CN111447728B - Flexible circuit board and electronic equipment - Google Patents
Flexible circuit board and electronic equipment Download PDFInfo
- Publication number
- CN111447728B CN111447728B CN202010302554.2A CN202010302554A CN111447728B CN 111447728 B CN111447728 B CN 111447728B CN 202010302554 A CN202010302554 A CN 202010302554A CN 111447728 B CN111447728 B CN 111447728B
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- China
- Prior art keywords
- pad
- circuit board
- copper foil
- flexible circuit
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000011889 copper foil Substances 0.000 claims abstract description 52
- 230000017525 heat dissipation Effects 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000003351 stiffener Substances 0.000 claims 4
- 230000000694 effects Effects 0.000 abstract description 12
- 230000003014 reinforcing effect Effects 0.000 description 16
- 239000000463 material Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible circuit board and electronic equipment, wherein the flexible circuit board comprises a substrate, a first copper foil layer and a first solder mask layer which are sequentially stacked, the first copper foil layer comprises a heat dissipation pad, an anode pad and a cathode pad, the heat dissipation pad, the anode pad and the cathode pad are exposed by windowing the first solder mask layer, a plurality of first through holes are formed in the first copper foil layer, a through hole corresponding to the first through hole is formed in the substrate, and the through hole penetrates through the substrate. The invention improves the heat dissipation effect of the flexible circuit board, avoids the damage of the electronic equipment caused by overhigh local temperature and prolongs the service life of the electronic equipment.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a flexible circuit board and electronic equipment.
Background
Printed Circuit Boards (PCBs) are common electronic components, and are support bodies for electronic components, and are widely used in various electronic devices. The conventional Printed Circuit board is a rigid board which is not bendable, and due to the structural shape limitation of some electronic components, a Flexible Printed Circuit (FPC) which can be bent needs to be used, and the FPC is a Flexible Printed Circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. In the practical use of the flexible printed circuit board, due to the heat insulation effect of the substrate and the adhesive, heat generated by electronic components in a copper foil layer circuit is not easy to dissipate, the heat conductivity is only 0.3-0.4 w/m.k, the electric energy utilization rate of a power element is reduced, for example, in the existing widely-used LED, when the traditional flexible printed circuit board is adopted, 20% of input power is converted into light, the rest 80% of input power is converted into heat energy, and the heat which is not easy to dissipate can cause the damage of the electronic components or the flexible printed circuit board, so that the service life of electronic equipment is influenced.
Disclosure of Invention
The invention mainly aims to provide a flexible circuit board and electronic equipment, and aims to solve the problems that the conventional flexible circuit board is poor in heat dissipation effect and easy to damage the electronic equipment.
In order to achieve the above object, the present invention provides a flexible circuit board, which includes a substrate, a first copper foil layer, and a first solder resist layer, which are sequentially stacked, wherein the first copper foil layer includes a heat dissipation pad, a positive pad, and a negative pad, the heat dissipation pad, the positive pad, and the negative pad are exposed by opening a window on the first solder resist layer, a plurality of first through holes are formed in the first copper foil layer, and a via hole corresponding to the first through hole is formed in the substrate, and the via hole penetrates through the substrate.
Preferably, the inner wall of the first through hole and the inner wall of the via hole are sputtered with circumferentially surrounding copper layers.
Preferably, a plurality of the first through holes are symmetrically distributed around the heat dissipation pad.
Preferably, the flexible circuit board further comprises a second copper foil layer arranged on one side of the substrate, which is away from the first copper foil layer, and the second copper foil layer is provided with a second through hole corresponding to the through hole.
Preferably, the flexible circuit board further comprises a second solder mask layer arranged on one side, away from the substrate, of the second copper foil layer, and the second through hole is exposed by windowing the second solder mask layer.
Preferably, the flexible circuit board further comprises a reinforcing plate arranged on one side of the second solder mask layer, which is far away from the second copper foil layer.
Preferably, the first copper foil layer and the second copper foil layer are located within a coverage area of the reinforcing plate.
Preferably, the reinforcing plate is a stainless steel reinforcing plate or a copper foil plate.
Preferably, the positive electrode pad and the negative electrode pad are respectively distributed on opposite sides of the heat dissipation pad.
In addition, the invention also provides electronic equipment which comprises an electronic component and the flexible circuit board, wherein the electronic component comprises a positive pin, a negative pin and a fixed pin, the positive pin is electrically connected with the positive bonding pad, the negative pin is electrically connected with the negative bonding pad, the fixed pin is welded with the heat dissipation bonding pad, and the electronic component is not electrically connected with the heat dissipation bonding pad.
According to the technical scheme, the heat dissipation pad is electrically connected with the electronic component through the positive electrode pad and the negative electrode pad, the heat dissipation pad is not electrically connected with the electronic component, the first copper foil layer is provided with the plurality of first through holes, and the substrate is provided with the through holes corresponding to the first through holes, so that heat of the electronic component can be transferred to the heat dissipation pad and then transferred out through the first through holes and the through holes, the heat dissipation effect of the flexible circuit board is improved, the electronic equipment is prevented from being damaged due to overhigh local temperature, and the service life of the electronic equipment is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic design of a flexible circuit board of an embodiment of the present invention;
fig. 2 is a schematic design diagram of another view of a flexible circuit board according to an embodiment of the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
2 | First |
| 21 | Heat |
22 | |
| 23 | Negative |
24 | First through |
| 25 | |
31 | |
| 32 | |
4 | Second |
| 41 | Second through hole |
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a flexible circuit board, as shown in fig. 1, comprising a substrate 1, a first copper foil layer 2 and a first solder mask layer which are sequentially laminated, wherein the first copper foil layer 2 comprises a heat dissipation pad 21, an anode pad 22 and a cathode pad 23, the heat dissipation pad 21, the anode pad 22 and the cathode pad 23 are exposed by windowing the first solder mask layer, a plurality of first through holes 24 are formed in the first copper foil layer 2, a through hole corresponding to the first through hole 24 is formed in the substrate 1, and the through hole penetrates through the substrate 1.
The positive electrode pad 22 and the negative electrode pad 23 are respectively used for being electrically connected with a positive electrode pin and a negative electrode pin of an electronic component, a first wire 31 and a second wire 32 are further arranged on the substrate 1, the first wire 31 is connected with the positive electrode pad 22, and the second wire 32 is connected with the negative electrode pad 23 and used for achieving signal transmission of the positive electrode pad 22 and the negative electrode pad 23. The heat dissipation pad 21 is soldered to the electronic component, but there is no electrical connection between the heat dissipation pad 21 and the electronic component. When designing a schematic diagram, a measuring point 25 is added on the first copper foil layer 2, if the measuring point 25 is not added, the circuit board design software cannot carry out copper laying design on the heat dissipation pad 21 without electric property, the measuring point 25 is seemingly electrically connected with the heat dissipation pad 21, but because the heat dissipation pad 21 is not electrically associated with the inside of an electronic component, the connection of the measuring point 25 and the heat dissipation pad 21 on the flexible circuit board has no influence on the performance of the electronic component. The first soldermask layer is also not windowed for this test point 25 during the actual manufacturing process.
The substrate 1 is a flexible film formed by an insulating material, a first solder mask layer is laid after a first copper foil layer 2 is laid on the insulating substrate 1 and the first copper foil layer 2 is etched, the first solder mask layer is composed of a solder mask material, and the solder mask material is used through a liquid wet process or a dry film lamination. The first solder mask layer can be a green ink layer, then a window for exposing the heat dissipation pad 21, the positive electrode pad 22 and the negative electrode pad 23 is formed on the first solder mask layer, and then tin is coated on the heat dissipation pad 21, the positive electrode pad 22 and the negative electrode pad 23 for connecting with the electronic component.
The electronic component can be an optical electronic product, such as an LED, the LED is used as a light source device, the heat productivity is high, and the heat dissipation requirement is strict, the plurality of first through holes 24 are formed in the first copper foil layer 2, and the through holes corresponding to the first through holes 24 are formed in the substrate 1, so that the heat of the electronic component can be transferred to the heat dissipation coil 21 and then transferred out through the first through holes 24 and the through holes, the heat dissipation effect of the flexible circuit board is improved, the damage of electronic equipment caused by overhigh local temperature is avoided, and the service life of the electronic equipment is prolonged. It can be understood that the first through holes 24 are distributed at positions avoiding all the pads and the wiring on the pads, and the area of the heat dissipation pad 21 is set to be larger than the areas of the positive pad 22 and the negative pad 23 to improve the effect of the flexible circuit board.
Specifically, the inner wall of the first through hole 24 and the inner wall of the via hole are sputtered with circumferentially surrounding copper layers. That is, thin copper layers are sputtered on the inner walls of the first through holes 24 and the inner walls of the via holes, so that the layers of the substrate 1 are conducted, and the heat transfer efficiency can be improved. In other embodiments, the via hole and the first through hole 24 may be filled with copper paste, and heat transfer may be achieved after the copper paste is solidified.
More specifically, a plurality of first through holes 24 are symmetrically distributed around the heat-radiating pad 21. A plurality of first through holes 24 are distributed around the positive electrode pad 22 and the negative electrode pad 23, and the first through holes 24 around the heat dissipation pad 21 can be arranged more densely to improve the heat dissipation effect.
Further, as shown in fig. 2, the flexible circuit board further includes a second copper foil layer 4 disposed on a side of the substrate 1 away from the first copper foil layer 2, and the second copper foil layer 4 is provided with a second through hole 41 corresponding to the through hole. The second copper foil layer 4 can improve the heat dissipation effect of the flexible circuit board, a thin copper layer surrounding circumferentially is also sputtered on the inner wall of the second through hole 41, and the second through hole 41 is communicated with the through hole, so that the heat dissipation effect of the flexible circuit board is further enhanced. In other embodiments, copper paste may be poured into the second through hole 41, and after curing, the heat dissipation effect may also be improved.
Furthermore, the flexible circuit board further includes a second solder resist layer disposed on a side of the second copper foil layer 4 facing away from the substrate 1, and the second through hole 41 is exposed by opening a window in the second solder resist layer. The second solder resist layer can protect the second copper foil layer 4, and the second through hole 41 is exposed by windowing, so that heat can be smoothly transferred out.
The flexible circuit board of the embodiment further comprises a reinforcing plate arranged on one side of the second solder mask layer, which is far away from the second copper foil layer 4. The flexible circuit board has small mechanical strength and is easy to crack, the mechanical strength of the flexible circuit board can be enhanced by the laminating reinforcing plate, parts and the like can be conveniently installed on the surface of the flexible circuit board, and the reinforcing material of the reinforcing plate can be phenolic resin, glass fiber, PET (polyethylene terephthalate), PI (polyimide), metal or the like. The heat of the electronic component of the present embodiment is transferred to the heat-sink pad 21, and then transferred to the reinforcing plate through the first through hole 24 of the first copper foil layer 2, the via hole of the substrate 1, and the second through hole 41 of the second copper foil layer 4. In other embodiments, a reinforcing plate may also be directly attached to the side of the substrate 1 away from the first copper foil layer 2, that is, the second copper foil layer 4 and the second solder resist layer are omitted, and heat of the electronic component is transferred to the heat dissipation pad 21 and then directly transferred to the reinforcing plate through the first through hole 24 of the first copper foil layer 2 and the via hole of the substrate 1. A radiator can be arranged on one side of the reinforcing plate to improve the radiating effect.
Preferably, the first and second copper foil layers 2 and 4 are located within the coverage area of the reinforcing plate. The first copper foil layer 2 and the second copper foil layer 4 are respectively laid on two opposite sides of the substrate 1 and are both located in the range of the reinforcing plate, and a plurality of first through holes 24 are arranged in the range to communicate the first copper foil layer 2 and the second copper foil layer 4.
More preferably, the reinforcing plate is a stainless steel reinforcing plate or a copper foil plate, which can not only enhance the mechanical strength of the flexible circuit board, but also improve the heat dissipation effect of the reinforcing plate.
Wherein the positive electrode pad 22 and the negative electrode pad 23 are respectively distributed on opposite sides of the heat dissipation pad 21. The heat dissipation pad 21 is located between the positive electrode pad 22 and the negative electrode pad 23, the area of the heat dissipation pad 21 is large, the first through holes 24 are evenly distributed, and heat dissipation can be more uniform.
In addition, the invention also provides electronic equipment which comprises an electronic component and the flexible circuit board, wherein the electronic component comprises a positive electrode pin, a negative electrode pin and a fixed pin, the positive electrode pin is electrically connected with the positive electrode bonding pad 22, the negative electrode pin is electrically connected with the negative electrode bonding pad 23, the fixed pin is welded with the heat dissipation bonding pad 21, and the electronic component is not electrically connected with the heat dissipation bonding pad 21. The specific structure of the flexible circuit board refers to the above embodiments, and since the flexible circuit board adopts all technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the above embodiments are achieved, and no further description is given here.
The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by the present specification or directly/indirectly applied to other related technical fields under the spirit of the present invention are included in the scope of the present invention.
Claims (9)
1. A flexible circuit board is characterized by comprising a substrate, a first copper foil layer and a first solder mask layer which are sequentially stacked, wherein the first copper foil layer comprises a heat dissipation pad, an anode pad and a cathode pad; the area of the heat dissipation pad is larger than that of the positive electrode pad and that of the negative electrode pad, the first through holes are distributed around the positive electrode pad, the heat dissipation pad and the negative electrode pad, and circumferentially surrounding copper layers are sputtered on the inner walls of the first through holes and the inner walls of the through holes.
2. The flexible circuit board of claim 1, wherein a plurality of said first through holes are symmetrically distributed around said heat spreading pad.
3. The flexible circuit board of claim 1, further comprising a second copper foil layer disposed on a side of the substrate facing away from the first copper foil layer, wherein the second copper foil layer defines a second through hole corresponding to the via hole.
4. The flexible circuit board of claim 3, further comprising a second solder mask layer disposed on a side of the second copper foil layer facing away from the substrate, the second via hole exposed by windowing the second solder mask layer.
5. The flexible circuit board of claim 4, further comprising a stiffener disposed on a side of the second solder mask layer facing away from the second copper foil layer.
6. The flexible circuit board of claim 5, wherein the first and second copper foil layers are located within a footprint of the stiffener.
7. The flexible circuit board of claim 5, wherein the stiffener is a stainless steel stiffener or a copper foil plate.
8. The flexible circuit board according to any one of claims 1 to 7, wherein the positive electrode pad and the negative electrode pad are respectively distributed on opposite sides of the heat dissipation pad.
9. An electronic device, comprising an electronic component and the flexible circuit board according to any one of claims 1 to 8, wherein the electronic component comprises a positive pin, a negative pin and a fixing pin, the positive pin is electrically connected with the positive pad, the negative pin is electrically connected with the negative pad, the fixing pin is welded with the heat dissipation pad, and no electrical connection is formed between the electronic component and the heat dissipation pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010302554.2A CN111447728B (en) | 2020-04-17 | 2020-04-17 | Flexible circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010302554.2A CN111447728B (en) | 2020-04-17 | 2020-04-17 | Flexible circuit board and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN111447728A CN111447728A (en) | 2020-07-24 |
| CN111447728B true CN111447728B (en) | 2022-02-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010302554.2A Active CN111447728B (en) | 2020-04-17 | 2020-04-17 | Flexible circuit board and electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN111447728B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6521845B1 (en) * | 1997-06-12 | 2003-02-18 | Intel Corporation | Thermal spreading enhancements for motherboards using PBGAs |
| CN203446102U (en) * | 2013-09-05 | 2014-02-19 | 北汽福田汽车股份有限公司 | Circuit board and controller thereof |
| CN204761831U (en) * | 2015-08-07 | 2015-11-11 | 冠捷显示科技（厦门）有限公司 | PCB board encapsulation heat radiation structure |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103974598A (en) * | 2013-02-05 | 2014-08-06 | 欧司朗有限公司 | Circuit board |
| US9689536B2 (en) * | 2015-03-10 | 2017-06-27 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED tube lamp |
-
2020
- 2020-04-17 CN CN202010302554.2A patent/CN111447728B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6521845B1 (en) * | 1997-06-12 | 2003-02-18 | Intel Corporation | Thermal spreading enhancements for motherboards using PBGAs |
| CN203446102U (en) * | 2013-09-05 | 2014-02-19 | 北汽福田汽车股份有限公司 | Circuit board and controller thereof |
| CN204761831U (en) * | 2015-08-07 | 2015-11-11 | 冠捷显示科技（厦门）有限公司 | PCB board encapsulation heat radiation structure |
Also Published As
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| CN111447728A (en) | 2020-07-24 |
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Address after: 266101 f / F, phase II, Qingdao International Innovation Park, 1 Keyuan Weiyi Road, Laoshan District, Qingdao City, Shandong Province Patentee after: Geer Microelectronics Co.,Ltd. Address before: Room 103, 396 Songling Road, Laoshan District, Qingdao City, Shandong Province 266100 Patentee before: Goer Microelectronics Co.,Ltd. |