WO2019198241A1 - Method for manufacturing board with embedded components, and board with embedded components - Google Patents

Method for manufacturing board with embedded components, and board with embedded components Download PDF

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Publication number
WO2019198241A1
WO2019198241A1 PCT/JP2018/015609 JP2018015609W WO2019198241A1 WO 2019198241 A1 WO2019198241 A1 WO 2019198241A1 JP 2018015609 W JP2018015609 W JP 2018015609W WO 2019198241 A1 WO2019198241 A1 WO 2019198241A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
electronic component
conductor layer
component
layer
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PCT/JP2018/015609
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French (fr)
Japanese (ja)
Inventor
松本　徹
健太朗 青木
竜也 佐々木
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株式会社メイコー
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Priority to JP2020513046A priority Critical patent/JPWO2019198241A1/en
Priority to PCT/JP2018/015609 priority patent/WO2019198241A1/en
Publication of WO2019198241A1 publication Critical patent/WO2019198241A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a method for manufacturing a component-embedded substrate and a component-embedded substrate.
  • the component-embedded substrate as described above can effectively utilize the space in the insulating layer by incorporating a plurality of electronic components in one insulating layer.
  • the component-embedded substrate can connect the wiring between at least one of the conductor layers provided on both sides of the insulating layer and the terminals of the electronic component at a short distance. Connection reliability can be improved.
  • Patent Literature when one electronic component is connected to one conductor layer and the other electronic component is connected to the other conductor layer among the two electronic components incorporated in one insulating layer, for example, Patent Literature As disclosed in FIG. 1, a component-embedded substrate can be formed by bonding two substrates on which electronic components are mounted. More specifically, in the prior art of Patent Document 1, a first wiring board on which one electronic component is mounted and a second wiring board on which the other electronic component is mounted are mounted on each other's mounting surface. The component-embedded substrate is formed so that the two electronic components are arranged in one insulating layer.
  • the relative positions of both substrates can be shifted in the bonding process. More specifically, when the second wiring board is stacked on the first wiring board, the second wiring board is slightly slid in the direction perpendicular to the stacking direction with respect to the first wiring board. May be pasted together. In such a case, an error occurs in the relative arrangement of the wiring patterns formed in the conductor layers provided on both surfaces of the insulating layer, and there is a possibility that a conduction failure may occur in an interlayer connection such as a through hole.
  • the present invention has been made in view of such a situation, and an object of the present invention is to provide an electronic component and a conductor layer in a component-embedded substrate in which a plurality of electronic components having different connected conductor layers are embedded. It is an object of the present invention to provide a component built-in substrate manufacturing method and a component built-in substrate capable of improving the connection reliability.
  • a first aspect of the present invention is a method for manufacturing a component-embedded substrate in which a first electronic component and a second electronic component are embedded in an insulating layer sandwiched between a first conductor layer and a second conductor layer.
  • the first electronic component and the second electronic component incorporated in the component-embedded substrate are respectively mounted on the first adhesive layer and the second adhesive layer applied to the first conductor layer, and the insulating layer includes the second conductor layer on the surface. Buried in The first electronic component and the second electronic component are connected from the first conductor layer and the second conductor layer by the first laser via and the second laser via, respectively.
  • the second adhesive layer is applied with a greater thickness in the stacking direction than the first adhesive layer. For this reason, in the component-embedded substrate, the second laser via can be set shorter in accordance with the reduction in the separation distance between the second electronic component and the second conductor layer inside the insulating layer, and the connection reliability with respect to the second conductor layer is improved. .
  • the first electronic component and the second electronic component are both mounted on the first conductor layer via the first adhesive and the second adhesive, respectively.
  • the component-embedded substrate is less likely to cause a relative positional shift between the first electronic component and the second electronic component, as compared with the related art in which a plurality of component mounting substrates are bonded together.
  • the component-embedded substrate suppresses the relative displacement between the first conductor layer to which the first electronic component is connected and the second conductor layer to which the second electronic component is connected. In addition, it is possible to suppress the possibility of poor conduction in the interlayer connection to the respective wiring patterns formed on the second conductor layer.
  • the connection reliability between the electronic component and the conductor layer is ensured. Can be improved.
  • the adhesive application step includes a first adhesive layer forming step of applying a first adhesive layer to a mounting position of the second electronic component.
  • the first adhesive is applied to the mounting position of the first electronic component, and the second adhesive is laminated by laminating a second adhesive layer having the same thickness as the first adhesive on the first adhesive layer.
  • a second adhesive layer forming step to be formed.
  • the second adhesive for mounting the second electronic component is formed by laminating the second adhesive layer on the first adhesive layer, and the thickness of the second adhesive layer is set to the first adhesive layer.
  • the second adhesive has a predetermined spacing interval between the second conductor layer and the second electronic component.
  • the component-embedded substrate manufacturing method is set to a thickness obtained by subtracting the separation interval and the thickness of the second electronic component from the thickness of the insulating layer.
  • the mounting position in the thickness direction of the insulating layer of the second electronic component connected to the second conductor layer can be freely set according to the thickness of the second adhesive.
  • the first electronic component and the second electronic component are built in the insulating layer sandwiched between the first conductor layer and the second conductor layer, and the first conductor layer and the first electronic component are located inside the insulating layer.
  • the second conductor layer and the second electronic component are connected by the second laser via.
  • the first electronic component is mounted on the first conductor layer via the first adhesive
  • the second electronic component is mounted on the first conductor layer via the second adhesive. That is, since the first electronic component and the second electronic component are both mounted on the first conductor layer, the relative positions of each other can be set using the first conductor layer as a common reference.
  • the second adhesive is thicker in the stacking direction than the first adhesive, the spacing between the second conductor layer and the second electronic component can be set short. Therefore, according to the fourth aspect of the present invention, for the same reason as in the first aspect, in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected are embedded, the electronic component and the conductor layer Connection reliability can be improved.
  • a fifth aspect of the present invention there is provided a method of manufacturing a component-embedded substrate in which the first electronic component and the second electronic component are embedded in an insulating layer sandwiched between the first conductor layer and the second conductor layer.
  • the first electronic component and the second electronic component incorporated in the component-embedded substrate are arranged on an adhesive tape that covers a support plate and a step forming member provided on the surface of the support plate, and both are embedded in an insulating layer. Relative position is set. At this time, since the first electronic component and the second electronic component are both arranged on the adhesive tape on the support plate, the relative positions of the support plate can be set with the support plate as a common reference. In addition, the gap between the second conductor layer and the second electronic component can be set short by the step forming member.
  • the electronic component and the conductor layer Connection reliability can be improved.
  • a sixth aspect of the present invention is a method for manufacturing a component-embedded substrate according to the fifth aspect of the present invention, wherein the step forming member is made of metal.
  • the step forming member can be prevented from expanding and contracting even under high temperature conditions by being made of metal, for example, compared with the case where the step forming member is formed of a resin material, and the thickness is set more accurately. can do.
  • a method for manufacturing a component-embedded substrate that can improve the connection reliability between the electronic component and the conductor layer, and A component-embedded substrate can be provided.
  • FIG. 1 is a cross-sectional view of a component-embedded substrate 1 according to a first embodiment of the present invention.
  • the component-embedded substrate 1 includes a first electronic component 2, a second electronic component 3, an insulating layer 5, a first conductor layer L1, a second conductor layer L2, a first adhesive 6, a second adhesive 7, and a through hole TH. Is provided.
  • the component built-in substrate 1 functions as a circuit substrate incorporated in, for example, an electric / electronic device.
  • the first electronic component 2 has a first terminal 21 formed on one surface of the first component body 20.
  • the second electronic component 3 has a second terminal 31 formed on one surface of the second component body 30.
  • the terminal is embedded in the component main body so that the terminal forming surface of the component main body and the tip end surface of the terminal form the same plane.
  • the terminal may protrude from the terminal forming surface.
  • the insulating layer 5 is made of an insulating base material, embeds the first electronic component 2 and the second electronic component 3 inside, and also has a double-sided plate together with the first conductor layer L1 and the second conductor layer L2 formed on both sides, respectively. It is composed.
  • the first conductor layer L1 and the second conductor layer L2 are made of, for example, copper foil, and a circuit pattern (not shown) is formed by appropriately performing a patterning process.
  • Each of the first adhesive 6 and the second adhesive 7 is made of a thermosetting adhesive material, and is interposed between the first electronic component 2 and the second electronic component 3 and the first conductor layer L1, respectively. Each electronic component is mounted on the first conductor layer L1.
  • the 2nd adhesive agent 7 is formed by laminating
  • the first electronic component 2 is embedded in the insulating layer 5 with the terminal formation surface facing the first conductor layer L 1, and the first terminal 21 and the first conductor layer L 1 are electrically and physically connected by the first laser via 22. It is connected to the.
  • the second electronic component 3 is embedded in the insulating layer 5 with the terminal formation surface facing the second conductor layer L2, and the second terminal 31 and the second conductor layer L2 are electrically and physically connected by the second laser via 32. Has been.
  • the through hole TH electrically connects the first conductor layer L1 and the second conductor layer L2 by forming the plating P on the side surface of the through hole penetrating the insulating layer 5.
  • the through hole TH is not an essential component for the present invention.
  • the first electronic component 2 embedded in the insulating layer 5 is connected to the first conductor layer L1 by the first laser via 22 and is also embedded in the insulating layer 5.
  • the second electronic component 3 is connected to the second conductor layer L2 by the second laser via 32.
  • the second adhesive 7 constituted by laminating the first adhesive layer 7 a and the second adhesive layer 7 b is applied so that the thickness in the laminating direction is thicker than that of the first adhesive 6.
  • the second electronic component 3 mounted with the second adhesive 7 can reduce the spacing between the terminal formation surface of the second electronic component 3 and the second conductor layer L2, and shorten the second laser via. Since it can be formed, the electrical and physical connection reliability between the second electronic component 3 and the second conductor layer L2 can be improved.
  • the component-embedded substrate 1 may be configured as a multilayer substrate having a further laminated structure on the first conductor layer L1 side or the second conductor layer L2 side by a known build-up method or bonding of other substrates. .
  • the manufacturing method of the component built-in substrate 1 according to the first embodiment of the present invention includes a preparation process, an adhesive application process, a component mounting process, a component built-in process, and a laser via forming process.
  • the adhesive application step includes a first adhesive layer forming step and a second adhesive layer forming step.
  • FIG. 2 is a cross-sectional view showing a preparation step and a first adhesive layer forming step according to the first embodiment of the present invention.
  • a first conductor layer L1 made of copper foil is prepared.
  • the shape of the first conductor layer L1 can be stabilized by forming it on the surface of a support plate (not shown), for example.
  • a patterned double-sided plate may be used as the first conductor layer L1 as a support plate.
  • the first adhesive layer 7a having a predetermined thickness is applied to the position where the second electronic component 3 is to be mounted on the first conductor layer L1.
  • the first adhesive layer 7a uses a metal mask that covers a region other than the mounting position of the second electronic component 3 as a screen plate on the surface of the first conductor layer L1, thereby moving the second electronic component while moving the squeegee. 3 mounting positions. Then, the first adhesive layer 7a is cured by heating the first adhesive layer 7a.
  • FIG. 3 is a cross-sectional view showing an adhesive application process according to the first embodiment of the present invention.
  • the first adhesive layer 7a is cured, the same adhesive material as that of the first adhesive layer 7a is newly applied to each position on the first conductor layer L1 where the first electronic component 2 and the second electronic component 3 are to be mounted. Apply.
  • the first adhesive 6 is formed at the mounting position of the first electronic component 2
  • the second adhesive layer 7 b is laminated on the first adhesive layer 7 a at the mounting position of the second electronic component 3 to form the second adhesive.
  • Agent 7 will be formed.
  • the newly applied adhesive material has an equal thickness at each position, it can be formed by a single screen printing. That is, the first adhesive 6 and the second adhesive layer 7b are simultaneously printed and applied with a common thickness.
  • the second adhesive 7 is sized in consideration of the completed component-embedded substrate 1 shown in FIG. 1, and the interval between the second conductor layer L2 and the second electronic component 3 is a predetermined separation interval.
  • the thickness is set to the thickness obtained by subtracting the separation interval and the thickness of the second electronic component 3 from the thickness of the insulating layer 5.
  • the predetermined separation interval is appropriately short as long as the laser via connection between the second conductor layer L2 and the second electronic component 3 is satisfactorily performed and long enough not to expose the second electronic component 3 from the insulating layer 5. Can be set.
  • the first adhesive 6 and the second adhesive 7 can be applied once without going through the first adhesive layer forming process and the second adhesive layer forming process. You may form by a process.
  • FIG. 4 is a sectional view showing a component mounting process according to the first embodiment of the present invention.
  • each adhesive is applied in the adhesive application step
  • each electronic component is mounted on the first conductor layer L1 via each adhesive.
  • the first electronic component 2 is bonded to the first adhesive 6 with the terminal forming surface facing the first conductor layer L1
  • the second electronic component 3 has the terminal forming surface connected to the first conductor. It adheres to the second adhesive 7 toward the side opposite to the layer L1.
  • each electronic component is mounted on the common first conductor layer L1 via each adhesive, and the relative mounting height is adjusted by the thickness of each adhesive.
  • each electronic component is fixed to the 1st conductor layer L1 by hardening each adhesive agent by heating.
  • FIG. 5 is a cross-sectional view showing a component built-in process according to the first embodiment of the present invention.
  • each electronic component is mounted on the first conductor layer L ⁇ b> 1 via each adhesive in the component mounting step, each electronic component is embedded in the insulating layer 5.
  • the insulating layer 5 is made of an insulating resin material, for example, heating a prepreg arranged around each electronic component, and pressing the second conductor layer L2 made of copper foil on the surface and pressing in the thickness direction. Can be formed. Thereby, the insulating layer 5 embeds each electronic component and constitutes a double-sided plate together with the first conductor layer L1 and the second conductor layer L2 provided so as to be sandwiched from both sides.
  • the terminal of each electronic component and the first conductor layer L1 or the second conductor layer L2 are connected by the laser via in the laser via forming process, and through holes are appropriately formed.
  • the component built-in substrate 1 shown in FIG. 1 is formed. More specifically, the first electronic component 2 has the first conductor layer formed by forming the first laser via 22 that reaches the first terminal 21 from the first conductor layer L1 through the first adhesive 6. It is electrically connected to L1.
  • the second electronic component 3 is electrically connected to the second conductor layer L2 by forming the second laser via 32 that penetrates a part of the insulating layer 5 from the second conductor layer L2 and reaches the second terminal 31. Connected.
  • the first electronic component 2 is mounted on the first conductor layer L1 via the first adhesive 6, and the first The second electronic component 3 is mounted on the first conductor layer L ⁇ b> 1 via the second adhesive 7 that is applied thicker in the stacking direction than the first adhesive 6.
  • the second electronic component 3 can improve the connection reliability with respect to the second conductor layer L2 because the second laser via 32 can be set shorter as the distance from the second conductor layer L2 decreases.
  • the first electronic component 2 and the second electronic component 3 are connected together via the first adhesive 6 and the second adhesive 7, respectively. Since it is mounted on the first conductor layer L1, it is possible to reduce the possibility of relative positional deviation as compared with the conventional technique in which a plurality of component mounting boards are bonded together.
  • the wiring pattern formed in the second conductor layer L2 to which the second electronic component 3 is connected is Since the relative positional shift is suppressed with respect to the wiring pattern formed in the first conductor layer L1 to be connected, it is possible to suppress a possibility that a conduction failure occurs in the interlayer connection to both the wiring patterns. .
  • the connection between the electronic component and the conductor layer in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected is embedded. Reliability can be improved.
  • FIG. 6 is a cross-sectional view of the component built-in substrate 10 according to the second embodiment of the present invention.
  • the component-embedded substrate 10 according to the second embodiment is different from the component-embedded substrate 1 in the first embodiment described above in that the first adhesive 6 and the second adhesive 7 are not provided, and the manufacturing method is the first embodiment. This is different from the component-embedded substrate 1.
  • parts different from those of the first embodiment will be described, and components common to the first embodiment will be denoted by the same reference numerals and detailed description thereof will be omitted.
  • the manufacturing method of the component built-in substrate 10 according to the second embodiment of the present invention includes a step forming process, a tape attaching process, a component mounting process, a component embedding process, a peeling process, a component re-embedding process, and a laser via forming process.
  • FIG. 7 is a sectional view showing a step forming process according to the second embodiment of the present invention.
  • the step forming step first, the support plate 11 is prepared, and the step forming member 12 is provided at the mounting position of the second electronic component 3 on the surface of the support plate 11.
  • the step forming member 12 is a member for raising the second electronic component 3 relative to the first electronic component 2 in a later process, and is made of a heat-resistant rectangular parallelepiped metal.
  • the step forming member 12 can be formed of, for example, a cured resin material.
  • the step forming member 12 can prevent expansion and contraction even under high temperature conditions by being made of metal, and can set the thickness (step) more accurately. it can.
  • FIG. 8 is a cross-sectional view showing a tape attaching process according to the second embodiment of the present invention.
  • a removable adhesive tape 13 is attached so as to cover the exposed surface of the support plate 11 and the surface of the step forming member 12.
  • the adhesive tape 13 is a heat-resistant double-sided tape made of polyimide, for example.
  • FIG. 9 is a cross-sectional view showing a component mounting process according to the second embodiment of the present invention.
  • the first electronic component 2 is bonded to the adhesive tape 13 on the terminal forming surface
  • the second electronic component 3 is bonded to the adhesive tape 13 on the surface opposite to the terminal forming surface.
  • FIG. 10 is a cross-sectional view showing a component embedding process according to the second embodiment of the present invention.
  • the insulating layer 5 is made of an insulating resin material.
  • the insulating layer 5 heats a prepreg disposed around each electronic component, and cooperates with the second conductor layer L2 made of a copper foil overlaid on the surface and the support plate 11. It is formed by working and being pressed in the thickness direction.
  • FIG. 11 is a cross-sectional view illustrating a peeling process according to the second embodiment of the present invention.
  • the adhesive tape 13 is peeled from the insulating layer 5.
  • the support plate 11 and the step forming member 12 bonded together with the adhesive tape 13 are also peeled off from the insulating layer 5.
  • each electronic component is exposed to the outside of the insulating layer 5 at a portion where the adhesive tape 13 is peeled off.
  • FIG. 12 is a cross-sectional view showing a component re-embedding process according to the second embodiment of the present invention.
  • the first conductor layer L1 made of copper foil is formed on the surface opposite to the second conductor layer L2, and the first conductor layer L1 and the second conductor layer L2 provided on both surfaces are formed. And it is configured as a double-sided board.
  • the terminal of each electronic component and the first conductor layer L1 or the second conductor layer L2 are connected by the laser via in the laser via forming step, and appropriately By forming the through hole TH, the component built-in substrate 10 shown in FIG. 6 is formed. More specifically, the first electronic component 2 includes the first conductor via the first conductor via the first conductor layer L1 through the part of the insulating layer 5 and reaching the first terminal 21. It is electrically connected to the layer L1. The second electronic component 3 is electrically connected to the second conductor layer L2 by forming the second laser via 32 that penetrates a part of the insulating layer 5 from the second conductor layer L2 and reaches the second terminal 31. Connected.
  • the second electronic component 3 when the first electronic component 2 and the second electronic component 3 are arranged, the second electronic component 3 is The bottom is raised by the step forming member 12 so as to be higher than the first electronic component 2. For this reason, since the second electronic component 3 can set the second laser via 32 to be shorter in the component-embedded substrate 10 along with the reduction in the separation distance from the second conductor layer L2, the connection reliability with respect to the second conductor layer L2 is improved. Can be improved.
  • the common support plate 11 is used as a reference. Therefore, it is possible to reduce the possibility of relative positional deviation as compared with the conventional technique in which a plurality of component mounting boards are bonded together.
  • the wiring pattern formed in the second conductor layer L2 to which the second electronic component 3 is connected is the first electronic component 2. Since the relative positional shift is suppressed with respect to the wiring pattern formed in the first conductor layer L1 to be connected, it is possible to suppress a possibility that a conduction failure occurs in the interlayer connection to both the wiring patterns. .
  • the connection between the electronic component and the conductor layer in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected is embedded. Reliability can be improved.

Abstract

[Problem] To improve connection reliability between electronic components and conductor layers in a board with embedded components in which a plurality of electronic components connected to different conductor layers are embedded. [Solution] The present invention provides a method for manufacturing a board 1 with embedded components in which a first electronic component 2 and a second electronic component 3 are embedded in an insulating layer 5 sandwiched between a first conductive layer L1 and a second conductive layer L2, the method comprising: a preparation step for preparing the first conductive layer L1; an adhesive-application step for applying a first adhesive 6 and a second adhesive 7 onto the first conductive layer L1; a component-mounting step for mounting the first electronic component 2 and the second adhesive 7 on the first conductive layer L1; a component embedding step for forming the insulating layer 5 in which the first electronic component 2 and the second electronic component 3 are embedded; and a laser via-forming step for connecting the first conductive layer L1 and the first electronic component 2 and connecting the second conductive layer L2 and the second electronic component 3, wherein the second adhesive 7 is applied thicker than the first adhesive 6 in the adhesive-application step.

Description

部品内蔵基板の製造方法及び部品内蔵基板Manufacturing method of component-embedded substrate and component-embedded substrate
　本発明は、部品内蔵基板の製造方法及び部品内蔵基板に関する。 The present invention relates to a method for manufacturing a component-embedded substrate and a component-embedded substrate.
　従来から、各種の電気・電子機器の小型化、薄型化、軽量化、及び多機能化を図るための研究開発が行われてきている。特に、携帯電話、ノートパソコン、デジタルカメラ等の民生品では、多機能化を図りつつも小型化、薄型化、及び軽量化が強く求められている。また、各種の電気・電子機器においては、伝送信号の高周波化及び高速化も図られており、これに伴う信号ノイズの増大を防止することも要求されている。 Conventionally, research and development has been conducted to reduce the size, thickness, weight, and functionality of various electrical and electronic devices. In particular, consumer products such as mobile phones, notebook computers, and digital cameras are strongly required to be smaller, thinner, and lighter while being multi-functional. Further, in various electric / electronic devices, transmission signals have been increased in frequency and speed, and it is also required to prevent an increase in signal noise associated therewith.
　このような要求を実現するために、電気・電子機器に組み込まれる回路基板として、従来は基板表面に実装されていた各種の電子部品を基板の絶縁層である絶縁基材内に内蔵した構造を備える部品内蔵基板や、当該部品内蔵基板を積層してなる部品内蔵多層回路基板の研究開発及び製造が従来から行われてきている。 In order to realize such a requirement, as a circuit board to be incorporated in electrical and electronic equipment, a structure in which various electronic components conventionally mounted on the surface of the board are incorporated in an insulating base material which is an insulating layer of the board. Research and development and manufacture of a component-embedded substrate and a component-embedded multilayer circuit board obtained by laminating the component-embedded substrate have been conventionally performed.
　上記のような部品内蔵基板は、１つの絶縁層に複数の電子部品を内蔵することにより絶縁層内のスペースを有効に活用することができる。また、部品内蔵基板は、絶縁層の両面に設けられる導体層の少なくとも一方と当該電子部品の端子との配線を近距離で接続することができるため、導体層と電子部品との電気的・物理的な接続信頼性を向上させることができる。 The component-embedded substrate as described above can effectively utilize the space in the insulating layer by incorporating a plurality of electronic components in one insulating layer. In addition, the component-embedded substrate can connect the wiring between at least one of the conductor layers provided on both sides of the insulating layer and the terminals of the electronic component at a short distance. Connection reliability can be improved.
ここで、１つの絶縁層に内蔵される２つの電子部品のうち、一方の電子部品を一方の導体層に接続し、他方の電子部品を他方の導体層に接続する場合には、例えば特許文献１に開示されているように、電子部品が実装された２つの基板を張り合わせて部品内蔵基板を形成することができる。より具体的には、特許文献１の従来技術では、一方の電子部品が実装された第１の配線板と、他方の電子部品が実装された第２の配線板とを、互いの実装面を向い合せて張り合わせ、双方の電子部品が１つの絶縁層内に配置されるように部品内蔵基板が形成されている。 Here, when one electronic component is connected to one conductor layer and the other electronic component is connected to the other conductor layer among the two electronic components incorporated in one insulating layer, for example, Patent Literature As disclosed in FIG. 1, a component-embedded substrate can be formed by bonding two substrates on which electronic components are mounted. More specifically, in the prior art of Patent Document 1, a first wiring board on which one electronic component is mounted and a second wiring board on which the other electronic component is mounted are mounted on each other's mounting surface. The component-embedded substrate is formed so that the two electronic components are arranged in one insulating layer.
特開２００５－１４２１７８号公報JP 2005-142178 A
　しかしながら、２つの基板を張り合わせる従来技術では、張り合わせ工程において双方の基板の相対位置にずれが生じ得る。より具体的には、第１の配線板に第２の配線板を積層する場合に、第２の配線板が第１の配線板に対して積層方向に垂直な方向に僅かにスライドした状態で張り合わされる場合がある。このような場合には、絶縁層の両面に設けられる導体層に形成される配線パターンの相対配置に誤差が生じ、例えばスルーホールなどの層間接続において導通不良が発生する虞が生じる。 However, in the conventional technique in which two substrates are bonded together, the relative positions of both substrates can be shifted in the bonding process. More specifically, when the second wiring board is stacked on the first wiring board, the second wiring board is slightly slid in the direction perpendicular to the stacking direction with respect to the first wiring board. May be pasted together. In such a case, an error occurs in the relative arrangement of the wiring patterns formed in the conductor layers provided on both surfaces of the insulating layer, and there is a possibility that a conduction failure may occur in an interlayer connection such as a through hole.
　本発明は、このような状況に鑑みてなされたものであり、その目的とするところは、接続される導体層が互いに異なる複数の電子部品を内蔵する部品内蔵基板において、電子部品と導体層との接続信頼性を向上させることができる部品内蔵基板の製造方法、及び部品内蔵基板を提供することにある。 The present invention has been made in view of such a situation, and an object of the present invention is to provide an electronic component and a conductor layer in a component-embedded substrate in which a plurality of electronic components having different connected conductor layers are embedded. It is an object of the present invention to provide a component built-in substrate manufacturing method and a component built-in substrate capable of improving the connection reliability.
＜本発明の第１の態様＞
　本発明の第１の態様は、第１導体層及び第２導体層に挟まれる絶縁層に第１電子部品及び第２電子部品が内蔵される部品内蔵基板の製造方法であって、前記第１導体層を準備する準備工程と、前記第１導体層に第１接着剤及び第２接着剤を塗布する接着剤塗布工程と、前記第１接着剤を介して前記第１電子部品を前記第１導体層に実装し、前記第２接着剤を介して前記第２電子部品を前記第１導体層に実装する部品実装工程と、前記第１電子部品及び前記第２電子部品を埋設する前記絶縁層を形成し、前記絶縁層の表面を前記第２導体層で覆う部品内蔵工程と、前記第１導体層と前記第１電子部品とを接続する第１レーザビア、及び前記第２導体層と前記第２電子部品とを接続する第２レーザビアを形成するレーザビア形成工程と、を有し、前記接着剤塗布工程においては、前記第２接着剤の積層方向の厚みを前記第１接着剤よりも厚く塗布する、部品内蔵基板の製造方法である。 <First Aspect of the Present Invention>
A first aspect of the present invention is a method for manufacturing a component-embedded substrate in which a first electronic component and a second electronic component are embedded in an insulating layer sandwiched between a first conductor layer and a second conductor layer. A preparatory step of preparing a conductor layer; an adhesive application step of applying a first adhesive and a second adhesive to the first conductor layer; and the first electronic component via the first adhesive. A component mounting step of mounting on the conductor layer and mounting the second electronic component on the first conductor layer via the second adhesive, and the insulating layer embedding the first electronic component and the second electronic component Forming a component and covering the surface of the insulating layer with the second conductor layer; a first laser via connecting the first conductor layer and the first electronic component; and the second conductor layer and the second conductor layer. A laser via forming step of forming a second laser via for connecting the two electronic components; In serial adhesive applying step, thickly coated than the first adhesive lamination direction of the thickness of the second adhesive, a method for manufacturing a component-embedded substrate.
　部品内蔵基板に内蔵される第１電子部品及び第２電子部品は、第１導体層に塗布された第１接着層及び第２接着層にそれぞれ実装され、表面に第２導体層を備える絶縁層で埋設される。また、第１電子部品及び第２電子部品は、第１導体層及び第２導体層から第１レーザビア及び第２レーザビアによってそれぞれ接続される。 The first electronic component and the second electronic component incorporated in the component-embedded substrate are respectively mounted on the first adhesive layer and the second adhesive layer applied to the first conductor layer, and the insulating layer includes the second conductor layer on the surface. Buried in The first electronic component and the second electronic component are connected from the first conductor layer and the second conductor layer by the first laser via and the second laser via, respectively.
　ここで、第２接着層は、第１接着層に対して積層方向の厚みが厚く塗布されている。このため、部品内蔵基板は、絶縁層の内部において、第２電子部品と第２導体層との離間距離の縮小に伴い第２レーザビアを短く設定でき、第２導体層に対する接続信頼性が向上する。 Here, the second adhesive layer is applied with a greater thickness in the stacking direction than the first adhesive layer. For this reason, in the component-embedded substrate, the second laser via can be set shorter in accordance with the reduction in the separation distance between the second electronic component and the second conductor layer inside the insulating layer, and the connection reliability with respect to the second conductor layer is improved. .
　また、第１電子部品及び第２電子部品は、それぞれ第１接着剤及び第２接着剤を介して共に第１導体層に実装されている。これにより、部品内蔵基板は、複数の部品実装基板を張り合わせる従来技術と比較して、第１電子部品及び第２電子部品の相対的な位置ずれが生じる虞が低減される。 The first electronic component and the second electronic component are both mounted on the first conductor layer via the first adhesive and the second adhesive, respectively. As a result, the component-embedded substrate is less likely to cause a relative positional shift between the first electronic component and the second electronic component, as compared with the related art in which a plurality of component mounting substrates are bonded together.
　また、部品内蔵基板は、第１電子部品が接続される第１導体層と第２電子部品が接続される第２導体層との相対的な位置ずれが抑制されることにより、第１導体層及び第２導体層に形成されるそれぞれの配線パターンに対する層間接続において導通不良が発生する虞を抑制することができる。 Further, the component-embedded substrate suppresses the relative displacement between the first conductor layer to which the first electronic component is connected and the second conductor layer to which the second electronic component is connected. In addition, it is possible to suppress the possibility of poor conduction in the interlayer connection to the respective wiring patterns formed on the second conductor layer.
　従って、本発明の第１の態様に係る部品内蔵基板の製造方法によれば、接続される導体層が互いに異なる複数の電子部品を内蔵する部品内蔵基板において、電子部品と導体層との接続信頼性を向上させることができる。 Therefore, according to the component-embedded substrate manufacturing method according to the first aspect of the present invention, in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected are embedded, the connection reliability between the electronic component and the conductor layer is ensured. Can be improved.
＜本発明の第２の態様＞
　本発明の第２の態様は、上記した本発明の第１の態様において、前記接着剤塗布工程は、前記第２電子部品の実装位置に第１接着層を塗布する第１接着層形成工程と、前記第１電子部品の実装位置に前記第１接着剤を塗布すると共に、前記第１接着剤と同じ厚みの第２接着層を前記第１接着層に積層することにより前記第２接着剤を形成する第２接着層形成工程と、を含む、部品内蔵基板の製造方法である。 <Second Aspect of the Present Invention>
According to a second aspect of the present invention, in the first aspect of the present invention described above, the adhesive application step includes a first adhesive layer forming step of applying a first adhesive layer to a mounting position of the second electronic component. The first adhesive is applied to the mounting position of the first electronic component, and the second adhesive is laminated by laminating a second adhesive layer having the same thickness as the first adhesive on the first adhesive layer. And a second adhesive layer forming step to be formed.
　本発明の第２の態様によれば、第１接着層に第２接着層を積層することにより第２電子部品を実装するための第２接着剤を形成し、第２接着層の厚みを第１電子部品を実装するための第１接着剤と同じ厚みに設定することにより、少ない工数で容易に各接着剤を塗布することができる。 According to the second aspect of the present invention, the second adhesive for mounting the second electronic component is formed by laminating the second adhesive layer on the first adhesive layer, and the thickness of the second adhesive layer is set to the first adhesive layer. By setting the same thickness as the first adhesive for mounting one electronic component, it is possible to easily apply each adhesive with a small number of man-hours.
＜本発明の第３の態様＞
　本発明の第３の態様は、上記した本発明の第１又は第２の態様において、前記第２接着剤は、前記第２導体層と前記第２電子部品との間隔が所定の離間間隔となるように、前記絶縁層の厚みから前記離間間隔及び前記第２電子部品の厚みを差し引いた厚みに設定される、部品内蔵基板の製造方法である。 <Third Aspect of the Present Invention>
According to a third aspect of the present invention, in the first or second aspect of the present invention described above, the second adhesive has a predetermined spacing interval between the second conductor layer and the second electronic component. In this manner, the component-embedded substrate manufacturing method is set to a thickness obtained by subtracting the separation interval and the thickness of the second electronic component from the thickness of the insulating layer.
　本発明の第３の態様によれば、第２導体層に接続される第２電子部品の絶縁層における厚み方向の実装位置を、第２接着剤の厚みによって自在に設定することができる。 According to the third aspect of the present invention, the mounting position in the thickness direction of the insulating layer of the second electronic component connected to the second conductor layer can be freely set according to the thickness of the second adhesive.
＜本発明の第４の態様＞
　本発明の第４の態様は、第１導体層及び第２導体層に挟まれる絶縁層と、前記絶縁層の内部において前記第１導体層に塗布された第１接着剤及び第２接着剤と、前記第１接着剤を介して前記第１導体層に実装されると共に、前記第１接着剤を貫通する第１レーザビアを介して前記第１導体層に接続される第１電子部品と、前記第２接着剤を介して前記第１導体層に実装されると共に、第２レーザビアを介して前記第２導体層に接続される第２電子部品と、を備え、前記第２接着剤は、前記第１接着剤よりも積層方向の厚みが厚い、部品内蔵基板である。 <Fourth aspect of the present invention>
According to a fourth aspect of the present invention, an insulating layer sandwiched between the first conductor layer and the second conductor layer, and a first adhesive and a second adhesive applied to the first conductor layer inside the insulating layer, A first electronic component mounted on the first conductor layer via the first adhesive and connected to the first conductor layer via a first laser via penetrating the first adhesive; A second electronic component that is mounted on the first conductor layer via a second adhesive and connected to the second conductor layer via a second laser via, and the second adhesive is This is a component-embedded substrate that is thicker in the stacking direction than the first adhesive.
　部品内蔵基板は、第１導体層及び第２導体層に挟まれる絶縁層に第１電子部品及び第２電子部品が内蔵され、絶縁層の内部において、第１導体層と第１電子部品とが第１レーザビアにより接続されると共に、第２導体層と第２電子部品とが第２レーザビアにより接続されている。ここで、第１電子部品は第１接着剤を介して第１導体層に実装され、第２電子部品は第２接着剤を介して第１導体層に実装されている。すなわち、第１電子部品及び第２電子部品は、共に第１導体層に実装されることから、第１導体層を共通の基準として互いの相対位置を設定することができる。また、第２接着剤が第１接着剤に対して積層方向の厚みが厚いことにより、第２導体層と第２電子部品との離間間隔を短く設定することができる。従って、本発明の第４の態様によれば、上記した第１の態様と同様の理由により、接続される導体層が互いに異なる複数の電子部品を内蔵する部品内蔵基板において、電子部品と導体層との接続信頼性を向上させることができる。 In the component-embedded substrate, the first electronic component and the second electronic component are built in the insulating layer sandwiched between the first conductor layer and the second conductor layer, and the first conductor layer and the first electronic component are located inside the insulating layer. In addition to being connected by the first laser via, the second conductor layer and the second electronic component are connected by the second laser via. Here, the first electronic component is mounted on the first conductor layer via the first adhesive, and the second electronic component is mounted on the first conductor layer via the second adhesive. That is, since the first electronic component and the second electronic component are both mounted on the first conductor layer, the relative positions of each other can be set using the first conductor layer as a common reference. In addition, since the second adhesive is thicker in the stacking direction than the first adhesive, the spacing between the second conductor layer and the second electronic component can be set short. Therefore, according to the fourth aspect of the present invention, for the same reason as in the first aspect, in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected are embedded, the electronic component and the conductor layer Connection reliability can be improved.
＜本発明の第５の態様＞
　本発明の第５の態様は、第１導体層及び第２導体層に挟まれる絶縁層に第１電子部品及び第２電子部品が内蔵される部品内蔵基板の製造方法であって、支持板の表面において、前記第２電子部品の実装位置に所定の段差を形成する段差形成部材を設ける段差形成工程と、前記支持板及び前記段差形成部材の表面を粘着テープで覆うテープ貼り付け工程と、前記粘着テープの表面において、前記第１電子部品の実装位置に前記第１電子部品を実装し、前記第２電子部品の実装位置に前記第２電子部品を実装する部品実装工程と、前記第１電子部品及び前記第２電子部品を埋設する前記絶縁層を形成し、前記支持板と協働して前記絶縁層を挟む第２導体層を形成する部品埋設工程と、前記絶縁層から前記粘着テープを剥離する剥離工程と、前記粘着テープを剥離した部分に絶縁材料を補充し、第２導体層と協働して補充後の前記絶縁層を挟む前記第１導体層を形成する部品再埋設工程と、前記第１導体層と前記第１電子部品とを接続する第１レーザビア、及び前記第２導体層と前記第２電子部品とを接続する第２レーザビアを形成するレーザビア形成工程と、を有する、部品内蔵基板の製造方法である。 <Fifth aspect of the present invention>
According to a fifth aspect of the present invention, there is provided a method of manufacturing a component-embedded substrate in which the first electronic component and the second electronic component are embedded in an insulating layer sandwiched between the first conductor layer and the second conductor layer. On the surface, a step forming step of providing a step forming member that forms a predetermined step at the mounting position of the second electronic component, a tape attaching step of covering the surface of the support plate and the step forming member with an adhesive tape, A component mounting step of mounting the first electronic component at a mounting position of the first electronic component on the surface of the adhesive tape, and mounting the second electronic component at a mounting position of the second electronic component; Forming the insulating layer for embedding the component and the second electronic component, and forming a second conductor layer sandwiching the insulating layer in cooperation with the support plate; and the adhesive tape from the insulating layer A peeling step to peel off and the viscosity A part re-embedding step of replenishing an insulating material to the part where the tape has been peeled off and forming the first conductor layer sandwiching the insulating layer after replenishment in cooperation with the second conductor layer; the first conductor layer; And a laser via forming step for forming a second laser via for connecting the second conductor layer and the second electronic component, and a method for manufacturing the component-embedded substrate. .
　部品内蔵基板に内蔵される第１電子部品及び第２電子部品は、支持板及び支持板の表面に設けられた段差形成部材を覆う粘着テープ上に配置され、絶縁層に埋設されることにより両者の相対位置が設定される。このとき、第１電子部品及び第２電子部品は、共に支持板上の粘着テープに配置されることから、支持板を共通の基準として互いの相対位置を設定することができる。また、段差形成部材により第２導体層と第２電子部品との離間間隔を短く設定することができる。従って、本発明の第５の態様によれば、上記した第１の態様と同様の理由により、接続される導体層が互いに異なる複数の電子部品を内蔵する部品内蔵基板において、電子部品と導体層との接続信頼性を向上させることができる。 The first electronic component and the second electronic component incorporated in the component-embedded substrate are arranged on an adhesive tape that covers a support plate and a step forming member provided on the surface of the support plate, and both are embedded in an insulating layer. Relative position is set. At this time, since the first electronic component and the second electronic component are both arranged on the adhesive tape on the support plate, the relative positions of the support plate can be set with the support plate as a common reference. In addition, the gap between the second conductor layer and the second electronic component can be set short by the step forming member. Therefore, according to the fifth aspect of the present invention, for the same reason as in the first aspect, in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected are embedded, the electronic component and the conductor layer Connection reliability can be improved.
＜本発明の第６の態様＞
　本発明の第６の態様は、上記した本発明の第５の態様において、前記段差形成部材は金属からなる、部品内蔵基板の製造方法である。 <Sixth aspect of the present invention>
A sixth aspect of the present invention is a method for manufacturing a component-embedded substrate according to the fifth aspect of the present invention, wherein the step forming member is made of metal.
　本発明の第６の態様によれば、段差形成部材は、例えば樹脂材料により形成される場合と比較して、金属からなることによって高温条件下においても伸縮を防止でき、より精確に厚みを設定することができる。 According to the sixth aspect of the present invention, the step forming member can be prevented from expanding and contracting even under high temperature conditions by being made of metal, for example, compared with the case where the step forming member is formed of a resin material, and the thickness is set more accurately. can do.
　本発明によれば、接続される導体層が互いに異なる複数の電子部品を内蔵する部品内蔵基板において、電子部品と導体層との接続信頼性を向上させることができる部品内蔵基板の製造方法、及び部品内蔵基板を提供することができる。 According to the present invention, in a component-embedded substrate that houses a plurality of electronic components having different conductor layers to be connected, a method for manufacturing a component-embedded substrate that can improve the connection reliability between the electronic component and the conductor layer, and A component-embedded substrate can be provided.
本発明の第１実施形態に係る部品内蔵基板の断面図である。It is sectional drawing of the component built-in board | substrate which concerns on 1st Embodiment of this invention. 本発明の第１実施形態に係る準備工程及び第１接着層形成工程を表す断面図である。It is sectional drawing showing the preparatory process and 1st contact bonding layer formation process which concern on 1st Embodiment of this invention. 本発明の第１実施形態に係る接着剤塗布工程を表す断面図である。It is sectional drawing showing the adhesive agent coating process which concerns on 1st Embodiment of this invention. 本発明の第１実施形態に係る部品実装工程を表す断面図である。It is sectional drawing showing the component mounting process which concerns on 1st Embodiment of this invention. 本発明の第１実施形態に係る部品内蔵工程を表す断面図である。It is sectional drawing showing the component built-in process which concerns on 1st Embodiment of this invention. 本発明の第２実施形態に係る部品内蔵基板の断面図である。It is sectional drawing of the component built-in board | substrate which concerns on 2nd Embodiment of this invention. 本発明の第２実施形態に係る段差形成工程を表す断面図である。It is sectional drawing showing the level | step difference formation process which concerns on 2nd Embodiment of this invention. 本発明の第２実施形態に係るテープ貼り付け工程を表す断面図である。It is sectional drawing showing the tape sticking process which concerns on 2nd Embodiment of this invention. 本発明の第２実施形態に係る部品実装工程を表す断面図である。It is sectional drawing showing the component mounting process which concerns on 2nd Embodiment of this invention. 本発明の第２実施形態に係る部品埋設工程を表す断面図である。It is sectional drawing showing the component embedding process which concerns on 2nd Embodiment of this invention. 本発明の第２実施形態に係る剥離工程を表す断面図である。It is sectional drawing showing the peeling process which concerns on 2nd Embodiment of this invention. 本発明の第２実施形態に係る部品再埋設工程を表す断面図である。It is sectional drawing showing the component re-embedding process which concerns on 2nd Embodiment of this invention.
　以下、図面を参照し、本発明の実施の形態について詳細に説明する。尚、本発明は以下に説明する内容に限定されるものではなく、その要旨を変更しない範囲において任意に変更して実施することが可能である。また、実施の形態の説明に用いる図面は、いずれも構成部材を模式的に示すものであって、理解を深めるべく部分的な強調、拡大、縮小、または省略などを行っており、構成部材の縮尺や形状等を正確に表すものとはなっていない場合がある。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. In addition, the drawings used for the description of the embodiments schematically show constituent members, and are partially emphasized, enlarged, reduced, or omitted to deepen the understanding. In some cases, the scale, shape, and the like are not accurately represented.
＜第１実施形態＞
　図１は、本発明の第１実施形態に係る部品内蔵基板１の断面図である。部品内蔵基板１は、第１電子部品２、第２電子部品３、絶縁層５、第１導体層Ｌ１、第２導体層Ｌ２、第１接着剤６、第２接着剤７、及びスルーホールＴＨを備える。部品内蔵基板１は、例えば電気・電子機器に組み込まれる回路基板として機能する。 <First Embodiment>
FIG. 1 is a cross-sectional view of a component-embedded substrate 1 according to a first embodiment of the present invention. The component-embedded substrate 1 includes a first electronic component 2, a second electronic component 3, an insulating layer 5, a first conductor layer L1, a second conductor layer L2, a first adhesive 6, a second adhesive 7, and a through hole TH. Is provided. The component built-in substrate 1 functions as a circuit substrate incorporated in, for example, an electric / electronic device.
　第１電子部品２は、第１部品本体２０の一方の面に第１端子２１が形成されている。第２電子部品３は、第２部品本体３０の一方の面に第２端子３１が形成されている。 The first electronic component 2 has a first terminal 21 formed on one surface of the first component body 20. The second electronic component 3 has a second terminal 31 formed on one surface of the second component body 30.
　ここで、第１電子部品２及び第２電子部品３は、本実施形態においては端子が部品本体に埋設されることにより部品本体の端子形成面と端子の先端面とが同一平面を成しているものとしているが、端子形成面から端子が突出していてもよい。 Here, in the first electronic component 2 and the second electronic component 3, in the present embodiment, the terminal is embedded in the component main body so that the terminal forming surface of the component main body and the tip end surface of the terminal form the same plane. The terminal may protrude from the terminal forming surface.
　絶縁層５は、絶縁基材からなり、第１電子部品２及び第２電子部品３を内部に埋設する他、両面にそれぞれ形成された第１導体層Ｌ１及び第２導体層Ｌ２と共に両面板を構成している。ここで、第１導体層Ｌ１及び第２導体層Ｌ２は、例えば銅箔からなり、それぞれ適宜パターニング処理されることにより、図示しない回路パターンが形成される。 The insulating layer 5 is made of an insulating base material, embeds the first electronic component 2 and the second electronic component 3 inside, and also has a double-sided plate together with the first conductor layer L1 and the second conductor layer L2 formed on both sides, respectively. It is composed. Here, the first conductor layer L1 and the second conductor layer L2 are made of, for example, copper foil, and a circuit pattern (not shown) is formed by appropriately performing a patterning process.
　第１接着剤６及び第２接着剤７は、いずれも熱硬化性の接着材料からなり、第１電子部品２及び第２電子部品３と第１導体層Ｌ１と間にそれぞれ介在することにより、各電子部品を第１導体層Ｌ１に実装する。ここで、第２接着剤７は、詳細を後述するように、第１接着層７ａと第２接着層７ｂとが積層されることにより形成されている。 Each of the first adhesive 6 and the second adhesive 7 is made of a thermosetting adhesive material, and is interposed between the first electronic component 2 and the second electronic component 3 and the first conductor layer L1, respectively. Each electronic component is mounted on the first conductor layer L1. Here, the 2nd adhesive agent 7 is formed by laminating | stacking the 1st contact bonding layer 7a and the 2nd contact bonding layer 7b so that a detail may mention later.
　また、第１電子部品２は、端子形成面を第１導体層Ｌ１に向けて絶縁層５に埋設され、第１端子２１と第１導体層Ｌ１とが第１レーザビア２２によって電気的・物理的に接続されている。第２電子部品３は、端子形成面を第２導体層Ｌ２に向けて絶縁層５に埋設され、第２端子３１と第２導体層Ｌ２とが第２レーザビア３２によって電気的・物理的に接続されている。 The first electronic component 2 is embedded in the insulating layer 5 with the terminal formation surface facing the first conductor layer L 1, and the first terminal 21 and the first conductor layer L 1 are electrically and physically connected by the first laser via 22. It is connected to the. The second electronic component 3 is embedded in the insulating layer 5 with the terminal formation surface facing the second conductor layer L2, and the second terminal 31 and the second conductor layer L2 are electrically and physically connected by the second laser via 32. Has been.
　スルーホールＴＨは、絶縁層５を貫通する貫通孔の側面にめっきＰが形成されることにより、第１導体層Ｌ１と第２導体層Ｌ２とを電気的に導通する。但し、スルーホールＴＨは、本発明に対しては必須の構成要素ではない。 The through hole TH electrically connects the first conductor layer L1 and the second conductor layer L2 by forming the plating P on the side surface of the through hole penetrating the insulating layer 5. However, the through hole TH is not an essential component for the present invention.
　上記のように、第１実施形態に係る部品内蔵基板１は、絶縁層５に内蔵される第１電子部品２が第１レーザビア２２によって第１導体層Ｌ１に接続され、同じく絶縁層５に内蔵される第２電子部品３が第２レーザビア３２によって第２導体層Ｌ２に接続される。このとき、第１電子部品２及び第２電子部品３は、第１接着剤６及び第２接着剤７のそれぞれを介して共に第１導体層Ｌ１に実装されることから、第１導体層Ｌ１を共通の基準として互いの相対位置を設定することができる。 As described above, in the component-embedded substrate 1 according to the first embodiment, the first electronic component 2 embedded in the insulating layer 5 is connected to the first conductor layer L1 by the first laser via 22 and is also embedded in the insulating layer 5. The second electronic component 3 is connected to the second conductor layer L2 by the second laser via 32. At this time, since the first electronic component 2 and the second electronic component 3 are both mounted on the first conductor layer L1 via the first adhesive 6 and the second adhesive 7, respectively, the first conductor layer L1. Can be set as a common reference.
　また、第１接着層７ａと第２接着層７ｂとが積層されて構成される第２接着剤７は、第１接着剤６よりも積層方向の厚みが厚くなるよう塗布されている。これにより、第２接着剤７で実装される第２電子部品３は、第２電子部品３の端子形成面と第２導体層Ｌ２との離間間隔を縮小することができ、第２レーザビアを短く形成することができることから、第２電子部品３と第２導体層Ｌ２との電気的・物理的な接続信頼性を向上させることができる。 Further, the second adhesive 7 constituted by laminating the first adhesive layer 7 a and the second adhesive layer 7 b is applied so that the thickness in the laminating direction is thicker than that of the first adhesive 6. As a result, the second electronic component 3 mounted with the second adhesive 7 can reduce the spacing between the terminal formation surface of the second electronic component 3 and the second conductor layer L2, and shorten the second laser via. Since it can be formed, the electrical and physical connection reliability between the second electronic component 3 and the second conductor layer L2 can be improved.
　尚、部品内蔵基板１は、第１導体層Ｌ１側や第２導体層Ｌ２側において、公知のビルドアップ工法や他の基板の張り合わせにより、更なる積層構造を有する多層基板として構成してもよい。 The component-embedded substrate 1 may be configured as a multilayer substrate having a further laminated structure on the first conductor layer L1 side or the second conductor layer L2 side by a known build-up method or bonding of other substrates. .
　次に、上記した部品内蔵基板１の製造方法について、図２乃至図５を参照しながら説明する。本発明の第１実施形態に係る部品内蔵基板１の製造方法は、準備工程、接着剤塗布工程、部品実装工程、部品内蔵工程、及びレーザビア形成工程を有する。ここで、接着剤塗布工程は、第１接着層形成工程及び第２接着層形成工程を含む。 Next, a method for manufacturing the component-embedded substrate 1 will be described with reference to FIGS. The manufacturing method of the component built-in substrate 1 according to the first embodiment of the present invention includes a preparation process, an adhesive application process, a component mounting process, a component built-in process, and a laser via forming process. Here, the adhesive application step includes a first adhesive layer forming step and a second adhesive layer forming step.
　図２は、本発明の第１実施形態に係る準備工程及び第１接着層形成工程を表す断面図である。まず、準備工程では、銅箔からなる第１導体層Ｌ１が準備される。ここで、第１導体層Ｌ１は、例えば図示しない支持板の表面に形成することにより形状を安定させることができる。また、第１導体層Ｌ１は、部品内蔵基板１を多層基板として構築する場合には、例えば、パターニング済みの両面板を支持板として使用してもよい。 FIG. 2 is a cross-sectional view showing a preparation step and a first adhesive layer forming step according to the first embodiment of the present invention. First, in the preparation step, a first conductor layer L1 made of copper foil is prepared. Here, the shape of the first conductor layer L1 can be stabilized by forming it on the surface of a support plate (not shown), for example. Further, when the component-embedded substrate 1 is constructed as a multilayer substrate, for example, a patterned double-sided plate may be used as the first conductor layer L1 as a support plate.
　第１導体層Ｌ１が準備されると、第１導体層Ｌ１上の第２電子部品３を実装すべき位置に、所定の厚みを有する第１接着層７ａが塗布される。第１接着層７ａは、例えば、第１導体層Ｌ１の表面において、第２電子部品３の実装位置以外の領域を覆うメタルマスクをスクリーン版として用いることで、スキージを移動させながら第２電子部品３の実装位置に形成することができる。そして、第１接着層７ａを加熱することにより第１接着層７ａを硬化させる。 When the first conductor layer L1 is prepared, the first adhesive layer 7a having a predetermined thickness is applied to the position where the second electronic component 3 is to be mounted on the first conductor layer L1. For example, the first adhesive layer 7a uses a metal mask that covers a region other than the mounting position of the second electronic component 3 as a screen plate on the surface of the first conductor layer L1, thereby moving the second electronic component while moving the squeegee. 3 mounting positions. Then, the first adhesive layer 7a is cured by heating the first adhesive layer 7a.
　図３は、本発明の第１実施形態に係る接着剤塗布工程を表す断面図である。第１接着層７ａが硬化されると、第１電子部品２及び第２電子部品３を実装すべき第１導体層Ｌ１上のそれぞれの位置に、第１接着層７ａと同じ接着材料を新たに塗布する。これにより、第１電子部品２の実装位置においては第１接着剤６が形成され、第２電子部品３の実装位置においては第１接着層７ａに第２接着層７ｂが積層されて第２接着剤７が形成されることになる。 FIG. 3 is a cross-sectional view showing an adhesive application process according to the first embodiment of the present invention. When the first adhesive layer 7a is cured, the same adhesive material as that of the first adhesive layer 7a is newly applied to each position on the first conductor layer L1 where the first electronic component 2 and the second electronic component 3 are to be mounted. Apply. As a result, the first adhesive 6 is formed at the mounting position of the first electronic component 2, and the second adhesive layer 7 b is laminated on the first adhesive layer 7 a at the mounting position of the second electronic component 3 to form the second adhesive. Agent 7 will be formed.
　ここで、新たに塗布される接着材料は、それぞれの位置において等しい厚みを有することから、一回のスクリーン印刷で形成することができる。すなわち、第１接着剤６及び第２接着層７ｂが互いに共通の厚みで同時に印刷塗布される。また、第２接着剤７は、図１に示す完成後の部品内蔵基板１を考慮して寸法が規定され、第２導体層Ｌ２と第２電子部品３との間隔が所定の離間間隔となるように、接着剤塗布工程において、絶縁層５の厚みから当該離間間隔及び第２電子部品３の厚みを差し引いた厚みに設定される。尚、所定の離間間隔は、第２導体層Ｌ２と第２電子部品３とのレーザビア接続が良好に行われる程度に短く、第２電子部品３が絶縁層５から露出しない程度に長い間隔として適宜設定することができる。 Here, since the newly applied adhesive material has an equal thickness at each position, it can be formed by a single screen printing. That is, the first adhesive 6 and the second adhesive layer 7b are simultaneously printed and applied with a common thickness. The second adhesive 7 is sized in consideration of the completed component-embedded substrate 1 shown in FIG. 1, and the interval between the second conductor layer L2 and the second electronic component 3 is a predetermined separation interval. As described above, in the adhesive application step, the thickness is set to the thickness obtained by subtracting the separation interval and the thickness of the second electronic component 3 from the thickness of the insulating layer 5. The predetermined separation interval is appropriately short as long as the laser via connection between the second conductor layer L2 and the second electronic component 3 is satisfactorily performed and long enough not to expose the second electronic component 3 from the insulating layer 5. Can be set.
　尚、接着剤塗布工程においては、公知のディスペンサーを使用することにより、第１接着層形成工程及び第２接着層形成工程を経ることなく、第１接着剤６及び第２接着剤７を一度の工程により形成してもよい。 In the adhesive application process, by using a known dispenser, the first adhesive 6 and the second adhesive 7 can be applied once without going through the first adhesive layer forming process and the second adhesive layer forming process. You may form by a process.
　図４は、本発明の第１実施形態に係る部品実装工程を表す断面図である。接着剤塗布工程において各接着剤が塗布されると、各電子部品が各接着剤を介して第１導体層Ｌ１に実装される。ここで、部品実装工程においては、第１電子部品２が端子形成面を第１導体層Ｌ１側に向けて第１接着剤６に接着され、第２電子部品３が端子形成面を第１導体層Ｌ１と反対側に向けて第２接着剤７に接着される。このとき、各電子部品は、いずれも各接着剤を介して共通の第１導体層Ｌ１に実装され、相対的な実装高さについても各接着剤の厚みにより調整されている。そして、各接着剤を加熱によって硬化させることにより、各電子部品が第１導体層Ｌ１に固定される。 FIG. 4 is a sectional view showing a component mounting process according to the first embodiment of the present invention. When each adhesive is applied in the adhesive application step, each electronic component is mounted on the first conductor layer L1 via each adhesive. Here, in the component mounting process, the first electronic component 2 is bonded to the first adhesive 6 with the terminal forming surface facing the first conductor layer L1, and the second electronic component 3 has the terminal forming surface connected to the first conductor. It adheres to the second adhesive 7 toward the side opposite to the layer L1. At this time, each electronic component is mounted on the common first conductor layer L1 via each adhesive, and the relative mounting height is adjusted by the thickness of each adhesive. And each electronic component is fixed to the 1st conductor layer L1 by hardening each adhesive agent by heating.
　図５は、本発明の第１実施形態に係る部品内蔵工程を表す断面図である。部品実装工程において各電子部品が各接着剤を介して第１導体層Ｌ１に実装されると、各電子部品は、絶縁層５により埋設される。絶縁層５は、絶縁性を有する樹脂材料からなり、例えば各電子部品の周囲に配置されたプリプレグを加熱すると共に、銅箔からなる第２導体層Ｌ２を表面に重ねて厚み方向に押圧することにより形成することができる。これにより、絶縁層５は、各電子部品を埋設し、両面から挟まれるように設けられた第１導体層Ｌ１及び第２導体層Ｌ２と共に両面板を構成する。 FIG. 5 is a cross-sectional view showing a component built-in process according to the first embodiment of the present invention. When each electronic component is mounted on the first conductor layer L <b> 1 via each adhesive in the component mounting step, each electronic component is embedded in the insulating layer 5. The insulating layer 5 is made of an insulating resin material, for example, heating a prepreg arranged around each electronic component, and pressing the second conductor layer L2 made of copper foil on the surface and pressing in the thickness direction. Can be formed. Thereby, the insulating layer 5 embeds each electronic component and constitutes a double-sided plate together with the first conductor layer L1 and the second conductor layer L2 provided so as to be sandwiched from both sides.
　部品内蔵工程において各電子部品が絶縁層５に埋設されると、レーザビア形成工程によって各電子部品の端子と第１導体層Ｌ１又は第２導体層Ｌ２とがレーザビアにより接続されると共に、適宜スルーホールＴＨが形成されることにより、図１に示す部品内蔵基板１が形成される。より具体的には、第１電子部品２は、第１導体層Ｌ１から第１接着剤６を貫通して第１端子２１に到達する第１レーザビア２２が形成されることにより、第１導体層Ｌ１と電気的に接続される。第２電子部品３は、第２導体層Ｌ２から絶縁層５の一部を貫通して第２端子３１に到達する第２レーザビア３２が形成されることにより、第２導体層Ｌ２と電気的に接続される。 When each electronic component is embedded in the insulating layer 5 in the component built-in process, the terminal of each electronic component and the first conductor layer L1 or the second conductor layer L2 are connected by the laser via in the laser via forming process, and through holes are appropriately formed. By forming TH, the component built-in substrate 1 shown in FIG. 1 is formed. More specifically, the first electronic component 2 has the first conductor layer formed by forming the first laser via 22 that reaches the first terminal 21 from the first conductor layer L1 through the first adhesive 6. It is electrically connected to L1. The second electronic component 3 is electrically connected to the second conductor layer L2 by forming the second laser via 32 that penetrates a part of the insulating layer 5 from the second conductor layer L2 and reaches the second terminal 31. Connected.
　以上のように、本発明の第１実施形態に係る部品内蔵基板１の製造方法によれば、第１接着剤６を介して第１電子部品２を第１導体層Ｌ１に実装すると共に、第１接着剤６よりも積層方向の厚みが厚く塗布された第２接着剤７を介して第２電子部品３を第１導体層Ｌ１に実装している。このため、第２電子部品３は、第２導体層Ｌ２との離間間隔の縮小に伴い第２レーザビア３２を短く設定できることから、第２導体層Ｌ２に対する接続信頼性を向上させることができる。 As described above, according to the method for manufacturing the component-embedded substrate 1 according to the first embodiment of the present invention, the first electronic component 2 is mounted on the first conductor layer L1 via the first adhesive 6, and the first The second electronic component 3 is mounted on the first conductor layer L <b> 1 via the second adhesive 7 that is applied thicker in the stacking direction than the first adhesive 6. For this reason, the second electronic component 3 can improve the connection reliability with respect to the second conductor layer L2 because the second laser via 32 can be set shorter as the distance from the second conductor layer L2 decreases.
　また、本発明の第１実施形態に係る部品内蔵基板１の製造方法によれば、第１電子部品２及び第２電子部品３がそれぞれ第１接着剤６及び第２接着剤７を介して共に第１導体層Ｌ１に実装されていることから、複数の部品実装基板を張り合わせる従来技術と比較して、相対的な位置ずれが生じる虞が低減される。 In addition, according to the method for manufacturing the component-embedded substrate 1 according to the first embodiment of the present invention, the first electronic component 2 and the second electronic component 3 are connected together via the first adhesive 6 and the second adhesive 7, respectively. Since it is mounted on the first conductor layer L1, it is possible to reduce the possibility of relative positional deviation as compared with the conventional technique in which a plurality of component mounting boards are bonded together.
　さらに、本発明の第１実施形態に係る部品内蔵基板１の製造方法によれば、第２電子部品３が接続される第２導体層Ｌ２において形成される配線パターンが、第１電子部品２が接続される第１導体層Ｌ１において形成される配線パターンに対して、相対的な位置ずれが抑制されることから、双方の配線パターンに対する層間接続において導通不良が発生する虞を抑制することができる。 Furthermore, according to the method for manufacturing the component-embedded substrate 1 according to the first embodiment of the present invention, the wiring pattern formed in the second conductor layer L2 to which the second electronic component 3 is connected is Since the relative positional shift is suppressed with respect to the wiring pattern formed in the first conductor layer L1 to be connected, it is possible to suppress a possibility that a conduction failure occurs in the interlayer connection to both the wiring patterns. .
　従って、本発明の第１実施形態に係る部品内蔵基板１の製造方法によれば、接続される導体層が互いに異なる複数の電子部品を内蔵する部品内蔵基板において、電子部品と導体層との接続信頼性を向上させることができる。 Therefore, according to the manufacturing method of the component-embedded substrate 1 according to the first embodiment of the present invention, the connection between the electronic component and the conductor layer in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected is embedded. Reliability can be improved.
＜第２実施形態＞
　図６は、本発明の第２実施形態に係る部品内蔵基板１０の断面図である。第２実施形態に係る部品内蔵基板１０は、上記した第１実施形態における部品内蔵基板１に対して第１接着剤６及び第２接着剤７を備えない点、並びに製造方法が第１実施形態の部品内蔵基板１と異なる。以下、第１実施形態と異なる部分について説明することとし、第１実施形態と共通する構成要素については、同じ符号を付して詳細な説明を省略する。 Second Embodiment
FIG. 6 is a cross-sectional view of the component built-in substrate 10 according to the second embodiment of the present invention. The component-embedded substrate 10 according to the second embodiment is different from the component-embedded substrate 1 in the first embodiment described above in that the first adhesive 6 and the second adhesive 7 are not provided, and the manufacturing method is the first embodiment. This is different from the component-embedded substrate 1. Hereinafter, parts different from those of the first embodiment will be described, and components common to the first embodiment will be denoted by the same reference numerals and detailed description thereof will be omitted.
　以下、第２実施形態に係る部品内蔵基板１０の製造方法について、図６乃至図１２を参照しながら説明する。本発明の第２実施形態に係る部品内蔵基板１０の製造方法は、段差形成工程、テープ貼り付け工程、部品実装工程、部品埋設工程、剥離工程、部品再埋設工程、及びレーザビア形成工程を有する。 Hereinafter, a method for manufacturing the component-embedded substrate 10 according to the second embodiment will be described with reference to FIGS. The manufacturing method of the component built-in substrate 10 according to the second embodiment of the present invention includes a step forming process, a tape attaching process, a component mounting process, a component embedding process, a peeling process, a component re-embedding process, and a laser via forming process.
　図７は、本発明の第２実施形態に係る段差形成工程を表す断面図である。段差形成工程においては、まず支持板１１を準備し、支持板１１の表面における第２電子部品３の実装位置に段差形成部材１２が設けられる。 FIG. 7 is a sectional view showing a step forming process according to the second embodiment of the present invention. In the step forming step, first, the support plate 11 is prepared, and the step forming member 12 is provided at the mounting position of the second electronic component 3 on the surface of the support plate 11.
　段差形成部材１２は、後の工程において第２電子部品３を第１電子部品２に対して底上げするための部材であり、耐熱性を有する直方体形状の金属からなる。ここで、段差形成部材１２は、例えば硬化済みの樹脂材料により形成することもできるが、金属からなることによって高温条件下においても伸縮を防止でき、より精確に厚み（段差）を設定することができる。 The step forming member 12 is a member for raising the second electronic component 3 relative to the first electronic component 2 in a later process, and is made of a heat-resistant rectangular parallelepiped metal. Here, the step forming member 12 can be formed of, for example, a cured resin material. However, the step forming member 12 can prevent expansion and contraction even under high temperature conditions by being made of metal, and can set the thickness (step) more accurately. it can.
　図８は、本発明の第２実施形態に係るテープ貼り付け工程を表す断面図である。段差形成工程において支持板１１上に段差形成部材１２が設けられると、支持板１１の露出した表面と段差形成部材１２の表面とを覆うように脱着可能な粘着テープ１３が貼り付けられる。粘着テープ１３は、例えばポリイミドからなる耐熱性を有する両面テープである。 FIG. 8 is a cross-sectional view showing a tape attaching process according to the second embodiment of the present invention. When the step forming member 12 is provided on the support plate 11 in the step forming step, a removable adhesive tape 13 is attached so as to cover the exposed surface of the support plate 11 and the surface of the step forming member 12. The adhesive tape 13 is a heat-resistant double-sided tape made of polyimide, for example.
　図９は、本発明の第２実施形態に係る部品実装工程を表す断面図である。テープ貼り付け工程において支持板１１及び段差形成部材１２の表面に粘着テープ１３が貼り付けられると、次に、粘着テープ１３上に各電子部品が実装される。 FIG. 9 is a cross-sectional view showing a component mounting process according to the second embodiment of the present invention. When the adhesive tape 13 is affixed to the surfaces of the support plate 11 and the step forming member 12 in the tape affixing step, each electronic component is then mounted on the adhesive tape 13.
　より具体的には、部品実装工程においては、第１電子部品２が端子形成面において粘着テープ１３に接着され、第２電子部品３が端子形成面と反対側の面において粘着テープ１３に接着される。このとき、第２電子部品３は、段差形成部材１２が設けられた部分における粘着テープ１３上に接着されることから、第１電子部品２に対して底上げされた状態で配置されることになる。また、各電子部品は、互いの相対的な配置高さが段差形成部材１２により調整されつつ、共通の粘着テープ１３に接着されていることから、高い精度で部品同士の相対配置を設定される。 More specifically, in the component mounting step, the first electronic component 2 is bonded to the adhesive tape 13 on the terminal forming surface, and the second electronic component 3 is bonded to the adhesive tape 13 on the surface opposite to the terminal forming surface. The At this time, since the second electronic component 3 is adhered onto the adhesive tape 13 in the portion where the step forming member 12 is provided, the second electronic component 3 is arranged in a state where it is raised with respect to the first electronic component 2. . Moreover, since each electronic component is adhered to the common adhesive tape 13 while the relative arrangement height thereof is adjusted by the step forming member 12, the relative arrangement of the components can be set with high accuracy. .
　図１０は、本発明の第２実施形態に係る部品埋設工程を表す断面図である。部品実装工程において粘着テープ１３上に各電子部品が実装されると、各電子部品は、絶縁層５により埋設される。絶縁層５は、絶縁性を有する樹脂材料からなり、例えば各電子部品の周囲に配置されたプリプレグを加熱すると共に、表面に重ねた銅箔からなる第２導体層Ｌ２と支持板１１とにより協働して厚み方向に押圧されることで形成される。 FIG. 10 is a cross-sectional view showing a component embedding process according to the second embodiment of the present invention. When each electronic component is mounted on the adhesive tape 13 in the component mounting process, each electronic component is embedded in the insulating layer 5. The insulating layer 5 is made of an insulating resin material. For example, the insulating layer 5 heats a prepreg disposed around each electronic component, and cooperates with the second conductor layer L2 made of a copper foil overlaid on the surface and the support plate 11. It is formed by working and being pressed in the thickness direction.
　図１１は、本発明の第２実施形態に係る剥離工程を表す断面図である。部品埋設工程において各電子部品が絶縁層５により埋設されると、絶縁層５から粘着テープ１３が剥離される。これにより、粘着テープ１３と一体に接着された支持板１１及び段差形成部材１２についても絶縁層５から剥離されることになる。このとき、各電子部品は、粘着テープ１３が剥離された部分において絶縁層５の外部に露出する。 FIG. 11 is a cross-sectional view illustrating a peeling process according to the second embodiment of the present invention. When each electronic component is embedded by the insulating layer 5 in the component embedding process, the adhesive tape 13 is peeled from the insulating layer 5. As a result, the support plate 11 and the step forming member 12 bonded together with the adhesive tape 13 are also peeled off from the insulating layer 5. At this time, each electronic component is exposed to the outside of the insulating layer 5 at a portion where the adhesive tape 13 is peeled off.
　図１２は、本発明の第２実施形態に係る部品再埋設工程を表す断面図である。剥離工程において絶縁層５から粘着テープ１３が剥離されると、粘着テープ１３が剥離された部分５ａにおいて絶縁材料を補充することにより、各電子部品を補充後の絶縁層５によって再度埋設する。このとき、絶縁層５は、図６に示す完成後の部品内蔵基板１０の厚みを考慮して補充する絶縁材料の量が設定される。また、補充後の絶縁層５は、第２導体層Ｌ２と反対の面において、銅箔からなる第１導体層Ｌ１が形成され、両面に設けられた第１導体層Ｌ１及び第２導体層Ｌ２と共に両面板として構成される。 FIG. 12 is a cross-sectional view showing a component re-embedding process according to the second embodiment of the present invention. When the adhesive tape 13 is peeled from the insulating layer 5 in the peeling step, each electronic component is re-embedded by the insulating layer 5 after replenishment by replenishing the insulating material in the portion 5a where the adhesive tape 13 is peeled off. At this time, the amount of the insulating material to be replenished for the insulating layer 5 is set in consideration of the thickness of the completed component-embedded substrate 10 shown in FIG. In addition, in the insulating layer 5 after replenishment, the first conductor layer L1 made of copper foil is formed on the surface opposite to the second conductor layer L2, and the first conductor layer L1 and the second conductor layer L2 provided on both surfaces are formed. And it is configured as a double-sided board.
　部品再埋設工程において各電子部品が絶縁層５に再度埋設されると、レーザビア形成工程によって各電子部品の端子と第１導体層Ｌ１又は第２導体層Ｌ２とがレーザビアにより接続されると共に、適宜スルーホールＴＨが形成されることにより、図６に示す部品内蔵基板１０が形成される。より具体的には、第１電子部品２は、第１導体層Ｌ１から絶縁層５の一部を貫通して第１端子２１に到達する第１レーザビア２２が形成されることにより、第１導体層Ｌ１と電気的に接続される。第２電子部品３は、第２導体層Ｌ２から絶縁層５の一部を貫通して第２端子３１に到達する第２レーザビア３２が形成されることにより、第２導体層Ｌ２と電気的に接続される。 When each electronic component is re-embedded in the insulating layer 5 in the component re-embedding step, the terminal of each electronic component and the first conductor layer L1 or the second conductor layer L2 are connected by the laser via in the laser via forming step, and appropriately By forming the through hole TH, the component built-in substrate 10 shown in FIG. 6 is formed. More specifically, the first electronic component 2 includes the first conductor via the first conductor via the first conductor layer L1 through the part of the insulating layer 5 and reaching the first terminal 21. It is electrically connected to the layer L1. The second electronic component 3 is electrically connected to the second conductor layer L2 by forming the second laser via 32 that penetrates a part of the insulating layer 5 from the second conductor layer L2 and reaches the second terminal 31. Connected.
　以上のように、本発明の第２実施形態に係る部品内蔵基板１０の製造方法によれば、第１電子部品２と第２電子部品３とが配置されるときに、第２電子部品３を第１電子部品２よりも高い位置となるように段差形成部材１２によって底上げが行われる。このため、第２電子部品３は、部品内蔵基板１０においては、第２導体層Ｌ２との離間間隔の縮小に伴い第２レーザビア３２を短く設定できることから、第２導体層Ｌ２に対する接続信頼性を向上させることができる。 As described above, according to the method for manufacturing the component-embedded substrate 10 according to the second embodiment of the present invention, when the first electronic component 2 and the second electronic component 3 are arranged, the second electronic component 3 is The bottom is raised by the step forming member 12 so as to be higher than the first electronic component 2. For this reason, since the second electronic component 3 can set the second laser via 32 to be shorter in the component-embedded substrate 10 along with the reduction in the separation distance from the second conductor layer L2, the connection reliability with respect to the second conductor layer L2 is improved. Can be improved.
　また、本発明の第２実施形態に係る部品内蔵基板１０の製造方法によれば、第１電子部品２及び第２電子部品３が粘着テープ１３に張り付けられるときに、共通の支持板１１を基準として配置されることから、複数の部品実装基板を張り合わせる従来技術と比較して、相対的な位置ずれが生じる虞が低減される。 Further, according to the method for manufacturing the component-embedded substrate 10 according to the second embodiment of the present invention, when the first electronic component 2 and the second electronic component 3 are attached to the adhesive tape 13, the common support plate 11 is used as a reference. Therefore, it is possible to reduce the possibility of relative positional deviation as compared with the conventional technique in which a plurality of component mounting boards are bonded together.
　さらに、本発明の第２実施形態に係る部品内蔵基板１０の製造方法によれば、第２電子部品３が接続される第２導体層Ｌ２において形成される配線パターンが、第１電子部品２が接続される第１導体層Ｌ１において形成される配線パターンに対して、相対的な位置ずれが抑制されることから、双方の配線パターンに対する層間接続において導通不良が発生する虞を抑制することができる。 Furthermore, according to the method for manufacturing the component-embedded substrate 10 according to the second embodiment of the present invention, the wiring pattern formed in the second conductor layer L2 to which the second electronic component 3 is connected is the first electronic component 2. Since the relative positional shift is suppressed with respect to the wiring pattern formed in the first conductor layer L1 to be connected, it is possible to suppress a possibility that a conduction failure occurs in the interlayer connection to both the wiring patterns. .
　従って、本発明の第２実施形態に係る部品内蔵基板１０の製造方法によれば、接続される導体層が互いに異なる複数の電子部品を内蔵する部品内蔵基板において、電子部品と導体層との接続信頼性を向上させることができる。 Therefore, according to the method for manufacturing the component-embedded substrate 10 according to the second embodiment of the present invention, the connection between the electronic component and the conductor layer in the component-embedded substrate in which a plurality of electronic components having different conductor layers to be connected is embedded. Reliability can be improved.
　　１、１０　部品内蔵基板
　　２　第１電子部品
　　３　第２電子部品
　　５　絶縁層
　　６　第１接着剤
　　７　第２接着剤
　１１　支持板
　１２　段差形成部材
　１３　粘着テープ
　２０　第１部品本体
　２１　第１端子
　２２　第１レーザビア
　３０　第２部品本体
　３１　第２端子
　３２　第２レーザビア
　Ｌ１　第１導体層
　Ｌ２　第２導体層 DESCRIPTION OF SYMBOLS 1, 10 Component built-in board 2 1st electronic component 3 2nd electronic component 5 Insulating layer 6 1st adhesive 7 2nd adhesive 11 Support plate 12 Level difference forming member 13 Adhesive tape 20 1st component main body 21 1st terminal 22 1st 1 laser via 30 second component body 31 second terminal 32 second laser via L1 first conductor layer L2 second conductor layer

Claims (6)

  1. 　第１導体層及び第２導体層に挟まれる絶縁層に第１電子部品及び第２電子部品が内蔵される部品内蔵基板の製造方法であって、
    　前記第１導体層を準備する準備工程と、
    　前記第１導体層に第１接着剤及び第２接着剤を塗布する接着剤塗布工程と、
    　前記第１接着剤を介して前記第１電子部品を前記第１導体層に実装し、前記第２接着剤を介して前記第２電子部品を前記第１導体層に実装する部品実装工程と、
    　前記第１電子部品及び前記第２電子部品を埋設する前記絶縁層を形成し、前記絶縁層の表面を前記第２導体層で覆う部品内蔵工程と、
    　前記第１導体層と前記第１電子部品とを接続する第１レーザビア、及び前記第２導体層と前記第２電子部品とを接続する第２レーザビアを形成するレーザビア形成工程と、を有し、
    　前記接着剤塗布工程においては、前記第２接着剤の積層方向の厚みを前記第１接着剤よりも厚く塗布する、部品内蔵基板の製造方法。     A method for manufacturing a component-embedded substrate in which a first electronic component and a second electronic component are embedded in an insulating layer sandwiched between a first conductor layer and a second conductor layer,
    A preparation step of preparing the first conductor layer;
    An adhesive application step of applying a first adhesive and a second adhesive to the first conductor layer;
    A component mounting step of mounting the first electronic component on the first conductor layer via the first adhesive and mounting the second electronic component on the first conductor layer via the second adhesive;
    Forming the insulating layer for embedding the first electronic component and the second electronic component, and covering the surface of the insulating layer with the second conductor layer;
    A laser via forming step of forming a first laser via that connects the first conductor layer and the first electronic component, and a second laser via that connects the second conductor layer and the second electronic component;
    In the adhesive application step, the component-embedded substrate manufacturing method, wherein the thickness of the second adhesive in the stacking direction is larger than that of the first adhesive.
  2. 　前記接着剤塗布工程は、
    　前記第２電子部品の実装位置に第１接着層を塗布する第１接着層形成工程と、
    　前記第１電子部品の実装位置に前記第１接着剤を塗布すると共に、前記第１接着剤と同じ厚みの第２接着層を前記第１接着層に積層することにより前記第２接着剤を形成する第２接着層形成工程と、を含む、請求項１に記載の部品内蔵基板の製造方法。     The adhesive application step includes
    A first adhesive layer forming step of applying a first adhesive layer to a mounting position of the second electronic component;
    The first adhesive is applied to the mounting position of the first electronic component, and the second adhesive is formed by laminating a second adhesive layer having the same thickness as the first adhesive on the first adhesive layer. The manufacturing method of the component built-in board | substrate of Claim 1 including the 2nd contact bonding layer formation process to do.
  3. 　前記第２接着剤は、前記第２導体層と前記第２電子部品との間隔が所定の離間間隔となるように、前記絶縁層の厚みから前記離間間隔及び前記第２電子部品の厚みを差し引いた厚みに設定される、請求項１又は２に記載の部品内蔵基板の製造方法。 The second adhesive subtracts the spacing distance and the thickness of the second electronic component from the thickness of the insulating layer so that the spacing between the second conductor layer and the second electronic component is a predetermined spacing distance. The method for manufacturing a component-embedded substrate according to claim 1, wherein the thickness is set to a predetermined thickness.
  4. 　第１導体層及び第２導体層に挟まれる絶縁層と、
    　前記絶縁層の内部において前記第１導体層に塗布された第１接着剤及び第２接着剤と、
    　前記第１接着剤を介して前記第１導体層に実装されると共に、前記第１接着剤を貫通する第１レーザビアを介して前記第１導体層に接続される第１電子部品と、
    　前記第２接着剤を介して前記第１導体層に実装されると共に、第２レーザビアを介して前記第２導体層に接続される第２電子部品と、を備え、
    　前記第２接着剤は、前記第１接着剤よりも積層方向の厚みが厚い、部品内蔵基板。     An insulating layer sandwiched between the first conductor layer and the second conductor layer;
    A first adhesive and a second adhesive applied to the first conductor layer inside the insulating layer;
    A first electronic component mounted on the first conductor layer via the first adhesive and connected to the first conductor layer via a first laser via penetrating the first adhesive;
    A second electronic component mounted on the first conductor layer via the second adhesive and connected to the second conductor layer via a second laser via; and
    The component-embedded substrate, wherein the second adhesive is thicker in the stacking direction than the first adhesive.
  5. 　第１導体層及び第２導体層に挟まれる絶縁層に第１電子部品及び第２電子部品が内蔵される部品内蔵基板の製造方法であって、
    　支持板の表面において、前記第２電子部品の実装位置に所定の段差を形成する段差形成部材を設ける段差形成工程と、
    　前記支持板及び前記段差形成部材の表面を粘着テープで覆うテープ貼り付け工程と、
    　前記粘着テープの表面において、前記第１電子部品の実装位置に前記第１電子部品を実装し、前記第２電子部品の実装位置に前記第２電子部品を実装する部品実装工程と、
    　前記第１電子部品及び前記第２電子部品を埋設する前記絶縁層を形成し、前記支持板と協働して前記絶縁層を挟む第２導体層を形成する部品埋設工程と、
    　前記絶縁層から前記粘着テープを剥離する剥離工程と、
    　前記粘着テープを剥離した部分に絶縁材料を補充し、第２導体層と協働して補充後の前記絶縁層を挟む前記第１導体層を形成する部品再埋設工程と、
    　前記第１導体層と前記第１電子部品とを接続する第１レーザビア、及び前記第２導体層と前記第２電子部品とを接続する第２レーザビアを形成するレーザビア形成工程と、を有する、部品内蔵基板の製造方法。     A method for manufacturing a component-embedded substrate in which a first electronic component and a second electronic component are embedded in an insulating layer sandwiched between a first conductor layer and a second conductor layer,
    A step forming step of providing a step forming member for forming a predetermined step at the mounting position of the second electronic component on the surface of the support plate;
    A tape attaching step of covering the surfaces of the support plate and the step forming member with an adhesive tape;
    On the surface of the adhesive tape, a component mounting step of mounting the first electronic component at a mounting position of the first electronic component and mounting the second electronic component at a mounting position of the second electronic component;
    A component embedding step of forming the insulating layer for embedding the first electronic component and the second electronic component, and forming a second conductor layer sandwiching the insulating layer in cooperation with the support plate;
    A peeling step of peeling the adhesive tape from the insulating layer;
    Refilling the insulating material in the part where the adhesive tape has been peeled off, and re-embedding the component to form the first conductor layer sandwiching the insulating layer after replenishment in cooperation with the second conductor layer;
    A component comprising: a first laser via that connects the first conductor layer and the first electronic component; and a laser via formation step that forms a second laser via that connects the second conductor layer and the second electronic component. A method for manufacturing a built-in substrate.
  6. 　前記段差形成部材は金属からなる、請求項５に記載の部品内蔵基板の製造方法。 The method for manufacturing a component-embedded board according to claim 5, wherein the step forming member is made of metal.
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