CN114390793A - Manufacturing method of high-shielding flexible board and high-shielding flexible board - Google Patents
Manufacturing method of high-shielding flexible board and high-shielding flexible board Download PDFInfo
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- CN114390793A CN114390793A CN202111537822.XA CN202111537822A CN114390793A CN 114390793 A CN114390793 A CN 114390793A CN 202111537822 A CN202111537822 A CN 202111537822A CN 114390793 A CN114390793 A CN 114390793A
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- flexible board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a manufacturing method of a high-shielding flexible board and the high-shielding flexible board, and provides the flexible board, wherein the flexible board comprises a first film layer, a circuit copper layer and a second film layer, and the first film layer and the second film layer are respectively positioned on the upper surface and the lower surface of the circuit copper layer; coarsening the flexible board; silk-screen printing a silver paste pattern layer on the first film layer, and baking and curing; and attaching a third film layer on the cured silver paste pattern layer, and performing rapid lamination to form the high-shielding flexible board. The silver paste pattern layer with high shielding property is manufactured on the film layer, the other film layer is manufactured on the silver paste pattern layer, a good double-layer pattern and double-layer film structure is formed, a reliable flow manufacturing method is formed, the high shielding property can be effectively achieved, the flexibility and the folding property of the flexible circuit board are not affected, and the flexible board with high shielding property can be provided for a connector and a high-precision instrument.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a manufacturing method of a high-shielding flexible board and the high-shielding flexible board.
Background
For some flexible boards applied in connectors and high precision instruments, good electromagnetic shielding performance is required.
At present, a thin film layer with electromagnetic shielding performance or a composite thin film layer (for example, a polyimide layer + an aluminum foil layer + a polyimide layer) is generally adopted and disposed in an area where good electromagnetic shielding performance is required, and then pressing and processing are performed to form a shielding structure, so that a shielding effect is achieved.
However, the thin film layer or the composite thin film layer with electromagnetic shielding performance generally has high cost, which is not beneficial to the batch production and application of the flexible board, and the thin film layer has high requirements on the processing technology and needs to realize effective matching among various materials, so a large amount of manpower, materials and time cost need to be invested in processing, and the requirements of low-cost and high-efficiency processing are not met for the common flexible board.
In view of the above background, it is desirable to provide a method for manufacturing a flexible board with high shielding performance, which is low in cost and can be effectively applied to batch flexible board processing.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a high-shielding flexible plate and the high-shielding flexible plate, and aims to solve the problems of difficulty in manufacturing process and high manufacturing cost of the conventional flexible plate with electromagnetic shielding performance.
In order to achieve the above object, the present invention provides a method for manufacturing a high shielding flexible board, including:
providing a flexible board, wherein the flexible board comprises a first film layer, a circuit copper layer and a second film layer, and the first film layer and the second film layer are respectively positioned on the upper surface and the lower surface of the circuit copper layer;
roughening the flexible plate;
silk-screen printing a silver paste pattern layer on the first film layer, and baking and curing;
and attaching a third film layer on the cured silver paste pattern layer, and performing rapid lamination to form the high-shielding flexible board.
Further, the flexible board is formed by performing a flow process with the circuit copper layer as a base layer, wherein the flow process comprises:
providing the circuit copper layer, attaching the first film layer to one surface of the circuit copper layer, and performing quick pressing treatment to form a single-sided flexible board;
carrying out graphic processing treatment on the single-sided flexible board to form a single-sided graphic flexible board;
and attaching the second film layer to the single-sided graphic flexible board, and performing quick pressing treatment to form the flexible board.
Further, the first film layer is formed by laminating a first adhesive layer and a first covering film layer; the second film layer is formed by laminating a second adhesive layer and a second covering film layer; the first adhesive layer or the second adhesive layer is a polyolefin adhesive layer or an epoxy resin adhesive layer or an acrylic adhesive layer.
Further, the third film layer is formed by laminating a third adhesive layer and a third covering film layer, the laminating processing mode is that the third adhesive layer is formed by silk-screening or coating an adhesive on the silver paste pattern layer, prebaking is carried out according to the parameter of 75 ℃ multiplied by 35min to 45min, the third covering film layer is attached, quick-pressing treatment is carried out, and post-curing baking is carried out according to the parameter of 120 ℃ multiplied by 35min to 45 min.
Further, the third adhesive layer is a polyolefin adhesive layer, an epoxy resin adhesive layer or an acrylic adhesive layer, and the colloid viscosity of the silk-screen or coating colloid is 130-170dpa.
Further, the length of the third film layer is smaller than that of the first film layer, and the width of the third film layer is smaller than or equal to that of the first film layer; the thickness of the third glue layer is larger than that of the silver paste pattern layer.
Further, the silver paste pattern layer is an S-shaped circuit pattern, and the circuit width of the S-shaped circuit pattern is 0.5mm to 2.5 mm.
Further, the silver paste pattern layer is a mesh circuit pattern, and the width of the mesh circuit pattern is 0.3mm to 2.0 mm.
Further, the high shielding property flexible board further comprises a second shielding structure, the second shielding structure is manufactured on the second film layer, and the second shielding structure is symmetrical to the structure formed by the silver paste pattern layer and the third film layer.
In order to achieve the above object, the present invention provides a high shielding flexible board, which is manufactured by any one of the above manufacturing methods.
According to the manufacturing method of the high-shielding flexible circuit board, the film layer is manufactured on the flexible circuit board, the silver paste pattern layer is manufactured on the film layer, the shielding layer can be effectively formed by utilizing the good shielding characteristic of silver paste, the silver paste pattern layer is protected by the other film layer, the flexible circuit board with double film layers is formed, the high-shielding characteristic can be effectively achieved, the flexibility of the flexible circuit board is not affected, and the flexible circuit board with high shielding performance can be provided for connectors and high-precision instruments.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic process flow diagram of a method for manufacturing a high-shielding flexible board according to the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a high shielding flexible board according to the present invention;
FIG. 3 is a schematic structural diagram of another embodiment of a high shielding flexible board according to the present invention;
FIG. 4 is a schematic diagram of an "S" -shaped circuit pattern of a silver paste pattern layer according to the present invention;
FIG. 5 is a schematic view of a mesh circuit pattern of a silver paste pattern layer according to the present invention;
fig. 6 is a schematic structural diagram of a high-shielding flexible board according to the present invention, which includes a second shielding structure.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | High shielding |
300b | Second |
| 100 | Copper layer of |
400 | Silver |
| 200 | |
500 | |
| 200a | First |
500a | Third |
| 200b | A first |
500b | Third |
| 300 | |
20 | |
| 300a | First adhesive layer | / | / |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The key point of the method for manufacturing the rigid-flex printed circuit board in this embodiment is in the process of the typesetting and laminating process.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic process flow diagram of a method for manufacturing a high-shielding flexible board according to the present invention; fig. 2 is a schematic structural diagram of an embodiment of a high shielding flexible board according to the present invention.
As shown in fig. 2, the high-shielding flexible printed circuit board 10 of the present embodiment is obtained by the manufacturing method shown in fig. 1, the high-shielding flexible printed circuit board 10 is processed on the basis of a flexible printed circuit board, and the flexible printed circuit board includes a first film layer 200, a circuit copper layer 100, and a second film layer 300, wherein the first film layer 200 and the second film layer 300 are respectively located on the upper and lower surfaces of the circuit copper layer 100; the basic steps of manufacturing the high-shielding flexible board by taking the flexible board as a basis comprise coarsening the flexible board, silk-screen printing a silver paste pattern layer 400 on the first film layer 200, baking and curing, attaching a third film layer 500 on the cured silver paste pattern layer 400, and performing rapid pressing to form the high-shielding flexible board 10.
Because the surface of the flexible board is relatively smooth, that is, the surfaces of the first film layer 200 and the second film layer 300 are relatively smooth, the flexible board needs to be roughened, because the material inertness of the first film layer 200 and the second film layer 300 is generally relatively strong, and it is difficult to react with the first film layer 200 and the second film layer 300 by using common chemical liquid, the roughening treatment here generally adopts plasma roughening treatment, the plasma roughening treatment can utilize a plasma environment, the surface of the material with relatively strong inertness is effectively roughened, and the silver paste pattern layer 400 can be better manufactured on the first film layer 200.
After the roughening is completed, silver paste needs to be manufactured on the first film layer 200, if the whole surface of the silver paste is coated on the first film layer 200, on one hand, the bending performance of the flexible board is affected, and the problems of silver paste surface fracture and the like possibly occur in the bending process, and on the other hand, the cost generated by whole surface coating is high; therefore, the silver paste is required to be made into a circuit pattern, and the silver paste pattern layer 400 is made in a silk-screen printing manner, so that parameters of the silver paste pattern in various aspects such as precision, thickness and pattern shape can be effectively controlled.
After the silver paste pattern layer 400 is printed by silk screen, the silver paste pattern layer needs to be cured, generally, the silver paste refers to a paste compound system of silver powder mixed with polymer resin, so that the polymer resin can be effectively promoted to generate a thermal curing reaction by baking and curing, and a volatile solvent in the compound system can be volatilized to form the curing of the silver paste pattern layer.
After the silver paste pattern layer 400 is cured, the third film layer 500 needs to be attached to the surface of the silver paste pattern layer 400 to protect the silver paste pattern layer 400, and a reliable bending performance foundation is provided for the flexible board.
In this embodiment, the flexible board is formed by using the circuit copper layer 100 as a basic layer and performing a flow process, that is, on the basis of the circuit copper layer 100, a first film layer 200 is firstly attached to one side of the flexible board, and a fast pressing process is performed to form a single-sided flexible board; performing graphic processing treatment, namely forming a required circuit graphic on the circuit copper layer 100, attaching the second film layer 300, and performing rapid pressing treatment to form a flexible board; the flexible board formed here is a structure in which the double-sided copper layer covers the circuit copper layer 100, and is not a typical double-sided copper layer covered copper clad board structure.
Referring to fig. 3, fig. 3 is a schematic structural diagram of another embodiment of a high shielding flexible board according to the present invention; in this embodiment, the first film layer 200 is formed by laminating a first adhesive layer 200a and a first covering film layer 200b, and the second film layer 300 is formed by laminating a second adhesive layer 300a and a second covering film layer 300 b; the film layer is set to be of a laminated structure of the glue layer and the covering film layer, so that gaps of the circuit patterns can be filled with the glue layer effectively, the adhesiveness of the covering film layer and the circuit layer is increased by the glue layer, and the problems of holes, layering and the like of the circuit board are solved.
Referring to fig. 3 again, in the present embodiment, the third film layer 500 is formed by performing a lamination process on a third glue layer 500a and a third cover film layer 500b, the lamination process is performed by performing a screen printing or a glue coating process on the silver paste pattern layer 400 to form the third glue layer 500a, performing a pre-baking process with a parameter of 75 ℃ x 35min to 45min, attaching the third cover film layer 500b, performing a rapid press-fitting process, and performing a post-curing baking process with a parameter of 120 ℃ x 35min to 45 min.
Similarly, also set up third rete 500 into the laminated structure of glue film and cover rete, because silver thick liquid graphic layer 400 possesses the line pattern equally, and the silver thick liquid circuit is now to the copper layer circuit of flexbile plate itself, its cohesion with the cover membrane material is weaker, more need the cover protection of cover membrane, consequently, increase third glue film 500a, can effectively fill the circuit clearance of silver thick liquid graphic layer 400, and can effectively improve the rete of effective protection and the cohesion of silver thick liquid graphic layer 400 and first rete 200. The third adhesive layer 500a is manufactured in a silk-screen or coating mode, so that the range, the thickness, the covering effect and other factors of the third adhesive layer 500a can be effectively controlled, after the silk-screen or coating of the third adhesive layer 500a is finished, the adhesive layer is baked at the low temperature of 75 ℃ for 35min to 45min in a short time, the adhesive layer can be semi-cured (incompletely cured), a foundation is provided for the subsequent attachment of the third covering film layer 500b, and after the third covering film layer 500b is attached, the third covering film layer 500b and the third adhesive layer 500a are subjected to pressing and combining processing in a fast pressing (fast pressing) mode, so that a good lamination combining effect is formed; in general, the rapid pressing is carried out at a temperature of 120 ℃ to 150 ℃ and at a concentration of 50kg/cm2To 100kg/cm2Pressure of 60 seconds to 70 secondsCombining; and after the rapid lamination is finished, baking at a high temperature of 120 ℃ for 35min to 45min for a short time, so that the binding force between the adhesive layer and the film layer is improved, and the internal stress of the flexible plate is removed.
It should be noted that the process of laminating the first film layer 200a and the first covering film layer 200b and the process of laminating the second film layer 300a and the second covering film layer 300b to form the first film layer 200a and the second film layer 300b can also be performed by laminating the third film layer 500a and the third covering film layer 500b to form the third film layer 500.
In this embodiment, the first adhesive layer 200a, the second adhesive layer 300a, and the third adhesive layer 500a may be a polyolefin adhesive layer, an epoxy resin adhesive layer, or an acrylic adhesive layer, with a viscosity of 130-.
Referring to fig. 2 and 3 again, in the present embodiment, in order to prevent the upper covering film layer from exceeding the covering range of the lower covering film layer and causing delamination, the length of the third film layer 500 is set to be smaller than that of the first film layer 200, but the third film layer 500 and the first film layer 200 may be selectively formed simultaneously, so that the width of the third film layer 500 may be smaller than or equal to that of the first film layer 200; as can be seen from the characteristics and effects of the third adhesive layer 500a, the third film layer 500a plays a role in filling the silver paste pattern layer 400, so that the thickness of the third adhesive layer 500a is greater than that of the silver paste pattern layer 400, a good filling effect can be achieved, and the problems of poor lamination, delamination, voids and the like caused by the direct foundation of the third covering film layer 500b and the silver paste pattern layer 400 can be prevented.
Referring to fig. 4 and 5, fig. 4 is a schematic diagram of an "S" shaped circuit pattern of the silver paste pattern layer of the present invention, and fig. 5 is a schematic diagram of a mesh circuit pattern of the silver paste pattern layer of the present invention.
The silver paste pattern layer 400 is used as a high shielding layer, but if the silver paste is directly manufactured on the whole surface of the first film layer 200, the problems that the third film layer 500 is poor in adhesion, the silver paste layer is easy to crack during subsequent bending and the like are easily caused, and the cost of using the silver paste material is high; therefore, the design adopts a screen printing mode, the silver paste is manufactured into a pattern mode on the first film layer, the shielding effect can be effectively achieved, the elastic bending of the silver paste pattern is facilitated, and the material cost of the silver paste is saved, in the embodiment, the silver paste pattern layer 400 can be designed into an S-shaped circuit pattern, and the circuit width of the S-shaped circuit pattern is 0.5mm to 2.5 mm; it can also be designed as a mesh circuit pattern 400b, the mesh circuit pattern having a circuit width of 0.3mm to 2.0 mm.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a high shielding flexible board according to the present invention, which includes a second shielding structure. If the flexible board itself needs a double-sided high shielding effect to form a more closed shielding environment, the second shielding structure 20 can be manufactured on the other side of the flexible board by the same method and structure; the second shielding structure 20 is fabricated on the second film layer 300, and the second shielding structure 20 is symmetrical to the structure formed by the silver paste pattern layer 400 and the third film layer 500.
In this embodiment, by using the above manufacturing method, a flexible board with high shielding performance can be obtained.
In this embodiment, through the flexible board structure of preparation cover film centre gripping circuit copper layer, be favorable to the high shielding circuit layer on follow-up preparation silver thick liquid graphic layer, make high shielded silver thick liquid graphic layer on the cover rete, utilize the good electromagnetic shield characteristic of silver thick liquid, make the flexible board possess high shielding effect, utilize another cover film protection silver thick liquid layer, form good double-deck cover film, the structure of double-deck figure (copper layer circuit figure, silver thick liquid layer circuit figure), under the prerequisite that does not influence the flexible board and flex the characteristic, it is that the flexible board forms good shielding effect.
The manufacturing process of the embodiment forms an integral manufacturing process based on various factors such as manufacturing quality, cost, structural characteristics and effect characteristics, the integral process flows are mutually connected and are mutually related front and back, the expansion and shrinkage characteristics of the covering film, the filling and adhesion characteristics of the adhesive layer and the silk-screen and shielding characteristics of the silver paste layer are fully utilized, the flow manufacturing characteristics of complex structures of various materials are formed, and a good high-shielding flexible board product can be provided for the electronic information industry mainly using a connector.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A manufacturing method of a high-shielding flexible board is characterized by comprising the following steps:
providing a flexible board, wherein the flexible board comprises a first film layer, a circuit copper layer and a second film layer, and the first film layer and the second film layer are respectively positioned on the upper surface and the lower surface of the circuit copper layer;
roughening the flexible plate;
silk-screen printing a silver paste pattern layer on the first film layer, and baking and curing;
and attaching a third film layer on the cured silver paste pattern layer, and performing rapid lamination to form the high-shielding flexible board.
2. The method according to claim 1, wherein the flexible printed circuit board is formed by performing a process using the copper circuit layer as a base layer, the process including:
providing the circuit copper layer, attaching the first film layer to one surface of the circuit copper layer, and performing quick pressing treatment to form a single-sided flexible board;
carrying out graphic processing treatment on the single-sided flexible board to form a single-sided graphic flexible board;
and attaching the second film layer to the single-sided graphic flexible board, and performing quick pressing treatment to form the flexible board.
3. The method for manufacturing a flexible printed circuit board with high shielding property according to claim 1, wherein the first film layer is formed by laminating a first adhesive layer and a first cover film layer; the second film layer is formed by laminating a second adhesive layer and a second covering film layer; the first adhesive layer or the second adhesive layer is a polyolefin adhesive layer or an epoxy resin adhesive layer or an acrylic adhesive layer.
4. The method for manufacturing a highly shielding flexible board as claimed in claim 1, wherein the third film layer is formed by laminating a third glue layer and a third cover film layer, and the laminating process is performed by screen printing or coating a glue on the silver paste pattern layer to form the third glue layer, pre-baking at 75 ℃ for 35min to 45min, attaching the third cover film layer, performing a rapid pressure treatment, and post-curing baking at 120 ℃ for 35min to 45 min.
5. The method as claimed in claim 3 or 4, wherein the third adhesive layer is a polyolefin adhesive layer, an epoxy resin adhesive layer or an acrylic adhesive layer, and the viscosity of the silk-screen or glue-coating adhesive is 130-170 dpa.s.
6. The method according to claim 4, wherein the length of the third layer is less than the length of the first layer, and the width of the third layer is less than or equal to the width of the first layer; the thickness of the third glue layer is larger than that of the silver paste pattern layer.
7. The method for manufacturing a flexible printed circuit board with high shielding property according to claim 1, wherein the silver paste pattern layer is an "S" shaped circuit pattern, and the circuit width of the "S" shaped circuit pattern is 0.5mm to 2.5 mm.
8. The method for manufacturing a flexible printed circuit board with high shielding property according to claim 1, wherein the silver paste pattern layer is a mesh circuit pattern, and the width of the mesh circuit pattern is 0.3mm to 2.0 mm.
9. The method for manufacturing a high shielding flexible board according to claim 1, wherein the high shielding flexible board further comprises a second shielding structure, the second shielding structure is manufactured on the second film layer, and the second shielding structure is symmetrical to a structure formed by the silver paste pattern layer and the third film layer.
10. A highly shielded flexible board, characterized in that it is manufactured by the manufacturing method as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111537822.XA CN114390793A (en) | 2021-12-16 | 2021-12-16 | Manufacturing method of high-shielding flexible board and high-shielding flexible board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111537822.XA CN114390793A (en) | 2021-12-16 | 2021-12-16 | Manufacturing method of high-shielding flexible board and high-shielding flexible board |
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| CN114390793A true CN114390793A (en) | 2022-04-22 |
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| CN202111537822.XA Pending CN114390793A (en) | 2021-12-16 | 2021-12-16 | Manufacturing method of high-shielding flexible board and high-shielding flexible board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115666016A (en) * | 2022-09-24 | 2023-01-31 | 深圳市实锐泰科技有限公司 | Manufacturing method of ultrathin high-shielding flexible circuit board |
| CN115696787A (en) * | 2022-09-23 | 2023-02-03 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-shielding flexible circuit board |
| CN115696766A (en) * | 2022-09-24 | 2023-02-03 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-precision flexible circuit board |
-
2021
- 2021-12-16 CN CN202111537822.XA patent/CN114390793A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115696787A (en) * | 2022-09-23 | 2023-02-03 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-shielding flexible circuit board |
| CN115696787B (en) * | 2022-09-23 | 2024-04-26 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-shielding flexible circuit board |
| CN115666016A (en) * | 2022-09-24 | 2023-01-31 | 深圳市实锐泰科技有限公司 | Manufacturing method of ultrathin high-shielding flexible circuit board |
| CN115696766A (en) * | 2022-09-24 | 2023-02-03 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-precision flexible circuit board |
| CN115666016B (en) * | 2022-09-24 | 2024-04-09 | 深圳市实锐泰科技有限公司 | Manufacturing method of ultrathin high-shielding flexible circuit board |
| CN115696766B (en) * | 2022-09-24 | 2024-04-30 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-precision flexible circuit board |
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