CN218998358U - Multilayer printed circuit board - Google Patents
Multilayer printed circuit board Download PDFInfo
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- CN218998358U CN218998358U CN202222865179.XU CN202222865179U CN218998358U CN 218998358 U CN218998358 U CN 218998358U CN 202222865179 U CN202222865179 U CN 202222865179U CN 218998358 U CN218998358 U CN 218998358U
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- support frame
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Abstract
The utility model discloses a multilayer printed circuit board which comprises a first circuit board, wherein a second circuit board is arranged at the upper end of the first circuit board, a third circuit board is arranged at the lower end of the first circuit board, a heat radiating device is arranged at the lower end of the third circuit board, supporting devices are jointly arranged at the upper end of the second circuit board and the lower end of the third circuit board, circuit layers are respectively arranged at the upper ends of the first circuit board, the second circuit board and the third circuit board, and an anti-deflection device is jointly arranged at the left end and the right end of the first circuit board. According to the multilayer printed circuit board, the clamping blocks on the deviation prevention device are used for clamping and limiting the circuit board, so that the phenomenon that a plurality of circuit boards are offset and misplaced when being bonded is prevented, the quality of the multilayer printed circuit board is further improved, the heat dissipation performance of the circuit board is improved through the heat dissipation device, the bending resistance of the multilayer circuit board can be enhanced through the supporting device, and the possibility that the multilayer circuit board is bent is reduced.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a multilayer printed circuit board.
Background
The circuit board is also called a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper plate, an impedance board and the like, and the circuit board enables a circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of electric appliance layout. Particularly, the electronic products are rapidly developed nowadays, and the performance of the multilayer circuit board is greatly improved compared with that of a single-layer circuit board, so that the multilayer circuit board is more and more widely used.
The prior patent (application number 202120968715.1) discloses a multilayer printed circuit board, wherein when a multilayer high-precision printed circuit board is manufactured, a plurality of double-sided boards or single-sided boards are required to be bonded to form the multilayer printed circuit board, and when a plurality of double-sided boards or single-sided boards are bonded, the placement positions of the two boards cannot be well controlled, so that the dislocation between the two boards can occur, the bonding effect can be influenced, and the quality of the multilayer printed circuit board is reduced; in addition, the circuit on the circuit board is also more accurate, once the multilayer circuit board receives external force influence, the circuit board then produces the buckling easily, and then influences the life of circuit board. In summary, the conventional multilayer circuit board has the following problems:
1. when a plurality of double-sided boards or single-sided boards are bonded, the placement position between the two boards cannot be well controlled, so that dislocation between the two boards can occur, and the quality of the multilayer printed circuit board is further affected; 2. once the multilayer circuit board is affected by external force, the circuit board is easy to bend, and the service life of the circuit board is further affected.
Disclosure of Invention
The utility model mainly aims to provide a multilayer printed circuit board, which can effectively solve the problem that when a plurality of double-sided boards or single-sided boards are bonded, the placement position between the two boards cannot be well controlled, so that dislocation between the two boards can occur, and the quality of the multilayer printed circuit board is further affected; once the multilayer circuit board is affected by external force, the circuit board is easy to bend, and the service life of the circuit board is further affected.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the utility model provides a multilayer printed circuit board, includes a circuit board, no. two circuit boards are installed to a circuit board upper end, no. three circuit boards are installed to a circuit board lower extreme, heat abstractor is installed to No. three circuit boards lower extreme, strutting arrangement is installed jointly to No. two circuit boards upper end and No. three circuit boards lower extreme, circuit layer is all installed to a circuit board, no. two circuit boards and No. three circuit boards upper end, deviation preventing device is installed jointly to a circuit board left end and right-hand member.
Preferably, the deviation prevention device comprises a first support frame and a second support frame, a group of clamping blocks are respectively arranged at one ends of the first support frame and the second support frame, screw holes are respectively formed in the front portions of the upper ends and the rear portions of the upper ends of the first support frame and the second support frame, a first screw is respectively arranged at the front portions of the upper ends and the rear portions of the upper ends of the first support frame and the second support frame, two second screws are respectively arranged at the left portions of the upper ends and the right portions of the upper ends of the first circuit board, and the first support frame and the second support frame are respectively arranged at the left ends and the right ends of the first circuit board through the clamping blocks. Clamping and limiting are carried out on the circuit boards through clamping blocks on the first support frame and the second support frame, so that the phenomenon that a plurality of circuit boards are offset and misplaced when being bonded is prevented, and the quality of the multilayer printed circuit board is improved.
Preferably, the heat dissipating device comprises a heat conducting copper layer, a group of heat conducting copper columns are respectively arranged at the left part of the upper end and the right part of the upper end of the heat conducting copper layer, graphite radiating fins are arranged at the lower end of the heat conducting copper layer, and the heat conducting copper layer is arranged at the lower end of the third circuit board. The heat in the multilayer circuit board can be rapidly led out through the heat conducting copper layer on the heat radiating device and the heat conducting copper column on the heat conducting copper layer, and the heat is radiated through the graphite radiating fins, so that the heat radiating performance of the circuit board is improved.
Preferably, the supporting device comprises a first reinforcing frame and a second reinforcing frame, the left part and the right part of one end corresponding to the first reinforcing frame and the second reinforcing frame are respectively provided with an adhesive layer, and the first reinforcing frame and the second reinforcing frame are respectively arranged at the upper end of the second circuit board and the lower end of the third circuit board through the adhesive layers. The first reinforcing frame and the second reinforcing frame on the supporting device are respectively arranged at the upper end and the lower end of the multilayer circuit board, so that the bending resistance of the multilayer circuit board can be enhanced, and the possibility that the multilayer circuit board is bent is reduced.
Preferably, the second screw is consistent with the screw hole in size and corresponds to the screw hole in position up and down.
Preferably, the two groups of heat conducting copper columns are bilaterally symmetrical and distributed in a rectangular array.
Compared with the prior art, the utility model has the following beneficial effects:
1. when a plurality of double-sided boards or single-sided boards are bonded, the circuit board to be bonded is aligned to the clamping blocks on the first support frame and the second support frame through the clamping grooves on the double-sided boards or the single-sided boards, then the circuit board is gradually put into the double-sided boards or the single-sided boards, the clamping blocks on the first support frame and the second support frame are used for clamping and limiting the circuit board, the phenomenon that a plurality of circuit boards are offset and misplaced when being bonded is prevented, and the quality of the multilayer printed circuit board is improved.
2. The heat in the multilayer circuit board can be rapidly led out and radiated through the graphite radiating fin through the heat conducting copper layer on the radiating device and the heat conducting copper column on the heat conducting copper layer, the graphite radiating fin is a brand new heat conducting and radiating material, and is uniformly heat-conducting along two directions, so that the performance of the consumer electronic product is improved while the heat source and the components are shielded, and the radiating performance of the circuit board is further improved.
3. When the multilayer circuit board is stressed and bent, the first reinforcing frame and the second reinforcing frame on the supporting device are respectively arranged at the upper end and the lower end of the multilayer circuit board, so that the bending resistance of the multilayer circuit board can be enhanced, and the bending possibility of the multilayer circuit board is reduced.
Drawings
FIG. 1 is a schematic view of the overall structure of a multilayer printed wiring board according to the present utility model;
FIG. 2 is a schematic diagram of the whole structure of an anti-deviation device of a multilayer printed circuit board according to the present utility model;
FIG. 3 is a schematic diagram showing the overall structure of a heat dissipating device of a multilayer printed circuit board according to the present utility model;
fig. 4 is a schematic diagram of the whole structure of a supporting device of a multi-layer printed circuit board according to the present utility model.
In the figure: 1. a first circuit board; 2. an anti-deviation device; 3. a heat sink; 4. a support device; 5. a second wiring board; 6. a third wiring board; 7. a circuit layer; 20. a first support frame; 21. a second support frame; 22. a first screw; 23. a clamping block; 24. screw holes; 25. a second screw; 30. a thermally conductive copper layer; 31. a thermally conductive copper pillar; 32. graphite heat sink; 40. a first reinforcing frame; 41. a second reinforcing frame; 42. an adhesive layer.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-4, a multilayer printed circuit board comprises a first circuit board 1, a second circuit board 5 is installed at the upper end of the first circuit board 1, a third circuit board 6 is installed at the lower end of the first circuit board 1, a heat dissipation device 3 is installed at the lower end of the third circuit board 6, a supporting device 4 is jointly installed at the upper end of the second circuit board 5 and the lower end of the third circuit board 6, a circuit layer 7 is installed at the upper ends of the first circuit board 1, the second circuit board 5 and the third circuit board 6, and an anti-deflection device 2 is jointly installed at the left end and the right end of the first circuit board 1.
The deviation prevention device 2 comprises a first support frame 20 and a second support frame 21, wherein a group of clamping blocks 23 are respectively arranged at the corresponding ends of the first support frame 20 and the second support frame 21, screw holes 24 are respectively formed in the front part and the rear part of the upper end of the first support frame 20 and the rear part of the upper end of the second support frame 21, first screws 22 are respectively arranged in the front part and the rear part of the upper end of the first support frame 20 and the rear part of the upper end of the second support frame 21, and two second screws 25 are respectively arranged at the left part and the right part of the upper end of the first circuit board 1; in a specific embodiment, the first circuit board 1, the second circuit board 5 and the third circuit board 6 are all installed at the upper ends of the first support frame 20 and the second support frame 21 in a screw fixing manner. The first support frame 20 and the second support frame 21 are respectively arranged at the left end and the right end of the first circuit board 1 through clamping blocks 23; the second screw 25 corresponds to the screw hole 24 in size and in position. As a specific implementation manner, in this embodiment, the clamping and limiting are performed on the circuit boards through the clamping blocks 23 on the first supporting frame 20 and the second supporting frame 21, so that the phenomenon that a plurality of circuit boards are offset and misplaced during bonding is prevented, and the quality of the multilayer printed circuit board is further improved.
The heat dissipation device 3 comprises a heat conduction copper layer 30, wherein a group of heat conduction copper columns 31 are respectively arranged at the left part and the right part of the upper end of the heat conduction copper layer 30, a graphite heat dissipation fin 32 is arranged at the lower end of the heat conduction copper layer 30, and the heat conduction copper layer 30 is arranged at the lower end of the third circuit board 6; the two groups of heat conducting copper columns 31 are bilaterally symmetrical and distributed in a rectangular array. As a specific implementation manner, in this embodiment, heat in the multilayer circuit board can be rapidly led out through the heat conducting copper layer 30 on the heat dissipating device 3 and the heat conducting copper columns 31 thereon, and heat is dissipated through the graphite heat dissipating fins 32, so that the heat dissipating performance of the circuit board is improved.
The supporting device 4 comprises a first reinforcing frame 40 and a second reinforcing frame 41, wherein an adhesive layer 42 is arranged at the left part and the right part of one end corresponding to the first reinforcing frame 40 and the second reinforcing frame 41, and the first reinforcing frame 40 and the second reinforcing frame 41 are respectively arranged at the upper end of the second circuit board 5 and the lower end of the third circuit board 6 through the adhesive layer 42. As a specific embodiment, in this embodiment, the first reinforcing frame 40 and the second reinforcing frame 41 on the supporting device 4 are respectively installed at the upper end and the lower end of the multilayer circuit board, so as to further strengthen the bending resistance of the multilayer circuit board, thereby reducing the possibility of bending the multilayer circuit board.
It should be noted that, the present utility model is a multilayer printed circuit board, when the multilayer circuit board is stressed and bent, the first reinforcing frame 40 and the second reinforcing frame 41 on the supporting device 4 are respectively installed at the upper end and the lower end of the multilayer circuit board, so as to further strengthen the bending resistance of the multilayer circuit board, and the heat in the multilayer circuit board can be rapidly led out through the heat conducting copper layer 30 on the heat dissipating device 3 and the heat conducting copper column 31 thereon, and dissipated through the graphite cooling fin 32, the graphite cooling fin 32 is a brand-new heat conducting and dissipating material, and is uniformly conducted along two directions, so that the heat source and the components are shielded, the performance of the consumer electronic product is improved, and the heat dissipating performance of the circuit board is further improved, when a plurality of double-sided boards or single-sided boards are bonded, the circuit board to be bonded is aligned to the clamping blocks 23 on the first supporting frame 20 and the second supporting frame 21 through the clamping grooves on the first supporting frame 20 and then gradually put into the circuit board, and the clamping blocks 23 on the first supporting frame 20 and the second supporting frame 21 are used for clamping and limiting the circuit board, so that the quality of the multilayer printed circuit board is prevented from being offset when the plurality of boards are bonded, and the quality of printed circuit boards is further improved.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. A multilayer printed wiring board comprising a wiring board number one (1), characterized in that: the circuit board (1) upper end is installed No. two circuit boards (5), no. three circuit boards (6) are installed to No. one circuit board (1) lower extreme, heat abstractor (3) are installed to No. three circuit boards (6) lower extreme, strutting arrangement (4) are installed jointly to No. two circuit boards (5) upper end and No. three circuit boards (6) lower extreme, circuit layer (7) are all installed to No. one circuit board (1), no. two circuit boards (5) and No. three circuit boards (6) upper end, deviation preventing device (2) are installed jointly to No. one circuit board (1) left end and right-hand member.
2. A multilayer printed wiring board according to claim 1, wherein: the anti-deflection device (2) comprises a support frame (20) and a second support frame (21), one ends of the support frame (20) and the second support frame (21) are respectively provided with a group of clamping blocks (23), screw holes (24) are formed in the front portions of the upper ends and the rear portions of the upper ends of the support frame (20) and the second support frame (21), a screw (22) is respectively arranged in the front portions of the upper ends and the rear portions of the upper ends of the support frame (20) and the second support frame (21), two second screws (25) are respectively arranged in the left portions of the upper ends and the right portions of the upper ends of the circuit board (1), and the support frame (20) and the second support frame (21) are respectively arranged at the left ends and the right ends of the circuit board (1) through the clamping blocks (23).
3. A multilayer printed wiring board according to claim 1, wherein: the heat dissipation device (3) comprises a heat conduction copper layer (30), a group of heat conduction copper columns (31) are respectively arranged at the left part of the upper end and the right part of the upper end of the heat conduction copper layer (30), graphite cooling fins (32) are arranged at the lower end of the heat conduction copper layer (30), and the heat conduction copper layer (30) is arranged at the lower end of a third circuit board (6).
4. A multilayer printed wiring board according to claim 1, wherein: the supporting device (4) comprises a reinforcing frame (40) and a second reinforcing frame (41), wherein an adhesive layer (42) is arranged at the left part and the right part of one end corresponding to the first reinforcing frame (40) and the second reinforcing frame (41), and the first reinforcing frame (40) and the second reinforcing frame (41) are respectively arranged at the upper end of the second circuit board (5) and the lower end of the third circuit board (6) through the adhesive layer (42).
5. A multilayer printed wiring board according to claim 2, wherein: the second screw (25) is consistent with the screw hole (24) in size and corresponds to the screw hole in position up and down.
6. A multilayer printed wiring board according to claim 3, wherein: the two groups of heat conduction copper columns (31) are bilaterally symmetrical and distributed in a rectangular array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222865179.XU CN218998358U (en) | 2022-10-28 | 2022-10-28 | Multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222865179.XU CN218998358U (en) | 2022-10-28 | 2022-10-28 | Multilayer printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218998358U true CN218998358U (en) | 2023-05-09 |
Family
ID=86219850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222865179.XU Active CN218998358U (en) | 2022-10-28 | 2022-10-28 | Multilayer printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218998358U (en) |
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2022
- 2022-10-28 CN CN202222865179.XU patent/CN218998358U/en active Active
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