CN111757593A - Glass core board circuit board and preparation method thereof - Google Patents
Glass core board circuit board and preparation method thereof Download PDFInfo
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- CN111757593A CN111757593A CN202010607334.0A CN202010607334A CN111757593A CN 111757593 A CN111757593 A CN 111757593A CN 202010607334 A CN202010607334 A CN 202010607334A CN 111757593 A CN111757593 A CN 111757593A
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- 239000011521 glass Substances 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 20
- 230000001070 adhesive effect Effects 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 224
- 239000002585 base Substances 0.000 claims description 50
- 238000009413 insulation Methods 0.000 claims description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000011889 copper foil Substances 0.000 claims description 24
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 238000004080 punching Methods 0.000 claims description 15
- 239000004642 Polyimide Substances 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- 229920006231 aramid fiber Polymers 0.000 claims description 9
- 150000002148 esters Chemical class 0.000 claims description 9
- 239000002356 single layer Substances 0.000 claims description 9
- 239000002202 Polyethylene glycol Substances 0.000 claims description 8
- 229920001223 polyethylene glycol Polymers 0.000 claims description 8
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 8
- 239000004800 polyvinyl chloride Substances 0.000 claims description 8
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims description 8
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000003513 alkali Substances 0.000 claims description 3
- 230000008602 contraction Effects 0.000 abstract description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000008093 supporting effect Effects 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a glass core board circuit board and a preparation method thereof, wherein the glass core board circuit board comprises a first circuit board, a second circuit board and a core board which is arranged between the first circuit board and the second circuit board and is provided with a through hole, the core board, the first circuit board and the second circuit board are connected into a whole through an adhesive, the through hole is filled with a conductive material, and the core board is glass. The glass core board circuit board realizes the connection of the two conductive circuit boards on the glass core board, the glass core board effectively controls the expansion and contraction and heat dissipation of the high-density circuit and the bonding pad in the process of controlling the glass core board, and the glass core board cannot be cracked in the expansion and contraction process of the conductive circuit boards, thereby playing a role in supporting strength.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a glass core board circuit board and a preparation method thereof.
Background
At present, more and more circuit boards for surface mounting high-density components, such as mini-LED display panels, are used. The size and the spacing of the bonding pads on the outermost layer of the circuit board reach below 100 mu m, and the traditional multilayer PCB in up-and-down symmetrical structure, manufacturing process and material can not meet the requirements of dimensional stability and element heat dissipation of circuits on the surface layer of the circuit board.
Disclosure of Invention
Based on the structure, the invention provides the glass core board circuit board and the preparation method thereof, aiming at realizing the connection of two conductive circuit boards on the glass core board, realizing the flexible design of conductive circuits by the glass core board, effectively controlling the dimensional stability and heat dissipation of the conductive circuit boards, and preventing the glass core board from being cracked in the expansion and contraction process of the conductive circuit boards.
A glass core board circuit board is characterized in that: the circuit board comprises a first circuit board, a second circuit board and a core board which is arranged between the first circuit board and the second circuit board and is provided with a through hole, wherein the core board is connected with the first circuit board and the second circuit board into a whole through an adhesive, the through hole is filled with a conductive material, and the core board is glass.
In a further scheme, the first circuit board is a double-sided single-layer circuit board or a double-sided multi-layer circuit board.
According to the further scheme, the first circuit board is a double-sided single-layer circuit board, the double-sided circuit board comprises a first insulating base layer, a first conductive circuit layer is arranged on one side of the first insulating base layer, a second conductive circuit layer is sequentially arranged on the other side of the first insulating base layer, and a first conductive through hole is formed between the first conductive circuit layer and the first insulating base layer so as to realize the conduction of the first conductive circuit layer and the second conductive circuit layer; the second circuit board be two-sided multilayer circuit board, two-sided multilayer circuit board include second insulation basic unit, one side of second insulation basic unit is equipped with upper conductive circuit layer, and the opposite side is equipped with multilayer lower floor's conductive circuit layer, and is equipped with second insulation basic unit between every layer lower floor's conductive circuit layer, upper conductive circuit layer and lower floor's conductive circuit layer are through running through the second conductive through-hole realization of second insulation basic unit and switch on.
Further, the material of the first conductive circuit layer, the second conductive circuit layer, the upper conductive circuit layer, and the lower conductive circuit layer may be selected from copper, nickel, palladium, beryllium, or a copper alloy thereof. In a further scheme, the first circuit board is a double-sided flexible single-layer circuit board, the first conductive circuit layer is a first copper foil circuit layer, the second conductive circuit layer is a second copper foil circuit layer, and the first insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride; the second circuit board is a double-sided flexible multilayer circuit board, the upper conductive circuit layer is an upper copper foil circuit layer, the lower conductive circuit layer is a lower copper foil circuit layer, and the second insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride. Because the flexible circuit board has the characteristic of easy deformation, the flexible circuit board is easy to bend, wind or have defects caused by factors such as static electricity, air pressure and the like in the processing process, and the flexible circuit board connected by the glass core board has smaller deformation and more stable size.
In a further scheme, the core board is electrically connected with the first circuit board and the second circuit board through holes filled with conductive materials.
Further, the through hole is completely filled with a conductive material.
In a further scheme, a first solder mask layer is arranged on the surface of a first conductive circuit layer of the first circuit board, and a first hole pad is arranged on the surface of a first conductive through hole of the first circuit board; and a second solder mask layer is arranged on the surface of the lower conductive circuit layer of the second circuit board, and a second hole pad is arranged on the surface of the second conductive through hole of the second circuit board.
In a further aspect, the diameter of the first via pad is greater than the diameter of the first conductive via, and the diameter of the second via pad is greater than the diameter of the second conductive via.
In a further aspect, the first conductive via is completely filled with a conductive material; or, the first conductive through hole has a resin plug hole with an unmetallized surface.
In a further aspect, the second conductive via is completely filled with a conductive material; or, the second conductive through hole has a resin plug hole with an unmetallized surface.
The technical scheme adopted by the invention is as follows: a preparation method of a glass core board circuit board comprises the following steps:
s1: forming a first adhesive layer on the first surface of the glass core plate;
s2: the first surface of the glass core plate is attached to the first circuit board;
s3: punching a through hole on the glass core plate;
s4: filling the through hole with a conductive material;
s5: forming a second adhesive on the second surface of the glass core plate;
s6: the second surface of the glass core plate is attached to the second circuit board.
In a further scheme, the first circuit board is a double-sided single-layer circuit board or a double-sided multi-layer circuit board;
according to the technical scheme, the first circuit board is a double-sided single-layer circuit board, the double-sided circuit board comprises a first insulation base layer, a first conductive circuit layer is arranged on one side of the first insulation base layer, a second conductive circuit layer is sequentially arranged on the other side of the first insulation base layer, and a first conductive through hole is formed between the first conductive circuit layer and the first insulation base layer to achieve conduction of the first conductive circuit layer and the second conductive circuit layer. The second circuit board be two-sided multilayer circuit board, two-sided multilayer circuit board include second insulation basic unit, one side of second insulation basic unit is equipped with upper conductive circuit layer, and the opposite side is equipped with multilayer lower floor's conductive circuit layer, and is equipped with second insulation basic unit between every layer lower floor's conductive circuit layer, upper conductive circuit layer and lower floor's conductive circuit layer are through running through the second conductive through-hole realization of second insulation basic unit and switch on.
In a further scheme, the first circuit board is a double-sided flexible single-layer circuit board, the first conductive circuit layer is a first copper foil circuit layer, the second conductive circuit layer is a second copper foil circuit layer, and the first insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride; the second circuit board is a double-sided flexible multilayer circuit board, the upper conductive circuit layer is an upper copper foil circuit layer, the lower conductive circuit layer is a lower copper foil circuit layer, and the second insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride.
In a further scheme, the core board is electrically connected with the first circuit board and the second circuit board through holes filled with conductive materials.
Further, the through hole is completely filled with a conductive material.
In a further scheme, the step S3 of reading a coordinate point of the punching position from the first conductive through hole of the first circuit board, punching the through hole with laser, and removing the punched glue residue and debris by corroding the hole wall and the hole bottom with alkali solution after punching to ensure that the first conductive through hole of the first circuit board is completely exposed.
Further, in step S4, the through hole is filled with a conductive material completely, and filled with a conductive plug paste or filled with a plating.
Step S6 is followed by preparing a first solder mask layer on the surface of the first conductive trace layer of the first circuit board, preparing a first hole pad on the surface of the first conductive via of the first circuit board, preparing a second solder mask layer on the surface of the lower conductive trace layer of the second circuit board, and preparing a second hole pad on the surface of the second conductive via of the second circuit board.
In a further aspect, the diameter of the first via pad is greater than the diameter of the first conductive via, and the diameter of the second via pad is greater than the diameter of the second conductive via.
In a further aspect, the first conductive via is completely filled with a conductive material; or, the first conductive through hole has a resin plug hole with an unmetallized surface.
In a further aspect, the second conductive via is completely filled with a conductive material; or, the second conductive through hole has a resin plug hole with an unmetallized surface.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. according to the glass core board circuit board, the two conductive circuit boards are connected on the glass core board, the glass core board effectively controls the expansion and contraction and heat dissipation of the high-density circuit and the bonding pad controlled by the glass core board in the process, and the glass core board cannot be cracked in the expansion and contraction process of the conductive circuit boards, so that the strength supporting effect is achieved.
2. According to the preparation method of the glass core board circuit board, the prepared circuit board or circuit boards are adhered to glass by using the adhesive, and interlayer connection is realized by punching, so that the requirement of high-precision lamination alignment is avoided, and the process is simple.
Drawings
Fig. 1 to 8 are schematic diagrams of a method for manufacturing a circuit board with a glass core board according to an embodiment of the present invention.
Wherein the reference numerals are as follows:
101-glass core board, 102-first adhesive layer, 103-first conductive trace layer, 104-first insulating base layer, 105-first conductive via, 106-second conductive trace layer, 107-via, 108-conductive material, 109-second adhesive layer, 110-upper conductive trace layer, 111-lower conductive trace layer, 112-second insulating base layer, 113-second conductive via, 114-first solder mask, 115-first via pad, 116-second solder mask, 117-second via pad, 118-first lower conductive trace base layer, 119-first insulating base layer, 120-first conductive via, 121-first upper conductive trace layer, 122-first solder mask, 123-first via pad.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
A preparation method of a glass core board circuit board comprises the following steps:
s1: a first adhesive layer 102 is formed by applying a thermosetting adhesive to a first side of a glass core sheet 101, as shown in fig. 1.
S2: the first surface of the glass core board 101 is attached to a first circuit board, and is cured by heating, as shown in fig. 2, the first circuit board is a manufactured existing first circuit board, the first circuit board is a double-sided flexible circuit board, the double-sided flexible circuit board comprises a first insulating base layer 104, the first insulating base layer 104 is selected from polyimide, a first conductive circuit layer 103 is arranged on one side of the first insulating base layer 104, the first conductive circuit layer 103 is a first copper foil circuit layer, a second conductive circuit layer 106 is sequentially arranged on the other side of the first conductive circuit layer 103, the second conductive circuit layer 106 is a second copper foil circuit layer, and a first conductive through hole 105 is arranged between the first conductive circuit layer 103 and the first insulating base layer 104 to realize the conduction of the first conductive circuit layer 103 and the second conductive circuit layer 106. The first conductive via 105 is completely filled with a conductive via paste, and the first surface of the glass core board 101 is bonded to the second conductive trace layer 106.
S3: reading the coordinate points of the punching positions from part of the first conductive through holes 105 of the first circuit board, punching the through holes 107 by using laser, and corroding the hole walls and the hole bottoms by alkali liquor after punching to remove punched glue residues and scraps as shown in fig. 3, thereby ensuring that the first conductive through holes 105 of the coordinate points of the punching positions of the first circuit board are completely exposed.
S4: the conductive material 108 is completely filled in the through hole 107, and as shown in fig. 4, the through hole 107 filled with the conductive material 108 is completely connected with the first conductive through hole 105 at the coordinate point of the punching position by using the conductive plug paste, and is electrically connected with the first circuit board through the through hole 107 filled with the conductive material 108.
S5: the second side of the glass core 101 is coated with a thermosetting adhesive to form a second adhesive layer 109, as shown in fig. 5, and the thermosetting adhesive covering the through holes 107 of the conductive material 108 is removed to facilitate complete exposure of the through holes 107 filled with the conductive material 108.
S6: the second surface of the glass core board 101 is attached to a second circuit board, and is heated and cured, the second circuit board is electrically connected with a through hole 107 filled with a conductive material 108, as shown in fig. 6, the second circuit board is a manufactured existing second circuit board which can be directly selected, the second circuit board is a double-sided flexible multilayer circuit board, the double-sided flexible multilayer circuit board comprises a second insulation base layer 112, the second insulation base layer 112 is selected from polyimide, an upper conductive circuit layer 110 is arranged on one side of the second insulation base layer 112, the upper conductive circuit layer 110 is an upper copper foil circuit layer, a plurality of lower conductive circuit layers 111 are arranged on the other side of the second insulation base layer, the lower conductive circuit layers 111 are lower copper foil circuit layers, a second insulation base layer 112 is arranged between each lower conductive circuit layer 111, and the upper conductive circuit layer 110 and the lower conductive circuit layer 112 are conducted through a second conductive through hole 113 penetrating through the second, the second conductive via 113 is completely filled with conductive plug hole paste; the second side of the glass core 101 is bonded to an upper conductive trace layer 110 and is electrically connected to a second circuit board through vias 107 filled with conductive material 108.
S7: a first solder resist layer 114 is prepared on the surface of the first conductive circuit layer 103 of the first circuit board, a first hole pad 115 is prepared on the surface of the first conductive through hole 105 of the first circuit board, a second solder resist layer 116 is prepared on the surface of the lower conductive circuit layer 112 of the second circuit board, and a second hole pad 117 is prepared on the surface of the second conductive through hole 113 of the first circuit board, as shown in fig. 7, the first solder resist layer 114 and the second solder resist layer 116 are formed by a spray printing method on the outermost lower conductive circuit layer of the lower conductive circuit layer 112, but the invention is not limited thereto. And preparing a second hole pad 117 on the surface of the second conductive through hole 113 of the second circuit board, wherein the first hole pad 115 and the second hole pad 117 are both nickel layers, the diameter of the first hole pad 115 is larger than that of the first conductive through hole 105, and the diameter of the second hole pad 117 is larger than that of the first conductive through hole 113, so that the glass core board circuit board is prepared.
Example 2
The procedure was as in example 1, except that,
the first circuit board in step S2 is an existing first circuit board that is completed, the first circuit board is a double-sided flexible circuit board, the double-sided flexible circuit board includes a first insulating base layer 104, the first insulating base layer 104 is selected from polyethylene terephthalate, the first conductive trace layer 103 is a first nickel foil trace layer, a second conductive trace layer 106 is sequentially disposed on the other side of the double-sided flexible circuit board, the second conductive trace layer 106 is a second nickel foil trace layer, the first conductive via 105 is filled with a conductive material, and the first conductive via 105 is filled with a conductive material and filled with a resin via hole whose surface is not metallized.
S4: the through hole 107 is completely filled with the conductive material 108, as shown in fig. 4, a chemical copper deposition electroplating process is adopted, a film needs to be coated and windowed on the surface of the workpiece to ensure that other non-metallized parts cannot be subjected to copper deposition and electroplating, the film is removed after the process, and the through hole 107 filled with the conductive material 108 is completely connected with the first conductive through hole 105 at the coordinate point of the punching position.
The second circuit board in step S6 is an existing second circuit board that is completed, and may be directly selected, and the second circuit board is a double-sided flexible multilayer circuit board, and the double-sided flexible multilayer circuit board includes a second insulating base layer 112, the second insulating base layer 112 is selected from aramid fiber ester, the upper conductive trace layer 110 is an upper palladium foil trace layer, the lower conductive trace layer 111 is a lower palladium foil trace layer, and the second conductive via 113 is completely filled with conductive via-filling paste.
Example 3
The procedure was as in example 1, except that,
the first circuit board in step S2 is an existing first circuit board that is completed, the first circuit board is a double-sided circuit board, the double-sided circuit board includes a first insulation base layer 104, the first insulation base layer 104 is selected from epoxy resin, the first conductive circuit layer 103 is a first copper alloy circuit layer, the other side is sequentially provided with a second conductive circuit layer 106, the second conductive circuit layer 106 is a second copper alloy circuit layer, the first conductive through hole 105 is filled with a conductive material, and the first conductive through hole 105 is filled with a resin plug hole whose surface is not metallized.
The second circuit board in step S6 is an existing second circuit board that is completed and can be directly selected, and the second circuit board is a double-sided flexible multilayer circuit board, and the double-sided flexible multilayer circuit board includes a second insulation base layer 112, the second insulation base layer 112 is selected from polyimide, the upper conductive circuit layer 110 is an upper copper foil circuit layer, the lower conductive circuit layer 111 is a lower copper foil circuit layer, and the second conductive through hole 113 is completely filled with conductive plug paste.
Example 4
The procedure was as in example 1, except that,
the first circuit board in step S2 is an existing first circuit board that is completed, the first circuit board is a double-sided circuit board, the double-sided circuit board includes a first insulation base layer 104, the first insulation base layer 104 is selected from epoxy resin, the first conductive circuit layer 103 is a first copper alloy circuit layer, the other side is sequentially provided with a second conductive circuit layer 106, the second conductive circuit layer 106 is a second copper alloy circuit layer, the first conductive through hole 105 is filled with a conductive material, and the first conductive through hole 105 is filled with a resin plug hole whose surface is not metallized.
The second circuit board in step S6 is an existing second circuit board that is completed, and may be directly selected, where the second circuit board is a double-sided multilayer circuit board, the double-sided flexible multilayer circuit board includes a second insulating base layer 112, the second insulating base layer 112 is selected from epoxy resin, the upper conductive circuit layer 110 is an upper copper alloy circuit layer, the lower conductive circuit layer 111 is a lower copper alloy circuit layer, the second conductive through hole 113 is filled with a conductive material, and the second conductive through hole 113 is filled with a resin plug hole whose surface is not metallized.
Example 5
The procedure was as in example 1, except that,
s2: as shown in fig. 8, the first surface of the glass core 101 is attached to a first circuit board, and is cured by heating, where the first circuit board is a manufactured existing first circuit board, the first circuit board is a double-sided flexible multilayer circuit board, the double-sided flexible multilayer circuit board includes a first insulating base layer 119, the first insulating base layer 119 is selected from polyimide, one side of the first insulating base layer is provided with a first upper conductive circuit layer 121, the first upper conductive circuit layer 121 is an upper copper foil circuit layer, the other side is provided with a plurality of first lower conductive circuit layers 118, the first lower conductive circuit layer 118 is a lower copper foil circuit layer, a first insulating base layer 119 is arranged between each first lower conductive circuit layer 118, the first upper conductive circuit layer 121 and the first lower conductive circuit layer 118 are conducted through a first conductive through hole 120 penetrating through the first insulating base layer 119, and the first conductive through hole 120 is completely filled with conductive plug paste; the first side of the glass core 101 is bonded to the lowermost conductive trace layer 118 and is electrically connected to the first circuit board through vias 107 filled with conductive material 108.
S3: the punching position coordinate point is read from a portion of the first conductive via 120 of the first circuit board, and the via hole 107 is punched using a laser.
S7: preparing a first solder mask 122 on the surface of the first upper conductive circuit layer of the first circuit board, preparing a first hole pad 123 on the surface of the first conductive through hole 105 of the first circuit board, preparing a second solder mask 116 on the surface of the lower conductive circuit layer 112 of the second circuit board, and preparing a second hole pad 117 on the surface of the second conductive through hole 113 of the first circuit board.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A glass core board circuit board is characterized in that: the circuit board comprises a first circuit board, a second circuit board and a core board which is arranged between the first circuit board and the second circuit board and is provided with a through hole, wherein the core board is connected with the first circuit board and the second circuit board into a whole through an adhesive, the through hole is filled with a conductive material, and the core board is glass.
2. The glass core board of claim 1, wherein: the first circuit board be two-sided individual layer circuit board, two-sided circuit board include first insulation basic unit, one side of first insulation basic unit be equipped with first conducting wire layer, the opposite side is equipped with second conducting wire layer in proper order, be equipped with first electrically conductive through-hole between first conducting wire layer and the first insulation basic unit in order to realize switching on of first conducting wire layer and second conducting wire layer. The second circuit board be two-sided multilayer circuit board, two-sided multilayer circuit board include second insulation basic unit, one side of second insulation basic unit is equipped with upper conductive circuit layer, and the opposite side is equipped with multilayer lower floor's conductive circuit layer, and is equipped with second insulation basic unit between every layer lower floor's conductive circuit layer, upper conductive circuit layer and lower floor's conductive circuit layer are through running through the second conductive through-hole realization of second insulation basic unit and switch on.
3. The glass core board of claim 2, wherein: the first circuit board is a double-sided flexible single-layer circuit board, the first conducting circuit layer is a first copper foil circuit layer, the second conducting circuit layer is a second copper foil circuit layer, and the first insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride; the second circuit board is a double-sided flexible multilayer circuit board, the upper conductive circuit layer is an upper copper foil circuit layer, the lower conductive circuit layer is a lower copper foil circuit layer, and the second insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride.
4. The glass core board of claim 2, wherein: a first solder mask layer is arranged on the surface of a first conductive circuit layer of the first circuit board, and a first hole pad is arranged on the surface of a first conductive through hole of the first circuit board; and a second solder mask layer is arranged on the surface of the lower conductive circuit layer of the second circuit board, and a second hole pad is arranged on the surface of the second conductive through hole of the second circuit board.
5. The glass core board of claim 4, wherein: the diameter of the first hole bonding pad is larger than that of the first conductive through hole, and the diameter of the second hole bonding pad is larger than that of the second conductive through hole.
6. A preparation method of a glass core board circuit board is characterized by comprising the following steps: the method comprises the following steps:
s1: forming a first adhesive layer on the first surface of the glass core plate;
s2: the first surface of the glass core plate is attached to the first circuit board;
s3: punching a through hole on the glass core plate;
s4: filling the through hole with a conductive material;
s5: forming a second adhesive on the second surface of the glass core plate;
s6: the second surface of the glass core plate is attached to the second circuit board.
7. The method for manufacturing a glass core board as defined in claim 6, wherein: the first circuit board is a double-sided single-layer circuit board which comprises a first insulating base layer, a first conductive circuit layer is arranged on one side of the first insulating base layer, a second conductive circuit layer is sequentially arranged on the other side of the first insulating base layer, and a first conductive through hole is formed between the first conductive circuit layer and the first insulating base layer so as to realize the conduction of the first conductive circuit layer and the second conductive circuit layer; the second circuit board be two-sided multilayer circuit board, two-sided multilayer circuit board include second insulation basic unit, one side of second insulation basic unit is equipped with upper conductive circuit layer, and the opposite side is equipped with multilayer lower floor's conductive circuit layer, and is equipped with second insulation basic unit between every layer lower floor's conductive circuit layer, upper conductive circuit layer and lower floor's conductive circuit layer are through running through the second conductive through-hole realization of second insulation basic unit and switch on.
8. The method for manufacturing a glass core board as defined in claim 7, wherein: the first circuit board is a double-sided flexible single-layer circuit board, the first conducting circuit layer is a first copper foil circuit layer, the second conducting circuit layer is a second copper foil circuit layer, and the first insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride; the second circuit board is a double-sided flexible multilayer circuit board, the upper conductive circuit layer is an upper copper foil circuit layer, the lower conductive circuit layer is a lower copper foil circuit layer, and the second insulating base layer is selected from one of polyimide, polyethylene glycol terephthalate, aramid fiber ester and polyvinyl chloride.
9. The method for manufacturing a glass core board as defined in claim 7, wherein: and S3, reading the coordinate point of the punching position from the first conductive through hole of the first circuit board, punching the through hole by adopting laser, and corroding the through hole by alkali liquor.
10. The method for manufacturing a glass core board as defined in claim 7, wherein: step S6 is followed by preparing a first solder mask layer on the surface of the first conductive trace layer of the first circuit board, preparing a first hole pad on the surface of the first conductive via of the first circuit board, preparing a second solder mask layer on the surface of the lower conductive trace layer of the second circuit board, and preparing a second hole pad on the surface of the second conductive via of the second circuit board.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364166A (en) * | 2022-01-06 | 2022-04-15 | 深圳市鼎华芯泰科技有限公司 | Hole filling method of circuit board and manufacturing method of double-sided circuit board |
| WO2022143519A1 (en) * | 2020-12-28 | 2022-07-07 | 中国科学院苏州纳米技术与纳米仿生研究所 | Electrode interlink structure, manufacturing method therefor, and application thereof |
| WO2022259760A1 (en) * | 2021-06-09 | 2022-12-15 | Ｆｉｃｔ株式会社 | Laminated substrate and method of manufacturing laminated substrate |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1108026A (en) * | 1993-09-21 | 1995-09-06 | 松下电器产业株式会社 | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
| CN101542719A (en) * | 2007-03-30 | 2009-09-23 | 住友电木株式会社 | Connection structure for flip-chip semiconductor package, buildup layer material, sealing resin composition and circuit board |
| JP2015207580A (en) * | 2014-04-17 | 2015-11-19 | 凸版印刷株式会社 | Wiring board and manufacturing method of the same |
| US20160128186A1 (en) * | 2014-11-05 | 2016-05-05 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| JP2016092164A (en) * | 2014-11-04 | 2016-05-23 | 日本特殊陶業株式会社 | Wiring board and manufacturing method of the same |
| JP2018116951A (en) * | 2017-01-16 | 2018-07-26 | 富士通株式会社 | Circuit board, manufacturing method for the same, and electronic equipment |
| CN108604574A (en) * | 2016-02-03 | 2018-09-28 | 索尼公司 | Semiconductor device and manufacturing method, imaging device and electronic equipment |
| CN111182741A (en) * | 2018-11-09 | 2020-05-19 | 庆鼎精密电子（淮安）有限公司 | Flexible circuit board and manufacturing method thereof |
-
2020
- 2020-06-29 CN CN202010607334.0A patent/CN111757593B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1108026A (en) * | 1993-09-21 | 1995-09-06 | 松下电器产业株式会社 | Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same |
| CN101542719A (en) * | 2007-03-30 | 2009-09-23 | 住友电木株式会社 | Connection structure for flip-chip semiconductor package, buildup layer material, sealing resin composition and circuit board |
| JP2015207580A (en) * | 2014-04-17 | 2015-11-19 | 凸版印刷株式会社 | Wiring board and manufacturing method of the same |
| JP2016092164A (en) * | 2014-11-04 | 2016-05-23 | 日本特殊陶業株式会社 | Wiring board and manufacturing method of the same |
| US20160128186A1 (en) * | 2014-11-05 | 2016-05-05 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board and method of manufacturing the same |
| CN108604574A (en) * | 2016-02-03 | 2018-09-28 | 索尼公司 | Semiconductor device and manufacturing method, imaging device and electronic equipment |
| JP2018116951A (en) * | 2017-01-16 | 2018-07-26 | 富士通株式会社 | Circuit board, manufacturing method for the same, and electronic equipment |
| CN111182741A (en) * | 2018-11-09 | 2020-05-19 | 庆鼎精密电子（淮安）有限公司 | Flexible circuit board and manufacturing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022143519A1 (en) * | 2020-12-28 | 2022-07-07 | 中国科学院苏州纳米技术与纳米仿生研究所 | Electrode interlink structure, manufacturing method therefor, and application thereof |
| WO2022259760A1 (en) * | 2021-06-09 | 2022-12-15 | Ｆｉｃｔ株式会社 | Laminated substrate and method of manufacturing laminated substrate |
| CN114364166A (en) * | 2022-01-06 | 2022-04-15 | 深圳市鼎华芯泰科技有限公司 | Hole filling method of circuit board and manufacturing method of double-sided circuit board |
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