KR100907353B1 - Electromagnetic shielding film for flexible printed circuit board, shielded fpcb and method for manufacturing shielded fpcb - Google Patents

Abstract

An electromagnetic shielding film for a flexible printed circuit board is provided to improve contact of a shielding film by removing a bend part which is formed when the electromagnetic shielding film is adhered to a flexible PCB. A first cover lay is laminated on a flexible copper clad laminate, and an electromagnetic shielding film is composed of the first cover lay, a conductive layer(34), and a second cover lay(33). A first adhesive layer and a internal base film are laminated on the first cover lay, and A flexible synthetic resin used for the internal base film is one of polyimide, polyamide, polyamide imide, polyester, polyphenylene sulfide, and polyethersulfone.

Description

ELECTROMAGNETIC SHIELDING FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, SHIELDED FPCB AND METHOD FOR MANUFACTURING SHIELDED FPCB}

The present invention relates to a flexible PCB electromagnetic wave shielding film, a shielding flexible PCB with the shielding film, and a method of manufacturing the shielding flexible PCB, and more particularly, to increase the electromagnetic shielding effect of the flexible PCB and to improve the adhesion of the shielding film. To make it possible.

Recently, flexible printed circuit boards (also called "FPCBs") are widely used in electronic devices such as computers, mobile phones, video cameras, and printers. The flexible PC is formed of a copper foil printed circuit on a flexible film such as polyimide or polyester film, and is used to flexibly connect a circuit of two parts moving like a sliding phone.

Figure 1 shows the structure of such a flexible PCB briefly. FIG. 1A shows a planar structure of the flexible PC, and FIG. 1B shows a cross-sectional structure in the I-I 'direction.

The flexible PC 1 is composed of a body portion A provided on both sides for connecting two portions to a circuit and a central tail portion B connecting the body portion A. In the tail portion B, the inner copper foil layer 3 is coated on the flexible film 2 such as polyimide and polyester film to form a predetermined circuit, and is also called a flexible copper clad laminate (“FCCL”). (4) is provided, and the cover lay (7) for protecting a circuit from an external physical shock is attached to the surface of this flexible copper foil laminated board (4).

The coverlay 7 is composed of an adhesive layer 5 in close contact with the inner copper foil layer 3 and a protective film 6 attached on the adhesive layer 5. The protective film 6 is made of synthetic resin having excellent flexibility as well as heat resistance and abrasion resistance.

Bonding sheet 8 is attached to the body portion A so as to surround both the flexible copper foil laminate 4 and the coverlay 7, and the bonding sheet 8 is electrically connected to the outside. The outer copper foil layer 9 for this is formed. Most of the surface of the outer copper foil layer 9 is coated and protected with PSR ink (not shown), but constitutes a zip connector exposed to the outside at the end of the body portion A and connected to the slot of the electronic device. The body portion A has a larger thickness than the tail portion B because the bonding sheet 8, the outer copper foil layer 9, and the PSR ink are further laminated, so that the bottom portion A and the tail portion B are separated. There will be a height difference.

In addition, a via hole 10 is formed through the body portion A, and a copper plating layer 11 is formed on an inner surface of the via hole 10 to electrically connect the inner copper foil layer 3 and the outer copper foil layer 9. Connect it.

Since the flexible PC 1 configured as described above may be adversely affected by the electromagnetic waves generated inside the electronic device, a configuration capable of shielding electromagnetic interference (also referred to as "EMI") must be included. The most commonly used shielding configuration among the prior art is to attach an electromagnetic shielding film to the surface of the flexible PC 1.

Figure 2 shows the structure of the electromagnetic wave shielding film that is currently used the most.

The electromagnetic shielding film 20 is composed of an insulation layer 22, a metal thin film layer 23, and a conductive adhesive layer 24, and transparent transfer film 21 and release film 25 are attached to upper and lower surfaces thereof, respectively. . The insulation layer 22 is made of a casting film layer, the metal thin film layer 23 is made of a silver (Ag) deposition layer, the conductive adhesive layer 24 is a gold, silver, aluminum, It is made by mixing metal powders such as copper.

3 shows a flexible PC with the electromagnetic shielding film shown in FIG. 2 attached thereto. The flexible PC 1 has a structure in which the flexible copper foil laminate 4, the coverlay 7, the bonding sheet 8, and the outer copper foil layer 9 are laminated, and the detailed configuration thereof has been described above with reference to FIG. As shown.

The electromagnetic wave shielding film 20 is press-attached to the upper and lower outer surfaces of the flexible PC 1, respectively, with the transfer film 21 and the release film 25 removed. In order to exhibit the electromagnetic shielding effect, the metal thin film layer 23 should be grounded to the flexible PC1. In the case of the conventional electromagnetic shielding film 20, the metal thin film layer 23 is the via hole 10 of the flexible PC1. The copper plating layer 11 formed at the ground was indirectly grounded through the conductive adhesive layer 24 (see enlargement of "C").

This indirect grounding resulted in poor grounding, which was a major factor in reducing the shielding effect. Furthermore, the electromagnetic wave shielding film 20 has been attached to both the upper and lower sides of the flexible PC 1 as one method for enhancing the shielding effect, which increases the thickness of the tail portion B, thereby decreasing its flexibility. There was a problem.

In addition, since the electromagnetic shielding film 20 is flexibly attached to the connecting portion (“D” portion) of the body portion A and the tail portion B of the flexible PC 1 having the step difference, an adhesive lifting phenomenon occurs. It fell off during use or in severe cases was torn.

In order to solve the problem of the conventional electromagnetic shielding film 20, a method of directly coating silver powder on the surface of the tail portion of the flexible PC 1 without using the film itself has been used. However, since this method coats the silver powder on the heterogeneous resin film layer, the adhesion is low and the coating layer is peeled off, and the stepped portion coating connecting the body portion (A) and the tail portion (B) of the flexible PCB 1 is precisely There was a problem that the shielding effect is further lowered than when the electromagnetic shielding film 20 is used rather than made.

The present invention was devised to solve this problem, and by newly developing a cross-sectional structure of the electromagnetic wave shielding film and the flexible structure of the flexible PC, it is possible to improve the adhesion of the film and improve the adhesiveness of the film by being directly grounded. It is an object of the present invention to provide a PCB cost electromagnetic wave shielding film, a shielding flexible PC with the electromagnetic shielding film attached thereto, and a method for producing the shielding flexible PC.

According to the present invention for achieving the above object, the flexible PC cost electromagnetic wave shielding film includes a tail portion including a flexible copper foil laminate, a bonding sheet and an outer copper foil layer are sequentially stacked on both sides of the flexible copper foil laminate, and the flexible copper foil laminate An electromagnetic wave shielding film used for a flexible PC made of a body part having a via hole for electrical connection therewith, the first cover layer comprising an inner base film of a flexible synthetic resin and a first adhesive layer adhered onto the flexible copper clad laminate of the tail part, A second coverlay made of a conductor layer laminated on the first coverlay and directly grounded to the copper plating layer of the via hole, and a second adhesive layer adhered to the conductor layer and an outer base film of the flexible synthetic resin; The first coverlay, the conductor layer and the second coverlay It is configured to be attached horizontally to the group a flexible copper-clad laminate.

On the other hand, in order to achieve the object of the present invention, the shielding flexible PC ratio includes a tail portion including a flexible copper foil laminate, a bonding sheet and an external copper foil layer are sequentially laminated on both sides of the flexible copper foil laminate, and the electrical A body portion having a via hole for connection; A first coverlay comprising a first adhesive layer adhered on the flexible copper foil laminate of the tail portion and an inner base film of flexible synthetic resin, a conductor layer laminated on the first coverlay and directly grounded to the copper plating layer of the via hole and the conductor An electromagnetic wave shielding film composed of a second adhesive layer adhered on the layer and a second coverlay made of an outer base film of a flexible synthetic resin is attached.

On the other hand, the manufacturing method of the shielding flexible PC for achieving the object of the present invention, the step of laminating the inner copper foil layer constituting the circuit on the flexible film to produce a flexible copper foil laminated plate; A first coverlay comprising a first adhesive layer and an inner base film on the flexible copper foil laminate, a conductor layer laminated on the first coverlay, and an outer base film laminated on the conductor layer and having a second adhesive layer and a flexible synthetic resin Horizontally attaching the electromagnetic shielding film composed of the second cover lays; Sequentially laminating a bonding sheet and an outer copper foil layer on both sides of the flexible copper foil laminate having the electromagnetic shielding film; And forming a via hole through the outer copper foil layer, the bonding sheet, the electromagnetic shielding film, and the flexible copper foil laminate to directly ground the conductor layer of the electromagnetic shielding film to the copper plating layer of the via hole.

According to the present invention configured as described above, since the electromagnetic wave shielding film is no longer bent to be bonded portion can be prevented from falling or tearing the film during use due to the lifting phenomenon of the adhesive, the adhesion of the film is greatly improved.

In addition, according to the present invention, since the conductor layer of the electromagnetic shielding film is directly grounded to the copper plating layer of the via hole, more excellent grounding property can be obtained, thereby improving the electromagnetic shielding effect.

In addition, according to the present invention can reduce the work maneuver than the conventional manufacturing method to attach the electromagnetic shielding film separately, the productivity is improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The electromagnetic wave shielding film 30 according to the present invention is developed on the assumption that it is used by being attached to the flexible PC 1 illustrated in FIG. 1.

The flexible PC 1 is composed of a tail portion B including a flexible copper foil laminated plate 4 and a bonding sheet 8 and an outer copper foil layer 9 sequentially stacked on both sides of the flexible copper foil laminated board 4. A body portion A having a via hole 10 for electrical connection with the flexible copper foil laminate 4 is formed. For a detailed configuration of the flexible PC 1, refer to the above description with reference to FIG.

The flexible copper foil laminate 4 has a form in which an inner copper foil layer 3 constituting a circuit is laminated on the flexible film 2, and an adhesive layer is formed between the flexible film 2 and the inner copper foil layer 3. It is divided into two layers and three layers according to whether there is, and is divided into single-sided and double-sided types depending on which side of the flexible film 2 is laminated on the inner copper foil layer 3. According to how many inner copper foil layers 3 are laminated | stacked, it is divided into a single layer type and a multilayer type.

Electromagnetic shielding film according to the present invention can be applied to all of the various types of flexible PCBs described above, and can be applied to a flexible rigid board made of a flexible board or a rigid material through appropriate design changes. Do.

In addition, since the bonding sheet 8 can be replaced with a prepreg made by infiltrating the thermosetting resin into the glass fiber, such a change of the material will belong to the equivalent range of the present invention.

4 shows two cross-sectional structures of the flexible PC cost electromagnetic wave shielding film 30 according to the present invention.

The electromagnetic wave shielding film 30 shown in FIG. 4A is largely laminated on the first cover lay 37, which is laminated on the flexible copper clad laminate 4, and on the first cover lay 37. It consists of a conductor layer 34 directly grounded to the copper plating layer 11 of the via hole 10 and a second cover lay 33 stacked on the conductor layer 34. The release film 38 may be attached to the lower surface of the first cover lay 37 to protect the film.

The first cover lay 37 is formed by laminating a first adhesive layer 36 press-bonded on the flexible copper clad laminate 4 and an inner base film 35 made of a flexible synthetic resin thereon. The first cover lay 37 protects the flexible copper foil laminate 4 constituting the circuit from external physical shocks, and has the same function as the cover lay 7 of the conventional flexible PC 1 shown in FIG. 1. To perform.

The first adhesive layer 36 may be any one of an adhesive resin, a thermoplastic resin, a thermosetting resin, and the like, but when excellent adhesiveness and reliability are required, acrylic, epoxy, urethane, modified acrylic, and modified epoxy It is preferable to use curable adhesives of the type and modified urethane type. Curable adhesives have good adhesion and reliability because they are first heated and pressed and then fully cured. All of them preferably have a viscosity such that they do not flow out of the electromagnetic shielding film at the time of heating and pressurization.

When using this 1st adhesive bond layer 36 for simple film adhesion | attachment, it apply | coats to 5 micrometers or more, and in order to make it fully fill between the patterns of a flexible copper foil laminated board, it is apply | coated to 15-20 micrometers thick. In consideration of this point, the thickness of the first adhesive layer 36 is preferably adjusted to 5 to 20 μm.

Engineering plastics are used as the flexible synthetic resin used as the inner base film 35, and among them, polyimide, polyamide, polyamide imide, polyester ( Polyester), polyphenylene sulfide (Polyphenylene sulfide), polyether sulfon (Polyether sulfon), it is preferably used selected from nylon (Nylon). Since these engineering plastics have their specific properties, it is important to select and use a suitable one for the intended use. For example, when both flexibility and heat resistance are required, a polyimide film can be used.

The thickness of the inner base film 35 is variously applied according to the use of the flexible PCB, and a film having a thickness of 8 to 10 μm is used for a portion requiring flexibility, and a film having a thickness of 25 μm is used for a portion requiring dimensional stability. . In consideration of this point, the thickness of the inner base film 35 is preferably adjusted to 8 to 25 μm.

The conductor layer 34 is grounded to the flexible PC 1 to shield electromagnetic waves, and a metal thin film layer made of gold, silver, copper, or the like having excellent conductivity is mainly used. Since gold is expensive, manufacturing costs are high and copper is easily oxidized in contact with air, so it is preferable to use silver which is relatively inexpensive and can secure both conductivity and reliability.

As a representative material capable of forming the metal thin film layer using silver, there is an organic silver complex compound disclosed in Korean Patent Laid-Open No. 2007-52258. Using this organic silver complex compound, a nano-sized silver-containing powder can be coated on a polymer film such as polyimide to produce a thin film or directly print it. Thin film manufacturing and printing methods include spin coating, roll coating, spray coating, dip coating, flow coating and inkjet printing, offset printing, screen printing, gravure printing and flexo Printing is possible.

It is preferable that the thickness of a metal thin film layer is 0.03-2 micrometers. When the thickness of the metal thin film layer is less than 0.03 μm, the ground is not directly made with the copper plating layer 11 of the via hole 10.

On the other hand, the conductor layer 34 may be configured using a carbon nanotube (Carbon Nano Tube). Carbon nanotubes are a new material consisting of six carbon hexagons connected to each other to form a tubular shape. Electrical conductivity is similar to that of copper, thermal conductivity is similar to diamond, which is the most excellent in nature, and the strength is more than 100 times better than steel. The principle of electromagnetic shielding is that after electromagnetic waves enter a conductive material, some of it is reflected and some is converted to surface current that flows and is either released as heat or bypassed to ground. Therefore, the use of carbon nanotubes excellent in both electrical and thermal conductivity can provide a better shielding effect than the metal thin film layer.

On the other hand, the second cover lay 33 is composed of the second adhesive layer 32 which is pressure-bonded to the conductor layer 34 and the outer base film 31 made of a flexible synthetic resin thereon. The second cover lay 33 serves to protect the conductor layer 34, which is a main component that performs the electromagnetic shielding function, from external physical shocks.

Since the basic material and thickness characteristics of the second adhesive layer 32 are the same as those of the first adhesive layer 36 described above, detailed descriptions thereof will be omitted. However, since the second adhesive layer 32 is in direct contact with the conductor layer 34, the second adhesive layer 32 may be configured to have conductivity in order to improve grounding between the conductor layer 34 and the copper plating layer 11. One way to make the second adhesive layer 32 conductive is to add a conductive filler. As the conductive filler, metal powders such as gold, silver, copper, aluminum, and nickel may be used, and conductive balls made of copper wrapped with epoxy resin may be used.

Since the basic material and thickness characteristics of the flexible synthetic resin used as the outer base film 31 are the same as those of the flexible synthetic resin used as the inner base film 35, detailed description thereof will be omitted.

On the other hand, Figure 4 (b) is shown another cross-sectional structure of the electromagnetic shielding film according to the present invention. This embodiment is the same as in FIG. 4A in that it consists of a first coverlay 37, a conductor layer 34 and a second coverlay 33, but the conductor layer 34 is a second coverlay. It differs in that it is laminated | stacked between the 2nd adhesive bond layer 32 which comprises 33, and the outer base film 31, and comprises a part of 2nd coverlay 33. As shown in FIG.

According to this embodiment, since the lower part of the second cover lay 33 is composed of an adhesive layer, the bonding force with the first cover lay 37 is increased, and the process of simply joining the two cover lays 33 and 37 manufactured separately. Since only the electromagnetic wave shielding film 30 can be completed, there is an advantage that the work man-hour is reduced. In addition, the conductive layer 34 is directly grounded with the copper plating layer 11 of the via hole 10 to improve the shielding effect.

5 shows a shielding flexible PC with the electromagnetic shielding film 30 according to the present invention configured as described above. Although FIG. 5 shows an electromagnetic wave shielding film having a cross-sectional structure of FIG. 4A, the electromagnetic shielding film having a cross-sectional structure of FIG. . For the sake of understanding, the same components constituting the flexible PC 1 are denoted by the same reference numerals as in FIG. 3.

The first technical feature of the present invention, which is distinguished from the conventional shielding flexible PCB published in FIG. 3, is that the entire electromagnetic shielding film 30 belongs to the flexible copper foil laminate 4 belonging to the tail portion B of the flexible PC1. Only horizontally attached, it is not bent attached to the step portion connecting the body portion (A) and the tail portion (B) of the shielding flexible PC (1). In other words, in the electromagnetic wave shielding film 30 having the laminated structure of FIG. 4A, the first cover lay 37, the conductor layer 34, and the second cover lay 33 are entirely formed of the flexible copper foil laminate 4. ), And the electromagnetic wave shielding film 30 having the laminated structure of FIG. 4B has a first cover lay 37 and an entire second cover lay 33 on the flexible copper clad laminate 4. It is attached horizontally.

 As a result, the curved adhesive portion is eliminated and the electromagnetic shielding film 30 can be prevented from being dropped or torn during use due to the lifting phenomenon of the adhesive as in the prior art, thereby improving the adhesion of the film.

A second technical feature of the present invention is that the conductor layer 34 of the electromagnetic shielding film 30 is directly grounded to the copper plating layer 11 of the via hole 10 (see section “E” in FIG. 5). Therefore, as shown in FIG. 3, the metal thin film layer 23 may have a better grounding property than the case where the metal thin film layer 23 is indirectly grounded to the copper plating layer 11 of the via hole 10 through the conductive adhesive layer 24. Is improved.

Referring to Figure 6 will be briefly described a method of manufacturing a shielding flexible PC according to the present invention.

First, the flexible copper foil laminated board 4 is manufactured by laminating | stacking the internal copper foil layer 3 which comprises a circuit on the flexible film 2 (S10). The flexible copper foil laminated board 4 may be manufactured directly, and you may purchase and arrange the flexible copper foil laminated board 4 currently commercially available.

Immediately attaching the electromagnetic shielding film 30 according to the present invention to the flexible copper foil laminate 4 (S20). More specifically, a first cover lay 37 made of a first adhesive layer 36 and an inner base film 35 on the flexible copper foil laminate 4, and a conductor layer laminated on the first cover lay 37. (34) and an electromagnetic wave shielding film (30) composed of a second cover layer (33) laminated on the conductor layer (34) and made of a second adhesive layer (32) and an outer base film (31) of a flexible synthetic resin. do. Here, although an electromagnetic wave shielding film having a lamination structure shown in FIG. 4 (a) is illustrated, an electromagnetic wave shielding film having a lamination structure shown in FIG. 4 (b) may be used.

In this step, as shown in FIG. 3, the bonding sheet 8 and the outer copper foil layer 9 are laminated on both sides of the flexible copper clad laminate 4, the via holes 10 are formed, and then the electromagnetic wave shielding film 20 is attached. It is distinguished from the conventional manufacturing method. That is, the step of attaching the electromagnetic wave shielding film according to the present invention is the same as the step of attaching the conventional coverlay 7 on the flexible copper foil laminate 4 in FIG. Therefore, according to the present invention, since the cover wave 7 can be attached at the same time to the electromagnetic shielding film 30 at the same time, the work maneuver is reduced. In addition, since the electromagnetic wave shielding film 30 can be horizontally attached, adhesiveness is greatly improved compared to the conventional electromagnetic wave shielding film in which both ends are bent and attached as shown in FIG. 3.

After attaching the electromagnetic wave shielding film 30, the bonding sheet 8 and the outer copper foil layer 9 are sequentially laminated on both sides of the flexible copper foil laminate 4 (S30). This completes the entire form of the shielding flexible PC according to the present invention.

Finally, a via hole 10 is formed to penetrate the outer copper foil layer 9, the bonding sheet 8, the electromagnetic shielding film 30, and the flexible copper foil laminate 4, and the copper plating layer 11 is coated therein. (S40). As a result, the outer copper foil layer 9 and the flexible copper foil laminate 4 are circuit-connected, and the conductor layer 34 of the electromagnetic shielding film 30 is directly grounded with the copper plating layer 11 of the via hole 10. . In this case, since the ground resistance is almost " 0 ", the shielding effect is greatly improved compared to the conventional electromagnetic shielding film in which the conductive layer and the copper plating layer of the via hole are indirectly grounded as shown in FIG.

In order to confirm the technical effects of the electromagnetic wave shielding film according to the present invention described above, the following comparative experiment was carried out.

First, as an example according to the present invention, a shielding flexible PC of the type shown in FIG. 5 was manufactured. Modified epoxy resins were used as the first and second adhesive layers 36 and 32 of each coverlay, and polyimide films were used as the inner and outer base films 35 and 31, respectively. In addition, the conductor layer 34 was coated with nano-sized silver powder and then directly grounded to the copper plating layer of the via hole. The electromagnetic wave shielding film 30 comprised in this way was attached only to one surface of the flexible copper foil laminated board 4, and the shielding flexible PC ratio was finally completed.

On the other hand, as a comparative example, the shielding flexible PC of the form shown in FIG. 3 was manufactured. That is, the electromagnetic wave shielding film 20 is flexibly attached to the stepped portion connecting the body portion A and the tail portion B of the shielding flexible PC, and the metal is formed using the anisotropic conductive adhesive layer 24 instead of the modified epoxy resin. The thin film layer 23 is indirectly grounded to the copper plating layer of the via hole. In addition, the material of the base film and the like were prepared in the same manner as in Example. The electromagnetic wave shielding film 30 comprised in this way was affixed on both surfaces of the flexible copper foil laminated board 4, and the shielding flexible PC ratio was finally completed.

Table 1 shows the results of comparing the physical properties of the two shielding flexible PCB.

Adhesive force (Kgf / cm) After Ground Resistance (mΩ) Heat resistance Cycles Filling resistance Exterior Curl (mm) Example 1.3 0 OK 2 1 × 10 ⁶ OK (◎) Comparative example 0.6 250 OK 6 6 × 10 ⁵ OK (△)

The Example showed a better effect than the comparative example in terms of all physical properties. In particular, the embodiment showed a very excellent adhesion compared to the comparative example was bent attached by improving the bonding structure of the electromagnetic shielding film to be attached horizontally. In addition, since the grounding resistance is "0" due to the direct grounding of the via hole with the copper plating layer, this greatly contributes to the improvement of the shielding effect described later.

In addition, both the appearance was good in terms of heat resistance indicating the degree to withstand the heat (200 ° C. or more) generated when soldering the shielding flexible PC, but the example was low in the case of curl (a number indicating the degree of warpage caused by heat). The Examples showed excellent effects in terms of both the resistance to measuring the number of times until the bending was repeatedly applied to the shielding flexible PCB and the filling resistance indicating the degree to which the adhesive layer was filled between the patterns of the flexible copper clad laminate.

Table 2 shows the results of comparing the shielding effect of the two shielding flexible PCB.

Frequency (MHz) 30 100 200 400 600 800 900 1000 Shielding Rate (dB) Example 40 51 59 53 58 59 59 58 Comparative example 33 48 57 51 52 55 55 56

The example showed better shielding effect than the comparative example in all frequency ranges. Moreover, although the Example showed an improved shielding effect to the comparative example attached to both sides even though the electromagnetic shielding film was attached only to one side of the tail portion B including the flexible copper clad laminate 4 It will show better shielding effect at equivalent attachment conditions.

1 is a view showing a general flexible PC ratio.

2 is a view showing a conventional flexible PC cost electromagnetic shielding film.

3 is a view showing a flexible PC with an electromagnetic shielding film of FIG.

Figure 4 is a view showing a flexible PCB electromagnetic wave shielding film according to the present invention.

5 is a view showing a flexible PC with an electromagnetic shielding film of FIG.

Figure 6 is a flow chart showing a method of manufacturing a shielding flexible PC according to the present invention.

※ Explanation of code for main part of drawing ※

30: electromagnetic wave shielding film 31: outer base film

32: second adhesive layer 33: second cover-lay

34: conductor layer 35: inner base film

36: first adhesive layer 37: first cover lay

38: release film

Claims (20)

The tail portion B including the flexible copper foil laminate 4 and a bonding sheet 8 and an outer copper foil layer 9 are sequentially stacked on both sides of the flexible copper foil laminate 4, and the flexible copper foil laminate 4 is As the electromagnetic shielding film used in the flexible PC (1) consisting of a body portion (A) formed with a via hole 10 for electrical connection of A first cover comprising a first adhesive layer 36 adhered on the flexible copper foil laminated plate 4 of the tail portion B and an inner base film 35 of a flexible synthetic resin laminated on the first adhesive layer 36. Ray 37; A conductor layer 34 stacked on the first coverlay 37 and directly grounded to the copper plating layer 11 of the via hole 10; A second cover layer 33 composed of a second adhesive layer 32 bonded onto the conductor layer 34 and an outer base film 31 of a flexible synthetic resin laminated on the second adhesive layer 32, , The first coverlay (37), the conductor layer (34) and the second coverlay (33) are flexible PCB cost electromagnetic shielding film, characterized in that the whole is configured to be attached horizontally to the flexible copper foil laminate (4). The tail portion B including the flexible copper foil laminate 4 and a bonding sheet 8 and an outer copper foil layer 9 are sequentially stacked on both sides of the flexible copper foil laminate 4, and the flexible copper foil laminate 4 is As the electromagnetic shielding film used in the flexible PC (1) consisting of a body portion (A) formed with a via hole 10 for electrical connection of A first cover comprising a first adhesive layer 36 adhered on the flexible copper foil laminated plate 4 of the tail portion B and an inner base film 35 of a flexible synthetic resin laminated on the first adhesive layer 36. Ray 37; A second adhesive layer 32 adhered to the inner base film 35, a conductor layer 34 laminated on the second adhesive layer 32 and directly grounded to the copper plating layer 11 of the via hole 10, and It consists of a second cover lay 33 made of an outer base film 31 of flexible synthetic resin laminated on the conductor layer 34, The first coverlay (37) and the second coverlay (33) are flexible PCB cost electromagnetic shielding film, characterized in that the whole is configured to be attached horizontally to the flexible copper foil laminate (4). delete delete The method according to claim 1 or 2, The conductive layer 34 is made of a metal thin film layer, the thickness of the flexible PCB cost electromagnetic shielding film, characterized in that 0.03 ~ 2㎛. The method according to claim 1 or 2, The conductor layer 34 is a flexible PCB electromagnetic shielding film, characterized in that consisting of carbon nanotubes (Carbon Nano Tube). The method according to claim 1 or 2, The flexible synthetic resin constituting the inner base film 35 and the outer base film 31 is selected from polyimide, polyamide, polyamideimide, polyester, polyphenylene sulfide, polyethersulfone, nylon, Flexible PCB cost electromagnetic shielding film, characterized in that the thickness of 8 to 25㎛. The method according to claim 1 or 2, The first adhesive layer 36 and the second adhesive layer 32 is selected from acrylic, epoxy, urethane, modified acrylic, modified epoxy and modified urethane curable adhesives, the thickness of which is 5 ~ 20㎛ Flexible PC cost electromagnetic wave shielding film to make. The method according to claim 8, The second adhesive layer 32 is a flexible PCB electromagnetic wave shielding film, characterized in that the conductive adhesive layer. The tail portion B including the flexible copper foil laminate 4 and a bonding sheet 8 and an outer copper foil layer 9 are sequentially stacked on both sides of the flexible copper foil laminate 4, and the flexible copper foil laminate 4 is Consists of a body portion (A) formed with a via hole 10 for electrical connection of A first cover comprising a first adhesive layer 36 adhered on the flexible copper foil laminated plate 4 of the tail portion B and an inner base film 35 of a flexible synthetic resin laminated on the first adhesive layer 36. Ray 37; A conductor layer 34 stacked on the first coverlay 37 and directly grounded to the copper plating layer 11 of the via hole 10; Electromagnetic waves composed of a second adhesive layer 32 bonded on the conductor layer 34 and a second cover lay 33 made of an outer base film 31 of a flexible synthetic resin laminated on the second adhesive layer 32. Electromagnetic shielding flexible PCB, characterized in that the shielding film 30 is attached. The tail portion B including the flexible copper foil laminate 4 and a bonding sheet 8 and an outer copper foil layer 9 are sequentially stacked on both sides of the flexible copper foil laminate 4, and the flexible copper foil laminate 4 is Consists of a body portion (A) formed with a via hole 10 for electrical connection of A first cover comprising a first adhesive layer 36 adhered on the flexible copper foil laminated plate 4 of the tail portion B and an inner base film 35 of a flexible synthetic resin laminated on the first adhesive layer 36. Ray 37; A second adhesive layer 32 adhered to the inner base film 35, a conductor layer 34 laminated on the second adhesive layer 32 and directly grounded to the copper plating layer 11 of the via hole 10, and An electromagnetic wave shielding flexible PCB comprising an electromagnetic wave shielding film (30) composed of a second cover lay (33) made of an outer base film (31) of a flexible synthetic resin laminated on the conductor layer (34). The method according to claim 10, The first cover lay (37), the conductor layer (34) and the second cover lay (33) are electromagnetic shielding flexible PCB, characterized in that the whole is horizontally attached to the flexible copper foil laminate (4). The method according to claim 11, The first cover lay (37) and the second cover lay (33) are electromagnetic shielding flexible PCB, characterized in that the whole is attached horizontally to the flexible copper foil laminate (4). The method according to claim 10 or 11, The conductor layer 34 is made of a metal thin film layer, the thickness is 0.03 ~ 2㎛ characterized in that the electromagnetic shielding flexible PC. The method according to claim 10 or 11, The conductor layer 34 is electromagnetic shielding flexible PCB, characterized in that made of carbon nanotubes. The method according to claim 10 or 11, The flexible synthetic resin constituting the inner base film 35 and the outer base film 31 is selected from polyimide, polyamide, polyamideimide, polyester, polyphenylene sulfide, polyethersulfone, and nylon. Electromagnetic shielding flexible PCB having a thickness of 8 to 25 µm. The method according to claim 10 or 11, The first adhesive layer 36 and the second adhesive layer 32 is selected from acrylic, epoxy, urethane, modified acrylic, modified epoxy and modified urethane curable adhesives, the thickness of which is 5 ~ 20㎛ Electromagnetic shielding flexible PC. The method according to claim 17, The second adhesive layer 32 is electromagnetic shielding flexible PCB, characterized in that the conductive adhesive layer. Stacking the internal copper foil layer 3 constituting the circuit on the flexible film 2 to produce a flexible copper foil laminate 4; A first coverlay 37 made of a first adhesive layer 36 and an inner base film 35 on the flexible copper foil laminate 4, a conductor layer 34 laminated on the first coverlay 37, and the Horizontally attaching the electromagnetic shielding film 30 composed of a second cover layer 33 laminated on the conductor layer 34 and made of a second adhesive layer 32 and an outer base film 31 of flexible synthetic resin; Laminating a bonding sheet (8) and an outer copper foil layer (9) on both sides of the flexible copper foil laminate (4) to which the electromagnetic wave shielding film (30) is attached; And A via hole 10 is formed to penetrate the outer copper foil layer 9, the bonding sheet 8, the electromagnetic shielding film 30, and the flexible copper foil laminate 4 to form a conductor layer 34 of the electromagnetic shielding film 30. Directly grounding the copper plating layer (11) of the via hole (10). Stacking the internal copper foil layer 3 constituting the circuit on the flexible film 2 to produce a flexible copper foil laminate 4; A first coverlay 37 made of a first adhesive layer 36 and an inner base film 35 on the flexible copper foil laminate 4, a second adhesive layer 32 on the first coverlay 37, Horizontally attaching the electromagnetic shielding film 30 composed of the second coverlay 33 in which the conductor layer 34 and the outer base film 31 are sequentially stacked; Laminating a bonding sheet (8) and an outer copper foil layer (9) on both sides of the flexible copper foil laminate (4) to which the electromagnetic wave shielding film (30) is attached; And A via hole 10 is formed to penetrate the outer copper foil layer 9, the bonding sheet 8, the electromagnetic shielding film 30, and the flexible copper foil laminate 4 to form a conductor layer 34 of the electromagnetic shielding film 30. Directly grounding the copper plating layer (11) of the via hole (10).

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