CN219107776U - Heat dissipation circuit board - Google Patents
Heat dissipation circuit board Download PDFInfo
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- CN219107776U CN219107776U CN202223423661.4U CN202223423661U CN219107776U CN 219107776 U CN219107776 U CN 219107776U CN 202223423661 U CN202223423661 U CN 202223423661U CN 219107776 U CN219107776 U CN 219107776U
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- circuit board
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model discloses a heat dissipation circuit board, comprising: a substrate; a first heat dissipation plate provided at an outer edge of the substrate; the main board is arranged on the substrate and is provided with a first connector; the first auxiliary plate is arranged on the first heat dissipation plate and is provided with a second connector, and the first connector is electrically connected with the second connector. According to the heat dissipation circuit board disclosed by the utility model, the main board is arranged on the substrate, the electronic parts with small heating value are arranged on the main board, the electric elements with serious heating value are arranged on the first auxiliary board, the heat emitted by the electric elements with serious heating value on the first auxiliary board is emitted by the first heat dissipation board, and the first heat dissipation board is arranged at the outer edge of the substrate, so that the temperature of the electronic parts on the main board is prevented from being increased by the heat emitted by the electric elements with serious heating value, and the influence of the electric elements with serious heating value on the electronic parts of the main board is reduced. The utility model can be applied to the field of circuit boards.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a heat dissipation circuit board.
Background
The circuit board is used for realizing the electrical connection of a plurality of electric elements, and a part of electric elements generate larger heat during operation, so that a radiating fin for radiating heat is required to be arranged on the circuit board. At present, a heat sink is generally embedded in a circuit board, so that the heat sink is attached to an electrical element with serious heat generation. However, the heat emitted by the electrical components with severe heat generation heats up surrounding electronic components, which affects the normal operation of other electronic components of the circuit board.
Disclosure of Invention
The present utility model is directed to a heat dissipating circuit board, which solves one or more of the technical problems of the prior art, and at least provides a beneficial choice or creation.
The technical scheme adopted for solving the technical problems is as follows:
a heat dissipating circuit board, comprising:
a substrate;
a first heat dissipation plate provided at an outer edge of the substrate;
the main board is arranged on the substrate and is provided with a first connector;
the first auxiliary plate is arranged on the first heat dissipation plate and is provided with a second connector, and the first connector is electrically connected with the second connector.
The beneficial effects of the utility model are as follows: the mainboard is arranged on the substrate, the electronic component with small heating value is arranged on the mainboard, the electric component with serious heating value is arranged on the first auxiliary board, the first auxiliary board is arranged on the first heat dissipation board, the first heat dissipation board is arranged on the periphery of the substrate, the mainboard is electrically connected with the first auxiliary board through the first connector and the second connector, the heat emitted by the electric component with serious heating value on the first auxiliary board is emitted by the first heat dissipation board, the first heat dissipation board is arranged on the outer edge of the substrate, the temperature of the electronic component on the mainboard is increased due to the heat emitted by the electric component with serious heating value, and the influence of the electric component with serious heating value on the electronic component of the mainboard is reduced.
As a further improvement of the above technical solution, the first heat dissipating plate is detachably connected to the substrate, and the first connector is detachably connected to the second connector.
Because the electric element on the first auxiliary board generates heat seriously, the condition that the electric element is damaged often appears, and the first heating panel is dismantled from the base plate, and the second joint of first auxiliary board is dismantled from the first joint of mainboard for first heating panel is dismantled with first auxiliary board, so that the electric element damaged on the first auxiliary board is changed.
As a further improvement of the above technical solution, the first sub-plate is detachably connected with the first heat dissipation plate.
After the electric elements on the first auxiliary plate are damaged, the first cooling plate and the first auxiliary plate are detached together, then the first auxiliary plate is separated from the first cooling plate, and the first cooling plate can be recycled.
As a further improvement of the technical scheme, a plurality of first positioning holes are formed in the first radiating plate, a plurality of second positioning holes are formed in the first auxiliary plate, and the positions of the second positioning holes are in one-to-one correspondence with the positions of the first positioning holes.
When the first cooling plate is recycled, the plurality of second positioning holes of the first auxiliary plate are matched with the plurality of first positioning holes of the first cooling plate, so that the first auxiliary plate and the first cooling plate can be accurately connected together, and interference of the first auxiliary plate and the first cooling plate on the substrate after the first auxiliary plate and the first cooling plate are assembled is avoided.
As a further improvement of the above technical solution, the shape of the first sub-plate is matched with the shape of the first heat dissipation plate.
The shape of first subplate and the shape phase-match of first heating panel, first subplate can be whole laminating on first heating panel, ensures that first heating panel can absorb the heat at each position of first subplate.
As a further improvement of the technical scheme, the plurality of first radiating plates are distributed at intervals along the outer edge of the substrate, the plurality of first joints are arranged in a one-to-one correspondence manner with the plurality of first radiating plates.
The first radiating plates are distributed at intervals along the outer edge of the substrate, and the first connectors are arranged in one-to-one correspondence with the first radiating plates, so that any one first radiating plate on the periphery of the substrate is conveniently selected to mount the first auxiliary plate, and the first auxiliary plate is more flexible to arrange.
As a further improvement of the technical scheme, the plurality of first auxiliary plates are arranged on the plurality of first radiating plates in a one-to-one correspondence manner, and the plurality of second connectors are electrically connected with the plurality of first connectors.
The plurality of first auxiliary plates are in one-to-one correspondence with the plurality of first radiating plates, so that a plurality of electric elements with serious heating are arranged on the plurality of first auxiliary plates, the plurality of electric elements with serious heating are separated, and the electric elements are prevented from being burnt out due to accumulation of heat emitted by the plurality of electric elements.
As a further improvement of the above technical solution, the shape of the substrate is polygonal, and the plurality of first heat dissipation plates are disposed on a plurality of sides of the substrate in a one-to-one correspondence manner.
The plurality of first cooling plates are arranged on the plurality of side edges of the polygonal substrate in a one-to-one correspondence manner, so that enough space is reserved between every two adjacent first cooling plates, the first cooling plates can be helped to dissipate heat outwards, and heat accumulation is avoided.
As a further improvement of the above technical solution, a heat-conducting silicone grease is filled between the first heat dissipation plate and the first sub-plate.
And heat conduction silicone grease is filled between the first heat dissipation plate and the first auxiliary plate, so that an air gap is formed between the first heat dissipation plate and the first auxiliary plate, and the heat conduction effect is reduced.
As a further improvement of the above technical solution, the substrate is an aluminum plate, and the first heat dissipation plate is a copper plate.
The electronic part of mainboard calorific capacity is not high, and the base plate of aluminum plate structure is enough mainboard heat dissipation, and the first heating panel that first subplate is connected is the copper, and copper's thermal conductivity is higher than aluminium, consequently the radiating effect of first heating panel is superior to the base plate to first heating panel dispels the heat to first subplate, need not to set up the copper of large tracts of land, helps saving the cost.
Drawings
The utility model is further described below with reference to the drawings and examples;
fig. 1 is a schematic structural diagram of a heat dissipating circuit board according to an embodiment of the present utility model;
FIG. 2 is a schematic top view of a heat dissipating circuit board according to an embodiment of the present utility model;
FIG. 3 is a schematic bottom view of a heat dissipating circuit board according to an embodiment of the present utility model;
fig. 4 is an exploded view of an embodiment of a heat dissipating circuit board according to the present utility model.
100. The heat dissipation device comprises a substrate, 110, a hole, 200, a first heat dissipation plate, 210, a first positioning hole, 300, a main board, 310, a first connector, 320, a through hole, 330, a third connector, 400, a first auxiliary board, 410, a second connector, 420, a second positioning hole, 500, a second auxiliary board, 510, a fourth connector, 600 and a second heat dissipation plate.
Detailed Description
Reference will now be made in detail to the present embodiments of the present utility model, examples of which are illustrated in the accompanying drawings, wherein the accompanying drawings are used to supplement the description of the written description so that one can intuitively and intuitively understand each technical feature and overall technical scheme of the present utility model, but not to limit the scope of the present utility model.
In the description of the present utility model, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present utility model and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, if there is a word description such as "a plurality" or the like, the meaning of a plurality is one or more, and the meaning of a plurality is two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number.
In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
Referring to fig. 1 to 4, the heat dissipating circuit board of the present utility model makes the following embodiments:
the heat dissipation circuit board includes a substrate 100, a first heat dissipation plate 200, a main board 300, and a first sub-board 400.
The first cooling plate 200 is welded at the outer edge of the substrate 100, the bottom surface of the main board 300 is adhered to the top surface of the substrate 100, the main board 300 dissipates heat through the substrate 100, the bottom surface of the first auxiliary board 400 is adhered to the top surface of the first cooling plate 200, the first auxiliary board 400 dissipates heat through the first cooling plate 200, serious heating electrical elements are arranged on the first auxiliary board 400, other electronic components are arranged on the main board 300, the main board 300 is provided with a first connector 310, the first connector 310 is positioned beside the first auxiliary board 400, the first auxiliary board 400 is provided with a second connector 410, the second connector 410 is electrically connected with the first connector 310 through a wire, and further the serious heating electrical elements are electrically connected with the electronic components, so that the function of the circuit board is realized.
In the present embodiment, the heat dissipation circuit board includes a substrate 100, a first heat dissipation plate 200, a main board 300, a first sub-board 400, a second sub-board 500, and a second heat dissipation plate 600.
The base plate 100 is an aluminum plate, the shape of the base plate 100 is regular nine-sided, three holes 110 are formed in the middle of the base plate 100, the three holes 110 are distributed at intervals, and the holes 110 are rectangular holes.
The shape of the main board 300 is matched with that of the substrate 100, the shape of the main board 300 is a regular nine-sided shape, the main board 300 is a common circuit board, three through holes 320 are formed in the main board 300, the positions of the three through holes 320 are in one-to-one correspondence with the positions of the three holes 110, the shape of the through holes 320 is matched with that of the holes 110, and the through holes 320 are rectangular holes.
The bottom surface of the main board 300 is adhered to the top surface of the substrate 100, and heat-conductive silicone grease is filled between the main board 300 and the substrate 100.
Nine first connectors 310 and three third connectors 330 are disposed on the main board 300, one first connector 310 is disposed on each side of the main board 300, the first connectors 310 face the outside of the main board 300, and each first connector 310 is provided with a first pin extending outwards. A third connector 330 is provided at the periphery of each through hole 320, and each third connector 330 is provided with a third pin extending toward the adjacent through hole 320.
The first auxiliary boards 400 are rectangular, nine first auxiliary boards 400 are arranged beside nine side edges of the main board 300 in a one-to-one correspondence mode, each first auxiliary board 400 is provided with a second connector 410, and the second connectors 410 are provided with second jacks. The first pin of the first connector 310 is inserted into the second insertion hole of the second connector 410, so that the first sub-board 400 is electrically connected to the main board 300, and the first sub-board 400 is connected to the main board 300.
The first heat dissipation plates 200 are copper plates, the first heat dissipation plates 200 are rectangular, the first heat dissipation plates 200 are adhered to the bottoms of the first auxiliary plates 400, nine first heat dissipation plates 200 are arranged, and the nine first heat dissipation plates 200 are connected to the nine first auxiliary plates 400 in a one-to-one correspondence mode. In this embodiment, the first heat dissipation plate 200 is provided with four first positioning holes 210 penetrating from top to bottom, the four first positioning holes 210 are respectively disposed on four sides of the first heat dissipation plate 200, the positions of the first auxiliary plate 400 corresponding to the four first positioning holes 210 are provided with second positioning holes 420, and the four second positioning holes 420 are in one-to-one correspondence with the four first positioning holes 210.
The second sub-plates 500 have a rectangular shape, the shape of the second sub-plates 500 is matched with the shape of the through holes 320, the number of the second sub-plates 500 is three, and the three second sub-plates 500 are installed in the three through holes 320 in a one-to-one correspondence. The second sub-board 500 is provided with a fourth connector 510, the fourth connector 510 is provided with a fourth jack, and the third pin of the third connector 330 is inserted into the fourth jack of the fourth connector 510, so that the second sub-board 500 is electrically connected with the main board 300, and the second sub-board 500 is fixed in the through hole 320.
The second heat dissipation plate 600 is a copper plate, the shape of the second heat dissipation plate 600 corresponds to that of the second auxiliary plate 500, the second heat dissipation plate 600 is adhered to the bottom of the second auxiliary plate 500, three second heat dissipation plates 600 are arranged, and the three second heat dissipation plates 600 are connected to the three second auxiliary plates 500 in a one-to-one correspondence.
The circuit of part of the circuit board requires the electric element with serious heat generation to be arranged in the middle of the main board 300, so that the hole 110 is arranged in the middle of the substrate 100, the through hole 320 is arranged at the position of the main board 300 corresponding to the hole 110, the second auxiliary board 500 and the second heat dissipation board 600 are assembled in the through hole 320 and the hole 110, the fourth connector 510 is matched with the third connector 330 to enable the second auxiliary board 500 to be electrically connected with the main board 300, the second auxiliary board 500 is subjected to heat dissipation through the second heat dissipation board 600, the second heat dissipation board 600 is not required to be inlaid on the substrate 100, and the manufacturing difficulty of the substrate 100 and the second heat dissipation board 600 is reduced.
In some embodiments, the first sub-panel 400 and the first heat dissipation panel 200 are detachably coupled together by screws; or, a buckle is arranged at the bottom of the first auxiliary plate 400, a buckle hole is arranged at a corresponding position of the first heat dissipation plate 200, and after the first auxiliary plate 400 is attached to the top surface of the first heat dissipation plate 200, the buckle is inserted into the buckle hole, so that the first auxiliary plate 400 and the first heat dissipation plate 200 are clamped together.
In addition, since the first sub-plate 400 and the first heat dissipation plate 200 need to be closely adhered, it is necessary to fill the heat conductive silicone grease between the first sub-plate 400 and the first heat dissipation plate 200 and then connect the first sub-plate 400 and the first heat dissipation plate 200 together.
Also, the second sub-plate 500 may be detachably coupled with the second heat dissipation plate 600 with reference to the above-described scheme.
In some embodiments, the shape of the substrate 100 may be triangular, quadrangular, pentagonal, or even polygonal, and is designed according to the number of electrical components with severe heat that need to be electrically connected to the motherboard 300.
In some embodiments, the shape of the substrate 100 may be designed according to the shape of the motherboard 300, and the substrate 100 may be a regular pattern or an irregular pattern, and only the plurality of first heat dissipation plates 200 need to be disposed on the periphery of the substrate 100.
In some embodiments, the substrate 100, the first heat dissipation plate 200, and the second heat dissipation plate 600 are all copper plates, and in order to improve the heat dissipation effect of the first heat dissipation plate 200 and the second heat dissipation plate 600, heat dissipation fins may be disposed at the bottoms of the first heat dissipation plate 200 and the second heat dissipation plate 600, and the area of the heat dissipation fins contacting with air is larger.
In some embodiments, the number of the first heat dissipation plate 200, the first sub-plate 400, and the second sub-plate 500 and the second heat dissipation plate 600 may be designed according to specific functional requirements of the circuit board. Such as: only two electric components with serious heat generation are arranged on the circuit board, and then two first auxiliary boards 400 and two first heat dissipation boards 200 are arranged; or an electric component having serious heat generation must be disposed in the middle of the circuit board, a second heat dissipation plate 600 and a second sub-plate 500 are disposed in the hole 110 of the base plate 100 and the through hole 320 of the main plate 300.
While the preferred embodiments of the present utility model have been illustrated and described, the present utility model is not limited to the embodiments, and various equivalent modifications and substitutions can be made by one skilled in the art without departing from the spirit of the present utility model, and these are intended to be included in the scope of the present utility model as defined in the appended claims.
Claims (10)
1. A heat dissipating circuit board, characterized in that: comprising the following steps:
a substrate;
a first heat dissipation plate provided at an outer edge of the substrate;
the main board is arranged on the substrate and is provided with a first connector;
the first auxiliary plate is arranged on the first heat dissipation plate and is provided with a second connector, and the first connector is electrically connected with the second connector.
2. The heat dissipating circuit board of claim 1, wherein: the first radiating plate is detachably connected with the base plate, and the first connector is detachably connected with the second connector.
3. The heat dissipating circuit board of claim 2, wherein: the first auxiliary plate is detachably connected with the first radiating plate.
4. A heat dissipating circuit board according to claim 3, wherein: the first cooling plate is provided with a plurality of first positioning holes, the first auxiliary plate is provided with a plurality of second positioning holes, and the positions of the second positioning holes are in one-to-one correspondence with the positions of the first positioning holes.
5. The heat dissipating circuit board of claim 2, wherein: the shape of the first auxiliary plate is matched with that of the first radiating plate.
6. The heat dissipating circuit board of claim 1, wherein: the first radiating plates are arranged in a plurality, the first radiating plates are distributed at intervals along the outer edge of the substrate, the first connectors are arranged in a plurality, and the first connectors and the first radiating plates are arranged in one-to-one correspondence.
7. The heat dissipating circuit board of claim 6, wherein: the first auxiliary plates are arranged in a plurality of first radiating plates in one-to-one correspondence, and the second connectors are electrically connected with the first connectors.
8. The heat dissipating circuit board of claim 7, wherein: the shape of the substrate is polygonal, and the plurality of first radiating plates are arranged on the plurality of side edges of the substrate in a one-to-one correspondence manner.
9. The heat dissipating circuit board of claim 1, wherein: and heat conduction silicone grease is filled between the first heat dissipation plate and the first auxiliary plate.
10. The heat dissipating circuit board of claim 1, wherein: the base plate is an aluminum plate, and the first radiating plate is a copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223423661.4U CN219107776U (en) | 2022-12-16 | 2022-12-16 | Heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223423661.4U CN219107776U (en) | 2022-12-16 | 2022-12-16 | Heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219107776U true CN219107776U (en) | 2023-05-30 |
Family
ID=86460209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223423661.4U Active CN219107776U (en) | 2022-12-16 | 2022-12-16 | Heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219107776U (en) |
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2022
- 2022-12-16 CN CN202223423661.4U patent/CN219107776U/en active Active
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| GR01 | Patent grant |