CN111757593B - Glass core board and preparation method thereof - Google Patents
Glass core board and preparation method thereof Download PDFInfo
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- CN111757593B CN111757593B CN202010607334.0A CN202010607334A CN111757593B CN 111757593 B CN111757593 B CN 111757593B CN 202010607334 A CN202010607334 A CN 202010607334A CN 111757593 B CN111757593 B CN 111757593B
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- 239000011521 glass Substances 0.000 title claims abstract description 51
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 221
- 239000002585 base Substances 0.000 claims description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 239000011889 copper foil Substances 0.000 claims description 20
- 238000004080 punching Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 9
- 229920006231 aramid fiber Polymers 0.000 claims description 7
- 150000002148 esters Chemical class 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- -1 polyethylene terephthalate Polymers 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 7
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 6
- 239000004800 polyvinyl chloride Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000008093 supporting effect Effects 0.000 abstract description 2
- 230000008602 contraction Effects 0.000 abstract 2
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a glass core board circuit board and a preparation method thereof, wherein the glass core board circuit board comprises a first circuit board, a second circuit board and a core board with through holes, wherein the core board is arranged between the first circuit board and the second circuit board, the core board, the first circuit board and the second circuit board are connected into a whole through an adhesive, the through holes are filled with conductive materials, and the core board is glass. According to the glass core board circuit board, the two conductive circuit boards are connected through the glass core board, the glass core board effectively controls the expansion and contraction and heat dissipation of the glass core board control high-density circuit and the bonding pad in the process, the glass core board cannot be pulled apart in the expansion and contraction process of the conductive circuit board, and the strength supporting function is achieved.
Description
Technical Field
The invention belongs to the technical field of printed circuit board manufacturing, and particularly relates to a glass core board and a preparation method thereof.
Background
At present, more and more circuit boards with high-density components are surface-mounted, such as mini-LED display panels. The size and the interval of the bonding pads on the outermost layer of the circuit board reach below 100 mu m, and the traditional up-down symmetrical structure, the manufacturing process and the materials of the multilayer PCB can not meet the requirements of the dimensional stability and the element heat dissipation of the surface layer circuit of the circuit board.
Disclosure of Invention
Based on the above, the invention provides a glass core board circuit board and a preparation method thereof, which aim to realize the connection of two conductive circuit boards through the glass core board, the glass core board realizes the flexible design of conductive circuits, the dimensional stability and heat dissipation of the conductive circuit board are effectively controlled, and the glass core board cannot be pulled apart in the expanding and shrinking process of the conductive circuit board.
A glass core board, characterized in that: the circuit board comprises a first circuit board, a second circuit board and a core board with a through hole, wherein the core board is arranged between the first circuit board and the second circuit board, the core board and the first circuit board and the second circuit board are connected into a whole through an adhesive, the through hole is filled with a conductive material, and the core board is glass.
Further, the first circuit board is a double-sided single-layer circuit board or a double-sided multi-layer circuit board.
Further, the first circuit board is a double-sided single-layer circuit board, the double-sided circuit board comprises a first insulating base layer, a first conductive circuit layer is arranged on one side of the first insulating base layer, a second conductive circuit layer is sequentially arranged on the other side of the first insulating base layer, and a first conductive through hole is arranged between the first conductive circuit layer and the first insulating base layer so as to realize the conduction of the first conductive circuit layer and the second conductive circuit layer; the second circuit board is a double-sided multilayer circuit board, the double-sided multilayer circuit board comprises a second insulating base layer, an upper conductive circuit layer is arranged on one side of the second insulating base layer, a plurality of lower conductive circuit layers are arranged on the other side of the second insulating base layer, a second insulating base layer is arranged between each two lower conductive circuit layers, and the upper conductive circuit layers and the lower conductive circuit layers are conducted through second conductive through holes penetrating through the second insulating base layer.
Further, the materials of the first conductive circuit layer, the second conductive circuit layer, the upper conductive circuit layer and the lower conductive circuit layer can be selected from copper, nickel, palladium, beryllium or copper alloy thereof. Further, the first circuit board is a double-sided flexible single-layer circuit board, the first conductive circuit layer is a first copper foil circuit layer, the second conductive circuit layer is a second copper foil circuit layer, and the first insulating base layer is one of polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride; the second circuit board is a double-sided flexible multilayer circuit board, the upper conductive circuit layer is an upper copper foil circuit layer, the lower conductive circuit layer is a lower copper foil circuit layer, and the second insulation base layer is one of polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride. Because the flexible circuit board has the characteristic of easy deformation, the flexible circuit board which is connected by adopting the glass core plate is easy to generate bending, winding or defects due to factors such as static electricity, air pressure and the like in the processing process, and has smaller deformation and more stable size.
Further, the core board is electrically connected with the first circuit board and the second circuit board through the through holes filled with the conductive material.
Further, the through holes are completely filled with conductive materials.
Further, a first solder mask layer is arranged on the surface of the first conductive circuit layer of the first circuit board, and a first hole bonding pad is arranged on the surface of the first conductive through hole of the first circuit board; the surface of the lower conductive circuit layer of the second circuit board is provided with a second solder mask layer, and the surface of the second conductive through hole of the second circuit board is provided with a second hole bonding pad.
Further, the diameter of the first hole bonding pad is larger than that of the first conductive through hole, and the diameter of the second hole bonding pad is larger than that of the second conductive through hole.
Further, the first conductive through hole is completely filled with a conductive material; or, the first conductive through hole is provided with a resin plug hole with an unmetallized surface.
Further, the second conductive through hole is completely filled with a conductive material; or, the second conductive through hole is provided with a resin plug hole with an unmetallized surface.
The technical scheme of the method adopted by the invention is as follows: a preparation method of a glass core board circuit board comprises the following steps:
s1: forming a first adhesive layer on a first side of the glass core plate;
s2: the first surface of the glass core plate is attached to the first circuit board;
s3: punching a through hole on the glass core plate;
s4: filling the through holes with a conductive material;
s5: forming a second adhesive on the second side of the glass core plate;
s6: the second surface of the glass core plate is attached to the second circuit board.
Further, the first circuit board is a double-sided single-layer circuit board or a double-sided multi-layer circuit board;
further, the first circuit board is a double-sided single-layer circuit board, the double-sided circuit board comprises a first insulating base layer, one side of the first insulating base layer is provided with a first conductive circuit layer, the other side of the first insulating base layer is provided with a second conductive circuit layer in sequence, and a first conductive through hole is arranged between the first conductive circuit layer and the first insulating base layer so as to realize the conduction of the first conductive circuit layer and the second conductive circuit layer. The second circuit board is a double-sided multilayer circuit board, the double-sided multilayer circuit board comprises a second insulating base layer, an upper conductive circuit layer is arranged on one side of the second insulating base layer, a plurality of lower conductive circuit layers are arranged on the other side of the second insulating base layer, a second insulating base layer is arranged between each two lower conductive circuit layers, and the upper conductive circuit layers and the lower conductive circuit layers are conducted through second conductive through holes penetrating through the second insulating base layer.
Further, the first circuit board is a double-sided flexible single-layer circuit board, the first conductive circuit layer is a first copper foil circuit layer, the second conductive circuit layer is a second copper foil circuit layer, and the first insulating base layer is one of polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride; the second circuit board is a double-sided flexible multilayer circuit board, the upper conductive circuit layer is an upper copper foil circuit layer, the lower conductive circuit layer is a lower copper foil circuit layer, and the second insulation base layer is one of polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride.
Further, the core board is electrically connected with the first circuit board and the second circuit board through the through holes filled with the conductive material.
Further, the through holes are completely filled with conductive materials.
Further, the step S3 reads the coordinate point of the punching position from the first conductive through hole of the first circuit board, the through hole is punched by adopting laser, and the punched glue residue and scraps are removed by etching the hole wall and the hole bottom by alkali liquor after punching, so that the first conductive through hole of the first circuit board is completely exposed.
Further, the step S4 is to fill the through holes with conductive material completely, fill the through holes with conductive via paste, or fill the through holes with plating.
After the step S6, a first solder mask layer is prepared on the surface of the first conductive circuit layer of the first circuit board, a first hole bonding pad is prepared on the surface of the first conductive through hole of the first circuit board, a second solder mask layer is prepared on the surface of the lower conductive circuit layer of the second circuit board, and a second hole bonding pad is prepared on the surface of the second conductive through hole of the second circuit board.
Further, the diameter of the first hole bonding pad is larger than that of the first conductive through hole, and the diameter of the second hole bonding pad is larger than that of the second conductive through hole.
Further, the first conductive through hole is completely filled with a conductive material; or, the first conductive through hole is provided with a resin plug hole with an unmetallized surface.
Further, the second conductive through hole is completely filled with a conductive material; or, the second conductive through hole is provided with a resin plug hole with an unmetallized surface.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. according to the glass core board circuit board, the two conductive circuit boards are connected with each other through the glass core board, the glass core board effectively controls expansion and shrinkage of the glass core board control high-density circuit and the bonding pad in the process and heat dissipation, and the glass core board cannot be pulled apart in the expansion and shrinkage process of the conductive circuit board, so that the strength supporting effect is achieved.
2. According to the preparation method of the glass core board circuit board, the prepared circuit board or the prepared circuit board is adhered to glass by using an adhesive, and interlayer connection is realized by punching, so that the requirement of high-precision lamination and alignment is avoided, and the process is simple.
Drawings
Fig. 1 to 8 are schematic diagrams of a method for manufacturing a glass core board according to an embodiment of the present invention.
Wherein reference numerals are as follows:
101-glass core board, 102-first binder layer, 103-first conductive trace layer, 104-first insulating base layer, 105-first conductive via, 106-second conductive trace layer, 107-via, 108-conductive material, 109-second binder layer, 110-upper conductive trace layer, 111-lower conductive trace layer, 112-second insulating base layer, 113-second conductive via, 114-first solder mask layer, 115-first via pad, 116-second solder mask layer, 117-second via pad, 118-first lower conductive trace layer, 119-first insulating base layer, 120-first conductive via, 121-first upper conductive trace layer, 122-first solder mask layer, 123-first via pad.
Detailed Description
In order to make the technical problems to be solved, the technical scheme and the beneficial effects of the invention more clear, the invention is further described in detail below with reference to the embodiment. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A preparation method of a glass core board circuit board comprises the following steps:
s1: a first adhesive layer 102 is formed by applying a thermosetting adhesive to a first side of the glass core panel 101, as shown in fig. 1.
S2: the first surface of the glass core board 101 is attached to a first circuit board, and is cured by heating, as shown in fig. 2, the first circuit board is a manufactured first circuit board, the first circuit board is a double-sided flexible circuit board, the double-sided flexible circuit board comprises a first insulating base layer 104, the first insulating base layer 104 is selected from polyimide, a first conductive circuit layer 103 is arranged on one side of the first insulating base layer 104, the first conductive circuit layer 103 is a first copper foil circuit layer, a second conductive circuit layer 106 is sequentially arranged on the other side of the first insulating base layer 104, the second conductive circuit layer 106 is a second copper foil circuit layer, and a first conductive through hole 105 is arranged between the first conductive circuit layer 103 and the first insulating base layer 104 to realize conduction of the first conductive circuit layer 103 and the second conductive circuit layer 106. The first conductive via 105 is completely filled with a conductive via paste, and the first side of the glass core plate 101 is bonded to the second conductive trace layer 106.
S3: and reading punching position coordinate points from part of the first conductive through holes 105 of the first circuit board, punching through holes 107 by adopting laser, and removing punched glue residues and scraps by etching the hole walls and the hole bottoms through alkali liquor after punching as shown in fig. 3, so as to ensure that the first conductive through holes 105 of the punching position coordinate points of the first circuit board are completely exposed.
S4: the conductive material 108 is completely filled into the through-hole 107, and as shown in fig. 4, the through-hole 107 filled with the conductive material 108 is completely connected to the first conductive through-hole 105 at the coordinate point of the punching position by the conductive plug paste, and is electrically connected to the first circuit board through the through-hole 107 filled with the conductive material 108.
S5: the second side of the glass core plate 101 is coated with a thermosetting adhesive to form a second adhesive layer 109, as shown in fig. 5, and the thermosetting adhesive is removed to cover the through holes 107 of the conductive material 108, facilitating complete exposure of the through holes 107 filled with the conductive material 108.
S6: the second surface of the glass core board 101 is attached to a second circuit board, and is thermally cured, the second circuit board is electrically connected with the through holes 107 filled with the conductive material 108, as shown in fig. 6, the second circuit board is a manufactured existing second circuit board, and can be directly selected, the second circuit board is a double-sided flexible multilayer circuit board, the double-sided flexible multilayer circuit board comprises a second insulation base layer 112, the second insulation base layer 112 is selected from polyimide, one side of the second insulation base layer 112 is provided with an upper conductive circuit layer 110, the upper conductive circuit layer 110 is an upper copper foil circuit layer, the other side is provided with a plurality of lower conductive circuit layers 111, the lower conductive circuit layers 111 are lower copper foil circuit layers, a second insulation base layer 112 is arranged between each lower conductive circuit layer 111, the upper conductive circuit layer 110 and the lower conductive circuit layer 112 are conducted through a second conductive through hole 113 penetrating through the second insulation base layer 112, and the second conductive through hole 113 is completely filled with conductive paste; the second side of the glass core board 101 is bonded to the upper conductive trace layer 110 and electrically connected to the second circuit board through the via hole 107 filled with the conductive material 108.
S7: a first solder mask layer 114 is prepared on the surface of the first conductive trace layer 103 of the first circuit board, a first hole bonding pad 115 is prepared on the surface of the first conductive via 105 of the first circuit board, a second solder mask layer 116 is prepared on the surface of the lower conductive trace layer 112 of the second circuit board, and a second hole bonding pad 117 is prepared on the surface of the second conductive via 113 of the first circuit board, as shown in fig. 7, where the lower conductive trace layer of the outermost layer of the lower conductive trace layer 112 is formed by a spray printing method, but the first solder mask layer 114 and the second solder mask layer 116 are not necessarily limited thereto. And preparing a second hole bonding pad 117 on the surface of the second conductive through hole 113 of the second circuit board, wherein the first hole bonding pad 115 and the second hole bonding pad 117 are nickel-gold layers, the diameter of the first hole bonding pad 115 is larger than that of the first conductive through hole 105, and the diameter of the second hole bonding pad 117 is larger than that of the first conductive through hole 113, so as to prepare the glass core board.
Example 2
The preparation process was identical to example 1, except that,
the first circuit board in step S2 is a manufactured existing first circuit board, the first circuit board is a double-sided flexible circuit board, the double-sided flexible circuit board comprises a first insulating base layer 104, the first insulating base layer 104 is selected from polyethylene terephthalate, the first conductive circuit layer 103 is a first nickel foil circuit layer, the other side is sequentially provided with a second conductive circuit layer 106, the second conductive circuit layer 106 is a second nickel foil circuit layer, the first conductive through holes 105 are filled with conductive materials, and the first conductive through holes 105 are filled with resin plug holes with non-metallized surfaces.
S4: the conductive material 108 is completely filled into the through hole 107, as shown in fig. 4, a chemical copper deposition electroplating process is adopted, a film is coated on the surface of the workpiece to form a window, the other non-metalized parts cannot be deposited with copper and electroplated, the film is retracted in the process, and the through hole 107 filled with the conductive material 108 is completely connected with the first conductive through hole 105 at the coordinate point of the punching position.
The second circuit board in step S6 may be directly selected from the existing second circuit boards after the manufacture, the second circuit board is a double-sided flexible multi-layer circuit board, the double-sided flexible multi-layer circuit board includes a second insulation base layer 112, the second insulation base layer 112 is selected from aramid fiber esters, the upper conductive circuit layer 110 is an upper palladium foil circuit layer, the lower conductive circuit layer 111 is a lower palladium foil circuit layer, and the second conductive via 113 is completely filled with conductive via paste.
Example 3
The preparation process was identical to example 1, except that,
the first circuit board in step S2 is a manufactured existing first circuit board, the first circuit board is a double-sided circuit board, the double-sided circuit board includes a first insulating base layer 104, the first insulating base layer 104 is selected from epoxy resin, the first conductive circuit layer 103 is a first copper alloy circuit layer, the other side is sequentially provided with a second conductive circuit layer 106, the second conductive circuit layer 106 is a second copper alloy circuit layer, the first conductive through hole 105 is filled with a conductive material, and the first conductive through hole 105 is filled with a resin plug hole with an unmetallized surface.
In step S6, the second circuit board may be directly selected from the existing second circuit boards after the manufacture, the second circuit board is a double-sided flexible multilayer circuit board, the double-sided flexible multilayer circuit board includes a second insulation base layer 112, the second insulation base layer 112 is selected from polyimide, the upper conductive circuit layer 110 is an upper copper foil circuit layer, the lower conductive circuit layer 111 is a lower copper foil circuit layer, and the second conductive via 113 is completely filled with conductive via paste.
Example 4
The preparation process was identical to example 1, except that,
the first circuit board in step S2 is a manufactured existing first circuit board, the first circuit board is a double-sided circuit board, the double-sided circuit board includes a first insulating base layer 104, the first insulating base layer 104 is selected from epoxy resin, the first conductive circuit layer 103 is a first copper alloy circuit layer, the other side is sequentially provided with a second conductive circuit layer 106, the second conductive circuit layer 106 is a second copper alloy circuit layer, the first conductive through hole 105 is filled with a conductive material, and the first conductive through hole 105 is filled with a resin plug hole with an unmetallized surface.
The second circuit board in step S6 may be a fabricated existing second circuit board, and the second circuit board may be a double-sided multilayer circuit board, where the double-sided flexible multilayer circuit board includes a second insulation base layer 112, the second insulation base layer 112 is selected from epoxy, the upper conductive circuit layer 110 is an upper copper alloy circuit layer, the lower conductive circuit layer 111 is a lower copper alloy circuit layer, the second conductive through hole 113 is filled with a conductive material, and the second conductive through hole 113 is filled with a resin plug hole with an unmetallized surface.
Example 5
The preparation process was identical to example 1, except that,
s2: the first surface of the glass core board 101 is attached to a first circuit board, and is cured by heating, as shown in fig. 8, the first circuit board is a manufactured first circuit board, the first circuit board is a double-sided flexible multilayer circuit board, the double-sided flexible multilayer circuit board comprises a first insulating base layer 119, the first insulating base layer 119 is selected from polyimide, a first upper conductive circuit layer 121 is arranged on one side of the first insulating base layer, the first upper conductive circuit layer 121 is an upper copper foil circuit layer, a plurality of first lower conductive circuit layers 118 are arranged on the other side of the first insulating base layer, the first lower conductive circuit layers 118 are lower copper foil circuit layers, a first insulating base layer 119 is arranged between each two first lower conductive circuit layers 118, the first upper conductive circuit layers 121 and the first lower conductive circuit layers 118 are conducted through first conductive through holes 120 penetrating through the first insulating base layer 119, and the first conductive through holes 120 are completely filled with conductive hole plugging slurry; the first side of the glass core board 101 is bonded to the lowermost conductive trace layer 118 and is electrically connected to the first circuit board through the via 107 filled with the conductive material 108.
S3: the coordinate points of the punching positions are read from a part of the first conductive vias 120 of the first circuit board, and the vias 107 are punched with laser.
S7: a first solder mask layer 122 is prepared on the surface of the first upper conductive circuit layer of the first circuit board, a first hole bonding pad 123 is prepared on the surface of the first conductive through hole 105 of the first circuit board, a second solder mask layer 116 is prepared on the surface of the lower conductive circuit layer 112 of the second circuit board, and a second hole bonding pad 117 is prepared on the surface of the second conductive through hole 113 of the first circuit board.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (3)
1. A preparation method of a glass core board is characterized in that: the method comprises the following steps:
s1: forming a first adhesive layer on a first side of the glass core plate;
s2: the first surface of the glass core plate is attached to the first circuit board;
s3: punching a through hole on the glass core plate, reading a punching position coordinate point from part of the first conductive through holes of the first circuit board, punching the through hole by adopting laser, and removing punched glue residues and scraps by etching the hole wall and the hole bottom through alkali liquor after punching to ensure that the first conductive through holes of the punching position coordinate point of the first circuit board are completely exposed;
s4: filling the through holes with a conductive material;
s5: forming a second adhesive on the second side of the glass core plate;
s6: attaching a second circuit board to the second surface of the glass core plate, heating and curing the second circuit board, and electrically connecting the second circuit board with the through holes filled with the conductive material;
the first circuit board is a double-sided single-layer circuit board, the double-sided single-layer circuit board comprises a first insulating base layer, a first conductive circuit layer is arranged on one side of the first insulating base layer, a second conductive circuit layer is sequentially arranged on the other side of the first insulating base layer, and a first conductive through hole is arranged between the first conductive circuit layer and the first insulating base layer so as to realize the conduction of the first conductive circuit layer and the second conductive circuit layer; the second circuit board is a double-sided multilayer circuit board, the double-sided multilayer circuit board comprises a second insulating base layer, an upper conductive circuit layer is arranged on one side of the second insulating base layer, a plurality of lower conductive circuit layers are arranged on the other side of the second insulating base layer, a second insulating base layer is arranged between each two lower conductive circuit layers, and the upper conductive circuit layers and the lower conductive circuit layers are conducted through second conductive through holes penetrating through the second insulating base layer.
2. The method for manufacturing a glass core board according to claim 1, wherein: the first circuit board is a double-sided flexible single-layer circuit board, the first conductive circuit layer is a first copper foil circuit layer, the second conductive circuit layer is a second copper foil circuit layer, and the first insulating base layer is one of polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride; the second circuit board is a double-sided flexible multilayer circuit board, the upper conductive circuit layer is an upper copper foil circuit layer, the lower conductive circuit layer is a lower copper foil circuit layer, and the second insulation base layer is one of polyimide, polyethylene terephthalate, aramid fiber ester and polyvinyl chloride.
3. The method for manufacturing a glass core board according to claim 1, wherein: after the step S6, a first solder mask layer is prepared on the surface of the first conductive circuit layer of the first circuit board, a first hole bonding pad is prepared on the surface of the first conductive through hole of the first circuit board, a second solder mask layer is prepared on the surface of the lower conductive circuit layer of the second circuit board, and a second hole bonding pad is prepared on the surface of the second conductive through hole of the second circuit board.
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| US20240047589A1 (en) * | 2020-12-28 | 2024-02-08 | Suzhou Institute Of Nano-Tech And Nano-Bionics (Sinano) , Chinese Academy Of Sciences | Interconnected electrode structure, method of manufacturing same, and use of same |
| JP2022188326A (en) * | 2021-06-09 | 2022-12-21 | Ｆｉｃｔ株式会社 | Multilayer substrate and manufacturing method of multilayer substrate |
| CN114364166A (en) * | 2022-01-06 | 2022-04-15 | 深圳市鼎华芯泰科技有限公司 | Hole filling method of circuit board and manufacturing method of double-sided circuit board |
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