CN212573077U - Flexible circuit board for SMT - Google Patents
Flexible circuit board for SMT Download PDFInfo
- Publication number
- CN212573077U CN212573077U CN202021098349.0U CN202021098349U CN212573077U CN 212573077 U CN212573077 U CN 212573077U CN 202021098349 U CN202021098349 U CN 202021098349U CN 212573077 U CN212573077 U CN 212573077U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- copper foil
- film
- smt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010408 film Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 44
- 239000011889 copper foil Substances 0.000 claims abstract description 39
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 26
- 239000013039 cover film Substances 0.000 claims abstract description 19
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000009434 installation Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model relates to a circuit board technical field discloses a higher and simple and convenient flexible circuit board for SMT of component installation of mechanical strength, possesses: at least one cover film (102a, 102b) formed in a flat structure, the cover film (102a, 102b) being attached to an upper surface or a lower surface of the flexible circuit board, the cover film (102a, 102b) being for surface insulation; at least one layer of copper foil (101) formed in a flat structure, the copper foil (101) being bonded between cover films (102a, 102b), the copper foil being for conducting signals; and at least one reinforcing sheet (103) which is arranged along the extending direction of the covering films (102a, 102b) or the copper foil (101) and attached to the bottom sides of the covering films (102a, 102b) or the copper foil (101), wherein the reinforcing sheet is used for reinforcing the mechanical strength of the flexible circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically say, relate to a flexible circuit board for SMT.
Background
An fpc (flexible Printed circuit) is a flexible Printed circuit board which is made of a flexible insulating base material such as polyimide or a polyester film and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property. At present, when electronic elements are installed on the surface of a flexible circuit board, due to the fact that the mechanical strength of the whole FPC is weak, cold welding of the electronic elements is prone to occurring, and the number of the circuit board to be repaired is increased.
Therefore, how to improve the mechanical strength of the FPC becomes a technical problem that needs to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in, to prior art's the aforesaid because FPC holistic mechanical strength is more weak, lead to electronic component to appear rosin joint and cause the defect that the repair of circuit board increases, provide a mechanical strength is higher and the simple installation of component flexible circuit board for SMT.
The utility model provides a technical scheme that its technical problem adopted is: a flexible circuit board for SMT is configured, comprising:
at least one cover film formed in a flat structure, the cover film being attached to an upper surface or a lower surface of the flexible circuit board, the cover film being for surface insulation;
at least one layer of copper foil formed in a flat structure, the copper foil being adhered between the cover films, the copper foil being used for conducting signals;
and at least one layer of reinforcing sheet arranged along the extending direction of the covering film or the copper foil and attached to the bottom side of the covering film or the copper foil, wherein the reinforcing sheet is used for reinforcing the mechanical strength of the flexible circuit board.
In some embodiments, the reinforcing sheet comprises a release paper and an electromagnetic shielding film, wherein the release paper is bonded with the electromagnetic shielding film through an adhesive;
the release paper is used for preventing the adhesive from being pressed on a front adhesive object;
the electromagnetic shielding film is used for protecting the circuit in the circuit board from being interfered by external strong electromagnetism.
In some embodiments, the cover film comprises a protective film and another release paper, the protective film being bonded to the release paper by the adhesive;
the protective film is used for surface insulation.
In some embodiments, the protective film is set to a thickness of 1mil or 2 mils.
In some embodiments, the copper foil is bonded to the substrate film by an adhesive, wherein,
the thickness of the copper foil is set to 1mil or 2 mils.
The flexible circuit board for SMT comprises at least one layer of covering film, at least one layer of copper foil and at least one layer of reinforcing sheet, wherein the covering film is attached to the upper surface of the flexible circuit board and is used for surface insulation; the copper foil is bonded between the covering films and used for conducting signals; at least one layer of reinforcing sheet is arranged along the extending direction of the covering film or the copper foil and is attached to the bottom side of the covering film or the copper foil, and the reinforcing sheet is used for reinforcing the mechanical strength of the flexible circuit board. Compared with the prior art, the bottom side of the circuit board is provided with at least one layer of reinforcing sheet to improve the mechanical strength of the flexible circuit board and solve the problem that the repair of the circuit board is increased due to insufficient soldering caused by weak mechanical strength of the existing circuit board.
Drawings
The invention will be further explained with reference to the drawings and examples, wherein:
fig. 1 is a cross-sectional view of an embodiment of a flexible circuit board for SMT;
fig. 2 is a cross-sectional view of another embodiment of a flexible circuit board for SMT.
Detailed Description
In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a cross-sectional view of an embodiment of a flexible circuit board for SMT; fig. 2 is a cross-sectional view of another embodiment of a flexible circuit board for SMT. As shown in fig. 1 and 2, in the first embodiment of the flexible circuit board for SMT of the present invention, the flexible circuit board 10 for SMT includes at least one copper foil 101, at least one cover film (102a, 102b), and at least one reinforcing sheet 103.
Specifically, the copper foil 101 is formed in a flat or strip structure, which is used to conduct signals.
Cover films (102a, 102b) are attached to the upper or lower surface of the flexible circuit board, specifically, the cover films (102a, 102b) are attached to the upper or lower surface of the copper foil 101.
The reinforcing sheet 103 is formed in a flat structure for reinforcing the mechanical strength of the FPC to facilitate mounting of electronic components on the surface of the circuit board. The thickness of the reinforcing sheet 103 may be set to 3mil to 9 mil.
Specifically, a cover film 102a is adhered to one surface of the copper foil 101, that is, a cover film 102a is disposed on the upper surface of the flexible circuit board 10; the other cover film 102b is attached to one surface of the copper foil 101, that is, the other cover film 102b is provided on the lower surface of the flexible circuit board 10, and the cover films (102a, 102b) are used for forming surface insulation of the copper foil 101.
The reinforcing sheet 103 is disposed along the extending direction of the cover film 102b or the copper foil 101, and attached to the bottom side of the cover film 102b or the copper foil 101, and the mechanical strength of the flexible circuit board 10 is reinforced by the reinforcing sheet 103.
Compared with the prior art, the bottom side of the flexible circuit board 10 for SMT is provided with at least one layer of reinforcing sheet 103 to improve the mechanical strength of the flexible circuit board 10, so that the problem that the repair of the flexible circuit board is increased due to insufficient soldering (mounting) of electronic elements caused by weak mechanical strength of the existing flexible circuit board is solved.
In some embodiments, in order to improve the overall performance of the reinforcing sheet 103, a release paper (not shown) and an electromagnetic shielding film (not shown) may be disposed in the reinforcing sheet 103, wherein the electromagnetic shielding film is specifically an EIM electromagnetic film, which can be coated with a shielding material on a base material (PET/PC/glass, etc.) of different substrates by a vacuum sputtering method, so as to achieve EMI electromagnetic interference shielding with extremely low resistance.
Specifically, the release paper is bonded to the electromagnetic shielding film by an adhesive, thereby improving the overall performance and the electromagnetic interference resistance of the reinforcing sheet 103.
The release paper is used for preventing the adhesive from adhering to the front part of the adhesive, so that the interference of surface mounting operation is avoided.
The electromagnetic shielding film is used for protecting the circuit in the circuit board from external strong electromagnetic interference.
In some embodiments, the cover films (102a, 102b) include a protective tape (not shown) and another release paper (not shown), wherein the protective tape serves as insulation on the surface of the copper foil 101.
Specifically, a protective film is bonded to the release paper by an adhesive, and the thickness of the protective film is set to 1mil or 2 mils.
In some embodiments, in order to increase the high dielectric constant of the flexible circuit board, a substrate film (not shown) may be disposed in the flexible circuit board 10, wherein the copper foil 101 is an electrolytic copper and a rolled copper, and the thickness of the copper foil 101 is set to 1mil or 2 mils.
Specifically, the copper foil 101 is bonded to a substrate film by an adhesive, and the high dielectric constant of the flexible circuit board is improved by the substrate film.
In some embodiments, to improve the joint property of the copper foil 101, at least one through hole 104 and positioning hole 105 may be disposed in the flexible circuit board 10. Specifically, the through hole 104 is provided along the radial direction of the flexible circuit board 10, and a positioning hole 105 extending from the cover film 102a into the copper foil 101 is provided at one side of the through hole 104.
The positioning holes 105 are used for connecting an outer layer circuit (corresponding to the upper layer of the double-layer circuit board) and an inner layer circuit (corresponding to the inner layer of the double-layer circuit board) through a plated hole or connecting copper foils of another flexible circuit board 10 to form the splicing of two or more circuit boards.
The flexible circuit board 10 is further provided with a buried hole 106, and the buried hole 106 can be connected with any circuit layer inside the flexible circuit board 10, but is not connected to an outer layer, so as to increase the usable space of other circuit layers.
In some embodiments, a solder resist 107 is further provided on the upper surface of the cover film 102a, and the solder resist 107 refers to a method of performing soldering by applying pressure while locally heating the element by using resistance heat generated by current passing through the solder and the contact as a heat source. During welding, metal does not need to be filled, the production rate is high, the deformation of a weldment is small, automation is easy to realize, and the resistance welding utilizes the resistance heat effect generated by current flowing through the contact surface and the adjacent area of a workpiece to heat the workpiece to be molten or plastic.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many modifications may be made by one skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (5)
1. A flexible circuit board for SMT is characterized by comprising:
two cover films formed in a flat structure, the cover films being attached to an upper surface or a lower surface of the flexible circuit board, the cover films being for surface insulation;
at least one layer of copper foil formed in a flat structure, the copper foil being adhered between the cover films, the copper foil being used for conducting signals;
at least one layer of reinforcing sheet arranged along the extending direction of the cover film or the copper foil and attached to the bottom side of the cover film or the copper foil, wherein the reinforcing sheet is used for reinforcing the mechanical strength of the flexible circuit board;
at least one through hole and a positioning hole are arranged in the flexible circuit board;
the through holes are arranged along the radial direction of the flexible circuit board, and the positioning holes extending from the covering film to the copper foil are arranged on one side of the through holes.
2. A flexible circuit board for SMT according to claim 1,
the reinforcing sheet comprises release paper and an electromagnetic shielding film, and the release paper is bonded with the electromagnetic shielding film through an adhesive;
the release paper is used for preventing the adhesive from being pressed on a front adhesive object;
the electromagnetic shielding film is used for protecting the circuit in the circuit board from being interfered by external strong electromagnetism.
3. A flexible circuit board for SMT according to claim 2,
the cover film comprises a protective film and another release paper, and the protective film is bonded with the release paper through the adhesive;
the protective film is used for surface insulation.
4. A flexible circuit board for SMT according to claim 3,
the thickness of the protective film is set to 1mil or 2 mils.
5. A flexible circuit board for SMT according to claim 3,
the copper foil is bonded to the base film by an adhesive, wherein,
the thickness of the copper foil is set to 1mil or 2 mils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021098349.0U CN212573077U (en) | 2020-06-15 | 2020-06-15 | Flexible circuit board for SMT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021098349.0U CN212573077U (en) | 2020-06-15 | 2020-06-15 | Flexible circuit board for SMT |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212573077U true CN212573077U (en) | 2021-02-19 |
Family
ID=74634993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021098349.0U Expired - Fee Related CN212573077U (en) | 2020-06-15 | 2020-06-15 | Flexible circuit board for SMT |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212573077U (en) |
-
2020
- 2020-06-15 CN CN202021098349.0U patent/CN212573077U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210219 |