CN210130065U - Shielding film with multilayer metal structure - Google Patents
Shielding film with multilayer metal structure Download PDFInfo
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- CN210130065U CN210130065U CN201921048574.0U CN201921048574U CN210130065U CN 210130065 U CN210130065 U CN 210130065U CN 201921048574 U CN201921048574 U CN 201921048574U CN 210130065 U CN210130065 U CN 210130065U
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Abstract
The utility model provides a shielding film with a multilayer metal structure, which comprises an insulating layer and multilayer metal compounded on the insulating layer; the thickness of each layer of metal is 0.05-5 mu m; the number of the layers of the multilayer metal is 2-10; and a conductive bonding layer is arranged between the multiple layers of metal. The utility model discloses a set up the multilayer metal, control the thickness of every layer of metal, bond through the conductive bonding layer between the metal level for shielding film possesses better flexibility, and shields the effect excellence. In addition, the conductive bonding layer is adopted, so that the bonding force between the metal layers is good, the shielding film has good flexibility while the high-frequency signal shielding performance of more than 80db @10ghz is ensured, the flexible requirement of the flexible circuit board is met, the high-temperature resistance is good, and the bonding force of the metal layers can be still kept not to be reduced and the high-frequency signal shielding film is stable and reliable during high-temperature impact.
Description
Technical Field
The utility model belongs to the technical field of the barrier film, especially, relate to a multilayer metal structure's barrier film.
Background
The existing shielding film material is a copper-aluminum foil adhesive tape and a shielding film material with the shielding effect of more than 50db within 1ghz, and has low price, easy material acquisition and good shielding effect, thus being the preferred material in various household electrical appliances and electronics factories. However, when the shielding film is specifically applied to a flexible circuit board, the copper foil and the aluminum foil cannot meet the requirements on thickness and bending resistance, the common shielding film cannot meet the requirements on shielding performance of a shielding layer with a high frequency of more than 1ghz and more than 65db, the shielding film for high-frequency application with the copper foil directly serving as the shielding layer is available on the market, but both the bending resistance and the high-temperature resistance cannot meet the production requirements of a flexible plate, the production cost is invisibly increased, and the shielding film has no use value.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a shielding film with a multi-layer metal structure, which has better flexibility and better shielding performance.
The utility model provides a shielding film with a multilayer metal structure, which comprises an insulating layer and multilayer metal compounded on the insulating layer; the thickness of each layer of metal is 0.05-5 mu m; the number of the layers of the multilayer metal is 2-10;
and a conductive bonding layer is arranged between the multiple layers of metal.
Preferably, the thickness of the insulating layer is 2-20 μm.
Preferably, the thickness of the conductive bonding layer is 1-10 μm.
Preferably, the bending resistance of the shielding film composite flexible plate under GB/T2679.5,135degree and Raidus 0.38mm is more than 20 times.
Preferably, each layer of metal is independently selected from nickel, gold, silver, copper, aluminum or tin.
Preferably, the thickness of the shielding film is 10-50 microns.
Preferably, the multilayer metal is 0.25-0.35 μm silver-0.25-0.35 μm nickel in sequence;
or 0.45 to 0.55 μm copper-0.2 to 0.25 μm silver-0.95 to 1.05 μm copper-0.2 to 0.25 μm Ni-0.2 to 0.25 μm silver;
or 0.95 to 1.05 μm of copper, 0.55 to 0.55 μm of copper, 0.2 to 0.3 μm of silver, and 0.25 to 0.35 μm of nickel.
Preferably, the adhesive in the conductive adhesive layer is selected from epoxy thermosetting conductive adhesive, acrylic thermosetting conductive adhesive or polyurethane thermosetting conductive adhesive commonly used in the market.
The utility model provides a shielding film with a multilayer metal structure, which comprises an insulating layer and multilayer metal compounded on the insulating layer; the thickness of each layer of metal is 0.05-5 mu m; the number of the layers of the multilayer metal is 2-10; and a conductive bonding layer is arranged between the multiple layers of metal. The utility model discloses a set up the multilayer metal, control the thickness of every layer of metal, bond through the conductive bonding layer between the metal level for shielding film possesses better flexibility, and shields the effect excellence. In addition, the conductive bonding layer is adopted, so that the bonding force between the metal layers is good, the high-temperature resistance is good, and the bonding force of the metal layers can be still kept to be not reduced and be stable and reliable during high-temperature impact. The experimental results show that: the thickness of the shielding film is 20-35 mu m, and when 2-7 layers of metal are formed, the shielding test under 10hgz reaches more than 80 db; the shielding test under 100ghz reaches more than 70 db; the whole obtained after the shielding film is laminated on the flexible plate can pass a high temperature resistance test of soaking for 30s at 288 ℃ and a bending resistance test for more than 50 times under GB/T2679.5,135degree and Radius of 0.38mm, and can meet the basic requirements of the flexible plate.
Drawings
Fig. 1 is a schematic structural diagram of a shielding film with a multilayer metal structure according to the present invention.
Detailed Description
The utility model provides a shielding film with a multilayer metal structure, which comprises an insulating layer and multilayer metal compounded on the insulating layer; the thickness of each layer of metal is 0.05-5 mu m; the number of the layers of the multilayer metal is 2-10;
and a conductive bonding layer is arranged between the multiple layers of metal.
The utility model discloses a set up the multilayer metal, control the thickness of every layer of metal, bond through the conductive bonding layer between the metal level for shielding film possesses better flexibility, and shields the effect excellence. In addition, the conductive bonding layer is adopted, so that the bonding force between the metal layers is good, the shielding film has good flexibility while the high-frequency signal shielding performance of more than 80db @10ghz is ensured, and the flexible requirement of the flexible circuit board is met; the high temperature resistance is good, and the bonding force of the metal layer can be kept to be not reduced and the metal layer is stable and reliable when the metal layer is impacted at high temperature. The utility model discloses used metal need not very thick under the condition of guaranteeing the flexible sheet material basic requirement (flexibility, high temperature resistant), but also can reach the shielding performance more than 80db (10ghz), is equivalent to the shielding performance of pure metal layer >2 mu m thickness, can also reduce cost.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a shielding film with a multilayer metal structure provided by the present invention; wherein, 1 is an insulating layer, 2 is a first layer of metal, 3 is a conductive bonding layer, 4 is a second layer of metal, 5 is a last layer of metal, 6 is a grounding conductive adhesive layer, and 7 is a protective film.
The shielding film with a multilayer metal structure provided by the utility model comprises an insulating layer 1; the thickness of the insulating layer is preferably 2-20 μm. The insulating layer preferably comprises resin, an auxiliary agent, a filler and a pigment in a mass ratio of 70-80: 5-10: 0-12: 0-15; the filler and the pigment are added according to actual conditions, and the insulating layer preferably comprises resin, an auxiliary agent, the filler and the pigment in a mass ratio of 70-80: 5-10: 8-12: 5-15; the resin is preferably selected from one or more of polyurethane, epoxy, polyimide, modified silica gel and polyethylene terephthalate; in a specific embodiment, the resin in the insulating layer is
ZY-3600R or Petpur adhesive.The auxiliary agent in the insulating layer is selected from one or more of a curing agent, a dispersing agent and a modifying agent of corresponding resin;
the filler is selected from one or more of titanium dioxide, heat conducting powder, silicon dioxide and carbon powder. In a particular embodiment, the filler is selected from titanium dioxide.
The present invention is directed to a method of making a transparent, white or black insulating layer, the method comprising applying a pigment to the insulating layer.
In one embodiment of the present invention, the insulation layer specifically comprises a material with a mass ratio of 70:20:5:5
Titanium dioxide, an auxiliary agent and black color paste;
or the insulating layer comprises ZY-3600R, Tailiter universal oily black paste, titanium dioxide and ZY-3600R curing agent in a mass ratio of 70:10:10: 10;
or the insulating layer specifically comprises Petpur adhesive, titanium dioxide, Petpur curing agent and Tailiter universal oily black paste in a mass ratio of 70:10:10: 10.
The thickness of the insulating layer is specifically 3 μm, 5 μm or 7 μm.
The shielding film with the multilayer metal structure provided by the utility model comprises multilayer metal compounded on the insulating layer; the thickness of each layer of metal is 0.05-5 mu m; the number of layers of the multilayer metal is 2-10. The thickness of each layer of metal is preferably 0.05-2 μm; the number of the multilayer metal layers is specifically 2, 3, 4, 5, 6, 7, 8, 9 or 10. In particular embodiments, each layer of metal is independently selected from nickel, gold, silver, copper, aluminum, or tin. The multilayer metal comprises a first layer of metal 2, a second layer of metal 4, and up to a last layer of metal 5.
In the utility model, a conductive bonding layer 3 is arranged between the multi-layer metals; the conductive adhesive layer plays a role of conduction. The conductive bonding layer is used as a non-metal layer, so that the flexibility can be effectively improved. The conductive bonding layer comprises glue, metal powder, a curing agent and an auxiliary agent in a mass ratio of 50-80: 5-70: 5-10; the glue in the conductive bonding layer is preferably selected from one or more of epoxy glue, acrylic glue, polyester and silica gel; the metal powder is preferably selected from one or more of nickel powder, silver copper powder, gold powder, silver powder and aluminum powder; the curing agent in the conductive bonding layer is preferably selected from one or more of the curing agents of the corresponding resin system; the auxiliary agent in the conductive bonding layer is selected from one or more of a curing agent, a filler dispersing agent and a surfactant of corresponding resin; the auxiliary agent in the conductive bonding layer is added as appropriate as the case may be. The utility model discloses in, glue in the electrically conductive tie coat is selected from the general electrically conductive adhesive such as epoxy thermosetting conducting resin, acrylic acid thermosetting conducting resin and polyurethane thermosetting conducting resin in the market. The thickness of the conductive bonding layer is preferably 1-10 mu m, and more preferably 3-8 mu m; in specific embodiments, the conductive adhesive layer has a thickness of 8 μm, 5 μm, or 3 μm.
In the utility model, the multilayer metal is preferably 0.25-0.35 μm silver-0.25-0.35 μm nickel; or 0.45 to 0.55 μm copper-0.2 to 0.25 μm silver-0.95 to 1.05 μm copper-0.2 to 0.3 μm Ni-0.2 to 0.3 μm silver; or 0.95 to 1.05 μm of copper, 0.45 to 0.55 μm of copper, 0.2 to 0.3 μm of silver, and 0.25 to 0.35 μm of nickel. In a specific embodiment, the multilayer metal is 0.3 μm silver to 0.3 μm nickel; or 0.5 μm copper-0.2 μm silver-1 μm copper-0.2 μm Ni-0.2 μm silver; or 1 μm copper-0.5 μm copper-0.2 μm silver-0.3 μm nickel.
In the utility model, a composite grounding conductive adhesive layer 6 is preferably selected on the topmost layer of the multilayer metal, and then a protective film 7 is covered; the protective film is preferably selected from a PP protective film or a PET release film.
The utility model provides a shielding film's each item performance accords with the IPC standard, and shielding test effect reaches more than 65 db.
The utility model provides a multilayer metal structure's barrier film is preferred to be made according to following method:
and coating an insulating layer on the release film, drying, then setting a first layer of metal, coating a conductive bonding layer on the first layer of metal, repeatedly setting a metal layer and coating the conductive bonding layer, setting a grounding conductive adhesive layer 6 on the last layer of metal layer, and finally covering a protective film 7 to obtain the shielding film with the multilayer metal structure.
The utility model discloses in, the temperature of stoving is preferably 100 ~ 200 ℃. The metal layer is arranged in a hot sticking mode, a vacuum plating mode or a water plating mode. The protective film is selected from a PP film or a PET release film.
The utility model adopts GB/T30142-2013 to test the shielding performance of the shielding film;
testing the bending resistance of the shielding film composite flexible circuit board by GB/T2679.5 (135degree, Radius0.38 mm);
and testing the high temperature resistance of the shielding film composite flexible plate by adopting a condition of soaking at 288 ℃ for 30 s.
The test result shows that: the shielding film has better resistance to SMT high-temperature soldering tin and bending after being attached to the flexible plate; the bonding force between the metal layers is good.
For further explanation of the present invention, the shielding films of the multilayer metal structure provided by the present invention will be described in detail with reference to the following examples, which should not be construed as limiting the scope of the present invention.
Example 1
1) The formula of the polyurethane insulation layer (based on 100 parts by weight) comprises the following components:
Titanium dioxide: 20
Auxiliary agent (A)
Curing agent): 5
Color paste: black: 5
Will be provided with
Mixing titanium dioxide, an auxiliary agent and black color paste to obtain black ink;
2) coating a raw material film with black glue: and (3) unreeling the prepared release film on a coating line, passing through a coating head, uniformly coating a layer of black glue with the thickness of 3 microns, drying the butanone solvent in an oven at the temperature of 100-200 ℃, and reeling.
3) Vacuum plating a silver layer with the thickness of 0.3 mu m;
4) coating a conductive bonding layer with the thickness of 3 mu m; the conductive bonding layer comprises epoxy glue, nickel powder, a polyurethane curing agent and an auxiliary agent in a mass ratio of 70:10:10:10, and the epoxy glue, the nickel powder, the polyurethane curing agent and the auxiliary agent are dried and cured;
5) plating a layer of second metal nickel with the thickness of 0.3 mu m on the glue surface;
6) coating a layer of grounding conductive adhesive layer with the thickness of 10 mu m on the second layer of metal, and then covering a layer of pp protective film;
8) and then, inspecting and cutting to obtain the shielding film with the multilayer metal structure.
Example 2
1) The formula of the epoxy insulating layer (based on 100 parts by weight) comprises the following components:
ZY-3600R (Zhu Yi electronic materials Co., Zhongshan city): 70;
tai liter general purpose oil black paste (Tai liter pigment Co., Ltd., Dongguan): 10;
titanium dioxide: 10;
ZY-3600R curing agent: 10;
mixing ZY-3600R, Tai liter universal oily black paste, titanium dioxide and a curing agent to obtain black glue;
unreeling the prepared release film on a coating line, passing through a coating head, uniformly coating a layer of black glue with the thickness of 5 mu m, drying the surface of the solvent in an oven at the temperature of 100-200 ℃, and rolling;
3) plating 0.5 μm copper by vacuum coating;
4) coating a conductive bonding layer with the thickness of 5 mu m; the conductive bonding layer comprises epoxy glue, nickel powder, a polyurethane curing agent and an auxiliary agent in a mass ratio of 70:10:10:10, and the epoxy glue, the nickel powder, the polyurethane curing agent and the auxiliary agent are dried and cured;
5) plating a layer of second metal silver with the thickness of 0.2 mu m on the glue surface;
6) repeating 4) and 5), sequentially plating 1 μm of third metallic copper, 0.2 μm of fourth metallic Ni, and 0.2 μm of 5 th metallic silver;
7) coating a grounding conductive adhesive layer on the 5 th layer of metal, and covering a pet release film;
8) and inspecting and cutting the product to obtain the shielding film with the multilayer metal structure.
Example 3
1) Adjusting the formula of the acrylic ink insulating layer (based on 100 parts by weight):
petpur adhesive (chongqing glauca): 70
Titanium dioxide: 10
Petpur curing agent: 10;
tai liter general purpose oil black paste (Tai liter pigment Co., Ltd., Dongguan): 10;
mixing the petpur adhesive, the titanium dioxide, the petpur glue curing agent and the black color paste to obtain black glue;
2) coating a raw material film with black glue: unreeling the prepared release film on a coating line, passing through a coating head, uniformly coating a layer of black glue with the thickness of 7 mu m, drying the surface of the solvent in an oven at the temperature of 100-200 ℃, and rolling;
3) vacuum plating a copper layer with the thickness of 1 mu m;
4) coating a conductive bonding layer with the thickness of 8 mu m; the conductive bonding layer comprises epoxy glue, nickel powder, a polyurethane curing agent and an auxiliary agent in a mass ratio of 70:10:10:10, and the epoxy glue, the nickel powder, the polyurethane curing agent and the auxiliary agent are dried and cured;
5) plating a layer of second metal copper with the thickness of 0.5 mu m on the glue surface;
6) repeating the steps 4) and 5), and plating a 0.2-micron silver layer on the 3 rd metal layer; plating a layer of 4 th metal layer nickel with the thickness of 0.3 mu m;
7) coating a grounding conductive adhesive layer on the 4 th layer of metal, and covering a layer of pp protective film;
8) and inspecting and cutting the product to obtain the shielding film with the multilayer metal structure.
Comparative example 1
1) The formula of the polyurethane insulation layer (based on 100 parts by weight) comprises the following components:
Titanium dioxide: 20
Auxiliary agent (A)
Curing agent): 5
Color paste: black 5
Will be provided with
Mixing titanium dioxide, an auxiliary agent and black color paste to obtain black glue;
2) coating a raw material film with black glue: and (3) unreeling the prepared release film on a coating line, passing through a coating head, uniformly coating a layer of black glue with the thickness of 3 microns, drying the surface of the solvent in an oven at the temperature of 100-200 ℃, and reeling.
3) Pasting a copper foil with the thickness of 2 microns by using a hot pasting machine at the temperature of 120 ℃, coating a grounding conductive adhesive layer with the thickness of 10 microns on the surface of the copper foil, and covering a pp protective film;
4) and then, inspecting and cutting to obtain the shielding film with the single-layer metal structure.
The utility model discloses carry out capability test to the barrier film of embodiment 1 ~ 3 and comparative example 1 preparation, see table 1 as a result, table 1 is the utility model discloses the capability test result of the barrier film of embodiment 1 ~ 3 and comparative example 1 preparation:
TABLE 1 Performance test results of the shielding films prepared in examples 1 to 3 and comparative example 1 of the present invention
As can be seen from the above embodiments, the present invention provides an insulating layer and a multilayer metal composite on the insulating layer; the thickness of each layer of metal is 0.05-5 mu m; the number of the layers of the multilayer metal is 2-10; and a conductive bonding layer is arranged between the multiple layers of metal. The utility model discloses a set up the multilayer metal, control the thickness of every layer of metal, bond through the conductive bonding layer between the metal level for shielding film possesses better flexibility, and shields the effect excellence. In addition, the conductive bonding layer is adopted, so that the bonding force between the metal layers is good, the high-temperature resistance is good, and the bonding force of the metal layers can be still kept to be not reduced and be stable and reliable during high-temperature impact. The experimental results show that: the thickness of the shielding film is 20-35 mu m, and when 2-7 layers of metal are formed, the shielding test reaches 78-85 db under 10 hgz; the shielding test under 100ghz reaches 71-79 db; the whole obtained after the shielding film is laminated on the flexible plate can pass a high temperature resistance test of soaking for 30s at 288 ℃ and a bending resistance test for more than 50 times under GB/T2679.5,135degree and Radius of 0.38mm, and can meet the basic requirements of the flexible plate.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. The shielding film with the multilayer metal structure is characterized by comprising an insulating layer and a multilayer metal compounded on the insulating layer; the thickness of each layer of metal is 0.05-5 mu m; the number of the layers of the multilayer metal is 2-10;
and a conductive bonding layer is arranged between the multiple layers of metal.
2. The shielding film according to claim 1, wherein the insulating layer has a thickness of 2 to 20 μm.
3. The shielding film according to claim 1, wherein the conductive adhesive layer has a thickness of 1 to 10 μm.
4. The shielding film of claim 1, wherein each layer of metal is independently selected from nickel, gold, silver, copper, aluminum, or tin.
5. The shielding film of claim 1, wherein the thickness of the shielding film is 10 to 50 micrometers.
6. The shielding film of claim 1, wherein the multilayer metal is, in order, 0.25 to 0.35 μ ι η silver-0.25 to 0.35 μ ι η nickel;
or 0.45 to 0.55 μm copper-0.2 to 0.25 μm silver-0.95 to 1.05 μm copper-0.2 to 0.3 μm Ni-0.2 to 0.3 μm silver;
or 0.95 to 1.05 μm of copper, 0.45 to 0.55 μm of copper, 0.2 to 0.3 μm of silver, and 0.25 to 0.35 μm of nickel.
7. The shielding film of claim 1, wherein the adhesive in the conductive adhesive layer is selected from epoxy thermosetting conductive adhesives, acrylic thermosetting conductive adhesives or polyurethane thermosetting conductive adhesives commonly used in the market.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021004177A1 (en) * | 2019-07-05 | 2021-01-14 | 海宁卓泰电子材料有限公司 | Shielding film having multi-layered metal structure |
| CN114075656A (en) * | 2020-08-22 | 2022-02-22 | 昆山鑫美源电子科技有限公司 | Preparation method of conductive film, current collection and transmission material and energy storage device |
-
2019
- 2019-07-05 CN CN201921048574.0U patent/CN210130065U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021004177A1 (en) * | 2019-07-05 | 2021-01-14 | 海宁卓泰电子材料有限公司 | Shielding film having multi-layered metal structure |
| US11765875B2 (en) | 2019-07-05 | 2023-09-19 | Haining Zhuotai Electronic Materials Co., Ltd | Shielding film having multi-layered metal structure |
| CN114075656A (en) * | 2020-08-22 | 2022-02-22 | 昆山鑫美源电子科技有限公司 | Preparation method of conductive film, current collection and transmission material and energy storage device |
| CN114075656B (en) * | 2020-08-22 | 2024-01-12 | 昆山鑫美源电子科技有限公司 | Preparation method of conductive film, current collection and transmission material and energy storage device |
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