CN115696787A - Manufacturing method of high-shielding flexible circuit board - Google Patents
Manufacturing method of high-shielding flexible circuit board Download PDFInfo
- Publication number
- CN115696787A CN115696787A CN202211166307.XA CN202211166307A CN115696787A CN 115696787 A CN115696787 A CN 115696787A CN 202211166307 A CN202211166307 A CN 202211166307A CN 115696787 A CN115696787 A CN 115696787A
- Authority
- CN
- China
- Prior art keywords
- flexible
- board
- circuit
- circuit board
- independent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000009975 flexible effect Effects 0.000 title claims abstract description 302
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims abstract description 144
- 238000012545 processing Methods 0.000 claims abstract description 82
- 239000004744 fabric Substances 0.000 claims abstract description 80
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000000853 adhesive Substances 0.000 claims abstract description 46
- 230000001070 adhesive effect Effects 0.000 claims abstract description 46
- 229910052802 copper Inorganic materials 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 46
- 238000004080 punching Methods 0.000 claims abstract description 29
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 238000004804 winding Methods 0.000 claims abstract description 7
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 45
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 36
- 229910052737 gold Inorganic materials 0.000 claims description 36
- 239000010931 gold Substances 0.000 claims description 36
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 32
- 238000005452 bending Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 20
- 238000013461 design Methods 0.000 abstract description 8
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 90
- 239000010408 film Substances 0.000 description 43
- 230000035882 stress Effects 0.000 description 35
- 238000010586 diagram Methods 0.000 description 12
- 239000000047 product Substances 0.000 description 12
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000013039 cover film Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000009739 binding Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing method of a high-shielding flexible circuit board, which comprises the following steps: manufacturing a circuit pattern layer on a flexible copper clad laminate, laminating a second flexible copper clad laminate on the surface of the flexible copper clad laminate, processing the circuit copper layer to form a mesh circuit, attaching a covering film layer, drilling and electroplating to form stress-relief holes, attaching a shielding film on the surface of the covering film layer, punching to form a plurality of independent wiring harness flexible boards, attaching single-sided adhesive acetic acid cloth to two ends of the covering film layer, attaching double-sided adhesive acetic acid cloth to the surface of the covering film layer, laminating and adhering the single-sided adhesive acetic acid cloth and the double-sided adhesive acetic acid cloth to each other until an integral wiring harness circuit board is formed, and winding and wrapping the laminating area by using the acetic acid cloth to form a high-shielding flexible circuit board; through design and processing netted circuit, shielding layer, acetic acid cloth, form triple protective effect, through the winding of acetic acid cloth stromatolite, form new flexible circuit board + pencil product mode, can replace the coaxial line, possess high shielding performance, high wiring density, high reliability, the comprehensive effect of the low processing degree of difficulty.
Description
Technical Field
The invention relates to the field of design and processing of flexible circuit boards, in particular to a manufacturing method of a high-shielding flexible circuit board.
Background
With the continuous development of terminal products such as new energy vehicles and the like, the flexible circuit board is used as a key electronic component for internal wiring and wiring, the application is more and more extensive, and based on the advantages of good flexibility of the flexible circuit board, high-integration-level wiring characteristics, flexible adaptability of application scenes, high reliability and the like, the flexible circuit board is more and more used for replacing a wiring harness circuit in the field of terminal products such as new energy vehicles and the like.
Generally, because the wiring harness circuit is long and the interference possibly suffered by the transmission process of the electric signals and other signals is large, the wiring harness circuit generally needs to be subjected to electromagnetic shielding treatment so as to improve the anti-interference capability of the electric signals and other signals in the transmission process; and under the condition that the flexible circuit board replaces a wire harness, the flexible circuit board also needs to be subjected to electromagnetic shielding treatment.
At present, because terminal products such as new energy automobile's function is more and more powerful, to replacing the wiring density of pencil class flexible circuit board, the reliability, high shielding nature, the requirement of performance such as big signal transmission effect also is more and more high, therefore flexible circuit board can adopt and increase the flexible circuit board number of piles, improve wiring density, use processing methods such as silver thick liquid, electromagnetic shielding film, promote its performance and effect, to the higher flexible circuit board of wiring density requirement, then can adopt multilayer flexible circuit board, or multilayer layer-stepping flexible circuit board's design.
However, the multilayer flexible circuit board has a more complex structure and a longer processing flow, so that the processing difficulty is higher, the processing cost is higher, and the processing difficulty of the multilayer layered flexible circuit board is higher; in addition, the silver paste and the electromagnetic shielding film are used only, so that the processing difficulty is further increased, and the processing cost is further increased; in order to meet the comprehensive consideration of high shielding performance, high wiring density, high reliability, low processing difficulty and low processing cost of the flexible circuit board in a limited assembly space, the requirement of effectively balancing all aspects is difficult to achieve by simply increasing the number of layers or designing the flexible circuit board into a multi-layer layered structure.
Based on the above background and problems, it is desirable to provide a simple and feasible method for manufacturing a high-shielding flexible circuit board, which is convenient for balancing various performance and effect requirements of a wire harness type flexible circuit board.
Disclosure of Invention
The invention aims to solve the problem of comprehensive performance balance of high processing difficulty, high processing cost, high shielding property, high reliability and the like required by replacing a wire harness type flexible circuit board in the prior art, and provides a manufacturing method of a high-shielding flexible circuit board, which is characterized by comprising the following steps of:
s10: taking a flexible copper-clad plate, and manufacturing a circuit pattern layer on the flexible copper-clad plate to form a pattern flexible plate;
s20: pressing and covering a second flexible copper clad laminate on the circuit pattern layer of the pattern flexible board, wherein the second flexible copper clad laminate comprises a circuit dielectric layer and a circuit copper layer, and the circuit dielectric layer covers the circuit pattern layer; carrying out graphic processing on the circuit copper layer to form a mesh circuit, and attaching a covering film layer on the second flexible copper-clad plate to form a mesh circuit flexible plate;
s30: drilling the reticular circuit flexible board, electroplating to form a stress relief hole, and integrally forming the stress relief hole flexible board;
s40: attaching a shielding film to the surface of the destressing hole flexible plate to form a shielding film flexible plate;
s50: punching the shielding film flexible board to form an independent wiring harness flexible board comprising a plurality of sub-boards which are adjacently distributed in parallel;
s60: attaching single-sided adhesive acetate cloth to two ends of the independent wiring harness flexible plate in the length direction, and attaching double-sided adhesive acetate cloth to one surface of part of the independent wiring harness flexible plate;
s70: laminating and adhering the independent wiring harness flexible plate which is not adhered with the double-sided adhesive acetic acid cloth on the independent wiring harness flexible plate which is adhered with the double-sided adhesive acetic acid cloth to form a primary wiring harness flexible plate;
s80: repeating the steps from S60 to S70 until the independent wiring harness flexible boards are overlapped to form an integral wiring harness circuit board;
s90: and winding and wrapping the overlapped area of the integral wiring harness circuit board by using single-sided adhesive acetic acid cloth to form the high-shielding flexible circuit board.
Further, the manufacturing of the circuit pattern layer on the flexible copper clad laminate further comprises the step of manufacturing golden finger patterns, wherein the golden finger patterns are located at two ends of the pattern flexible board in the length direction; and pressing and covering a second flexible copper clad laminate on the circuit pattern layer of the pattern flexible board, and further comprising the steps of attaching a release film to the position area, corresponding to the golden finger pattern, of the dielectric layer of the second flexible copper clad laminate and then performing the pressing and covering processing process.
Further, after the stress relief hole flexible plate is manufactured, depth control grooving processing is carried out on the surface of the stress relief hole flexible plate corresponding to the release film area, the second flexible copper clad laminate covering the golden finger pattern, the release film and the covering film layer are removed, the golden finger pattern is exposed, and the golden finger pattern is subjected to electric gold processing to form a golden finger.
Furthermore, the destressing holes are located at two ends of the flexible bending area of the destressing hole flexible plate in the length direction and are away from the golden fingers by a certain distance, and the destressing holes are distributed at two ends of the flexible bending area in the length direction in a pairwise corresponding mode;
the punching is carried out along the seam punching processing between the two corresponding distressing holes, and the punching and cutting are simultaneously carried out on the opposite single-side hole rings of the two opposite distressing holes.
Further, the double-sided adhesive acetate cloth is attached to part of the sub-board of the independent wiring harness flexible board independently according to the width of the independent wiring harness flexible board and the length of part of the seam punching;
the adhesive double-sided adhesive acetate cloth is distributed according to the distribution rule that the independent wiring harness flexible plates distributed from the center are attached to two ends, the surfaces of two adjacent independent wiring harness flexible plates are attached, one independent wiring harness flexible plate is not attached at intervals, and the surfaces of two adjacent independent wiring harness flexible plates are attached;
will not be attached the sticky acetic acid cloth of two-sided independent pencil flexonics board, stromatolite adhesion have the sticky acetic acid cloth of two-sided on the independent pencil flexonics board, for will not be attached the sticky acetic acid cloth of two-sided independent pencil flexonics board is by middle part position to having the sticky acetic acid cloth of two-sided pulls on the independent pencil flexonics board and folds and attach.
Furthermore, single-sided adhesive acetate cloth is attached to the two ends of the independent wire harness flexible board in the length direction, and the single-sided adhesive acetate cloth is integrally attached to the position of the stress relief hole along the intersection line of the golden finger pattern and the independent wire harness flexible board.
Further, the mesh circuit covers the surface of the patterned flexible board except the gold finger patterns.
Further, the line width of the mesh line is 0.1mm to 2.0mm.
Further, the mesh length of the mesh wire multiplied by the mesh width of the mesh wire is 0.1mm × 0.1mm to 2.0mm × 2.0mm.
Further, the stress relief hole comprises an annular ring, and the unilateral width of the annular ring is 50-300 μm.
In the technical scheme, the net-shaped circuit is added to achieve the effect of a first shielding layer on the flexible circuit board, the internal stress of the flexible board is removed through the stress removing hole, and the punched stress and the stress generated by overlapping, adhering and winding the subsequent independent wire harness flexible boards are removed; the method is characterized in that acetic acid cloth is adopted to superpose and adhere independent wiring harness flexible boards of the flexible circuit board to form an integral wiring harness circuit board, and in the whole process, under the condition that the number of layers of the circuit board is not specially increased or the structure of the circuit board is not changed, single circuit board is adhered, wound and packaged by using acetic acid cloth to form a product mode similar to a flexible circuit board plus wiring harnesses, so that a novel intermediate product which is excessive from a traditional wiring harness product to a flexible circuit board product is invented, a coaxial line can be replaced, and the cost is only about 10% of the replaced coaxial line; and the shielding performance of the reticular shielding circuit and the acetic acid cloth is utilized in the processing, so that the flexible circuit board has high shielding performance, and the comprehensive performance products and the processing effect of the high shielding performance, the high wiring density, the high reliability, the low processing difficulty and the low processing cost of the flexible circuit board can be met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic process flow diagram of an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional structure diagram of a circuit pattern layer manufactured by taking a double-sided copper-clad plate according to an embodiment of the invention;
FIG. 3 is a schematic cross-sectional view of a flexible board with a mesh circuit according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional structural diagram of a flexible board with a stress relief hole and a flexible board with a shielding film according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a planar structure of a flexible board for forming an independent wire harness according to an embodiment of the present invention;
FIG. 6 is a schematic plane structure diagram of the single-sided adhesive acetate cloth and the double-sided adhesive acetate cloth according to the embodiment of the invention;
FIG. 7 is a schematic diagram of a planar structure for forming a primary wiring harness flexible board according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a planar structure of an embodiment of the present invention for fabricating an integrated wiring harness circuit board;
fig. 9 is a schematic plan view illustrating a structure of a high-shielding flexible circuit board according to an embodiment of the invention.
The reference numbers indicate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Flexible board with |
5110 | |
| 110 | Flexible copper- |
5120 | |
| 1110 | First |
300 | Shielding film |
| 1120 | |
3210 | The first |
| 1130 | Second |
3220 | Second |
| 200 | Flexible board with net- |
6110 | First independent harness |
| 210 | Second flexible copper-clad plate (1) | 6120 | Second independent harness |
| 310 | Second flexible copper-clad plate (2) | 6130 | Third independent wire harness |
| 2110 | Line medium layer (1) | 6140 | Fourth independent wire harness |
| 3110 | Line medium layer (2) | 6210 | Punching gap |
| 2120 | A |
7110 | Single-sided adhesiveViscose |
| 3120 | |
7120 | Double-sided adhesive acetate cloth |
| 2130 | A first |
400 | Preliminary wiring harness |
| 3130 | Second cover film layer | 6110-6120 | First and second laminated |
| 2140 | First release film | 6130-6140 | Third four- |
| 3140 | |
10 | High-shielding |
| 300 | Shielding film flexible plate | 6110-6140 | Integrated wiring |
| 410 | Stress relief hole | 6110-6140 | First, second, third and fourth laminated |
| 4110 | Aperture ring | / | / |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the prior art, the flexible circuit board replacing the wiring harness generally achieves the effects of high wiring density and high reliability by increasing the number of circuit layers, namely, the flexible circuit board can be designed into a multilayer flexible circuit board, and if the flexible circuit board needs to be plugged, a gold finger can be designed to meet the function of electric connection.
The flexible circuit board can also be designed as a multilayer layered circuit board, generally, the multilayer layered circuit board is a rigid-flex combined circuit board, i.e. a flexible board in a flex area, which is divided into multiple layers, and the items are separately arranged, and the multiple layers of flexible boards are gathered into the rigid board to form the rigid board as a support, and the flexible board has the effect of flexing, folding and connecting.
The two modes all cause the design difficulty of the circuit board to increase, the processing flow increases and the processing difficulty increases.
In the embodiment of the invention, the high-shielding flexible circuit board can be a single-layer board or a double-sided board, and the processing process of the high-shielding flexible circuit board under the technology of the invention is the same.
The embodiment of the invention adopts a double-sided board as a specific implementation process to explain the technical method.
Referring to fig. 1, fig. 1 is a schematic process flow diagram according to an embodiment of the invention.
The manufacturing process of the embodiment of the present invention is implemented by using the flow of steps in fig. 1, and the flow of steps in fig. 1 will be further described step by step.
Referring to fig. 2, fig. 2 is a schematic cross-sectional structure diagram of a circuit pattern layer manufactured by taking a double-sided copper-clad plate according to an embodiment of the present invention; the processing procedure of fig. 2, which is the processing procedure of step S10 in fig. 1, is as follows:
s10: and (3) taking a flexible copper clad laminate, and manufacturing a circuit pattern layer on the flexible copper clad laminate to form a pattern flexible board.
As shown in fig. 2, the flexible copper clad laminate is a double-sided flexible copper clad laminate, and the double-sided flexible copper clad laminate is manufactured to form a double-sided circuit pattern layer, that is, a first circuit pattern layer 1110 and a second circuit pattern layer 1130 are formed, and the middle layer of the double-sided flexible copper clad laminate is an insulating medium layer 1120, so that the graphic flexible board 100 is manufactured.
In one embodiment, the manufacturing of the circuit pattern layer for the flexible copper clad laminate further includes manufacturing a gold finger pattern, as shown in fig. 2, the first circuit pattern layer 1110 and the second circuit pattern layer 1130 in fig. 2 include the gold finger pattern; the gold finger patterns are located at both ends of the long direction of the graphic flexible sheet 100.
The flexible circuit board of the embodiment is a product for replacing a wire harness, and the wire harness circuit board is connected with other modules, so that the wire harness circuit board generally needs to be spliced or welded by using a gold finger, and has good weldability and reliability; and a golden finger is used for plugging a circuit.
Referring to fig. 3, fig. 3 is a schematic cross-sectional structure diagram of a flexible board for forming a mesh circuit according to an embodiment of the present invention; the processing procedure of fig. 3, which is the processing procedure of step S20 in fig. 1, is as follows:
s20: pressing and covering a second flexible copper clad laminate on the circuit pattern layer of the pattern flexible board, wherein the second flexible copper clad laminate comprises a circuit dielectric layer and a circuit copper layer, and the circuit dielectric layer covers the circuit pattern layer; carrying out graphic processing on the circuit copper layer to form a mesh circuit, and attaching a covering film layer on the second flexible copper-clad plate to form a mesh circuit flexible plate;
as shown in fig. 3, a second flexible copper clad laminate (1) 210 and a second flexible copper clad laminate (2) 310 are respectively laminated on the first circuit pattern layer 1110 and the second circuit pattern layer 1130 of the graphic flexible board 100; the second flexible copper-clad plate (1) 210 comprises a circuit dielectric layer (1) 2110 and a circuit copper layer (1); the second flexible copper-clad plate (2) 310 comprises a circuit dielectric layer (2) 3110 and a circuit copper layer (2); the circuit dielectric layer (1) and the circuit dielectric layer (2) are respectively covered on the first circuit pattern layer 1110 and the second circuit pattern layer 1130; carrying out pattern processing on the circuit copper layer (1) and the circuit copper layer (2) to form a first reticular circuit 2120 and a second reticular circuit 3120; the first cover film layer 2130 and the second cover film layer 3130 are respectively attached to the second flexible copper clad laminate (1) 210 and the second flexible copper clad laminate (2) 310 to form the mesh circuit flexible board 200.
The design increases first reticular circuit 2120 and second reticular circuit 3120, makes the double-sided board originally, forms the four-layer board of pseudo nature, on the one hand, has cancelled the via hole of golden finger, makes the golden finger set up in the inlayer, can effectively reduce the transmission loss of signal of telecommunication, and on the other hand, the four-layer board of pseudo nature can provide upper and lower two-layer shielding circuit layer processing for the double-sided board.
It should be noted that after the gold finger is disposed on the inner layer, the gold finger can be processed by uncovering the cover, that is, the cover layer at the position of the gold finger is removed first, the subsequent processing is performed by attaching blue glue for protection, and the blue glue is torn off after the processing is completed; the method can also adopt a mode of uncovering after processing, namely, a covering copper layer contacted with the golden finger is designed on the covering layer at the position of the golden finger, then processing is carried out, and finally, the covering layer at the position of the golden finger is removed through a processing mode of depth-controlled plate milling or laser depth-controlled ablation; the two processing modes can be selected according to actual requirements.
Further, the mesh circuit covers the surface of the graphic flexible board except the golden finger graphic; as shown in fig. 3, the first mesh wire 2120 and the second mesh wire 3120 cover both surfaces of the graphic flexible sheet 100, respectively.
Further, the line width of the mesh line is 0.1mm to 2.0mm.
Preferably, the mesh length of the mesh wire multiplied by the mesh width of the mesh wire is 0.1mm × 0.1mm to 2.0mm × 2.0mm.
In this embodiment, the mesh circuit pattern is formed on the double-sided flexible printed circuit board, so as to form an effective shielding and protecting function for the first circuit pattern layer 1110 and the second circuit pattern layer 1130, and generally, the thickness of the mesh circuit is 10 μm to 50 μm so as not to affect the bending performance of the flexible printed circuit board itself.
It should be further noted that, because the flexible circuit board of the wire harness is generally designed with impedance lines, such a circuit board generally has a requirement on impedance values, but after the mesh-shaped circuit pattern is designed, a certain signal shielding effect, or a local shielding effect, or an effect of making the impedance values of the impedance lines uneven, is also generated on the impedance lines, and therefore, a certain adjustment and design need to be made on the line width of the mesh-shaped circuit pattern itself and the mesh width, and preferably, a thinner line width, for example, a line width of 100 μm or 150 μm or 200 μm, may be selected; the length and width of the mesh are 0.1mm × 0.1mm to 2.0mm × 2.0mm, and in the case that the impedance value is adjusted to the required value, it is preferable that the line widths of the mesh lines are selected to be the same, that is, for example, the line width of the mesh line is 1.0mm, and the length and width of the mesh are selected to be 1.0mm × 1.0mm, so that the best shielding effect and the best flexible effect can be achieved, and the effect of matching the best impedance with the thinnest material can be achieved; and a finer size can be selected according to actual requirements, for example, the lengths and the widths of the grids with the sizes of 0.1mm multiplied by 0.1mm, 0.15mm multiplied by 0.15mm, 0.5mm multiplied by 0.5mm and 0.8mm multiplied by 0.8mm can be selected, so that the grid size effect matched with the performances of the flexible circuit board, such as impedance performance, bending performance, processing reliability, attractiveness and the like, is realized.
It should be further noted that, in this embodiment, the requirement of the impedance value of the impedance line can be adjusted and satisfied by adjusting the line width and the grid size of the mesh circuit, and the impedance value can be adjusted by adjusting the width of the impedance line itself, generally, the wider the width of the impedance line is, the smaller the impedance value is, and the more stable the impedance is; in the actual processing and application process, the effect of comprehensively adjusting the impedance value by adjusting the width of the grid line, the size of the grid and the width of the impedance line and matching the grid line with the impedance line is usually needed.
In one embodiment, a second flexible copper clad laminate is laminated on the circuit pattern layer of the pattern flexible board 100, and the method further comprises the steps of firstly attaching a release film to a position area, corresponding to the golden finger pattern, of the dielectric layer of the second flexible copper clad laminate, and then carrying out the laminating processing process; as shown in fig. 3, first release films 2140 and 3140 are attached to the first and second circuit pattern layers 1110 and 1130, respectively, at the positions of the gold finger patterns included in the first and second circuit pattern layers.
Because the netted circuit has been made, then the double sided board has become the four-layer board of pseudo nature in fact, but because there is the golden finger design on the double sided board, consequently when processing golden finger region, need remove other layers such as the dielectric layer that covers above the golden finger region, adopt attached release film, not only can effectually play the effect of keeping apart other layers that cover on the golden finger with the golden finger layer, simultaneously after each pressfitting of flexible circuit board, can ensure again that each pressfitting of whole circuit board is firm, the phenomenon of interlaminar separation can not appear.
Referring to fig. 4, fig. 4 is a schematic cross-sectional structure diagram of a flexible board with a stress relief hole and a flexible board with a shielding film according to an embodiment of the present invention; the processing process of fig. 4, namely the process from S30 to S40 in fig. 1, is as follows:
s30: and drilling the reticular circuit flexible board, and electroplating to form a stress relief hole, so as to form the stress relief hole flexible board.
S40: and attaching a shielding film to the surface of the destressing hole flexible plate to form the shielding film flexible plate.
As shown in fig. 4, a mesh-type wiring flexible board 200 is drilled and plated to form a stress relief hole 410, and a stress relief hole flexible board is integrally formed, and a first shielding film 5110 and a second shielding film 5120 are respectively attached to both surfaces of the stress relief hole flexible board to form a shielding film flexible board 300.
In one embodiment, the destressing holes are located at two ends of the flexible folding area of the destressing hole flexible plate in the long direction and are at a certain distance from the golden finger, and the destressing holes are distributed in a pairwise corresponding mode at the two ends of the flexible folding area in the long direction;
in one embodiment, the stress relief hole comprises an annular ring having a single edge width of 50 μm to 300 μm.
Because the flexible circuit board of the embodiment needs punching processing in the subsequent processing process and needs lamination adhesion, because the medium material of the flexible circuit board is generally Polyimide (PI) material, the material has larger internal stress, in the punching and post-processing processes, the increased risks of easy deformation, easy pulling and the like can exist, the stress relief hole is manufactured, and in the subsequent punching processing, the unilateral hole ring of the stress relief hole is also punched, so that the internal stress of the flexible circuit board can be better released, and the external stress given to the flexible circuit board by the buffer knife in the buffer cutting processing can be better released; in general, the finished pore size of the stress relief pores may be 0.15mm or 0.2mm or 0.3mm or 0.4mm or 0.5mm; the thickness of the copper on the inner wall of the plated stress relief hole is generally 10-35 μm.
In addition, due to the fact that the unilateral hole ring of the stress relief hole needs to be punched during punching, and due to the fact that the flexible circuit board is a flexible circuit board replacing a wiring harness, lamination attachment needs to be conducted subsequently, under general conditions, regularity and flatness of the flexible circuit board need to be guaranteed, punching is generally linear during punching, and therefore the stress relief hole is also designed to be distributed in a mode that two ends of the stress relief hole correspond to each other in pairs.
However, in some embodiments, if the wiring harness flexible circuit board is in a bending pattern, the distribution of the stress relief holes is designed according to a specific shape, and the shape of the punched pattern is designed.
Attaching a shielding film, wherein the shielding film is generally an electromagnetic shielding film, and the thickness of the shielding film is generally 30 μm to 100 μm, and the de-stressing hole and the hole ring need to be avoided, so that the effect and the function of the de-stressing hole are prevented from being influenced by the shielding film.
In one embodiment, after the fabrication of the destressing hole flexible board is completed, depth control grooving processing is performed along the surface of the destressing hole flexible board corresponding to the release film area, the second flexible copper clad laminate covering the gold finger pattern, the release film and the covering film layer are removed, the gold finger pattern is exposed, and electrogilding processing (blue glue and electrogilding) is performed on the gold finger pattern, so that a gold finger is formed.
As shown in fig. 4, after the destressing flexible board is manufactured, the cover removing processing is performed on the coverage areas corresponding to the first gold finger 3210 and the second gold finger 3220, the depth control grooving is used in the processing process, the mechanical depth control milling grooving or the laser depth control ablation grooving mode can be adopted for processing, after the grooving, the first release film 2140 and the second release film 3140 respectively cover the areas corresponding to the first gold finger 3210 and the second gold finger 3220, so that the cover removing layer can be easily removed, the gold finger pattern can be exposed, the blue gel can be pasted on other areas of the circuit board, the area not requiring the gold plating is covered, and the gold processing is performed on the gold finger pattern area, so as to form the first gold finger 3210 and the second gold finger 3220.
As mentioned above, since the double-sided board of this embodiment is made with the mesh circuit, it becomes a pseudo four-layer board structure, so when processing the golden finger, it needs to perform the "cover uncovering" processing to expose the golden finger, and then perform the electrogilding processing to the golden finger to form a complete golden finger, it needs to be noted that when processing the golden finger, it needs to protect other areas of the board surface to avoid the attack of components such as grinding board and chemicals; furthermore, as the flexible circuit board also needs subsequent processing and manufacturing, in order to avoid the problems that the gold finger is damaged by the subsequent processing and the like, blue glue or a dry film needs to be used for protecting the gold finger, and then the blue glue is torn off or the dry film is faded off in the final finished product process; of course, a net-shaped circuit can be arranged on one side of the double-sided board to form a pseudo three-layer board structure.
It should be noted that, in order to more clearly illustrate the specific technical content of the embodiment, fig. 5 to 9 all use a flexible circuit board after being formed separately as an illustration, and do not affect the technical process description of the embodiment of fig. 5 to 9; in actual machining, which may be done in batch form, there may be tool areas at the edges of the board.
Referring to fig. 5, fig. 5 is a schematic plan view illustrating a flexible board for forming an independent wire harness according to an embodiment of the present invention; the processing procedure of fig. 5, which is the processing procedure of step S50 in fig. 1, is as follows:
s50: and punching the shielding film flexible board to form an independent wiring harness flexible board comprising a plurality of sub-boards which are adjacently distributed in parallel.
In the embodiment, the shielding film flexible board 300 is die-cut to form four independent harness flexible boards, i.e., a first independent harness flexible board 6110, a second independent harness flexible board 6120, a third independent harness flexible board 6130, and a fourth independent harness flexible board 6140 in the figure.
In one embodiment, the punching is performed by performing seam punching along the space between every two corresponding distressing holes, and the punching is performed while punching to cut off the opposite single-side hole rings of every two opposite distressing holes.
As shown in fig. 5, a punched gap 6210 is formed by punching a gap between each two corresponding stress relief holes 410, and a single-sided ring 4110 of each two opposite stress relief holes is punched out during punching.
As described above, since the polyimide sheet of the flexible circuit board has a large internal stress and a large external stress during punching, the flexible circuit board can be reliably punched and the stress of the flexible circuit board can be effectively released by using the distressing holes and performing the punching process between every two distressing holes; after punching, the formed independent wiring harness flexible plate can be effectively laminated in subsequent processing.
Referring to fig. 6, fig. 6 is a schematic plane structure diagram of a single-sided adhesive acetate cloth and a double-sided adhesive acetate cloth according to an embodiment of the present invention; the processing procedure of fig. 6, which is the processing procedure of step S60 in fig. 1, is as follows:
s60: and attaching single-sided adhesive acetate cloth to two ends of the independent wiring harness flexible plate in the long direction, and attaching double-sided adhesive acetate cloth to one surface of part of the independent wiring harness flexible plate.
As shown in fig. 6, a single-sided adhesive acetate cloth 7110 is attached to both ends of the independent wire harness flexible sheet in the longitudinal direction, and a double-sided adhesive acetate cloth 7120 is attached to a second independent wire harness flexible sheet 6120 and a third independent wire harness flexible sheet 6130.
In one embodiment, as shown in fig. 6, a single-sided adhesive tape 7110 is attached to both ends of the independent harness flexible board in the longitudinal direction, and the single-sided adhesive tape 7110 is integrally attached to the position of the stress relief hole along the intersection line of the golden finger pattern and the independent harness flexible board.
The acetate cloth is generally selected from acetate cloth electronic adhesive tapes with the functions of aging resistance, static electricity resistance and the like, in the embodiment, single-sided adhesive acetate cloth and double-sided adhesive acetate cloth are required to be selected, and the thicknesses of the acetate cloth can be selected to be 100 micrometers, 120 micrometers and 150 micrometers.
Firstly, single-sided adhesive acetic acid cloth 7110 is attached to two ends of the flexible circuit board, so that the two ends of the flexible circuit board are provided with certain shielding enhancement effect, meanwhile, the flexible circuit board can be protected with certain flexibility, and the problem that the flexible circuit board is likely to be torn from a stress-relief hole when the subsequent lamination is adhered is solved; the single-sided adhesive acetic cloth 7110 attached to the two ends of the flexible circuit board generally extends from the bottom end of the golden finger to the inside of the flexible circuit board body, and can cover or partially cover the stress relief hole.
In one embodiment, the double-sided adhesive acetate cloth 7120 is attached to part of the sub-boards of the independent wiring harness flexible board, and the double-sided adhesive acetate cloth 7120 is attached separately according to the width of the independent wiring harness flexible board and the length of part of the punching seam; the distribution rule of the attached double-sided adhesive acetic acid cloth 7120 is that the independent wiring harness flexible plate is attached to two ends from the center, and is adjacent to two the surface of the independent wiring harness flexible plate is attached, and is separated by one from the independent wiring harness flexible plate which is not attached and is adjacent to two the surface of the independent wiring harness flexible plate is attached.
As shown in fig. 6, to the attached sticky acetic acid cloth 7120 of two sides of the independent pencil flexor 6120 of second and the independent pencil flexor 6130 of third, to the attached sticky acetic acid cloth 7120 of two sides of the independent pencil flexor 6110 of first and the independent pencil flexor 6140 of fourth, be convenient for follow-up coincide adhesion to each layer, attached sticky acetic acid cloth 7120 of two sides one side at the flexible circuit board can.
When attached two-sided sticky acetic acid cloth, if carry out the preparation in batches, can adopt the mode of machine laminating or artifical laminating, if attach two adjacent independent pencil flexonics boards, can place the flow of attached acetic acid cloth before die-cut processing, after the whole double-sided sticky acetic acid cloth of having attached, die-cut, can practice thrift process flow and processing cost.
When a plurality of (more than or equal to 4) independent wiring harness flexible boards are arranged, double-sided adhesive acetate cloth can be attached to each independent wiring harness flexible board in an interval attaching mode, or alternatively, the double-sided adhesive acetate cloth can be attached in an interval 2-to-1 attaching mode.
Referring to fig. 7, fig. 7 is a schematic plan view illustrating a primary wiring harness flexible board manufactured according to an embodiment of the present invention; the processing process of fig. 7, which is the process of step S70 in fig. 1, is as follows:
s70: laminating and adhering the independent wiring harness flexible plate which is not adhered with the double-sided adhesive acetic acid cloth on the independent wiring harness flexible plate which is adhered with the double-sided adhesive acetic acid cloth to form a primary wiring harness flexible plate;
as shown in fig. 7, a first independent harness flexible board 6110 is laminated and adhered to a second independent harness flexible board 6120 to form a first two-laminated sub-board 6110-6120, and a fourth independent harness flexible board 6140 is laminated and adhered to a third independent harness flexible board 6130 to form a third four-laminated sub-board 6130-6140 to form a preliminary harness flexible board 400.
Will not be attached the sticky acetic acid cloth 7120 of two-sided independent pencil flexonics board, stromatolite adhesion have the sticky acetic acid cloth 7120 of two-sided on the independent pencil flexonics board, for will not be attached the sticky acetic acid cloth 7120 of two-sided independent pencil flexonics board is by the middle part position to the adhesion have the sticky acetic acid cloth 7120 of two-sided pulls and folds on the independent pencil flexonics board and attach.
As shown in fig. 7, the flexible circuit board is bundled, and the individual flexible boards for bundling are laminated by using double-sided adhesive tape 7120 attached in the previous step to form a flexible circuit board similar to the bundling; since the individual wire harness flexible board is plural, a preliminary wire harness flexible board is first laminated.
Referring to fig. 8, fig. 8 is a schematic plan view illustrating a circuit board with an integrated wiring harness according to an embodiment of the present invention; the processing procedure of fig. 8, which is the processing procedure of step S80 in fig. 1, is as follows:
s80: and repeating the steps from S60 to S70 until the independent wiring harness flexible boards are overlapped to form the integral wiring harness circuit board.
As shown in fig. 8, a double-faced adhesive tape 7120 is attached to the surface of one of the first two-layer sub-board 6110-6120 or the third four-layer sub-board 6130-6140 after lamination, and the first two-layer sub-board 6110-6120 and the third four-layer sub-board 6130-6140 are laminated to form the first two-layer four-layer sub-board 6110-6140, which is the integral wire harness circuit board 6110-6140.
And further performing wiring harness processing on the flexible circuit board to enable each independent wiring harness flexible board to form a wiring harness structure mode.
In this embodiment, the first independent harness flexible board 6110 and the second independent harness flexible board 6120 may be mutually wound using acetic acid cloth, the third independent harness flexible board 6130 and the fourth independent harness flexible board 6140 may be mutually wound using acetic acid cloth, and then the two wound sub-boards may be further mutually wound using acetic acid, so that an effect of separating signals of the second independent harness flexible board 6120 and the third independent harness flexible board 6130 using acetic acid cloth may be achieved.
It should be noted that, in this embodiment, the independent harness flexible boards on the two sides are adhered to the independent harness flexible board in the center, and then the adhered primary harness flexible board is laminated and adhered, so on one hand, the problem that the adhered independent harness flexible boards are hard to bend and tear due to disorder and no seal can be prevented, or the problem that the circuit transmission signal is distorted due to too large pulling and distortion of the circuit can be prevented, on the other hand, the distribution rationality of the wiring patterns of the independent harness flexible boards can be improved, and the wiring patterns of the independent harness flexible boards can be designed into the circuit patterns with a certain radian approaching to the center or into the circuit patterns with thicker two ends and thinner center according to the adhering sequence of the independent harness flexible boards, thereby improving the laminating adhesion performance of the independent harness flexible boards.
Because the flexible circuit board needs to be processed in a wiring harness mode, a certain distance needs to be reserved from the position of the golden finger to the position of the end of the punching gap, a space which can ensure the flatness is provided for the golden finger area of the end of the flexible circuit board, and the problems of poor insertion and welding caused by bending and twisting of the golden finger area are solved; furthermore, reinforcement can be arranged inside the golden finger area or inside the golden finger-free area of the single-side golden finger so as to enhance the hardness of the golden finger.
Referring to fig. 9, fig. 9 is a schematic plan view illustrating a circuit board with an integrated wiring harness according to an embodiment of the present invention; the processing procedure of fig. 9, which is the processing procedure of step S90 in fig. 1, is as follows:
s90: and winding and wrapping the overlapped area of the integral wiring harness circuit board by using single-sided adhesive acetic acid cloth to form the high-shielding flexible circuit board.
As shown in fig. 9, the high-shielding flexible circuit board 10 is formed by wrapping the laminated regions of the integrated wiring harness circuit boards 6110-6140 with a single-sided adhesive acetate cloth 7110.
The laminated integrated wiring harness circuit boards 6110 to 6140 are wound with an acetate cloth to form a wiring harness flexible circuit board, that is, the high-shielding flexible circuit board 10.
The acetic acid cloth is used, so that the effects of gluing, winding and binding can be achieved, the shielding performance of the flexible circuit board can be further enhanced, the circuit board can realize triple high-efficiency shielding layers of a mesh circuit, a shielding film and the acetic acid cloth, and the high shielding characteristic in the true sense is formed.
In conclusion, it can be seen that the triple protection effects of the mesh circuit, the shielding film layer and the acetic acid cloth are adopted in the embodiment, the acetic acid cloth is adopted to adhere the flexible circuit board lamination to form an intermediate product mode similar to the flexible circuit board and the wire harness, a novel product which replaces the flexible circuit board and also replaces the wire harness is formed, the processing difficulty is low compared with that of a multilayer flexible circuit board and a multilayer layered flexible circuit board, the product reliability is high, the processing cost is low, and the application flexibility is high.
It should be noted that, because there are different situations of design, processing and application of the flexible circuit board in the actual processing process and application process, the drawings of this embodiment are only used for illustrating the implementation process of this embodiment, and do not represent the size ratio of the actual product, nor represent the drawings which are enlarged in equal proportion according to the actual situation.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A manufacturing method of a high-shielding flexible circuit board is characterized by comprising the following steps:
s10: taking a flexible copper clad laminate, and manufacturing a circuit pattern layer on the flexible copper clad laminate to form a pattern flexible board;
s20: pressing and covering a second flexible copper clad laminate on the circuit pattern layer of the pattern flexible board, wherein the second flexible copper clad laminate comprises a circuit dielectric layer and a circuit copper layer, and the circuit dielectric layer covers the circuit pattern layer; carrying out graphic processing on the circuit copper layer to form a mesh circuit, and attaching a covering film layer on the second flexible copper-clad plate to form a mesh circuit flexible plate;
s30: drilling the reticular circuit flexible board, electroplating to form a stress relief hole, and integrally forming the stress relief hole flexible board;
s40: attaching a shielding film to the surface of the destressing hole flexible plate to form a shielding film flexible plate;
s50: punching the shielding film flexible plate to form an independent wiring harness flexible plate comprising a plurality of sub-plates which are adjacently distributed in parallel;
s60: attaching single-sided adhesive acetate cloth to two ends of the independent wiring harness flexible plate in the length direction, and attaching double-sided adhesive acetate cloth to one surface of part of the independent wiring harness flexible plate;
s70: laminating and adhering the independent wiring harness flexible plate which is not adhered with the double-sided adhesive acetic acid cloth on the independent wiring harness flexible plate which is adhered with the double-sided adhesive acetic acid cloth to form a primary wiring harness flexible plate;
s80: repeating the steps S60 to S70 until the independent wiring harness flexible boards are overlapped to form an integral wiring harness circuit board;
s90: and winding and wrapping the overlapped area of the integral wiring harness circuit board by using single-sided adhesive acetic acid cloth to form the high-shielding flexible circuit board.
2. The manufacturing method of the high-shielding flexible circuit board according to claim 1, wherein the manufacturing of the circuit pattern layer on the flexible copper clad laminate further comprises manufacturing of gold finger patterns, wherein the gold finger patterns are located at two ends of the pattern flexible board in the longitudinal direction;
and pressing and covering a second flexible copper clad laminate on the circuit pattern layer of the pattern flexible board, and further comprising the steps of attaching a release film to the position area, corresponding to the golden finger pattern, of the dielectric layer of the second flexible copper clad laminate and then performing the pressing and covering processing process.
3. The manufacturing method of the high-shielding flexible circuit board according to claim 2, wherein after the flexible board with the stress relief holes is manufactured, depth control grooving processing is performed along the surface of the flexible board with the stress relief holes corresponding to the release film area, the second flexible copper clad laminate covering the gold finger patterns, the release film and the covering film layer are removed, the gold finger patterns are exposed, and the gold finger patterns are subjected to electric gold processing to form gold fingers.
4. The manufacturing method of the high-shielding flexible circuit board as claimed in claim 2, wherein the stress relief holes are located at two ends of the flexible bending area of the flexible circuit board with the stress relief holes in the long direction and are spaced from the golden finger by a certain distance, and the stress relief holes are distributed at two ends of the flexible circuit board with the stress relief holes in the long direction;
the punching is carried out along the seam punching processing between the two corresponding distressing holes, and the punching and cutting are simultaneously carried out on the opposite single-side hole rings of the two opposite distressing holes.
5. The manufacturing method of the high-shielding flexible circuit board as claimed in claim 4, wherein said double-sided adhesive acetate cloth is separately attached to a portion of said sub-board of said independent harness flexible board according to the width of said independent harness flexible board and the length of a portion of said punched seam;
the adhesive double-sided adhesive acetate cloth is distributed according to the distribution rule that the independent wiring harness flexible plates distributed from the center are attached to the two ends, the surfaces of two adjacent independent wiring harness flexible plates are attached, the independent wiring harness flexible plates are not attached at intervals, and the surfaces of two adjacent independent wiring harness flexible plates are attached;
will not be attached the sticky acetic acid cloth of two-sided independent pencil flexonics board, stromatolite adhesion have the sticky acetic acid cloth of two-sided on the independent pencil flexonics board, for will not be attached the sticky acetic acid cloth of two-sided independent pencil flexonics board is by middle part position to having the sticky acetic acid cloth of two-sided pulls on the independent pencil flexonics board and folds and attach.
6. The method for manufacturing a high-shielding flexible circuit board according to claim 1, wherein single-sided adhesive acetate cloth is attached to both ends of the independent wire harness flexible board in the longitudinal direction, and the single-sided adhesive acetate cloth is integrally attached to the position of the stress relief hole along the intersection line of the gold finger pattern and the independent wire harness flexible board.
7. The method for manufacturing a high-shielding flexible circuit board as claimed in claim 1, wherein said mesh circuit covers the surface of said patterned flexible circuit board except said gold finger pattern.
8. The method for manufacturing a high-shielding flexible circuit board according to claim 1, wherein the mesh circuit has a circuit width of 0.1mm to 2.0mm.
9. The method of claim 1, wherein the length of the mesh circuit multiplied by the width of the mesh circuit is 0.1mm x 0.1mm to 2.0mm x 2.0mm.
10. The method for manufacturing a high-shielding flexible circuit board as claimed in claim 1, wherein the stress relief hole comprises an annular ring, and the width of a single side of the annular ring is 50 μm to 300 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211166307.XA CN115696787B (en) | 2022-09-23 | 2022-09-23 | Manufacturing method of high-shielding flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211166307.XA CN115696787B (en) | 2022-09-23 | 2022-09-23 | Manufacturing method of high-shielding flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115696787A true CN115696787A (en) | 2023-02-03 |
| CN115696787B CN115696787B (en) | 2024-04-26 |
Family
ID=85061912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211166307.XA Active CN115696787B (en) | 2022-09-23 | 2022-09-23 | Manufacturing method of high-shielding flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115696787B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100907353B1 (en) * | 2008-07-18 | 2009-07-10 | 한화엘앤씨 주식회사 | Electromagnetic shielding film for flexible printed circuit board, shielded fpcb and method for manufacturing shielded fpcb |
| CN114206008A (en) * | 2021-12-16 | 2022-03-18 | 深圳市实锐泰科技有限公司 | Manufacturing method of thick copper flexible board and thick copper flexible board |
| CN114390793A (en) * | 2021-12-16 | 2022-04-22 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-shielding flexible board and high-shielding flexible board |
-
2022
- 2022-09-23 CN CN202211166307.XA patent/CN115696787B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100907353B1 (en) * | 2008-07-18 | 2009-07-10 | 한화엘앤씨 주식회사 | Electromagnetic shielding film for flexible printed circuit board, shielded fpcb and method for manufacturing shielded fpcb |
| CN114206008A (en) * | 2021-12-16 | 2022-03-18 | 深圳市实锐泰科技有限公司 | Manufacturing method of thick copper flexible board and thick copper flexible board |
| CN114390793A (en) * | 2021-12-16 | 2022-04-22 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-shielding flexible board and high-shielding flexible board |
Non-Patent Citations (1)
| Title |
|---|
| 邹伟民;: "双面柔性线路板网印中的问题", 电子技术与软件工程, no. 10, 31 May 2017 (2017-05-31) * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115696787B (en) | 2024-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6367355B2 (en) | ||
| CN110881241A (en) | High-frequency low-loss glue-layer-free FPC and production process thereof | |
| CN113573475A (en) | Rigid-flex board and manufacturing method thereof | |
| CN109496063B (en) | Electromagnetic shielding film and manufacturing method thereof, flexible circuit board and manufacturing method thereof | |
| US7816609B2 (en) | Wired circuit board | |
| JP2019207835A (en) | Shield flat cable | |
| JPS6156700B2 (en) | ||
| CN115696787A (en) | Manufacturing method of high-shielding flexible circuit board | |
| CN103635007B (en) | Rigid-flexible circuit substrate, rigid-flexible circuit board and manufacture method | |
| WO2023123907A1 (en) | Manufacturing method for rigid-flex board, and circuit board | |
| CN113423172B (en) | Rigid-flexible circuit board and manufacturing method thereof | |
| CN109548272B (en) | Bending-resistant FPC and manufacturing method thereof | |
| CN211240255U (en) | High-frequency low-loss glue-layer-free FPC | |
| JPH0741051Y2 (en) | Flat cable with shield | |
| JP5593734B2 (en) | Shielded flat cable, shielded flat cable with connector, and manufacturing method thereof | |
| JPH07111371A (en) | Flexible printed board | |
| CN113543452B (en) | Circuit board and preparation method thereof | |
| JP6617505B2 (en) | Flat cable connection structure | |
| JP3218444B2 (en) | Chip type multilayer inductor | |
| JP2001217045A (en) | Connector having built-in emc function | |
| JPH1075088A (en) | Manufacture of electromagnetic interference suppression sheet | |
| CN110418507B (en) | Manufacturing process of high-frequency high-speed flexible circuit board | |
| CN209861253U (en) | Laminated structure of inner layer and outer layer shielding of multilayer flexible circuit board | |
| JPH0423494A (en) | Flexible printed wiring board | |
| CN103313533B (en) | The manufacture method of layer flexible distributing board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |