipation structure, and the heat dissipation structure comprises at least one heat dissipation through hole penetrating through the printed circuit board body and a heat conduction layer arranged on the hole wall of the heat dissipation through hole.

Optionally, the printed circuit board body with the surface that the pad contacted is provided with the recess, the pad inlays in the recess, the heat dissipation through-hole by the tank bottom of recess runs through printed circuit board, the heat-conducting layer by the pore wall of heat dissipation through-hole extends the cover the cell wall of recess, and with the pad is hugged closely.

Optionally, the heat dissipation structure includes a plurality of heat dissipation through holes, a plurality of heat dissipation through holes correspond to the pads and are uniformly arranged, and each of the hole walls of the heat dissipation through holes is provided with a heat conduction layer.

Optionally, the diameter of each heat dissipation through hole is 0.25 mm; the thickness of the heat conducting layer is 20 μm.

Optionally, the printed circuit board body comprises a lower green oil covering layer, at least two copper foil layers, a base material arranged between every two adjacent copper foil layers, and an upper green oil covering layer from the bottom layer to the top layer; the heat dissipation through hole sequentially penetrates through the upper green oil covering layer, the copper foil layer and the base material; and the hole wall of the heat dissipation through hole is provided with a first heat conduction layer corresponding to the position of the upper green oil covering layer, a second heat conduction layer corresponding to the position of the substrate, and the first heat conduction layer and the second heat conduction layer are used for communicating the upper green oil covering layer and the two adjacent copper foil layers to form the heat conduction layers on the hole wall of the heat dissipation through hole.

Optionally, the printed circuit board body comprises a lower green oil covering layer, at least two copper foil layers, a base material arranged between every two adjacent copper foil layers, and an upper green oil covering layer from the bottom layer to the top layer; the heat dissipation through hole sequentially penetrates through the upper green oil covering layer, the copper foil layer, the base material and the lower green oil covering layer; and the hole wall of the heat dissipation through hole is provided with a first heat conduction layer corresponding to the position of the upper green oil covering layer, a second heat conduction layer corresponding to the position of the substrate, and a third heat conduction layer corresponding to the position of the lower green oil covering layer, wherein the first heat conduction layer, the second heat conduction layer and the third heat conduction layer are used for communicating the upper green oil covering layer, the copper foil layer and the lower green oil covering layer to form the heat conduction layer on the hole wall of the heat dissipation through hole.

The application also discloses a display device, including the casing with like this application open any one printed circuit board, the printed circuit board body is kept away from the one side of components and parts is fixed in the casing.

Optionally, the casing includes a back plate, and an electrically and thermally conductive double-sided adhesive tape is disposed at a position of the back plate corresponding to the heat dissipation structure; the edge of the back plate corresponding to the printed circuit board body is at least provided with a fixing structure, and the printed circuit board is fixed on the back plate through the electric and heat conduction double-faced adhesive and the fixing structure.

Optionally, a position of the back plate corresponding to the heat dissipation structure is provided with a fixing groove, and the fixing groove is formed by recessing a contact surface of the back plate and the printed circuit board body towards a side far away from the printed circuit board body; the size of the fixing groove is equivalent to that of the heat dissipation structure, and the ratio of the depth of the recess of the fixing groove to the thickness of the double-sided adhesive tape is 100: and (105) and 110), wherein the electric and heat conduction double-sided adhesive tape is arranged in the fixing groove.

Optionally, the electric and thermal conductive double-sided tape includes an electric conductive adhesive inner core and an electric conductive adhesive coated on the surface of the electric conductive adhesive inner core, the thickness of the electric conductive adhesive inner core is 0.2mm, and the thickness of the electric conductive adhesive arranged on each side is 0.1 mm.

Compared with the scheme that the higher the heat generated by components, the more the abnormal driving or the damage of the components is easily caused, the heat dissipation structure is arranged on the position, corresponding to the bonding pad of the components, of the printed circuit board body, so that the heat dissipation efficiency of the components is improved, in addition, the heat dissipation structure consists of the heat dissipation through holes and the heat conduction layer, the heat can be dissipated through the heat dissipation through holes, the heat conduction layer is also arranged on the inner wall of the heat dissipation through holes, the heat generated by the components can be effectively guided to the printed circuit board body, the heat dissipation area is increased due to the fact that the area of the printed circuit board body is larger than that of the components, the heat conduction performance of the printed circuit board body is enhanced through the design of the heat dissipation through holes and the heat conduction layer, and the heat dissipation speed of the components can be effectively accelerated; simultaneously, heat radiation structure corresponds components and parts setting, can carry out the design of pertinence to every high fever components and parts, realizes point-to-point high-efficient heat dissipation, to the local accurate heat dissipation of high temperature, effectively improves printed circuit board's radiating efficiency, avoids components and parts because drive power is too big and produce the high heat, thereby can't in time give off and improve the actuating system temperature, and then leads to printed circuit board to damage.

Drawings

The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:

FIG. 1 is a schematic front view of a printed circuit board according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of the back side of a printed circuit board according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view taken along A-A' of FIG. 1;

FIG. 4 is a schematic cross-sectional view of a second printed circuit board according to an embodiment of the present application;

FIG. 5 is a schematic view of a display device according to an embodiment of the present application;

FIG. 6 is a schematic cross-sectional view taken along line B-B' of FIG. 5;

fig. 7 is a schematic view of the electrically and thermally conductive double-sided tape of the present application.

10, a display device; 20. a printed circuit board; 210. a printed circuit board body; 211. a lower green oil blanket; 212. a copper foil layer; 213. a substrate; 214. coating a green oil coating; 215. a groove; 220. a component; 221. a pad; 230. a heat dissipation structure; 231. a heat dissipating through hole; 232. a heat conductive layer; 233. a first thermally conductive layer; 234. a second thermally conductive layer; 235. a third heat conducting layer; 30. a housing; 310. a back plate; 311. a fixed structure; 312. fixing grooves; 320. the double-sided adhesive tape is electrically and thermally conductive; 321. an inner core of conductive adhesive; 322. a conductive adhesive.

Detailed Description

It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.

Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The present application is described in detail below with reference to the figures and alternative embodiments.

Fig. 1 is a schematic diagram of a printed circuit board according to an embodiment of the present application, fig. 2 is a schematic diagram of a back side of a printed circuit board according to an embodiment of the present application, fig. 3 is a schematic cross-sectional diagram of fig. 1 along a direction a-a', and referring to fig. 1-3, a printed circuit board 20 is disclosed as a first embodiment of the present application, and includes: the printed circuit board comprises a printed circuit board body 210 and a plurality of components 220, wherein the components 220 are arranged on the printed circuit board body 210, the surface of each component 220, which is in contact with the printed circuit board body 210, is provided with a bonding pad 221, and the components 220 are fixed on the printed circuit board body 210 through the bonding pads 221; the printed circuit board body 210 is provided with a heat dissipation structure 230 at a position corresponding to at least one pad 221, and the heat dissipation structure 230 includes at least one heat dissipation through hole 231 penetrating through the printed circuit board body 210 and a heat conduction layer 232 disposed on a hole wall of the heat dissipation through hole 231.

For the scheme that the higher the heat generated by the component 220 is, the more the abnormal driving or the damage of the component 220 is easily caused, the heat dissipation structure 230 is arranged on the printed circuit board body 210 corresponding to the pad 221 position of the component 220, so that the heat dissipation efficiency of the component 220 is improved, in addition, the heat dissipation structure 230 consists of the heat dissipation through hole 231 and the heat conduction layer 232, the heat can be dissipated through the heat dissipation through hole 231, the heat conduction layer 232 is also arranged on the inner wall of the heat dissipation through hole 231, the heat generated by the component 220 can be effectively guided to the printed circuit board body 210, because the area of the printed circuit board body 210 is usually larger than that of the component 220, the heat dissipation area is increased, through the design of the heat dissipation through hole 231+ the heat conduction layer 232, the heat conduction performance of the printed circuit board body 210 is enhanced, and the heat dissipation speed of the component 220 can be effectively accelerated; meanwhile, the heat dissipation structure 230 is arranged corresponding to the components 220, and can be used for carrying out targeted design on each high-heat component 220, so that point-to-point efficient heat dissipation is realized, the high-temperature place is accurately dissipated, the heat dissipation efficiency of the printed circuit board 20 is effectively improved, and the phenomenon that the components 220 generate high heat due to too large driving force and cannot dissipate the temperature of a driving system in time is avoided, and further the printed circuit board 20 is damaged.

In practical applications, the printed circuit board body 210 is generally a multi-layer structure, and the printed circuit board body 210 includes, from bottom to top, a lower green oil covering layer 211, at least two copper foil layers 212, a substrate 213 disposed between each two adjacent copper foil layers, and an upper green oil covering layer 214; the heat dissipation through hole 231 penetrates through the upper green oil covering layer 214, the copper foil layer 212 and the base material 213 in sequence; and the hole wall of the heat dissipation through hole 231 is provided with a first heat conduction layer 233 corresponding to the upper green oil covering layer 214, a second heat conduction layer 234 corresponding to the base material 213, and the first heat conduction layer 233 and the second heat conduction layer 234 are used for communicating the upper green oil covering layer and the two adjacent copper foil layers 212 to form the heat conduction layer 232 on the hole wall of the heat dissipation through hole 231.

Generally, the components 220 include chips (or integrated circuits), but the chips are generally unable to perform work tasks alone, and other components 220 must be serviced, so the components 220 further include resistors, capacitors, inductors, semiconductor diodes, transistors, and the like. In the embodiment of the present application, the component 220 is taken as a chip for example, the chip is rigidly connected to the printed circuit board body 210 by soldering, the printed circuit board body 210 is a multi-layer structure, and includes a lower green oil covering layer 211, at least two copper foil layers 212, a substrate 213, and an upper green oil covering layer 214, and generally, the main material of the substrate 213 is resin, which has poor thermal conductivity, so that the temperature of the chip cannot be dissipated in time, thereby increasing the temperature of the driving system.

In this embodiment, the heat dissipation through hole 231 penetrates through the upper green oil covering layer 214, the copper foil layer 212 and the substrate 213, wherein the upper green oil covering layer 214 is a surface fixed to the chip (i.e., a surface in contact with the pad 221), a first heat conduction layer 233 is disposed on a hole wall of the heat dissipation through hole 231 corresponding to the upper green oil covering layer 214, a second heat conduction layer 234 is disposed on the substrate 213 corresponding to the hole wall, the first heat conduction layer 233 and the second heat conduction layer 234 communicate the upper green oil covering layer with the two adjacent copper foil layers 212 to form a heat conduction layer 232, heat generated by the chip can be dissipated through the heat dissipation through hole 231 by air, and the heat generated by the chip can be conducted to each copper foil layer 212 through the heat conduction layer 232, so that heat dissipation is performed through the copper foil layers 212, thereby increasing the heat dissipation area and further improving the heat dissipation efficiency of the chip.

The first heat conduction layer 233 and the second heat conduction layer 234 can be made of copper materials, aluminum materials or other heat-conducting and electricity-conducting metal materials, preferably, the first heat conduction layer 233 and the second heat conduction layer 234 are made of copper materials which are the same as the copper foil layer 212, so that the manufacturing process can be simplified, and the production efficiency can be improved; meanwhile, the first heat conduction layer 233 and the second heat conduction layer 234 can be arranged corresponding to the position of the upper green oil covering layer 214 and the position of the base material 213, the first heat conduction layer 233 and the second heat conduction layer 234 can also extend to cover the hole wall of the heat dissipation through hole 231, and are also arranged corresponding to the position of the copper foil layer 212, so that the heat conduction layer 232 is formed on the hole wall of the heat dissipation through hole 231, the thickness of the heat conduction layer 232 formed in this way is uniform, the thickness of the heat conduction layer 232 corresponding to the position of the copper foil layer 212 is thicker, heat conduction to other positions of the copper foil layer 212 is facilitated, and the heat dissipation efficiency of the chip is improved.

Further, in order to ensure the flatness of the component 220 and the pcb body 210, a groove 215 is formed on the surface of the pcb body 210 contacting the pad 221, the pad 221 is embedded in the groove 215, the heat dissipation through hole 231 penetrates the pcb 20 from the bottom of the groove 215, and the heat conduction layer 232 extends from the wall of the heat dissipation through hole 231 to cover the wall of the groove 215 and closely contacts the pad 221.

Usually, the pad 221 at the bottom of the component 220 further has a certain thickness, and the size of the pad 221 is generally slightly smaller than that of the component 220, so that when the component 220 is fixed to the printed circuit board body 210, the component 220 cannot be tightly attached to the printed circuit board body 210, which may cause the component 220 to easily fall off, therefore, a groove 215 is disposed at a position of the printed circuit board body 210 corresponding to the pad 221, the pad 221 is embedded in the groove 215, the size of the groove 215 may be greater than or equal to that of the pad 221, but smaller than that of the component 220, for example, the size of the component 220 is 5mm × 5mm, the size of the ground pad 221 of the component 220 is 3mm × 3mm, and the area of the correspondingly disposed groove 215 may be 3.5mm × 3.5 mm; the heat dissipating through hole 231 penetrates through the printed circuit board 20 from the bottom of the groove 215, and the heat conducting layer 232 extends from the hole wall of the heat dissipating through hole 231 to cover the groove wall of the groove 215 and is tightly attached to the pad 221, so that the pad 221 can directly conduct heat generated by the component 220 to the printed circuit board body 210 through the heat conducting layer 232, and the component 220 can be ensured to be fully contacted and fixed with the printed circuit board body 210.

Optionally, the depth of the groove 215 may be set to be equal to the thickness of the upper green oil covering layer 214, so that the pad 221 may also directly contact with the copper foil layer 212, and thus, the bottom of the groove 215 may not be provided with the heat conducting layer 232, and only the groove wall of the groove 215 is provided with the heat conducting layer 232, so that while the heat dissipation efficiency of the component 220 is improved, certain cost may be saved. Of course, the groove bottom and the groove wall of the groove 215 may also be both provided with the heat conduction layer 232, and are communicated with the heat conduction layer 232 on the hole wall of the heat dissipation through hole 231, so that not only the continuity of the heat conduction layer 232 can be enhanced, but also the heat generated by the component 220 can be better dissipated, thereby avoiding the damage of the component 220 due to high heat, and improving the stability of the printed circuit board 20.

Specifically, the heat dissipation structure 230 includes a plurality of heat dissipation through holes 231, the plurality of heat dissipation through holes 231 are uniformly arranged corresponding to the pads 221, and a heat conduction layer 232 is arranged on a hole wall of each heat dissipation through hole 231; moreover, the diameter of each heat dissipation through hole 231 is 0.25 mm; the thickness of the thermally conductive layer 232 is 20 μm.

Because, the heat dissipation of components and parts 220 is realized through pad 221 and heat radiation structure 230, mainly through pad 221 and heat dissipation through-hole 231 and heat-conducting layer 232, realize the heat dissipation with the mode of air + heat-conducting layer 232 conduction, the quantity of heat dissipation through-hole 231 is more like this, the area of pad 221 and heat-conducting layer 232 is bigger, the radiating efficiency is better, and still guarantee that pad 221 and heat radiation structure 230's fixed effectual, therefore, in this embodiment, heat radiation structure 230 includes a plurality of heat dissipation through-holes 231 and sets up the heat-conducting layer 232 in every heat dissipation through-hole 231 and constitute, and, a plurality of heat dissipation through-holes 231 correspond the pad 221 and evenly arrange, guarantee that components and parts 220 dispel the heat evenly, avoid local high heat to lead to components and parts 220 to damage.

Generally, the size of each heat dissipation through hole 231 is fixed, a certain distance is required between two adjacent heat dissipation through holes 231, the number and arrangement of the heat dissipation through holes 231 are determined according to the size of the component 220 or the size of the pad 221 at the bottom of the component 220, for example, the size of the component 220 is generally 5mm by 5mm, and the number of the heat dissipation through holes 231 may be 4 by 4 to 16; then more heat dissipating vias 231 would need to be drilled for the component 220 having an area of 10mm by 10 mm. Experimental data prove that when the diameter of each heat dissipation through hole 231 is 0.25mm and the thickness of the heat conduction layer 232 is 20 μm, the heat dissipation effect of the component 220 is better, so that the diameters of the heat dissipation through holes 231 and the thickness of the heat conduction layer 232 are not changed, and different quantities are set according to the size of the component 220 to ensure the heat dissipation effect of the component 220.

Fig. 4 is a schematic cross-sectional view of a printed circuit board according to a second embodiment of the present application, and as shown in fig. 4, as a second embodiment of the present application, unlike the first embodiment, a printed circuit board body 210 includes a lower green oil covering layer 211, at least two copper foil layers 212, a substrate 213 disposed between each two adjacent copper foil layers, and an upper green oil covering layer 214 from bottom to top; the heat dissipation through hole 231 penetrates through the upper green oil covering layer 214, the copper foil layer 212, the base material 213 and the lower green oil covering layer 211 in sequence; the hole wall of the heat dissipation through hole 231 is provided with a first heat conduction layer 233 corresponding to the upper green oil covering layer 214, a second heat conduction layer 234 corresponding to the base material 213, and a third heat conduction layer 235 corresponding to the lower green oil covering layer 211, wherein the first heat conduction layer 233, the second heat conduction layer 234 and the third heat conduction layer 235 are used for communicating the upper green oil covering layer 214, the two adjacent copper foil layers 212 and the lower green oil covering layer 211 to form the heat conduction layer 232 on the hole wall of the heat dissipation through hole 231.

In this embodiment, the heat dissipating through-hole 231 completely penetrates the entire printed circuit board body 210, that is, the heat dissipation through-hole 231 penetrates not only the upper green oil cap layer 214, the copper foil layer 212 and the substrate 213 but also the lower green oil cap layer 211, in addition, a third heat conduction layer 235 is further arranged on the hole wall of the heat dissipation through hole 231 corresponding to the position of the lower green oil covering layer 211, the first heat conduction layer 233, the second heat conduction layer 234 and the third heat conduction layer 235 are communicated with the upper green oil covering layer 214, the two adjacent copper foil layers 212 and the lower green oil covering layer 211 to form a heat conduction layer 232 on the hole wall of the heat dissipation through hole 231, thus, the heat conducting layer 232 not only can conduct the heat generated by the component 220 to each copper foil layer 212 in the printed circuit board body 210, but also can conduct the heat to the outside of the printed circuit board body 210, through heat-conducting layer 232+ outside air heat dissipation, the radiating rate is faster, further improves the radiating efficiency. Preferably, the heat conducting layer 232 is uniformly arranged on the hole wall corresponding to the heat dissipation through hole 231 to ensure uniform heat dissipation.

Fig. 5 is a schematic diagram of a display device according to an embodiment of the present application, and as can be seen from fig. 5, the present application further discloses a display device 10, which includes a housing 30 and any one of the printed circuit boards 20 disclosed in the present application, wherein a surface of the printed circuit board body 210 away from the component 220 is fixed to the housing 30.

In this embodiment, the display device 10 includes the casing 30 and the printed circuit board 20, and the printed circuit board body 210 is fixed to the casing 30 on the side away from the component 220, so that the casing 30 and the printed circuit board 20 are connected to form a whole, and the heat generated by the component 220 can be conducted to the casing 30 through the heat dissipation structure 230, so as to further increase the contact area and improve the heat dissipation efficiency.

Specifically, the casing 30 includes a back plate 310, and an electrically and thermally conductive double-sided adhesive 320 is disposed at a position of the back plate 310 corresponding to the heat dissipation structure 230; at least one fixing structure 311 is disposed at the edge of the back plate 310 corresponding to the printed circuit board body 210, and the printed circuit board 20 is fixed to the back plate 310 through the electrically conductive and thermally conductive double-sided tape 320 and the fixing structure 311.

Generally, the housing 30 includes a back plate 310, a frame (a front frame, a middle frame, etc.), etc. in the display device 10, in the embodiment of the present application, the housing 30 is taken as the back plate 310 in the module backlight system as an example, when the component 220 is a chip, generally, the display driving system needs to be completed by the cooperation of chips with different functions, where the most commonly used chips include a timing control chip (TCON IC), a power management chip (PMIC), etc., and the high temperature chip, the entire driving system and the module backlight system are integrated into a whole to realize the rapid heat dissipation of the high temperature chip.

Meanwhile, in order to improve the fixing effect of the printed circuit board 20 and the back plate 310, the position of the back plate 310 corresponding to the heat dissipation structure 230 is provided with an electrically and thermally conductive double-sided tape 320, the edge corresponding to the printed circuit board body 210 is provided with at least one fixing structure 311, the fixing structure 311 may be a screw hole and a screw, and the printed circuit board 20 and the back plate 310 are fixed together through the electrically and thermally conductive double-sided tape 320 and the fixing structure 311. Moreover, the electrically and thermally conductive double-sided tape 320 has the performance of heat conduction and electrical conduction, and the position corresponding to the heat dissipation structure 230 is fixed by the electrically and thermally conductive double-sided tape 320, so that the electrically and thermally conductive double-sided tape 320 can not only quickly conduct heat to the backplane 310, but also enhance the electrical performance of the printed circuit board 20 itself.

Fig. 6 is a schematic cross-sectional view along B-B' of fig. 5, and as shown in fig. 6, in order to prevent the printed circuit board 20 from warping locally and ensure flatness, the back plate 310 is provided with a fixing groove 312 at a position corresponding to the heat dissipation structure 230, and the fixing groove 312 is formed by recessing a side of the back plate 310 contacting the printed circuit board body 210 away from the printed circuit board body 210; the size of the fixing groove 312 is equivalent to that of the heat dissipation structure 230, and the ratio of the depth of the recess of the fixing groove 312 to the thickness of the double-sided adhesive tape is 100: (105-110), the electric-heat-conduction double-sided adhesive tape 320 is arranged in the fixing groove 312.

Because the double-sided electrically and thermally conductive adhesive 320 has a certain thickness, the fixing groove 312 is disposed at a position of the back plate 310 corresponding to the heat dissipation structure 230, and the double-sided electrically and thermally conductive adhesive 320 is embedded in the fixing groove 312, so as to prevent a gap from being generated between the printed circuit board 20 and the back plate 310 or a local position from warping to affect flatness. And the double-sided adhesive tape 320 will generate a certain extrusion when being applied, in order to ensure the sufficient contact between the back plate 310 and the printed circuit board 20 and the adhesion effect, the size of the fixing groove 312 is equal to the size of the heat dissipation structure 230, and the ratio of the depth of the recess of the fixing groove 312 to the thickness of the double-sided adhesive tape 320 is 100: (105-.

Fig. 7 is a schematic view of the electric and thermal double-sided tape, and as shown in fig. 7, the electric and thermal double-sided tape 320 includes an electric-conductive adhesive core 321 and an electric-conductive adhesive 322 coated on a surface of the electric-conductive adhesive core 321, a thickness of the electric-conductive adhesive core 321 is 0.2mm, and a thickness of the electric-conductive adhesive 322 disposed on each surface is 0.1 mm.

In this embodiment, the electric and thermal conductive double-sided tape 320 includes an electric conductive adhesive inner core 321 and an electric conductive adhesive 322, the electric conductive adhesive inner core 321 is made of high electric and thermal conductive conductors such as metal copper and metal aluminum, and the electric conductive adhesive 322 is made of a polyurethane electric conductive adhesive 322, which can ensure high electric conductivity and high thermal conductivity, and the thickness of the electric conductive adhesive inner core 321 is 0.2mm, and the thickness of the electric conductive adhesive 322 disposed on each side is 0.1mm, so the thickness of the electric and thermal conductive double-sided tape 320 is 0.4mm, while ensuring adhesion performance, high electric conductivity and high thermal conductivity, the thickness of the electric and thermal conductive double-sided tape 320 can be prevented from being too thick, which results in an excessively thick display device 10 product, and is beneficial to design of the product to be light and thin.

It should be noted that the inventive concept of the present application can form many embodiments, but the present application has a limited space and cannot be listed one by one, so that, on the premise of no conflict, any combination between the above-described embodiments or technical features can form a new embodiment, and after the embodiments or technical features are combined, the original technical effect will be enhanced.

The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and the above solution can be applied thereto.

The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be considered as belonging to the protection scope of the present application.

Claims

1. A printed circuit board, comprising:

a printed circuit board body; and

the printed circuit board comprises a printed circuit board body, a plurality of components and a plurality of connecting wires, wherein the printed circuit board body is provided with a plurality of connecting wires;

the printed circuit board comprises a printed circuit board body, a bonding pad and a heat dissipation structure, wherein the position of the printed circuit board body at least corresponding to one bonding pad is provided with the heat dissipation structure, and the heat dissipation structure comprises at least one heat dissipation through hole penetrating through the printed circuit board body and a heat conduction layer arranged on the hole wall of the heat dissipation through hole.

2. The printed circuit board of claim 1, wherein a surface of the printed circuit board body contacting the pad is provided with a groove, the pad is embedded in the groove, the heat dissipation through hole penetrates through the printed circuit board from a bottom of the groove, and the heat conduction layer extends from a wall of the heat dissipation through hole to cover a wall of the groove and is tightly attached to the pad.

3. The printed circuit board of claim 1, wherein the heat dissipation structure comprises a plurality of heat dissipation through holes, the plurality of heat dissipation through holes are uniformly arranged corresponding to the bonding pads, and a heat conduction layer is arranged on a hole wall of each heat dissipation through hole.

4. The printed circuit board of claim 1, wherein each of the heat dissipating through-holes has a diameter of 0.25 mm; the thickness of the heat conducting layer is 20 μm.

5. The printed circuit board of claim 1, wherein the printed circuit board body comprises a lower green oil covering layer, at least two copper foil layers, a substrate disposed between each two adjacent copper foil layers, and an upper green oil covering layer, respectively, from bottom to top;

the heat dissipation through hole sequentially penetrates through the upper green oil covering layer, the copper foil layer and the base material; and the hole wall of the heat dissipation through hole is provided with a first heat conduction layer corresponding to the position of the upper green oil covering layer, a second heat conduction layer corresponding to the position of the substrate, and the first heat conduction layer and the second heat conduction layer are used for communicating the upper green oil covering layer and the two adjacent copper foil layers to form the heat conduction layers on the hole wall of the heat dissipation through hole.

6. The printed circuit board of claim 1, wherein the printed circuit board body comprises a lower green oil covering layer, at least two copper foil layers, a substrate disposed between each two adjacent copper foil layers, and an upper green oil covering layer, respectively, from bottom to top;

the heat dissipation through hole sequentially penetrates through the upper green oil covering layer, the copper foil layer, the base material and the lower green oil covering layer; and the hole wall of the heat dissipation through hole is provided with a first heat conduction layer corresponding to the position of the upper green oil covering layer, a second heat conduction layer corresponding to the position of the substrate, and a third heat conduction layer corresponding to the position of the lower green oil covering layer, wherein the first heat conduction layer, the second heat conduction layer and the third heat conduction layer are used for communicating the upper green oil covering layer, the copper foil layer and the lower green oil covering layer to form the heat conduction layer on the hole wall of the heat dissipation through hole.

7. A display device, comprising a housing and a printed circuit board according to any one of claims 1 to 6, wherein the surface of the printed circuit board body away from the components is fixed to the housing.

8. The display device according to claim 7, wherein the housing comprises a back plate, and an electrically and thermally conductive double-sided tape is disposed on the back plate at a position corresponding to the heat dissipation structure;

the edge of the back plate corresponding to the printed circuit board body is at least provided with a fixing structure, and the printed circuit board is fixed on the back plate through the electric and heat conduction double-faced adhesive and the fixing structure.

9. The display device according to claim 8, wherein the back plate is provided with a fixing groove at a position corresponding to the heat dissipation structure, and the fixing groove is formed by recessing a contact surface of the back plate and the printed circuit board body to a side away from the printed circuit board body; the size of the fixing groove is equivalent to that of the heat dissipation structure, and the ratio of the depth of the recess of the fixing groove to the thickness of the double-sided adhesive tape is 100: and (105) and 110), wherein the electric and heat conduction double-sided adhesive tape is arranged in the fixing groove.

10. The display device according to claim 8, wherein the double-sided electrically and thermally conductive adhesive comprises an inner core of electrically conductive adhesive and an electrically conductive adhesive coated on a surface of the inner core of electrically conductive adhesive, the inner core of electrically conductive adhesive has a thickness of 0.2mm, and the electrically conductive adhesive is disposed on each side of the inner core of electrically conductive adhesive and has a thickness of 0.1 mm.