CN112689381A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN112689381A CN112689381A CN202110153475.4A CN202110153475A CN112689381A CN 112689381 A CN112689381 A CN 112689381A CN 202110153475 A CN202110153475 A CN 202110153475A CN 112689381 A CN112689381 A CN 112689381A
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- circuit board
- printed circuit
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Abstract
The invention discloses a printed circuit board and a manufacturing method thereof, relating to the technical field of printed circuit boards, the invention comprises a substrate, a first mounting surface and a second mounting surface, wherein the two opposite surfaces of the substrate are respectively provided with the first mounting surface and the second mounting surface, the surface of the first mounting surface is provided with a core plate, the surface of the first mounting surface is also provided with a via hole, the inner side surface of the via hole is connected with a metal film, the core plate is adaptive to the metal film, the peripheral side of the via hole is connected with a slot hole, the joint of the via hole and the slot hole is provided with a welding spot, one side of the second mounting surface is provided with a heat dissipation plate, the two opposite side surfaces of the heat dissipation plate are both connected with a slide block, the inner side surface of the substrate is provided with a slide groove, the slide block is adaptive to the, the manufacturing method of the printed circuit board is simple, convenient and fast, high in manufacturing efficiency and low in cost.
Description
Technical Field
The present invention relates to printed circuit board technology, and is especially one kind of printed circuit board and its making process.
Background
Printed circuit boards are providers of electrical connections for electronic components, and are classified into single-sided boards, double-sided boards, four-sided boards, six-sided boards, and other multilayer boards according to the number of layers of the circuit boards, and since printed circuit boards are not general end products, the definitions of the names are somewhat disordered, for example: a motherboard for a personal computer, which is called a motherboard and cannot be directly called a circuit board, is different from the motherboard in the presence of the circuit board, so that the two are related but cannot be said to be the same when evaluating the industry; for another example: because there are integrated circuit components loaded on the circuit board, the news media is called IC board, but it is not substantially identical to the printed circuit board, which is usually a bare board, i.e. a circuit board without upper components;
the printed circuit board is developed from a single layer to a double-sided board, a multi-layer board and a flexible board, and is continuously developed towards high precision, high density and high reliability, the volume is continuously reduced, the cost is reduced, and the performance is improved, so that the printed circuit board still keeps strong vitality in the development process of future electronic products.
The prior printed circuit board still lacks a certain installation protection mechanism in actual use, has insufficient stability maintaining effect when the circuit board is used for a long time, influences the service life of the circuit board, and has the disadvantages of inconvenient operation and high manufacturing cost of the circuit board; to this end, we propose a printed circuit board and a method of manufacturing a printed circuit board.
Disclosure of Invention
The present invention is directed to a printed circuit board and a method for manufacturing the same, which solves the above-mentioned problems by improving the method for manufacturing the printed circuit board and adding a corresponding mounting-use prevention member to the printed circuit board.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a printed circuit board, includes base plate, first installation face and second installation face, the double-phase opposite surface of base plate is provided with first installation face and second installation face respectively, first installation face surface mounting has the core, first installation face surface still is provided with the via hole, the inboard surface of via hole is connected with the metallic film, the core suits with the metallic film, via hole week side connection has the slot hole, the via hole is provided with the solder joint with the junction in slot hole, second installation face one side is provided with the heating panel, the double-phase opposite side surface of heating panel all is connected with the slider, the inboard surface of base plate is provided with the spout, the slider suits with the spout, just slider and spout sliding fit, base plate week side is provided with the laminating groove.
Preferably, the upper surface of the periphery of the substrate is provided with a fixing hole, and the fixing hole penetrates through the substrate, so that the printed circuit board can be conveniently installed, fixed and used.
Preferably, the two opposite side surfaces of the substrate are provided with limiting grooves for limiting the position of the printed circuit board and preventing deviation.
Preferably, a plurality of air holes are formed in the surface of the radiating plate, so that heat dissipation is facilitated.
Preferably, the upper surface of the peripheral side of the first mounting surface is provided with an insulating layer, so that the use safety of the printed circuit board is improved.
Preferably, the press fit groove is a joint of the first mounting surface and the second mounting surface, and the operation is simple and convenient.
A method of manufacturing a printed circuit board, comprising the steps of:
the method comprises the following steps: selecting a glass fiber board material meeting the use standard, and cutting;
step two: drawing a use schematic diagram of the printed circuit board, and introducing the connection relation of the schematic diagram and the device information into a glass fiber board material;
step three: processing a glass fiber board material to obtain a substrate of the printed circuit board, and slotting two corresponding surfaces of the substrate to form two mounting surfaces;
step four: laying a core plate and each slot hole on a first mounting surface of the substrate to form required circuit connection, specifically laying by matching each via hole with the slot hole and connecting to form a welding point;
step five: the protection member is additionally arranged on the second mounting surface of the substrate, and particularly, a sliding block is matched with the sliding groove to mount a heat dissipation plate;
step six: fixing holes are formed in four top corners of the substrate;
step seven: the manufacture of the printed circuit board is completed.
Preferably, a metal film is arranged inside the via hole in the fourth step, and the metal film forms an electrical connection with the core plate and the slot hole.
Preferably, in the sixth step, the printed circuit board is mounted and fixed by the fixing holes at the four corners of the substrate, and the positions of the fixing holes at the four corners are kept consistent relatively, so as to maintain the use balance and stability of the printed circuit board.
Preferably, a heat conduction block is further connected between the bottom surface of the second mounting surface and the heat dissipation plate in the fifth step, so that heat transfer is facilitated, and the heat dissipation efficiency of the substrate is improved.
The invention has the following beneficial effects:
the printed circuit board has a certain installation protection effect on the main control module of the circuit board, the service life of the printed circuit board can be effectively guaranteed, and the protection structure is convenient to install and use, high in operation efficiency and strong in use stability.
Secondly, the printed circuit board is additionally provided with the auxiliary heat dissipation mechanism on the second mounting surface, so that heat generated in the long-time use process of the printed circuit board is effectively dissipated, and the protection effect and the stability of the printed circuit board are further enhanced.
Thirdly, the manufacturing method of the printed circuit board is simple, high in manufacturing efficiency and low in manufacturing cost, and is beneficial to popularization.
Drawings
FIG. 1 is a schematic view of an overall structure of a printed circuit board according to the present invention;
FIG. 2 is a schematic bottom view of a printed circuit board according to the present invention;
FIG. 3 is a schematic diagram of a heat sink plate of a PCB according to the present invention;
FIG. 4 is a schematic side view of a printed circuit board according to the present invention;
FIG. 5 is a cross-sectional view taken along plane C-C of FIG. 4 of a printed circuit board according to the present invention;
FIG. 6 is an enlarged view of a portion of the printed circuit board of the present invention at A in FIG. 3;
FIG. 7 is a flow chart of a method for manufacturing a printed circuit board according to the present invention.
In the figure: 1. a substrate; 2. a first mounting surface; 3. a second mounting surface; 4. a fixing hole; 5. a limiting groove; 6. welding spots; 7. a slot-shaped hole; 8. an insulating layer; 9. a core board; 10. a via hole; 11. a metal film; 12. a heat dissipation plate; 13. air holes are formed; 14. a slider; 15. a chute; 16. and (4) pressing the groove.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The first embodiment is as follows:
please refer to fig. 1-6: a printed circuit board comprises a substrate 1, a first mounting surface 2 and a second mounting surface 3, wherein the first mounting surface 2 and the second mounting surface 3 are respectively arranged on two opposite surfaces of the substrate 1, the building of a control module and a protection mechanism is facilitated, a core plate 9 is arranged on the surface of the first mounting surface 2, a through hole 10 is further arranged on the surface of the first mounting surface 2, a metal film 11 is connected to the inner side surface of the through hole 10, the metal film 11 is electrically connected with each control module, the core plate 9 is matched with the metal film 11 and facilitates the control module to form a control reaction effect, a slot-shaped hole 7 is connected to the periphery of the through hole 10, a welding point 6 is arranged at the connection position of the through hole 10 and the slot-shaped hole 7, each transmission point is connected in series or in parallel, the operation of the printed circuit board is facilitated, a heat dissipation plate 12 is, the use stability of the printed circuit board is enhanced, the opposite side surfaces of the heat dissipation plate 12 are connected with the sliding blocks 14, the inner side surface of the substrate 1 is provided with the sliding grooves 15, the sliding blocks 14 are adaptive to the sliding grooves 15, the sliding blocks 14 are in sliding fit with the sliding grooves 15, the heat dissipation plate 12 is convenient to disassemble and assemble, the use pertinence and the adaptability are stronger, the peripheral side surface of the substrate 1 is provided with the pressing grooves 16, and the first mounting surface 2 and the second mounting surface 3 are connected;
the upper surface of 1 week side of base plate is provided with fixed orifices 4, fixed orifices 4 run through base plate 1, be convenient for install fixedly this printed circuit board, 1 double-phase offside surface of base plate all is provided with spacing groove 5, it is spacing to install the use to printed circuit board, prevent that it from producing the displacement and influencing the result of use, heating panel 12 surface is provided with a plurality of bleeder vents 13, be convenient for take a breath the heat dissipation, 2 week side upper surfaces of first installation face are provided with insulating layer 8, promote printed circuit board's safety in utilization, pressfitting groove 16 is the junction of first installation face 2 and second installation face 3, the convenience of manufacturing is strengthened.
Example two:
please refer to fig. 7: a method of manufacturing a printed circuit board, comprising the steps of:
the method comprises the following steps: selecting a glass fiber board material meeting the use standard, and cutting;
step two: drawing a use schematic diagram of the printed circuit board, and introducing the connection relation of the schematic diagram and the device information into a glass fiber board material;
step three: processing a glass fiber board material to obtain a substrate 1 of the printed circuit board, and slotting two corresponding surfaces of the substrate 1 to form two mounting surfaces;
step four: laying a core plate 9 and each slotted hole on the first mounting surface 2 of the substrate 1 to form required circuit connection, specifically laying each via hole 10 in cooperation with the slotted hole 7 and connecting to form a welding point 6, so that the continuity is stronger, and the using effect of the printed circuit board is maintained;
step five: the protection member is additionally arranged on the second mounting surface 3 of the substrate 1, specifically, the sliding block 14 is matched with the sliding groove 15 to mount the heat dissipation plate 12, the heat dissipation plate 12 can move longitudinally, so that the disassembly, assembly and maintenance are convenient, and the operation is convenient;
step six: fixing holes 4 are formed in four top corners of the substrate 1, and the relative positions of the fixing holes 4 are kept consistent, so that the printed circuit board is beneficial to keeping the mounting balance and stability;
step seven: and finishing the manufacture of the printed circuit board, and cleaning equipment after finishing the manufacture of the printed circuit board, so that the printed circuit board is convenient to reuse.
Wherein, the metal film 11 is arranged at the inner side of the through hole 10 in the fourth step, and the metal film 11 is electrically connected with the core plate 9 and the slot hole 7.
And in the sixth step, the printed circuit board is fixedly installed through the fixing holes 4 at the four top corners of the substrate 1.
In the fifth step, a heat conducting block is connected between the bottom surface of the second mounting surface 3 and the heat dissipation plate 12 to enhance the heat dissipation efficiency.
The invention is a printed circuit board and a manufacturing method of the printed circuit board, the printed circuit board carries out installation protection on a main control module of the circuit board, each independent connecting slot hole is connected in series, an insulating layer 8 is used for packaging, the safety is enhanced, an auxiliary heat dissipation mechanism is additionally arranged on a second mounting surface 3, heat generated in the long-time use process of the printed circuit board is effectively dissipated, specifically, a sliding block 14 is matched with a sliding groove 15 for dismounting and mounting a heat dissipation plate 12, and the protection effect and the stability of the use of the printed circuit board are enhanced;
in the process, firstly, a glass fiber board material meeting the use standard is selected, cutting processing is carried out, then a use principle diagram of the printed circuit board is drawn, the connection relation and the device information of the principle diagram are led into the glass fiber board material, finally, the glass fiber board material is processed, a substrate 1 of the printed circuit board is obtained, and laying of each control module and a protection mechanism is carried out on the basis of the substrate 1, so that the manufacture completion degree of the printed circuit board is achieved.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A printed circuit board comprises a substrate (1), a first mounting surface (2) and a second mounting surface (3), wherein the first mounting surface (2) and the second mounting surface (3) are respectively arranged on two opposite surfaces of the substrate (1), and the printed circuit board is characterized in that: the surface mounting structure of the LED display panel is characterized in that a core plate (9) is mounted on the surface of the first mounting surface (2), a through hole (10) is further formed in the surface of the first mounting surface (2), a metal film (11) is connected to the inner side surface of the through hole (10), the core plate (9) is matched with the metal film (11), slot holes (7) are connected to the periphery of the through hole (10), welding points (6) are arranged at the joints of the through hole (10) and the slot holes (7), a heat dissipation plate (12) is arranged on one side of the second mounting surface (3), sliding blocks (14) are connected to the opposite side surfaces of the heat dissipation plate (12), sliding grooves (15) are formed in the inner side surface of the substrate (1), the sliding blocks (14) are matched with the sliding grooves (15), the sliding blocks (14) are in sliding fit with the sliding grooves (.
2. A printed circuit board according to claim 1, wherein: the upper surface of the periphery of the substrate (1) is provided with a fixing hole (4), and the fixing hole (4) penetrates through the substrate (1).
3. A printed circuit board according to claim 1, wherein: the two opposite side surfaces of the substrate (1) are provided with limit grooves (5).
4. A printed circuit board according to claim 1, wherein: the surface of the heat dissipation plate (12) is provided with a plurality of air holes (13).
5. A printed circuit board according to claim 1, wherein: and an insulating layer (8) is arranged on the upper surface of the peripheral side of the first mounting surface (2).
6. A printed circuit board according to claim 1, wherein: the pressing groove (16) is a joint of the first mounting surface (2) and the second mounting surface (3).
7. A method of manufacturing a printed circuit board, comprising the steps of:
the method comprises the following steps: selecting a glass fiber board material meeting the use standard, and cutting;
step two: drawing a use schematic diagram of the printed circuit board, and introducing the connection relation of the schematic diagram and the device information into a glass fiber board material;
step three: processing a glass fiber board material to obtain a substrate (1) of the printed circuit board, and slotting two corresponding surfaces of the substrate (1) to form two mounting surfaces;
step four: laying a core plate (9) and each slotted hole on a first mounting surface (2) of the substrate (1) to form required circuit connection, and specifically laying each through hole (10) in cooperation with a slotted hole (7) and connecting to form a welding point (6);
step five: the protection component is additionally arranged on the second mounting surface (3) of the substrate (1), and specifically, a sliding block (14) is matched with a sliding groove (15) to mount a heat dissipation plate (12);
step six: fixing holes (4) are formed in four top corners of the substrate (1);
step seven: the manufacture of the printed circuit board is completed.
8. A method for manufacturing a printed circuit board according to claim 7, wherein: and arranging a metal film (11) at the inner side of the through hole (10) in the fourth step, wherein the metal film (11) is electrically connected with the core plate (9) and the slot hole (7).
9. A method for manufacturing a printed circuit board according to claim 8, wherein: and in the sixth step, the printed circuit board is installed and fixed through the fixing holes (4) at the four top corners of the substrate (1).
10. A method for manufacturing a printed circuit board according to claim 9, wherein: and in the fifth step, a heat conducting block is also connected between the bottom surface of the second mounting surface (3) and the heat radiating plate (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110153475.4A CN112689381A (en) | 2021-02-04 | 2021-02-04 | Printed circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110153475.4A CN112689381A (en) | 2021-02-04 | 2021-02-04 | Printed circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112689381A true CN112689381A (en) | 2021-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110153475.4A Pending CN112689381A (en) | 2021-02-04 | 2021-02-04 | Printed circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN112689381A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051314A (en) * | 2021-11-22 | 2022-02-15 | 深圳市鑫祥泰电子有限公司 | Multilayer heat conduction type flexible circuit board |
| CN114666989A (en) * | 2022-04-30 | 2022-06-24 | 吉安满坤科技股份有限公司 | Processing technology for preparing automobile printed circuit board by using heat dissipation material |
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| JP2003244959A (en) * | 2002-02-20 | 2003-08-29 | Tdk Corp | Switching power supply and manufacturing method thereof |
| US20110240357A1 (en) * | 2010-03-30 | 2011-10-06 | Ibiden Co., Ltd | Wiring board and method for manufacturing the same |
| CN106961786A (en) * | 2017-05-19 | 2017-07-18 | 珠海英搏尔电气股份有限公司 | A kind of PCB radiating subassemblies, PCB circuit devcies and its radiating and manufacture method |
| CN208445923U (en) * | 2018-07-27 | 2019-01-29 | 江苏盐湖电子科技有限公司 | A kind of circuit board of high efficiency and heat radiation |
| CN210671136U (en) * | 2019-10-16 | 2020-06-02 | 南京恒利电子科技有限公司 | Decoding deck that heat dispersion is good |
-
2021
- 2021-02-04 CN CN202110153475.4A patent/CN112689381A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003244959A (en) * | 2002-02-20 | 2003-08-29 | Tdk Corp | Switching power supply and manufacturing method thereof |
| US20110240357A1 (en) * | 2010-03-30 | 2011-10-06 | Ibiden Co., Ltd | Wiring board and method for manufacturing the same |
| CN106961786A (en) * | 2017-05-19 | 2017-07-18 | 珠海英搏尔电气股份有限公司 | A kind of PCB radiating subassemblies, PCB circuit devcies and its radiating and manufacture method |
| CN208445923U (en) * | 2018-07-27 | 2019-01-29 | 江苏盐湖电子科技有限公司 | A kind of circuit board of high efficiency and heat radiation |
| CN210671136U (en) * | 2019-10-16 | 2020-06-02 | 南京恒利电子科技有限公司 | Decoding deck that heat dispersion is good |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051314A (en) * | 2021-11-22 | 2022-02-15 | 深圳市鑫祥泰电子有限公司 | Multilayer heat conduction type flexible circuit board |
| CN114051314B (en) * | 2021-11-22 | 2024-01-12 | 深圳市鑫祥泰电子有限公司 | Multilayer thermally conductive flexible circuit board |
| CN114666989A (en) * | 2022-04-30 | 2022-06-24 | 吉安满坤科技股份有限公司 | Processing technology for preparing automobile printed circuit board by using heat dissipation material |
| CN114666989B (en) * | 2022-04-30 | 2023-06-09 | 吉安满坤科技股份有限公司 | Processing technology for preparing automobile printed circuit board by using heat dissipation material |
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Application publication date: 20210420 |